MC33064D-5 - ON Semiconductor

 Semiconductor Components Industries, LLC, 2002

June, 2002 – Rev. 7 1Publication Order Number:

MC34064/D

MC34064, MC33064,

NCV33064

Undervoltage Sensing

Circuit

The MC34064 is an undervoltage sensing circuit specifically

designed for use as a reset controller in microprocessor–based

systems. It offers the designer an economical solution for low voltage

detection with a single external resistor. The MC34064 features a

trimmed–in–package bandgap reference, and a comparator with

precise thresholds and built-in hysteresis to prevent erratic reset

operation. The open collector reset output is capable of sinking in

excess of 10 mA, and operation is guaranteed down to 1.0 V input with

low standby current. The MC devices are packaged in 3–pin

TO-226AA, 8–pin SO–8 and Micro8 surface mount packages. The

NCV device is packaged in SO–8 and TO–226AA.

Applications include direct monitoring of the 5.0 V MPU/logic

power supply used in appliance, automotive, consumer and industrial

equipment.

•Trimmed–In–Package Temperature Compensated Reference

•Comparator Threshold of 4.6 V at 25°C

•Precise Comparator Thresholds Guaranteed Over Temperature

•Comparator Hysteresis Prevents Erratic Reset

•Reset Output Capable of Sinking in Excess of 10 mA

•Internal Clamp Diode for Discharging Delay Capacitor

•Guaranteed Reset Operation with 1.0 V Input

•Low Standby Current

•Economical TO–226AA, SO–8 and Micro8 Surface Mount Packages

1.2 Vref

2 (2)

1 (1)

3 (4)

Reset

Gnd

Input

=Sink Only

Positive True Logic

Pin numbers adjacent to terminals are for the 3–pin TO–226AA package.

Pin numbers in parenthesis are for the 8–lead packages.

This device contains 21 active transistors.

Figure 1. Representative Block Diagram

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123

Pin 1. Reset

2. Input

3. Ground

(Top View)

1N.C.

Ground

N.C.

5N.C.

N.C.

Input

Reset

PIN CONNECTIONS

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

See general marking information in the device marking

section on page 6 of this data sheet.

DEVICE MARKING INFORMATION

SO–8

D SUFFIX

CASE 751

Micro8

DM SUFFIX

CASE 846A

TO–226AA

P SUFFIX

CASE 29

MC34064, MC33064, NCV33064

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MAXIMUM RATINGS

Rating Symbol Value Unit

Power Input Supply Voltage Vin –1.0 to 10 V

Reset Output Voltage VO10 V

Reset Output Sink Current (Note 2) ISink Internally

Limited mA

Clamp Diode Forward Current, Pin 1 to 2 (Note 2) IF100 mA

Power Dissipation and Thermal Characteristics

P Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C

Thermal Resistance, Junction–to–Air

D Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C

Thermal Resistance, Junction–to–Air

DM Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C

Thermal Resistance, Junction–to–Air

RJA

625

200

625

200

520

240

°C/W

Operating Junction Temperature TJ+150 °C

Operating Ambient Temperature

MC34064

MC33064

NCV33064

TA0 to +70

–40 to +85

–40 to +125

°C

Storage Temperature Range Tstg –65 to +150 °C

1. ESD data available upon request.

ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range

that applies [Notes 3 and 4] unless otherwise noted.)

Characteristics Symbol Min Typ Max Unit

COMPARATOR

Threshold Voltage

High State Output (Vin Increasing)

Low State Output (Vin Decreasing)

Hysteresis

VIH

VIL

4.5

0.01

4.61

4.59

0.02

4.7

0.05

RESET OUTPUT

Output Sink Saturation

(Vin = 4.0 V, ISink = 8.0 mA)

(Vin = 4.0 V, ISink = 2.0 mA)

(Vin = 1.0 V, ISink = 0.1 mA)

VOL –

–

0.46

0.15

–

1.0

0.4

0.1

Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA

Output Off-State Leakage (Vin, Reset = 5.0 V) IOH – 0.02 0.5 A

Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) VF0.6 0.9 1.2 V

TOTAL DEVICE

Operating Input Voltage Range Vin 1.0 to 6.5 – – V

Quiescent Input Current (Vin = 5.0 V) Iin – 390 500 A

2. Maximum package power dissipation limits must be observed.

3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

4. Tlow =0°C for MC34064 Thigh = +70°C for MC34064

–40°C for MC33064 +85°C for MC33064

–40°C for NCV33064 +125°C for NCV33064

5. NCV prefix is for automotive and other applications requiring site and change control.

MC34064, MC33064, NCV33064

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VO, OUTPUT VOLTAGE (V)

Figure 2. Reset Output Voltage versus

Input Voltage Figure 3. Reset Output Voltage versus

Input Voltage

Figure 4. Comparator Threshold Voltage

versus Temperature Figure 5. Input Current versus Input Voltage

Figure 6. Reset Output Saturation versus

Sink Current Figure 7. Reset Delay Time

Vin, INPUT VOLTAGE (V)

8.0

6.0

4.0

2.0

00 2.0 4.0 6.0 8.0 10

RL = 10 k to Vin

TA = 25°C

Vin, INPUT VOLTAGE (V)

5.0

4.0

3.0

2.0

1.0

04.560 4.580 4.600 4.620 4.640

RL = 10 k to Vin

TA = 25°C

TA, AMBIENT TEMPERATURE (°C)

th, THRESHOLD VOLTAGE (V)

4.630

4.620

4.610

4.600

4.590

4.580

4.570-55 -25 0 25 50 75 100 125

RL = 10 k to Vin

Upper Threshold

High State Output

Lower Threshold

Low State Output

Vin, INPUT VOLTAGE (V)

in, INPUT CURRENT (mA)

1.0

0.8

0.6

0.4

0.2

00 2.0 4.0 6.0 8.0 10

TA = +25°C

-40°C

TA = +25°C

+85°C-40°C

VOL, OUTPUT SATURATION (V)

ISink, SINK CURRENT (mA)

2.0

1.5

1.0

0.5

0010203040

Vin = 4.0 V

TA = 85°C

TA = 25°C

TA = -40°C

90%

5.0 V -

4.0 V -

10%

+85°C

Reset

Vin

5.0V

4.0V

REF

10k

200 ns/DIV

Reset

Vin

Vin = 5.0 V to 4.0 V

RL = 10 k

TA = 25°C

Figure 8. Clamp Diode Forward Current versus Voltage

Figure 9. Low Voltage Microprocessor Reset

Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis

00 0.4 0.8 1.2 1.6

VF, FORWARD VOLTAGE (V)

, FORWARD CURRENT (mA)

Vin = 0 V

TA = 25°C

A time delayed reset can be accomplished with the

addition of CDLY

. For systems with extremely fast

power supply rise times (<500 ns) it is recommended

that the RCDLY time constant be greater than 5.0 s.

Vth(MPU) is the microprocessor reset input threshold.

tDLY = RCDLY In

1 - Vth(MPU)

Power

Supply

2 (2) R

1 (1)

Reset

CDLY

Microprocessor

Circuit

1.2 Vref

3 (4)

Power

Supply

2 (2) RL

1 (1) Reset

Microprocessor

Circuit

1.2Vref

3 (4)

VH ≈4.6 RH+ 0.02

Vth(lower) ≈ 340 RH x 10-6

Where:RH ≤ 150 

Where:RL ≥ 1.5 , ≤ 10 k

Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been

simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold

(Figure 4). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 340 A at

4.59V. The equations are accurate to ±10% with RH less than 150  and RL between 1.5 k and 10 k

Iin

Vin

MC34064, MC33064, NCV33064

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Test Data

(mV) Vth

(mV) RH

()RL

(k)

20 0 0 0

51 3.4 10 1.5

40 6.8 20 4.7

81 6.8 20 1.5

71 10 30 2.7

112 10 30 1.5

100 16 47 2.7

164 16 47 1.5

190 34 100 2.7

327 34 100 1.5

276 51 150 2.7

480 51 150 1.5

Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger

Figure 13. Low Power Switching Regulator

Figure 14. MOSFET Low Voltage Gate Drive Protection

Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above

circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2

MOSFET.

270

4.6V

VCC

MTP3055EL

2 (2)

1 (1)

3 (4)

1.2Vref

2 (2)

1 (1)

3 (4)

1.2Vref

Power

Supply

1.0k

2 (2)

1 (1)

3 (4)

1.2Vref

Solar

Cells

2 (2)

1 (1)

3 (4)

1.2Vref

Vin = 11.5

to 14.5V

470

MPSW51A

25H

VO = 5.0 V

IO = 50 mA

470 +

68022 +

1N5819

1.2k

330 1N756

4.7k

MC34064, MC33064, NCV33064

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Test Conditions Results

Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV

Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV

Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp

Efficiency Vin = 12.6 V, IO = 50 mA 77%

MC34064, MC33064, NCV33064

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ORDERING INFORMATION

Device Operating Temperature Range Package Shipping

MC34064D–5 SO–8 98 Units / Rail

MC34064D–5R2 SO–8 2500 Units/ Tape & Reel

MC34064DM–5R2

T=0°Cto+70°C

Micro8 4000 Units / Tape & Reel

MC34064P–5 TA = 0°C to +70°CTO–226AA 2000 Units / Bag

MC34064P–5RA TO–226AA 2000 Units / Tape & Reel

MC34064P–5RP TO–226AA 2000 Units / Ammo Pack

MC33064D–5 SO–8 98 Units / Rail

MC33064D–5R2 SO–8 2500 Units / Tape & Reel

MC33064DM–5R2

T=40°Cto+85°C

Micro8 4000 Units / Tape & Reel

MC33064P–5 TJ = –40°C to +85°CTO–226AA 2000 Units / Bag

MC33064P–5RA TO–226AA 2000 Units / Tape & Reel

MC33064P–5RP TO–226AA 2000 Units / Ammo Pack

NCV33064D–5R2* SO–8 2500 Units / Tape & Reel

NCV33064P–5RA* TA = –40°C to +125°CTO–226AA 2000 Units / Tape & Reel

NCV33064P–5RP*

A0Co 5C

TO–226AA 2000 Units / Ammo Pack

*NCV33064: Tlow = –40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring

site and change control.

ALYW5

3x064

SO–8

D SUFFIX

CASE 751

x = 3 or 4

y = I or C

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W= Work Week

MARKING DIAGRAMS

Micro8

DM SUFFIX

CASE 846A

Ly50

AYW

TO–226AA

P SUFFIX

CASE 29

MC3x0

64P–5

ALYWW

123

*This marking diagram also applies to NCV33064P.

MC34064, MC33064, NCV33064

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PACKAGE DIMENSIONS

P SUFFIX

PLASTIC PACKAGE

CASE 29–11

(TO–226AA)

ISSUE AL

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION X–X

SEATING

PLANE DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.20

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.045 0.055 1.15 1.39

H0.095 0.105 2.42 2.66

J0.015 0.020 0.39 0.50

K0.500 --- 12.70 ---

L0.250 --- 6.35 ---

N0.080 0.105 2.04 2.66

P--- 0.100 --- 2.54

R0.115 --- 2.93 ---

V0.135 --- 3.43 ---

D SUFFIX

PLASTIC PACKAGE

CASE 751–07

(SO–8)

ISSUE W

SEATING

PLANE

X 45

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

0.10 (0.004)

DIM

MIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

–X–

–Y–

0.25 (0.010)

–Z–

0.25 (0.010) Z SXS



MC34064, MC33064, NCV33064

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PACKAGE DIMENSIONS

DM SUFFIX

PLASTIC PACKAGE

CASE 846A–02

(Micro8)

ISSUE E

0.08 (0.003) A S

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A2.90 3.10 0.114 0.122

B2.90 3.10 0.114 0.122

C--- 1.10 --- 0.043

D0.25 0.40 0.010 0.016

G0.65 BSC 0.026 BSC

H0.05 0.15 0.002 0.006

J0.13 0.23 0.005 0.009

K4.75 5.05 0.187 0.199

L0.40 0.70 0.016 0.028

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

–B–

–A–

PIN 1 ID

8 PL

0.038 (0.0015)

–T– SEATING

PLANE

HJL

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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

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PUBLICATION ORDERING INFORMATION

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Phone: 81–3–5740–2700

Email: r14525@onsemi.com

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For additional information, please contact your local

Sales Representative.

MC34064/D

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