Data Sheet
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© 2014 ROHM Co., Ltd. All rights reserved.
lFeatures lOutline
•
Viewing angle 2θ 1/2 : 35°, 50
lDimensions
lSpecifications
Viewing angle 2θ 1/2 / 35°: Standard
Typ.
IFMax. VRMin. Typ. IF
(V) (mA) (mA) (V) (mcd) (mcd) (mA)
SLR-322VC
SLR-322DC
SLR-322YC 3.6 10
SLR-322MC 9 25
Viewing angle 2θ 1/2 / 50°: Standard
Typ.
IFMax. VRMin. Typ. IF
(V) (mA) (mA) (V) (mcd) (mcd) (mA)
SLR-322VR 3.6 10
SLR-322DU 2.2 6.3
SLR-322YY 3.6 10
SLR-322MG 5.6 16
*:Duty1/5, 200Hz
20
Orange
605
Yellow
2.1
587
Yellowish Green
75
25
572
10
3
630
10
3
-25 to +85
-30 to +100
2.0
10
GaAsP
on GaP
GaAsP
on GaP
Red
60
20
60*
GaP
IF
PD(mW)
IF(mA)
IFP(mA)
VR(V)
Topr(ºC)
Tstg(ºC)
(nm)
(mA)
Part No.
Chip
Structure
Absolute Maximum Ratings (Ta=25ºC)
Electrical and Optical Characteristics (Ta=25ºC)
Emitting
Power
Forward
Peak Forward
Reverse
Operating Temp.
Storage Temp.
Dissipation
Current
Current
Voltage
Typ.
(mA)
Dominant Wavelength lD
Power
Typ.
IF
10
3
5.0
16
-25 to +85
-30 to +100
2.0
2.1
10
10
25
630
605
587
572
SLR-322 Series
Tstg(ºC)
Chip
Structure
Absolute Maximum Ratings (Ta=25ºC)
IFP(mA)
Current
VR(V)
Voltage
Dissipation
Current
PD(mW)
Electrical and Optical Characteristics (Ta=25ºC)
Storage Temp.
Forward Voltag VF
lRecommended Solder Pattern
Luminous Intensity IV
IF(mA)
Topr(ºC)
(nm)
Forward
Peak Forward
Reverse
Operating Temp.
Reverse Current IR
Part No.
Emitting
Color
Red
20
GaP
Orange
Yellow
Yellowish Green
60
20
Forward Voltag VF
Reverse Current IR
Dominant Wavelength lD
Luminous Intensity IV
75
60*
3
Color
(unit : mm)
Tolerance : 0.2
(unit : mm)
V
D
Y
Color
Type
M
2.5 or 5.0
2.01.0±0.1
1/6
2014.11 - Rev.C
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Data Sheet
SLR-322 Series
lElectrical Characteristics Curves
10
1.0
0.1 1.51.0 2.0 2.5 3.0
50
-40 -20 0 20 40 60 80 100
1.4
1.2
1.0
0.8
0.6
0.4
10
1
0.1 1 10 100
0.1
20
10
0
-40 -20 0 20 40 60 80 100
30
Fig.1 Forward Current - Forward Voltages
FORWARD CURRENT : IF [mA]
FORWARD VOLTAGE : VF [V]
Ta=25ºC
Fig.2 Luminous Intensity -
Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
FORWARD CURRENT : IF [mA]
IF=10mA
Fig.4 Derating
AMBIENT TEMPERATURE : Ta [ºC]
SLR-322VC
SLR
-322VR
SLR
-322DC
SLR
-322DU
SLR
-322YC
SLR
-322YY
SLR
-322MC
SLR-322MG
Ta=25ºC
SLR-322VC
SLR
-322VR
SLR
-322DC
SLR
-322DU
SLR
-322YC
SLR
-322YY
SLR
-322MC
SLR-322MG
SLR-322VC
SLR
-322VR
SLR
-322DC
SLR
-322DU
SLR
-322YC
SLR
-322YY
SLR
-322MC
SLR-322MG
SLR-322VC
SLR
-322VR
SLR
-322DC
SLR
-322DU
SLR
-322YC
SLR
-322YY
SLR
-322MC
SLR-322MG
RELATIVE LUMINOUS INTENSITY [a.u.]
MAXIMUM FORWARD CURRENT : IF MAX. [mA]
2/6
2014.11 - Rev.C
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Data Sheet
SLR-322 Series
lViewing Angle
lRank Reference of Brightness
lPart No. Construction
Directivity (deg)
RELATIVE INTENSITY
10°
10° 20°
20°
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
0°
30°
60°
90°
30°
60°
90°
X
-
YX'
-
Y'
Directivity (deg)
RELATIVE INTENSITY
SLR-322 Series
SLR-322 Series（Clear）
X ‐Y
X’‐Y’
X ‐Y
X’‐Y’
10°
10° 20°
20°
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
0°
30°
60°
90°
30°
60°
90°
X
-
YX'
-
Y'
Red (V)
(Ta=25ºC, IF＝10mA)
E F G H J K L M N P Q
0.40 to 0.63 0.63 to 1.0 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63
*SLR-322VC
*SLR-322VR
Orange (D)
(Ta=25ºC, IF＝10mA)
E F G H J K L M N P Q
0.40 to 0.63 0.63 to 1.0 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63
*SLR-322DC
*SLR-322DU
Yellow (Y)
(Ta=25ºC, IF＝10mA)
E F G H J K L M N P Q
0.40 to 0.63 0.63 to 1.0 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63
*SLR-322YC
*SLR-322YY
Green(M)
(Ta=25ºC, IF＝10mA)
E F G H J K L M N P Q
0.40 to 0.63 0.63 to 1.0 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63
*SLR-322MC
*SLR-322MG
*Brightness on specification sheet include tolerance of within ±10%.
Rank
Iv (mcd)
Rank
Rank
Iv (mcd)
Iv (mcd)
Rank
Iv (mcd)
3/6
2014.11 - Rev.C
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Data Sheet
< Good > < No good >
To be fixed
< Good > < No good > < Good >
< 2 lead pins type >
< 3 lead pins type >
< 2 lead pin type > < 3 lead pin type >
Min.1
5°
Min.4
5°
Min.1
5°
Min.45°
Die bonding side
Min.4
5°
To be fixed
Die bonding side
SLR-322 Series
2014.11 - Rev.C
4/6
lAttention Points In Handling
Visual light emitting diode does not contain reinforcement materials such as glass fillers.
Therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous intensity
may occur. Please take care of the handling.
■FIXATION METHOD
1. ATTENTION POINTS
(1) Please do not give excessive heat over storage temperature to resin.
In case that the product has to be heated in oven for the glue fixing of surface mount pats, this LED should
be mounted after the glue fixing.
(2) Please avoid stress to resin at high temperature.
2. TERMINATION PROCESSING
(1) In case of termination processing, please fix the
termination
(2) Processing position, and process the reverse side of
LED body.
If stress is given during processing, It may cause
non-lighting failure.
(3) Please process before soldering.
3. ASSEMBLY ON PC BOARD
(1) In case of soldering on PCB, If the operation is done with stress, it may cause non-lighting failure during
soldering or using.
Please design the through-holes of PCB suitable for lead pins space or lead pins space after formin to avoid
the physical stress on resin.
(2) Using spacer between LED’s body and PCB is recommended.
In case of direct mount on PCB(SLR/SLI-343 series), please take care about clinch of led pins
to avoid the remained stress and solder heat stress.
Enough evaluation is requested before deciding assembly and soldering conditions.
Please consult with us if any problems in the evaluation stage.
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Data Sheet
∗Unit : mm
∗Lead types : □0.4mm
□0.5mm
< 2lead pin type > < 3lead pin type/2.5mm pitch > < 3 lead pin type/2.0mm pitch >
±
φ
±±
SLR-322 Series
2014.11 - Rev.C
5/6
4. SOLDERING (Sn-3Ag-0.5Cu)
(1) Please make soldering rapidly under the following temperature and time conditions.
(2) Please avoid stress to LED lamp during soldering.
(3) In case of double peak flow soldering, the temperature gap during 1st and 2nd soldering to be less than 100
degree C.
<Recommendable soldering conditions>
ARTIICLE SOLDERING
TEMP
OPERATION
TIME Remarks
Soldering
Dip
Pre-heat Max. 100ºC 60sec Max. -
Soldering
Bath Max. 265ºC 5sec Max.
In case of double peak flow soldering, the operation
time is counted from the beginning of 1st peak to the
end of 2nd peak.
Soldering Iron Max. 400ºC 3sec Max. The iron should not touch the LED’s body.
5. CLEANING
In case of cleaning, some solvents may cause damage of resin or cause non-lighting failure, so please check
the solvent before actual use.
The recommendable cleaning solvent is alcoholic one such as isopropyl alcohol.
<RECOMMENDABLE CLEANING CONDITIONS>
METHOD CONDITIONS
Cleaning by solvent
Temperature of
solvent : Max. 45ºC
Immersion time : Max. 3min
Cleaning by solvent Ultrasonic out : Ultrasonic out
Cleaning time : Max. 3min
6. RECOMMENDABLE ROUND PATTERN
Round pattern depends on the material PCB, density and circuit arrangement.
Our recommendation is as follow :
■ATTENTION ON STORAGING
Storage in dry box is most desirable, but if it is not possible, we recommend following conditions.
<RECOMMENDABLE STORAGE CONDITIONS>
ARTICLE Temperature Humidity Expiration Date
CONDITIONS 5 to 30ºC Max.60%RH Within 1 year
Poor storage conditions may cause some failure as bellow.
(1) Lead pins may corrode if it is stored in the environment of high temperature and humidity and lead to defective
soldering.
(2) In case of soldering after LED’s body absorb moisture highly, destruction or inferiority of luminous intensity
may occur.
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Data Sheet
SLR-322 Series
2014.11 - Rev.C
6/6
■APPLICATION METHOD
1. Precaution for Drive System and Off Mode
• Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the
products.
• If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous
intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of current
in LED.)
• Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the products
with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result in
function failure.
2. Operation Life Span
There’s possibility for intensity of light drop according to working conditions and environments (applied current,
surrounding temperature and humidity, corrosive gases ), please call our Sales staffs for inquiries about the
concerned application below.
(1) Longtime intensity of light life
(2) On mode all the time
3. Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier,
Switching and so on.
■OTHERS
1. Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia),
it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical
characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste)
aterials.
All of the above will cause function failure of the products.
Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of
the surrounding parts of the products and the atmospheric environment).
2. Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the
electrostatic discharge.
Please take appropriate measures to avoid the static electricity from human body and earthing setting of
production equipment. The resistance values of electrostatic discharge (actual values) are different varies with
products, therefore, please call our Sales staffs for inquiries.
3. Electromagnetic Wave
Please concern the influence on LED in case of application with strong electromagnetic wave such as IH
(Induction heating).
R1102
A
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Notice
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Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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