0.1–6 GHz 3 V, 14 dBm Amplifier
Technical Data
Features
• +14.8 dBm P1dB at 2.0 GHz
+17 dBm Psat at 2.0 GHz
• Single +3V Supply
• 2.8 dB Noise Figure at
2.0 GHz
• 12.4 dB Gain at 2.0 GHz
• Ultra-miniature Package
• Unconditionally Stable
Applications
• Buffer or Driver Amp for
PCS, PHS, ISM, SATCOM
and WLL Applications
• High Dynamic Range LNA
MGA-81563
Description
Agilent’s MGA-81563 is an eco-
nomical, easy-to-use GaAs MMIC
amplifier that offers excellent
power and low noise figure for
applications from 0.1 to 6 GHz.
Packaged in an ultra-miniature
SOT-363 package, it requires half
the board space of a SOT-143
package.
The output of the amplifier is
matched to 50 Ω (better than
2.1:1 VSWR) across the entire
bandwidth. The input is partially
matched to 50 Ω (better than
2.5:1 VSWR) below 4 GHz and
fully matched to 50 Ω (better than
2:1 VSWR) above. A simple series
inductor can be added to the input
to improve the input match below
4 GHz. The amplifier allows a
wide dynamic range by offering a
2.7 dB NF coupled with a +27 dBm
Output IP3.
The circuit uses state-of-the-art
PHEMT technology with proven
reliability. On-chip bias circuitry
allows operation from a single
+3 V power supply, while resistive
feedback ensures stability (K>1)
over all frequencies and
temperatures.
Surface Mount Package
SOT-363 (SC-70)
Pin Connections and
Package Marking
OUTPUT
and V
d
GND
81
GND
GND
INPUT
1
2
3
6
5
4 GND
Note: Package marking provides
orientation and identification.
Simplified Schematic
INPUT
3
OUTPUT
and V
d
6
GND
BIAS
1, 2, 4, 5
BIAS
2
Thermal Resistance[2]:
θch-c = 220°C/W
Notes:
1. Permanent damage may occur if
any of these limits are exceeded.
2. TC = 25°C (TC is defined to be the
temperature at the package pins
where contact is made to the
circuit board.)
MGA-81563 Electrical Specifications, TC = 25°C, ZO = 50 Ω, Vd = 3 V
Symbol Parameters and Test Conditions Units Min. Typ. Max. Std Dev[2]
Gtest Gain in test circuit[1] f = 2.0 GHz 10.5 12.4 0.44
NFtest Noise Figure in test circuit[1] f = 2.0 GHz 2.8 3.8 0.21
NF50 Noise Figure in 50 Ω system f = 0.5 GHz dB 3.1
f = 1.0 GHz 3.0
f = 2.0 GHz 2.7 0.21
f = 3.0 GHz 2.7
f = 4.0 GHz 2.8
f = 6.0 GHz 3.5
|S21|2Gain in 50 Ω system f = 0.5 GHz dB 12.5
f = 1.0 GHz 12.5
f = 2.0 GHz 12.3 0.44
f = 3.0 GHz 11.8
f = 4.0 GHz 11.4
f = 6.0 GHz 10.2
P1 dB Output Power at 1 dB Gain Compression f = 0.5 GHz dBm 15.1
f = 1.0 GHz 14.8
f = 2.0 GHz 14.8 0.86
f = 3.0 GHz 14.8
f = 4.0 GHz 14.8
f = 6.0 GHz 14.7
IP3Output Third Order Intercept Point f = 2.0 GHz dBm +27 1.0
VSWRin Input VSWR f = 2.0 GHz 2.7:1
VSWRout Output VSWR f = 2.0 GHz 2.0:1
IdDevice Current mA 31 42 51
Notes:
1. Guaranteed specifications are 100% tested in the circuit in Figure 10 in the Applications Information section.
2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during
the initial characterization of this product, and is intended to be used as an estimate for distribution of the typical
specification.
MGA-81563 Absolute Maximum Ratings Absolute
Symbol Parameter Units Maximum[1]
VdDevice Voltage, RF Output V 6.0
to Ground
Vgd Device Voltage, Gate V -6.0
to Drain
Vin Range of RF Input Voltage V +0.5 to -1.0
to Ground
Pin CW RF Input Power dBm +13
Tch Channel Temperature °C 165
TSTG Storage Temperature °C -65 to 150
3
MGA-81563 Typical Performance, TC = 25° C, Vd = 3 V
034512 6 0 34512 6
FREQUENCY (GHz) FREQUENCY (GHz)
Figure 2. Noise Figure (into 50 Ω)
vs. Frequency and Temperature.
TA = +85°C
TA = +25°C
TA = –40°C
0
2
4
6
8
16
12
14
10
GAIN (dB)
0
1
2
3
4
5
NOISE FIGURE (dB)
TA = +85°C
TA = +25°C
TA = –40°C
Figure 1. 50 Ω Power Gain vs.
Frequency and Temperature.
034512 6
FREQUENCY (GHz)
Figure 3. Output Power @ 1 dB Gain
Compression vs. Frequency and
Temperature.
P1 dB (dBm)
11
12
13
14
15
16
TA = +85°C
TA = +25°C
TA = –40°C
0
1
2
3
4
5
034512 6
NOISE FIGURE (dB)
FREQUENCY (GHz)
Figure 5. Noise Figure (into 50 Ω) vs.
Frequency and Voltage.
Vd = 3.3V
Vd = 3.0V
Vd = 2.7V
11
12
13
14
15
16
034512 6
FREQUENCY (GHz)
Figure 6. Output Power @ 1 dB Gain
Compression) vs. Frequency and
Voltage.
P1 dB (dBm)
Vd = 3.3V
Vd = 3.0V
Vd = 2.7V
0
2
4
6
8
16
12
14
10
034512 6
GAIN (dB)
FREQUENCY (GHz)
Figure 4. 50 Ω Power Gain vs.
Frequency and Voltage.
Vd = 3.3V
Vd = 3.0V
Vd = 2.7V
034512 6
VSWR (n:1)
FREQUENCY (GHz)
Figure 7. Input and Output VSWR
into 50 Ω vs. Frequency.
1
1.5
2
3
2.5
4
3.5
034512
0
10
20
40
30
60
50
DEVICE CURRENT (mA)
DEVICE VOLTAGE (V)
Figure 8. Device Current vs. Voltage
and Temperature.
FREQUENCY (GHz)
Figure 9. Minimum Noise Figure and
Associated Gain vs. Frequency.
GAIN and NF (dB)
TA = +85°C
TA = +25°C
TA = -40°CNF
Gain
034512 6
0
2
4
6
8
16
12
14
10
Input
Output
4
MGA-81563 Typical Scattering Parameters[1], TC = 25°C, ZO = 50 Ω, Vd = 3 V
Freq. S11 S21 S12 S22 K
GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor
0.1 0.57 -16 13.02 4.48 172 -25 0.051 312 0.43 -14 1.47
0.2 0.52 -13 12.58 4.258 171 -25 0.057 17 0.38 -13 1.58
0.5 0.49 -16 12.35 4.15 164 -25 0.059 8 0.35 -9 1.64
1.0 0.48 -28 12.18 4.06 152 -25 0.061 5 0.35 -15 1.65
1.5 0.47 -40 12.00 3.98 140 -25 0.063 5 0.34 -22 1.65
2.0 0.45 -52 11.82 3.90 128 -24 0.067 4 0.34 -30 1.65
2.5 0.43 -63 11.63 3.81 116 -24 0.070 2 0.32 -39 1.66
3.0 0.39 -75 11.37 3.70 104 -24 0.074 -1 0.31 -46 1.69
3.5 0.35 -87 11.11 3.59 93 -22 0.077 -4 0.29 -53 1.73
4.0 0.32 -100 10.85 3.49 81 -22 0.081 -7 0.27 -60 1.77
4.5 0.28 -114 10.58 3.38 70 -22 0.083 -11 0.25 -67 1.82
5.0 0.25 -130 10.30 3.27 59 -21 0.087 -15 0.23 -74 1.85
5.5 0.22 -146 10.02 3.17 49 -21 0.09 -20 0.21 -81 1.91
6.0 0.20 -166 9.75 3.07 38 -21 0.091 -25 0.19 -90 1.93
6.5 0.18 174 9.46 2.97 27 -21 0.093 -30 0.17 -96 1.98
7.0 0.17 150 9.12 2.86 16 -21 0.094 -36 0.14 -100 2.05
MGA-81563 Typical Noise Parameters[1]
TC = 25°C, ZO = 50 Ω, Vd = 3 V
Frequency NFOΓopt Rn/50 Ω
GHz dB Mag. Ang. —
0.5 2.90 0.16 1 1.57
1.0 2.80 0.15 17 0.96
1.5 2.70 0.14 28 0.75
2.0 2.69 0.14 37 0.41
2.5 2.68 0.13 44 0.39
3.0 2.68 0.11 50 0.38
3.5 2.68 0.09 56 0.36
4.0 2.69 0.06 65 0.34
4.5 2.69 0.03 76 0.33
5.0 2.68 0.01 137 0.32
5.5 2.67 0.02 -135 0.32
6.0 2.67 0.05 -109 0.32
6.5 2.71 0.07 -95 0.33
7.0 2.77 0.09 -78 0.36
Note:
1. Reference plane per Figure 11 in Applications Information section.
5
MGA-81563 Applications
Information
Introduction
This high performance GaAs
MMIC amplifier was developed for
commercial wireless applications
from 100 MHz to 6 GHz.
The MGA-81563 runs on only
3 volts and typically requires only
42 mA to deliver 14.8 dBm of
output power at 1 dB gain
compression.
An innovative internal bias circuit
regulates the device’s internal
current to enable the MGA-81563
to operate over a wide tempera-
ture range with a single, positive
power supply of 3 volts.
The MGA-81563 will operate with
reduced performance with
voltages as low as 1.5 volts.
The MGA-81563 uses resistive
feedback to simultaneously
achieve flat gain over a wide
bandwidth and match the input
and output impedances to 50 Ω.
The MGA-81563 is unconditionally
stable (K>1) over its entire
frequency range, making it both
very easy to use and yielding
consistent performance in the
manufacture of high volume
wireless products.
With a combination of high
linearity (+27 dBm output IP3) and
low noise figure (3 dB), the
MGA-81563 offers outstanding
performance for applications
requiring a high dynamic range,
such as receivers operating in
dense signal environments. A wide
dynamic range amplifier such as
the MGA-81563 can often be used
to relieve the requirements of
bulky, lossy filters at a receiver’s
input.
The 14.8 dBm output power (P1dB)
also makes the MGA-81563
extremely useful for pre-driver,
driver and buffer stages. For
transmitter gain stage applications
that require higher output power,
the MGA-81563 can provide
50 mW (17 dBm) of saturated
output power with a high power
added efficiency of 45%.
Test Circuit
The circuit shown in Figure 10 is
used for 100% RF testing of Noise
Figure and Gain. The 3.9 nH
inductor at the input fix-tunes the
circuit to 2 GHz. The only purpose
of the RFC at the output is to
apply DC bias to the device under
test. Tests in this circuit are used
to guarantee the NFtest and Gtest
parameters shown in the table of
Electrical Specifications.
RF
INPUT
3.9 nH
22 nH
RFC
100 pF
100 pF
Vd
RF
OUTPUT
81
Figure 10. Test Circuit.
Phase Reference Planes
The positions of the reference
planes used to specify the S-
Parameters and Noise Parameters
for this device are shown in
Figure 11. As seen in the illustra-
tion, the reference planes are
located at the point where the
package leads contact the test
circuit.
TEST CIRCUIT
REFERENCE
PLANES
Figure 11. Phase Reference Planes.
Specifications and Statistical
Parameters
Several categories of parameters
appear within this data sheet.
Parameters may be described with
values that are either “minimum
or maximum,” “typical,” or
“standard deviations.”
The values for parameters are
based on comprehensive product
characterization data, in which
automated measurements are
made on of a minimum of
500 parts taken from 3 non-
consecutive process lots of
semiconductor wafers. The data
derived from product character-
ization tends to be normally
distributed, e.g., fits the standard
“bell curve.”
Parameters considered to be the
most important to system perfor-
mance are bounded by minimum
or maximum values. For the
MGA-81563, these parameters are:
Gain (Gtest), Noise Figure (NFtest),
and Device Current (Id). Each of
these guaranteed parameters is
100% tested.
Values for most of the parameters
in the table of Electrical Specifica-
tions that are described by typical
data are the mathematical mean
(µ), of the normal distribution
taken from the characterization
data. For parameters where
measurements or mathematical
averaging may not be practical,
such as the Noise and S-parameter
tables or performance curves, the
data represents a nominal part
taken from the “center” of the
characterization distribution.
Typical values are intended to be
used as a basis for electrical
design.
6
To assist designers in optimizing
not only the immediate circuit
using the MGA-81563, but to also
optimize and evaluate trade-offs
that affect a complete wireless
system, the standard
deviation (σ) is provided for
many of the Electrical Specifica-
tions parameters (at 25°) in
addition to the mean. The stan-
dard deviation is a measure of the
variability about the mean. It will
be recalled that a normal distribu-
tion is completely described by
the mean and standard deviation.
Standard statistics tables or
calculations provide the probabil-
ity of a parameter falling between
any two values, usually symmetri-
cally located about the mean.
Referring to Figure 12 for ex-
ample, the probability of a param-
eter being between ±1σ is 68.3%;
between ±2σ is 95.4%; and be-
tween ±3σ is 99.7%.
68%
95%
99%
Parameter Value
Mean (µ)
(typical)
-3σ-2σ-1σ+1σ+2σ+3σ
Figure 12. Normal Distribution.
RF Layout
The RF layout in Figure 13 is
suggested as a starting point for
microstripline designs using the
MGA-81563 amplifier. Adequate
grounding is needed to obtain
optimum performance and to
maintain stability. All of the
ground pins of the MMIC should
be connected to the RF
groundplane on the backside of
the PCB by means of plated
through holes (vias) that are
placed near the package termi-
nals. As a minimum, one via
should be located next to each
ground pin to ensure good RF
grounding. It is a good practice to
use multiple vias to further
minimize ground path inductance.
81
50 Ω
50 Ω
RF Input RF Output
and Vd
Figure 13. RF Layout.
It is recommended that the PCB
pads for the ground pins not be
connected together underneath
the body of the package. PCB
traces hidden under the package
cannot be adequately inspected
for SMT solder quality.
PCB Material
FR-4 or G-10 printed circuit board
materials are a good choice for
most low cost wireless applica-
tions. Typical board thickness is
0.020 to 0.031 inches. The width of
the 50 Ω microstriplines on PC
boards in this thickness range is
also very convenient for mounting
chip components such as the
series inductor at the input or DC
blocking and bypass capacitors.
For higher frequencies or for
noise figure critical applications,
the additional cost of PTFE/glass
dielectric materials may be
warranted to minimize transmis-
sion line loss at the amplifier’s
input. A 0.5 inch length of 50 Ω
microstripline on FR-4, for
example, has approximately
0.3 dB loss at 4 GHz. This loss will
add directly to the noise figure of
the MGA-81563.
Biasing
The MGA-81563 is a voltage-
biased device and is designed to
operate from a single, +3 volt
power supply with a typical
current drain of 42 mA. The
internal current regulation circuit
allows the amplifier to be oper-
ated with voltages as high +5 volts
or as low as +1.5 volt. Refer to the
section titled “Operation at Bias
Voltages Other than 3 Volts” for
information on performance and
precautions when using other
voltages.
Typical Application Example
The printed circuit layout in
Figure 14 can serve as a design
guide. This layout is a
microstripline design (solid
groundplane on the backside of
the circuit board) with a 50 Ω
input and output. The circuit is
fabricated on 0.031-inch thick
FR-4 dielectric material. Plated
through holes (vias) are used to
bring the ground to the top side of
the circuit where needed. Multiple
vias are used to reduce the
inductance of the paths to ground.
IN
OUT
+V
MGA-8-A
Figure 14. PCB Layout.
A schematic diagram of the
application circuit is shown in
Figure 15. DC blocking capacitors
(C1 and C2) are used at the input
and output of the MMIC to isolate
the device from adjacent circuits.
7
Although the input terminal of the
MGA-81563 is at ground potential,
it is not a current sink. If the input
is connected to a preceding stage
that has a voltage present, the use
of the DC blocking capacitor (C1)
is required.
C2
C2
C4
C1 L1
RFC
V
d
RF
Output
RF
Input
Figure 15. Schematic Diagram.
DC bias is applied to the MGA-
81563 through the RF Output pin.
An inductor (RFC), or length of
high impedance transmission line
(preferably λ/4 at the band
center), is used to isolate the RF
from the DC supply.
The power supply is bypassed to
ground with capacitor C3 to keep
RF off of the DC lines and to
prevent gain dips or peaks in the
response of the amplifier.
An additional bypass capacitor,
C4, may be added to the bias line
near the Vd connection to elimi-
nate unwanted feedback through
bias lines that could cause oscilla-
tion. C4 will not normally be
needed unless several stages are
cascaded using a common power
supply.
When multiple bypass capacitors
are used, consideration should be
given to potential resonances. It is
important to ensure that the
capacitors when combined with
additional parasitic L’s and C’s on
the circuit board do not form
resonant circuits. The addition of
a small value resistor in the bias
supply line between bypass
capacitors will often “de-Q” the
bias circuit and eliminate the
effect of a resonance.
The value of the DC blocking and
RF bypass capacitors (C1– C3)
should be chosen to provide a
small reactance (typically
< 5 ohms) at the lowest operating
frequency. The reactance of the
RF choke (RFC) should be high
(e.g., several hundred ohms) at
the lowest frequency of operation.
The MGA-81563’s response at low
frequencies is limited to approxi-
mately 100 MHz by the size of
capacitors integrated on the
MMIC chip.
The input of the MGA-81563 is
partially matched internally to
50 Ω. Without external matching
elements, the input VSWR of the
MGA-81563 is 3.0:1 at 300 MHz
and decreases to 1.5:1 at 6 GHz.
This will be adequate for many
applications. If a better input
VSWR is required, the use of a
series inductor, L1 in the applica-
tions example, (or, alternatively a
length of high impedance trans-
mission line) is all that is needed
to improve the match. The table in
Figure 16 shows suggested values
for L1 for various wireless fre-
quency bands.
Frequency Inductor, L1
(GHz) (nH)
0.9 10
1.5 6.8
1.9 3.9
2.4 2.7
4.0 0.5
5.8 0
Figure 16. Values for L1.
These values for L1 take into
account the short length of 50 Ω
transmission line between the
inductor and the input pin of the
device.
For applications requiring mini-
mum noise figure (NFo), some
improvement over a 50 Ω match is
possible by matching the signal
input to the optimum noise match
impedance, Γo, as specified in the
“Typical Noise Parameters” table.
For most applications, as shown
in the example circuit, the output
of the MGA-81563 is already
sufficiently well matched to 50 Ω
and no additional matching is
needed. The nominal device
output VSWR is ≤ 2.2:1 from
300 MHz through 6 GHz.
The completed application
amplifier with all components and
SMA connectors is shown in
Figure 17.
IN
OUT
+V
C4
C3
RFC
C2
L1
C1
MGA-8-A
Figure 17. Complete Application Circuit.
8
Operation in Saturation for
Higher Output Power
For applications such as pre-
driver and driver stages in trans-
mitters, the MGA-81563 can be
operated in saturation to deliver
up to 50 mW (17 dBm) of output
power. The power added effi-
ciency increases to 45% at these
power levels.
There are several design consider-
ations related to reliability and
performance that should be taken
into account when operating the
amplifier in saturation.
First of all, it is important that the
stage preceding the MGA-81563
not overdrive the device. Refer-
ring to the “Absolute Maximum
Ratings” table, the maximum
allowable input power is
+13 dBm. This should be regarded
as the input power level above
which the device could be perma-
nently damaged.
Driving the amplifier into satura-
tion will also affect electrical
performance. Figure 18 presents
the Output Power, Third Order
Intercept Point (Output IP3), and
Power Added Efficiency (PAE) as
a function of Input Power. This
data represents performance into
a 50 Ω load. Since the output
impedance of the device changes
when driven into saturation, it is
possible to obtain even more
output power with a “power
match.” The optimum impedance
match for maximum output power
is dependent on frequency and
actual output power level and can
be arrived at empirically.
-20 -5 0 5-15 -10 10
Pout and IP
3
(dBm), PAE (%)
POWER IN (dBm)
-10
0
10
30
20
50
40
Power
PAE
IP
3
Figure 18. Output Power, IP3, and
Power-Added-Efficiency vs. Input
Power. (Vd = 3.0 V)
As the input power is increased
beyond the linear range of the
amplifier, the gain becomes more
compressed. Gain as a function of
either input or output power may
be derived from Figure 18. Gain
compression renders the amplifier
less sensitive to variations in the
power level from the preceding
stage. This can be a benefit in
systems requiring fairly constant
output power levels from the
MGA-81563.
Increased efficiency (45% at full
output power) is another benefit
of saturated operation. At high
output power levels, the bias
supply current drops by about
15%. This is normal and is taken
into account for the PAE data in
Figure 18.
Noise figure and input impedance
are also affected by saturated
power operation. As a guideline,
the input impedance is lowered,
resulting in an improvement in
input VSWR of approximately 20%.
Like other active devices, the
intermodulation products of the
MGA-81563 increase as the device
is driven further into nonlinear
operation. The 3rd, 5th, and 7th
order intermodulation products of
the MGA-81563 are shown in
Figure 19 along with the funda-
mental response. This data was
measured in the test circuit in
Figure 10.
-30 -5 0 5 10-15 -10 15
Pout, 3rd, 5th, 7th HARMONICS (dBm)
FREQUENCY (GHz)
-60
-50
-40
-20
-30
30
-10
0
10
20
7th5th
3rd
Pout
Figure 19. Intermodulation Products
vs. Input Power. (Vd = 3.0 V)
Operation at Bias Voltages
Other than 3 Volts
While the MGA-81563 is designed
primarily for use in +3 volt
applications, the internal bias
regulation circuitry allows it to be
operated with any power supply
voltage from +1.5 to +5 volts.
Performance of Gain, Noise
Figure, and Output Power over a
wide range of bias voltage is
shown in Figure 20. As can be
seen, the gain and NF are fairly
flat, but an increase in output
power is possible by using higher
voltages. The use of +5 volts
increases the P1dB by 2 dBm.
9
NF, GAIN, P
1 dB
(dB)
SUPPLY VOLTAGE (V)
0
2
4
8
6
18
10
12
14
16
NF
Gain
Power
034512
Figure 20. Gain, Noise Figure, and
Output Power vs. Supply Voltage.
Some thermal precautions must
be observed for operation at
higher bias voltages. For reliable
operation, the channel tempera-
ture should be kept within the
165°C indicated in the “Absolute
Maximum Ratings” table. As a
guideline, operating life tests have
established a MTTF in excess of
106 hours for channel tempera-
tures up to 150°C.
There are several means of biasing
the MGA-81563 at 3 volts in
systems that use higher power
supply voltages. The simplest
method, shown in Figure 21a, is to
use a series resistor to drop the
device voltage to 3 volts. For
example, a 47 Ω resistor will drop
a 5-volt supply to 3 volts at the
nominal current of 42 mA. Some
variation in performance could be
expected for this method due to
variations in current within the
specified 31 to 51 mA min/max
range.
47 Ω
(a)
+5 V
Silicon
Diodes
(b)
+5 V
Zener
Diode
(c)
+5 V
Figure 21. Biasing From Higher
Supply Voltages.
A second method illustrated in
Figure 21b, is to use forward-
biased diodes in series with the
power supply. For example, three
silicon diodes connected in series
will drop a 5-volt supply to
approximately 3 volts.
The use of the series diode
approach has the advantage of
less dependency on current
variation in the amplifiers since
the forward voltage drop of a
diode is somewhat current
independent.
Reverse breakdown diodes (e.g.,
Zener diodes) could also be used
as in Figure 21c. However, care
should be taken to ensure that the
noise generated by diodes in
either Zener or reverse break-
down is adequately filtered (e.g.,
bypassed to ground) such that the
diode’s noise is not added to the
amplifier’s signal.
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70)
package used by the MGA-81563 is
shown in Figure 22 (dimensions
are in inches). This layout pro-
vides ample allowance for pack-
age placement by automated
assembly equipment without
adding parasitics that could
impair the high frequency RF
performance of the MGA-81563.
The layout is shown with a
nominal SOT-363 package foot-
print superimposed on the PCB
pads.
0.026
0.035
0.075
0.016
Figure 22. PCB Pad Layout
(dimensions in inches).
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
10
TIME (seconds)
TMAX
TEMPERATURE (°C)
0
0
50
100
150
200
250
60
Preheat
Zone Cool Down
Zone
Reflow
Zone
120 180 240 300
Figure 23. Surface Mount Assembly Profile.
The MGA-81563 is has been
qualified to the time-temperature
profile shown in Figure 23. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for the MGA-81563. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
Electrostatic Sensitivity
GaAs MMICs are
electrostatic discharge
(ESD) sensitive
devices. Although the
MGA-81563 is robust in design,
permanent damage may occur to
these devices if they are subjected
to high energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equip-
ment) can discharge without
detection and may result in
degradation in performance or
failure. The MGA-81563 is an ESD
Class 1 device. Therefore, proper
ESD precautions are recom-
mended when handling, inspect-
ing, and assembling these devices
to avoid damage.
11
Package Dimensions
Outline 63 (SOT-363/SC-70)
2.20 (0.087)
2.00 (0.079) 1.35 (0.053)
1.15 (0.045)
1.30 (0.051)
REF.
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031) 0.20 (0.008)
0.10 (0.004)
0.30 (0.012)
0.10 (0.004)
0.30 REF.
10°
0.425 (0.017)
TYP.
DIMENSIONS ARE IN MILLIMETERS (INCHES)
MGA-81563 Part Number Ordering Information
Part Number No. of Devices Container
MGA-81563-TR1 3000 7" Reel
MGA-81563-BLK 100 antistatic bag
Tape Dimensions and Product Orientation
For Outline 63
Device Orientation
P
P
0
P
2
FW
C
D
1
D
E
A
0
8° MAX.
t
1
(CARRIER TAPE THICKNESS) T
t
(COVER TAPE THICKNESS)
5° MAX.
B
0
K
0
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
2.24 ± 0.10
2.34 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.088 ± 0.004
0.092 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS W
t
1
8.00 ± 0.30
0.255 ± 0.013 0.315 ± 0.012
0.010 ± 0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
WIDTH
TAPE THICKNESS C
T
t
5.4 ± 0.10
0.062 ± 0.001 0.205 ± 0.004
0.0025 ± 0.00004
COVER TAPE
USER
FEED
DIRECTION COVER TAPE
CARRIER
TAPE
REEL END VIEW
8 mm
4 mm
TOP VIEW
81 81 81 81
www.semiconductor.agilent.com
Data subject to change.
Copyright © 1999 Agilent Technologies
Obsoletes 5965-1328E
5965-9684E (11/99)
