4.3 Pull peel strength of land pattern
Consider that the print circuit board corresponding to the land
pattern size and sticking strength with the copper foil.
4.4 Bend strength
The stress in the electrodes and parts body, when the PCB
bends by weight and external stress of parts, causes the joining
electrode flaking off and the crack. Consider the bend ability of
print circuit board.
5. Adhesive
When an adhesive is applied, the spread should be set
corresponding to each part so that there are no overflow into the
land or no dropout of the parts.
5.1 Strength of adhesive must be strong not to fall and move parts
in the mounting process.
5.2 Stiffen at the low temperature as much as possible. Do not heat
parts as the cure temperature.
5.3 Keep without stringy, slumping adhesion, and dewetting that
solder can not adhere to parts.
5.4 After soldering, there must be no causticity.
6. Mounting
Please consider following to install parts in the printed circuit board.
1) Gap of installing position
2) Product floating from land pattern
3) Mechanical stress to overcoat of parts.
6.1 Do not touch with bare-handed in the electrode and wash it well
with an organic solvent when the foreign body such as oils and
fats adheres.
6.2 Mounting trouble of static electricity may occur when you touch
or rub the part, packaging materials and the cover tape of the
taping especially. When you deal with parts on the worktable,
please execute the static electricity prevention measures (like
the electrification prevention mat).
7. Soldering
7.1 The lead free is recommended in the solder paste.
Select appropriate solder paste after executing the evaluations
of soldering and strength of bond, etc.
7.2 Select flux without the causticity.
7.3 The conditions of temperature and time should be well
considered in the soldering process so that any warp or twist in
the printed circuit board may not grow.Moreover, the electrode
might flake off when the substrate is bent after it solders or the
high impact is given parts or around it.
7.4 In VPS Reflow, preheat well so that the difference of
temperature may not big too much between parts and inside of
furnace. A big difference of temperature cause drop out of parts.
7.5 Do not rub the electrodes of resistor with soldering iron. The
electrode may flake off when the iron is pressed on the
electrode. Do not raise the temperature of the soldering iron
more than necessary when the side electrode of parts is formed
with the Ag resin.
Figure-4
7.6 The overcoat and the main body may be chipped off when you
hold the parts strongly with tweezers.
Do not use parts detached from the print circuit board once
again.
7.7 Please refer to page 31 for our recommended soldering
conditions.
8. Cleaning
The remaining of the flux on print circuit board with part mounted
may cause a bad effect on humidity resistance and corrosion
resistance. Please use a rosin flux with low chlorine-containing, or
alcoholic and hydrocarbon solvent.
9. Other Notes
9.1 The use of the products mentioned in this catalog refers to
consumer applications that are available on the open market.
9.2 There are cases which high levels of reliability distinctive from
consumer applications sold on the open market are necessary
for electrical components which are used in equipment that
could effect human life or create huge social loss owing to
defect in medical equipment, space equipment, nuclear power-
related equipment, vehicle mounted equipment, aircraft and
other equipment. When you examine the use in the above-
mentioned equipment or for uses not mentioned within this
catalog, ensure that you consult with our sales department prior
to deployment.
9.3 As the use of resistors and surface-mounted parts used in all
electrical components, especially resistors used in high-voltage
circuits and in circuits prescribed for safely regulations, will be
greatly affected by the circuit used, the method of mounting, the
material, and environmental conditions, ensure that you consult
with our sales department prior to deployment when examining
the viability of use in characteristic circuits, mounting methods,
material and under characteristic environmental conditions,
9.4 Thoroughly verify performance and reliability when using under
the following characteristic environmental conditions :
(1) Use within a liquid environment (Water, oil, liquid chemical,
organic solution, etc.)
(2) Use in direct sunshine. Outdoors in heavy dew, in dusty
environments, or where corrosive gas is present (Sea
breezes, Cl2, H2S, NH3, SO2, NO2, etc.)
(3) Use in environments with strong electrostatic or magnetic
waves exists.
(4) Use nearby flammable substances.
(5) Use with the resistors coated in resin, etc.
(6) Use of water or water solution for flux cleaning after
unwashed soldering or soldering.
(7) Use under environment of condensation
9.5 Ensure that the condition of the mounting is evaluated and
verified on circuit boards when subjected to overloads in the
form of pulses or surges, etc.
9.6 Take cares handling these products as they may be damaged
and become defective if subject to impact, such as dropping.
F F Flaking off
A B C
SMD PRODUCT HANDLING MANUAL
Product specifications contained in this catalogue are subject to change at any time without notice. Please confirm specifications with your order. 【RoHS】29