Pb
RoHS
E1SGA27-27.000M
E1S G A 27 -27.000M
Series
RoHS Compliant (Pb-free) Resistance Welded Short
HC-49/UP SMD Crystal
Frequency Tolerance/Stability
±15ppm at 25°C, ±30ppm over 0°C to +70°C
Mode of Operation
AT-Cut Fundamental
Nominal Frequency
27.000MHz
Load Capacitance
27pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 27.000MHz
Frequency Tolerance/Stability ±15ppm at 25°C, ±30ppm over 0°C to +70°C
Aging at 25°C ±5ppm/year Maximum
Load Capacitance 27pF Parallel Resonant
Shunt Capacitance (C0) 7pF Maximum
Equivalent Series Resistance 40 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 1mWatt Maximum
Storage Temperature Range -40°C to +125°C
Insulation Resistance 500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014 Condition A
Gross Leak Test MIL-STD-883, Method 1014 Condition C
Lead Termination Sn 2µm - 6µm
Mechanical Shock MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
MAX
13.30 MAX 4.85
MAX
4.88 ±0.20 0.50 MIN (x2)
11.60 MAX
0.80 ±0.30 (x2)
NOTE: Coplanarity 0.360 MAX
LINE MARKING
1E27.000M
E=Ecliptek Designator
M=MHz
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 1 of 4
E1SGA27-27.000M
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X2)
All Dimensions in Millimeters
4.0
2.0 (X2)
5.5 (X2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 2 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
E1SGA27-27.000M
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 3 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
E1SGA27-27.000M
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/12/2010 | Page 4 of 4
