TPD2007F TOSHIBA Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit TPD2007F Low-Side Power Switch Array (8 Channels) for Motors, Solenoids, and Lamp Drivers The TPD2007F is an 8-channel low-side switch array. The IC has a vertical MOSFET output which can be directly driven from a CMOS or TTL logic circuit (e.g., an MPU). It offers overcurrent and overtemperature protection functions. Features * 8-channel low-side switch array incorporating an N-channel power MOSFET (1.4 max) * Can directly drive a power load from a microprocessor. * Built-in protection against overtemperature and overcurrent * 8-channel access enables space-saving design. * High operating voltage: 40 V * Low on-resistance: 1.4 max @VIN = 5 V, ID = 0.5 A (per channel) * Supports parallel operation. * Built-in active clamp circuit * Supplied in an SSOP-24 package (300 mil) in embossed taping. Pin Assignment Weight: 0.29 g (typ.) Marking Lot No. TPD2007F Note Part No. (or abbreviation code) NoteA dot marking for identifying the indication of product Labels. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge. Start of commercial production 1999-05 1 2013-12-26 TPD2007F Block Diagram 2 2013-12-26 TPD2007F Pin Description Pin No. Symbol Description 1 GND 2 N.C. 3 IN1 Control input pin for channel 1 and built-in pull-down resistor (300 k typ.) 4 IN2 Control input pin for channel 2 and built-in pull-down resistor (300 k typ.) 5 IN3 Control input pin for channel 3 and built-in pull-down resistor (300 k typ.) 6 IN4 Control input pin for channel 4 and built-in pull-down resistor (300 k typ.) 7 IN5 Control input pin for channel 5 and built-in pull-down resistor (300 k typ.) 8 IN6 Control input pin for channel 6 and built-in pull-down resistor (300 k typ.) 9 IN7 Control input pin for channel 7 and built-in pull-down resistor (300 k typ.) 10 IN8 Control input pin for channel 8 and built-in pull-down resistor (300 k typ.) 11 N.C. 12 GND 13 N.C. 14 N.C. 15 OUT8 Output pin for channel 8 16 OUT7 Output pin for channel 7 17 OUT6 Output pin for channel 6 18 OUT5 Output pin for channel 5 19 OUT4 Output pin for channel 4 20 OUT3 Output pin for channel 3 21 OUT2 Output pin for channel 2 22 OUT1 Output pin for channel 1 23 N.C. 24 N.C. GND pin; in common with the pin no.12 internally. GND pin; in common with the pin no.1 internally. Timing Chart Note: The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is restored only when the junction temperature falls by the hysteresis amount (10C typ.) in relation to the overheating detection temperature. 3 2013-12-26 TPD2007F Truth Table Input Signal Output Signal L H H L L H H Internally limited L H H H State Normal Overcurrent protection Overtemperature protection Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit VDSS 40 V VIN -0.5 ~ 7 V Output current ID Internally Limited A Power dissipation (operating all channels, ta = 25C) PT Drain-source voltage Input voltage 0.8 1.2 (Note) W Single pulse avalanche energy EAS 10 mJ Operating temperature Topr -40 ~ 85 C Junction temperature Tj 150 C Storage temperature Tstg -55 ~ 150 C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristic Thermal resistance junction to ambient (operating all channels, ta = 25c) Symbol Rth (j-a) Rating 156.3 104.2 (Note) Unit C / W Note: 60 mm x 60 mm x 1.6 mm when mounted on a glass epoxy PCB (DC) 4 2013-12-26 TPD2007F Electrical Characteristics (Unless otherwise specified, Tj = 25C) Symbol Test Circuit V (BR) DSS Vth Characteristic Min Typ. Max Unit ID = 10 mA, VIN = 0 V 40 V VDS = 24 V, IDS = 1 mA 0.8 2.0 V IIL VIN = 0 V -10 10 IIH VIN = 5 V 140 300 RDS(ON) VIN = 5 V, IO = 0.5 A 1.0 1.4 IDSS VDS = 40V 100 A IS(1) VDS = 12 V, VIN = 5 V, RL = 3 1 2 3 IS(2) VDS = 30 V, VIN = 5 V, RL = 3 0.7 2 TSD VIN = 5 V 160 TSD 10 tON 1 10 50 tOFF 1 10 50 Operating input voltage protection circuit VIN(P) 3.9 6.0 V Drain-source diode forward voltage VDSF 1.6 V Drain-source clamp voltage Input voltage Input current On resistance Off current Overcurrent protection Overtemperature Protection Temperature Hysteresis Switching time Test Condition VDD = 12 V, RL = 24, VIN = 0 V / 5 V IF = 1 A, VIN = 0 V A A C s Description of Protector Circuit (1) Overtemperature Protection * (2) The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is restored only when the junction temperature falls by the hysteresis amount (10C typ.) in relation to the overheating detection temperature. Overcurrent Protection * When overcurrent is detected, the overcurrent limiter function limits the output current. Normal operation is restored when the load current drops below the overcurrent detection value. Test Circuit Switching Time 5 2013-12-26 TPD2007F Tj = 25 Tj = 85 Tj = 25 Tj = 25 6 2013-12-26 TPD2007F 7 2013-12-26 TPD2007F Moisture-Proof Packing After the pack is opened, the devices should be used within 48 hours and in a 30C, 60% RH environment. Embossed-tape packing cannot be baked. Devices so packed must be within their allowable time limits after unpacking, as specified on the packing. Standard tape packing quantity: 2000 devices / reel (EL1) 8 2013-12-26 TPD2007F Package Dimensions Weight: 0.29 g (typ.) 9 2013-12-26 TPD2007F RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 10 2013-12-26