TPD2007F
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TOSHIBA Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit
TPD2007F
Low-Side Power Switch Array (8 Channels) for Motors, Solenoids, and Lamp Drivers
The TPD2007F is an 8-channel low-side switch array. The IC
has a vertical MOSFET output which can be directly driven from
a CMOS or TTL logic circuit (e.g., an MPU). It offers overcurrent
and overtemperature protection functions.
Features
8-channel low-side switch array incorporating an N-channel
power MOSFET (1.4Ω max)
Can directly drive a power load from a microprocessor.
Built-in protection against overtemperature and overcurrent
8-channel access enables space-saving design.
High operating voltage: 40 V
Low on-resistance: 1.4 Ω max @VIN = 5 V, ID = 0.5 A (per channel)
Supports parallel operation.
Built-in active clamp circuit
Supplied in an SSOP-24 package (300 mil) in embossed taping.
Pin Assignment Marking
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product,
ensure that the environment is protected against electrostatic discharge.
Weight: 0.29 g (typ.)
TPD2007F
Lot No.
Note
Part No. (or abbreviation code)
NoteA dot marking for identifying the indication of product Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is Directive 2011/65/EU of the European Parliament and
of the Council of 8 June 2011 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment.
Start of commercial production
1999-05
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Block Diagram
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Pin Description
Pin No. Symbol Description
1 GND GND pin; in common with the pin no.12 internally.
2 N.C.
3 IN1 Control input pin for channel 1 and built-in pull-down resistor (300 k typ.)
4 IN2 Control input pin for channel 2 and built-in pull-down resistor (300 k typ.)
5 IN3 Control input pin for channel 3 and built-in pull-down resistor (300 k typ.)
6 IN4 Control input pin for channel 4 and built-in pull-down resistor (300 k typ.)
7 IN5 Control input pin for channel 5 and built-in pull-down resistor (300 k typ.)
8 IN6 Control input pin for channel 6 and built-in pull-down resistor (300 k typ.)
9 IN7 Control input pin for channel 7 and built-in pull-down resistor (300 k typ.)
10 IN8 Control input pin for channel 8 and built-in pull-down resistor (300 k typ.)
11 N.C.
12 GND GND pin; in common with the pin no.1 internally.
13 N.C.
14 N.C.
15 OUT8 Output pin for channel 8
16 OUT7 Output pin for channel 7
17 OUT6 Output pin for channel 6
18 OUT5 Output pin for channel 5
19 OUT4 Output pin for channel 4
20 OUT3 Output pin for channel 3
21 OUT2 Output pin for channel 2
22 OUT1 Output pin for channel 1
23 N.C.
24 N.C.
Timing Chart
Note: The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is
restored only when the junction temperature falls by the hysteresis amount (10°C typ.) in relation to the
overheating detection temperature.
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Truth Table
Input Signal Output Signal State
L H
H L
Normal
L H
H Internally limited
Overcurrent protection
L H
H H
Overtemperature protection
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Drain-source voltage VDSS 40 V
Input voltage VIN 0.5 ~ 7 V
Output current ID
Internally
Limited A
0.8
Power dissipation
(operating all channels, ta = 25°C) PT
1.2 (Note)
W
Single pulse avalanche energy EAS 10 mJ
Operating temperature Topr 40 ~ 85 °C
Junction temperature Tj 150 °C
Storage temperature Tstg 55 ~ 150 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Thermal Characteristics
Characteristic Symbol Rating Unit
156.3 Thermal resistance junction to
ambient
(operating all channels, ta = 25°c)
ΣRth (j-a)
104.2 (Note)
°C / W
Note: 60 mm × 60 mm × 1.6 mm when mounted on a glass epoxy PCB (DC)
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Electrical Characteristics
(Unless otherwise specified, Tj = 25°C)
Characteristic Symbol
Test
Circuit Test Condition Min Typ. Max Unit
Drain-source clamp voltage V (BR) DSS I
D = 10 mA, VIN = 0 V 40 V
Input voltage Vth V
DS = 24 V, IDS = 1 mA 0.8 2.0 V
IIL V
IN = 0 V 10 10
Input current
IIH V
IN = 5 V 140 300
μA
On resistance RDS(ON) V
IN = 5 V, IO = 0.5 A 1.0 1.4
Off current IDSS V
DS = 40V 100 μA
IS(1) VDS = 12 V, VIN = 5 V,
RL = 3 1 2 3
Overcurrent protection
IS(2) VDS = 30 V, VIN = 5 V,
RL = 3 0.7 2
A
Temperature TSD V
IN = 5 V 160
Overtemperature
Protection Hysteresis ΔTSD 10
°C
tON 1 10 50
Switching time
tOFF 1
VDD = 12 V, RL = 24,
VIN = 0 V / 5 V 10 50
μs
Operating input voltage
protection circuit VIN(P) 3.9 6.0 V
Drain-source diode forward voltage VDSF IF = 1 A, VIN = 0 V 1.6 V
Description of Protector Circuit
(1) Overtemperature Protection
The overheating detector circuits feature hysteresis. After overheating is detected, normal operation
is restored only when the junction temperature falls by the hysteresis amount (10°C typ.) in relation
to the overheating detection temperature.
(2) Overcurrent Protection
When overcurrent is detected, the overcurrent limiter function limits the output current. Normal
operation is restored when the load current drops below the overcurrent detection value.
Test Circuit
Switching Time
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T
j
= 25
T
j
= 85
T
j
= 25
T
j
= 25
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Moisture-Proof Packing
After the pack is opened, the devices should be used within 48 hours and in a 30°C, 60% RH environment.
Embossed-tape packing cannot be baked. Devices so packed must be within their allowable time limits after
unpacking, as specified on the packing.
Standard tape packing quantity: 2000 devices / reel (EL1)
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Package Dimensions
Weight: 0.29 g (typ.)
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RESTRICTIONS ON PRODUCT USE
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in this document, and related hardware, software and systems (collectively "Product") without notice.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
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including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
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