52745-1797
52745-1697
20
18
17
16
8.15
8.65
0.66
9.15
10.65
14.6
16.1
15.1
14.1
13.3
14.3
12.8
7.5
9.5
12.3
8.5
8
52745-2097
52745-1897
7
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:49
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/02/27
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
KTOJO
2005/02/23
APPR:
NUKITA
2005/03/16
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52745
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN. ZIF FOR
SMT R/A (UPPER CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52745-050
PSD
001
D
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
金具
11
E
(DETAIL OF FITTING NAIL)
5
接点部(上面)
CONTACT POINT
(UPPER SIDE)
K
52745-1597
52745-1397
52745-1297
FITTING NAIL
C
10.6
12.6
8.1
9.1
9.6
10.1
11.1
11.6
12.1
13.1
13.6
注記NOTES
1.使用材料
MATERIAL
ハウジング：46ナイロン、ガラス充填、UL94V-0、白
HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE
アクチュエータ：ポリフェニレンサルファイド（PPS）、
ガラス充填、UL94V-0、黒
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK
ターミナル：リン青銅、ニッケル下地金めっき（t=0.2）
TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING
金具：リン青銅、ニッケル下地錫めっき（t=0.2）
FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING
2.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52745-**59 SHOULD BE LOCKED.
ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H.
UPPER DIRECTON:0.1MAXIMUM
LOWER DIRECTION:0.15 MAXIMUM
偶数極に適用
APPLY FOR EVEN CIRCUIT.
パターン剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの胴体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.ELV 及び RoHS 適合品
ELV AND RoHS COMPLIANT
3
5
4
6
2.53.65
4.65
10
5.65
6.15
(金具部投影図)
6.65
VIEW K
ORDER No. オーダー番号
15
EMBOSSED PACKAGE
2.455
1.02 1.28
0.74
11.8
11.3
10.8
10.3
9.8
9.3
8.8
7.3
C
7.15 613
14
6.57.65
4
2.656.3
CONNECTOR SERIES NO. : 52745-**59
極数
CKT.
(A)BD
1.5
0.85
0.5
±
0.1
0.5
+0.1
0
9.65
52745-1997
19
9
10.1513.815.6
5
3
3.5
4
7
4.15
5.15
7.8
8.3
52745-0797
52745-0897
52745-0997
52745-1097
52745-1497
9
52745-1197
4.5
12
52745-0697
52745-0497 6
5.5
8
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
R0.3
R0.303
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:49
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/02/27
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
KTOJO
2005/02/23
APPR:
NUKITA
2005/03/16
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52745
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN. ZIF FOR
SMT R/A (UPPER CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52745-050
PSD
001
D
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 2 OF 2
0.3
±
0.03
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
仕上がり厚さ
THICKNESS
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.3
±
0.03
仕上がり厚さ
THICKNESS
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
補強板：ポリエステル系
REINFORCE BOARD: PET
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
0.3
±
0.03
0.5(N-1)
±
0.05 0.5
±
0.1
0.5
±
0.05
0.5
±
0.1
4
±
0.5
0.6MAX.
(0.3)
0.5(N+1)
±
0.07
0.35+0.04
-0.03
6
±
0.5
3.65
0.5(N-1)
±
0.05
3.65
2.2
3.05 0.8
(0.2)
(0.3)
(0.3)
0.5(N-1)
±
0.05
0.5
±
0.05
1.25
1.25
(0.3)
1.94MIN.
0.45MAX.
4
±
0.5
0.5(N+1)
±
0.07
6
±
0.5
0.5
±
0.08
0.5
±
0.05
0.5
±
0.08
(0.605)
1.1
M
L
(PITCH)
DETAIL L
金具パターンエリア
CONNECTOR
POSITION
(マウント面)
(DETAIL OF FITTING NAIL
ON PATTERN)
KEEPING OUT AREA OF
PATTERN AND SOLDERING
BOARD
(FROM PATTERN EDGE)
適合金めっきFFC推奨寸法
6
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
THICKNESS: 0.3+0.03/-0.03
VIEW M
コネクタ位置
THICKNESS: 0.3+0.03/-0.03
パターンおよび
半田禁止エリア
RECOMMENDED P.C.BOARD
PATTERN DIMENSION(REF.)
(MOUNTING SIDE)
仕上がり厚さ：0.3
±
0.03
SOLDERING AREA
OF FITTING NAIL
参考基板レイアウト
適合金めっきFPC推奨寸法
(NON-ACCUMULATIVE)
APPLICABLE FFC OF GOLD
PLATING RECOMMENDED DIMENSION
(PITCH)
仕上がり厚さ：0.3
±
0.03
PATTERN
補強板
(STIFFENER BOARD)
(PITCH)
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± ---
10 OVER 30 UNDER ± ---
30 OVER ± ---
ANGULAR ± --- °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
補強板
(STIFFENER BOARD)
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
