TECHNICAL DATA SHEET 1/5 R223.434.800 SMT PLUG RECEPTACLE Series : MMBX REEL OF 750 All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATINGS (m) MATERIALS BRONZE,BRASS BERYLLIUM COPPER,BRASS LIQUID CRISTAL POLYMER PTFE - NPGR GOLD 1.3 OVER NICKEL 2 - - Issue : 0636 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. TECHNICAL DATA SHEET 2/5 R223.434.800 SMT PLUG RECEPTACLE Series : MMBX REEL OF 750 PACKAGING Standard 750 Unit SPECIFICATION Other Contact us ELECTRICAL CHARACTERISTICS ENVIRONMENTAL Impedance Operating temperature -55/+155 C 50 Frequency Hermetic seal 0-12.4 GHz NA Atm.cm3/s VSWR 1.15 * + 0,0000 x F(GHz) Maxi Panel leakage NA Insertion loss 0.05 F(GHz) dB Maxi RF leakage - ( 100** - F(GHz)) dB Maxi Voltage rating 330 Veff Maxi Dielectric withstanding voltage 1000 Veff mini Insulation resistance 1000 M mini OTHERS CHARACTERISTICS Assembly instruction Others : MECHANICAL CHARACTERISTICS Center contact retention Axial force - Mating end Axial force - Opposite end Torque 10 N mini 10 N mini NA N.cm mini Recommended torque Mating Panel nut NA N.cm NA N.cm Mating life Weight * to 2 GHz ** Interface only, up to 2.5GHz 500 Cycles mini 0,5800 g Issue : 0636 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. TECHNICAL DATA SHEET 3/5 R223.434.800 SMT PLUG RECEPTACLE Series : MMBX REEL OF 750 1. Deposit solder paste `SnAg4Cu0.5' on mounting zone by screen printing application. We recommend a low residue flux. We advise a thickness of 150 micromm ( 5.850 microinch ). Verify that the edges of the zone are clean. 2. Placement of the receptacle on the mounting zone with an automatic machine of `pick and place' type. A video camera is recommended for positioning of the component. Adhesive agents must not be used on the receptacle. 3. This process of soldering has been tested with convection oven. Below please find, the typical profile to use. 4. The cleaning of printed circuit boards is not obliged. 5. Verification of solder joints and position of the component by visual inspection. TEMPERATURE PROFILE Parameter Temperature rising Area Max Peak Temperature Max dwell time @260C Min dwell time @235C Max dwell time @235C Temperature drop in cooling Area Max dwell time above 100C Value 1 -4 260 10 20 60 -1 to - 4 420 Issue : 0636 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. Unit C/sec C sec sec sec C/sec sec TECHNICAL DATA SHEET 4/5 R223.434.800 SMT PLUG RECEPTACLE Series : MMBX REEL OF 750 PCB COPLANAR LINE Pattern and signal are on the same side The material of PCB is epoxy resin (FR4) . (Er = 4.6) The solder resist should be printed Except for the land pattern on the PCB Pattern Land for solder paste APPLICATION 75 WITH B = 0,55mm PCB thickness (mm) Coplanar ligne A (mm) 0,8 0,350 1,0 0,360 1,2 0,365 1,6 0,375 APPLICATION 50 WITH B = 1,2mm PCB thickness (mm) Coplanar ligne A (mm) 0,8 0,190 1,0 0,200 1,2 0,205 1,6 0,210 Issue : 0636 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. TECHNICAL DATA SHEET 5/5 R223.434.800 SMT PLUG RECEPTACLE Series : MMBX REEL OF 750 A VIEW R223.434.000 Issue : 0636 B In the effort to improve our products, we reserve the right to make changes judged to be necessary.