Surface Mount Switching Diode
SOT-23 Outline Dimensions
*Low Current Leakage
*Low Forward Voltage
*Reverse Recover Time Trr ≤ 4ns
*Small Outline Surface Mount SOT-23 Package
Features:
SWITCHING DIODE
200m AMPERES
50 VOLTS
SOT-23
Uint:mm
Dim
A
B
C
D
E
G
H
J
K
L
M
Min
0.35
1.19
2.10
0.85
0.46
1.70
2.70
0.01
0.89
0.30
0.076
Max
0.51
1.40
3.00
1.05
1.00
2.10
3.10
0.13
1.10
0.61
0.25
A
B
D
EG
M
L
H
J
TOP VIEW
K
C
1
2
3
BAV74
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15-Jul-05
Lead(Pb)-Free
P b
Unit
Characteristic Symbol Min Max
Electrical Characteristics (T
A=25˚C Unless Otherwise Note) (Each Diode)
Off Characteristics
Reverse Breakdown Voltage
IBR = 5.0 μAdc
Reverse Voltage Leakage Current
VR=50V, TJ=125˚C
VR=50V
VBR
IR
50 Vdc
0.1
100
-
-
-
Maximum Ratings
Characteristic
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
VR
UnitValue
Vdc
200
500
mAdc
mAdc
IF
IFM
50
Thermal Characteristics
Characteristic Symbol
Total Device Dissipation FR-5 Board1
TA=25˚C
Derate Above 25˚C
Total Device Dissipation Alumina Substrate2
TA=25˚C
Derate Above 25˚C
PD
PD
Max Unit
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Ambient
Junction and Storage Temperature
RθJA
RθJA
TJ, Tstg
225
1.8
556
300
2.4
417
-55 to + 150
mW
mW/˚C
mW
mW/˚C
˚C/W
˚C/W
˚C
1. FR-5=1.0x0.75x0.062 in.
2. Alumina=0.4x0.3x0.024 in 99.5% Alumina.
WEITRON
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BAV74
Diode Capacitance
(VR = 0, f = 1.0 MHz)
Forward Voltage
IF = 100 mAdc
Reverse Recovery Time
IF=IR=10 mAdc,IR(REC)=1.0 mAdc
measured at IR=1.0mA RL=100Ω
VF
trr
Vdc
ns
μAdc
CD2.0-
1.0
-
4.0
-
PF
2/3
15-Jul-05
0.2 0.4 0.6 0.8 1.0 1.2
VF, FORWARD VOLTAGE (VOLTS)
100
10
1.0
0.1
IF)
A
m( TNE
R
RUC
D
RA
W
RO
F ,
FIG.1 FORWARD VOLTAGE
T
A=- 40˚C
T
A=25°C
T
A=85˚C
0 10 20 30 40 50
VR. REVERSE VOLTAGE (VOLTS)
IA)Aµ( TNERRUC ESREVER .
10
1.0
0.1
0.01
0.001
T
A=150°C
T
A=125°C
T
A=25°C
T
A=55°C
T
A=85°C
FIG.2 LEAKAGE CURRENT
VR. REVERSW VOLTAGE (VOLTS)
CD( E
C
NA
T
I
C
AP
AC E
D
O
I
D . P)F
FIG.3 CAPACITANCE
0 2 4 6 8
1.0
0.9
0.8
0.7
0.6
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Device Marking
Characteristics Curve
Item Marking Eqivalent Circuit diagram
1
2
3
BAV74 JA