2000 May 02 6
Phycomp Product specification
Array chip resistors
size 4 × 0603
ARC241/ARC242
ARV241/ARV242
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the schedule of
“IEC publication 60115-8”
, category LCT/UCT/56 (rated temperature
range: Lower Category Temperature, Upper Category Temperature;
damp heat, long term, 56 days). The testing also covers the requirements
specified by EIA and EIAJ.
The tests are carried out in accordance with IEC publication 60 068,
“Recommended basic climatic and mechanical robustness testing
procedure for electronic components”
and under standard atmospheric
conditions according to
“IEC 60068-1”
, subclause 5.3.
Unless otherwise specified the following values apply:
Temperature: 15 °Cto35°C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with reference to the
relevant clauses of
“IEC publications 60115-8 and 60068”
; a short
description of the test procedure is also given.
In some instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
ARC241 ARV241 ARC242 ARV242
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual examination no holes; clean surface;
no visible damage
4.4.2 dimensions
(outline; see Fig.3)
gauge (mm) see Table 3 −
4.5 resistance applied voltage (+0/−10%): R −Rnom:
max. ±5%
R−Rnom:
max. ±1%
R−Rnom:
max. ±5%
10 Ω≤R < 100 Ω:0.3V
100 Ω≤R<1k
Ω:1V
1k
Ω≤R<10k
Ω:3V
10 kΩ≤R < 100 kΩ:10V
100 kΩ≤R<1M
Ω:25V
R≥1M
Ω:50V
4.18 20 (Tb) resistance to
soldering heat
unmounted chips; 10 ±1 s; 260 ±5°C no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)∆R/R max.:
±(1% +0.05 Ω)
4.29 45 (Xa) component solvent
resistance
isopropyl alcohol or H2O followed by
brushing in accordance with
“MIL 202 F”
no visible damage
4.17 20 (Ta) solderability unmounted chips completely immersed for
2±0.5 s in a solder bath at 235 ±2°C
good tinning (≥95% covered);
no visible damage