MK70120 - OKI Electronic Components

OKI Semiconductor PEDLMK70-02

Issue Date: Apr. 24, 2002

MK70110/MK70120 Preliminary

Bluetooth Module

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GENERAL DESCRIPTION

The MK70110 and MK70120 are Bluetooth modules that operate in the 2.4 GHz band. Mounted on the board of

each of these modules are Bluetooth baseband & RF transceiver IC, RF filter, flash memory, and TCXO. Lower

protocol stac ks up t o the HCI are alrea dy inst alled in t hese m odules as s oftware. These modul es can be co nnected

to user’s board product by using t he connector the m odules have. Since the m odules are provi ded not only with the

UART and USB interfaces as communication control interfaces but with a PCM interface as a voice control

interface, they can cope with any application for data and voice communication.

The MK70110 is equipped with an RF coaxial connector, and the MK70120 has a chip antenna built-in.

By utilizing the MK70110/MK70120, the development TAT for products equipped with Bluetooth can be

shortened very effectively.

FEATURES

• Conforms to the Bluetooth Specification Version 1.1

• Optimized design where originally developed LSI chips and authorized Oki software are used

• HCI full module includes Bluetooth baseband IC & RF transceiver IC, flash memory and TCXO

• RF output power: Class 2

• RF I/O: MK70110: RF coaxial connector / MK70120: Internal chip antenna

• Interfaces provided

UART interface* (up to 921.6 kbps)

USB interface* (USB1.1-conformed)

PCM interface (selectable between PCM Linear/A-law/µ-law)

* Supports HCI commands.

BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry.

The information contained herein can change without notice owing to the product being under development.

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BLOCK DIAGRAM

RF_LSI

ML7050LA

ANT Chip

MK70120

PCM_IN

PCM_OUT

PCM_CLK

BPF

Osc.

13 MHz

PCM_SYNC

BB_LSI ML70Q511LA

4Mbit

Flash ROM

CPU

RM7TDMI

Baseband

Core

Voltage

Regulato

VDD

GND

UART_RD

UART_TD

* UART_CTS

* UART_RTS

PCM

I/F

PCM

I/F

USB

I/F USB_D+

USB_D

–

RESET

** XCLK

(

32 kHz ±200

)

VBUS

TEST1

Note: * indicates that the pin will be supported later.

** XCLK is o

tional

Connector

MK70110

32 KB

SRAM

20-Pin Connector

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power supply voltage VDD Ta = 25°C –0.3 to 4.5 V

Input voltage VIN Ta = 25°C –0.3 to 4.5 V

Input RF power — Ta = 25°C 20 dBm

Storage temperature Tstg — –20 to +70 °C

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RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Min. Typ. Max. Unit

Power supply voltage VDD — 3.2 — 3.45 V

“H” level input voltage Vih — 2.2 — 3.6 V

“L” level input voltage Vil — 0 — 0.8 V

Operating temperature TOP — 0 25 50 °C

ELECTRICAL CHARACTERISTICS

Specifications in this section are fulfilled under the conditions that VDD = 3.3 V ±0.1 V, Ta = 0 to 50°C. Values o f

the RF characteri stics represent those speci fied at the edge of t he module for bot h the MK70110 an d the MK70120.

General Specifications

Items Specification Note

Conformance Specifications Bluetooth Specification

Version 1.1 —

Power Class Class 2 —

Frequency range 2,402 to 2,480 MHz —

Number of channels 79ch —

Channel separation 1 MHz —

Modulation method GFSK —

RF input-output impedance Nominal 50 Ω 2,402 to 2,480 MHz

Symbol Rate 1 Mbps —

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DC Characteristics

Output voltage (Applies to digital pins except USB ports)

Parameter Symbol Min. Typ. Max. Unit

“H” level output voltage Voh 2.4 — — V

“L” level output voltage Vol — — 0.4 V

Output voltage (Applies to USB ports (USB_D+, USB_D–))

Parameter Symbol Min. Typ. Max. Unit

“H” level output voltage Voh 2.8 — 3.6 V

“L” level output voltage Vol — — 0.3 V

Power consumption (UART interface, with 32 kHz XCLK)

Mode Typ. Max. Unit

Initialize (Stop mode) 10 — mA

Idle (Cold standby) 6 — mA

Hold mode (Slave) 40 — mA

Sniff mode (Slave) 40 — mA

ACL connection DH1 103 125 mA

SCO connection HV1 113 135 mA

RF Transmission Characteristics

Parameter Min. Max. Unit Remarks

Output power –6 +4 dBm

Frequency deviation –50 +50 kHz

Frequency drift

DH1

DH3, DH5

–25

–40

+25

+40

kHz

Frequency shift

∆f1avg: payload = 11110000

∆f2max: payload = 1010…

∆f2avg/∆f1avg

140

115

175

—

kHz

20 dB band width — 1 MHz

In-band spurious emission

Freq. offset = ±2 MHz

Freq. offset ≥ ±3 MHz

—

–20

–40

dBm

Measured by peak detection

Out-of-band spurious emission

30 MHz ≤ f < 1GHz

1 GHz ≤ f ≤ 12.75 GHz

1.8 GHz ≤ f ≤ 1.9 GHz

5.15 GHz ≤ f ≤ 5.30 GHz

—

–36

–30

–47

dBm

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Reception Characteristics

Parameter Min. Max. Unit Remarks

Reception sensitivity — 0.1 % at –70 dBm input

C/I characteristics

Co-channel

Adjacent channel C/I = 1 MHz

Adjacent channel C/I = 2 MHz

Adjacent channel C/I ≥ 3 MHz

Image frequency*2

Image frequency ±1 MHz*2

—

–30*1

–40*1

–6

–16

Specification at ordinary temperature

(Bluetooth Ver.1.1 Test Specification)

Out-of-band blocking

30 MHz ≤ f < 2,000 MHz

2,000 MHz ≤ f ≤ 2,399 MHz

2,498 MHz ≤ f < 3,000 MHz

3,000 MHz ≤ f ≤ 12.75 GHz

–10

–27

–10

—

dBm

Specification at ordinary temperature

Intermodulation characteristic –25 — dB Specification at ordinary temperature

Maximum input level — 0.1 % Specification at ordinary temperature, at

–20 dBm input

Limit of collateral radio waves

30 MHz ≤ f < 1 GHz

1 GHz ≤ f ≤ 12.75 GHz

—

–57

–47

dBm

Spurious emission during inquiry scan

operation

*1 Relaxed C/I specification

On five spurious response frequencie s with a distance of ≥ 2 MHz from the wanted signal (except for

image frequency and image ±1 MHz), a relaxed interference requirement C/I = –17 dB is applied.

(According to Bluetooth Specification 1.1, Part A Radio Specification)

*2 Image Frequencies and adjacent interference to image

Image frequency = Co-channel –4 MHz

±1 MHz adjacent interference to image frequency = Co-channel –3 MHz, Co-channel –5 MHz

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MECHANICAL CHARACTERISTICS

Weight Specifications

Model Name Weight

MK70120 (antenna built-in type) 3.6 g (Max.)

MK70110 (RF coaxial connector type) 3.5 g (Max.)

RF I/O Pin Specifications

The following chip antenna and RF coaxial connector are mounted:

Model Name RF I/O Type Manufacturer / Model Name

MK70120 Chip antenna MURATA MFG. / ANCM12G45

MK70110 RF coaxial connector HIROSE ELECTRIC / U.FL-R-SMT

Connector Specifications

The following board-to-board connector is mounted:

Interface Type Manufacturer / Series Name

Board-to-board connector Matsushita Electric Works / AXK6F20345

A header is mounted on the module side.

It is therefore recommended that a 2.0 mm high socket (AXK5F20545) be used against the socket

insertion side of the connector.

Board-to-board Connector Detail

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CONNECTOR PIN DESCRIPTIONS

Pin Symbol Type Description If Not Used

5, 6, 7 VDD — Power supply pin*1 —

15, 16 GND — Ground pin —

1 UART_RTS O UART Ready To Send (transmission data ready)*2 Pull_up or VDD

19 UART_CTS I UART Clear To Send (transmission ready)*2 Pull_down or GND

2 UART_TD O UART transmission data Pull_up or VDD

20 UART_RD I UART receive data Pull_up or VDD

12 USB_D+ I/O USB Data + Open

9 USB_D– I/O USB Data – Open

13 VBUS I

HCI transport selection pin

H: USB is used as HCI

L: UART is used as HCI

adhering to the above logic at power-on

—

4 PCM_OUT O PCM data output Open

17 PCM_IN I PCM data input*5 Open

3 PCM_CLK O PCM clock output (64 kHz/128 kHz)*5 Open

18 PCM_SYNC O PCM synchronous signal input (8 kHz)*5 Open

8 RESET*6 I

Reset signal input pin Reset = L

Effective reset pulse width > 10 µsec Pull_up

14 XCLK I Subclock input pin 32 kHz*3 GND

11 TEST1 I Test pin for our company's use*4 Open

10 N.C — N.C. Open

*1 Mount an approximately 10 µF tantalum or electrolytic capacitor to the power supply input pin.

The capacitor should be mounted as close to the power supply pin of the module as possible.

*2 At present, this pin is not supported. Must be left open.

*3 At present, this pin does not support a 32 kHz sub-clock. Connect to GND.

*4 Test pin for our company’s use. Must be left open.

*5 The PCM_IN, CLK, and SYNC pins are pulled-down internally.

*6 Setting the reset signal input pin RESET to a “L” leve l can reset the LSI. The reset state of the LSI is

held for a duration of 10 msec even after the reset signal is switched to a “H” level.

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INTERFACE SPECIFICATIONS

USB Interface

• Conforms to USB1.1

• Supports 12 Mbps

Parameter Symbol

Condition

[1], [2], [3] Min. Typ. Max. Unit

Rise time TR 4 — 20

Fall time TF CL = 50 pF 4 — 20

Output signal crossover voltage VCRS CL = 50 pF 1.3 — 2 V

Driver output resistance ZDRV When being driven in

a steady state 28 — 44 Ω

Data rate TDRATE Average bit rate

(12 Mbps ±0.25%) 11.97 — 12.03 Mbps

[1] TR and TF are the intervals of the transition time from 10% to 90% (TR) or from 90% to 10% (TF) of

an amplitude.

[2] Input signal crossover point (When USB connector is not attached)

VDD

0 V

0.8VDD

0.2VDD

0.8VDD

0.2VDD

UART Interface

Various settings can be made for the UART interface by using the Vendor specific command (refer to the

ML70110/MK70120 User’s Manual).

The default values are as follows:

• Baud rate: 115.2 kbps

• Parity: Non-parity

• Data length: 8 bits

• Stop bit: 1 bit

• Flow control: off

PCM Interface

• Application format

PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/µ-law

• Bluetooth format

CVSD/A-law/µ-law

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PCMCLK (64kHz

or 128kHz)

PCMOUT

PCMSYNC

LSB MSB DA TA DAT A DATA LSB DATA

125

s (8 kHz)

MSB

8 bits or 16 bits

Data is output at the timing of CLK rise.

PCM Output Timing

PCMCLK (64kHz

or 128kHz)

PCMIN

PCMSYNC

LSB MSB DATA DATA DATA LSB DATA

125 µs (8 kHz)

MSB

8 bits or 16 bits

Data is captured at the timing of CLK fall.

PCM Input Timing

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PCM Timing Specifications

Parameter Symbol Condition Min. Typ. Max. Unit

PCMIN setup time to PCMCLK (input) fall tPC0 500 — —

PCMIN hold time to PCMCLK (input) fall tPC1 500 — —

PCMOUT setup time to PCMCLK (input) rise tPC2 500 — —

PCMOUT hold time to PCMCLK (input) rise tPC3 500 — —

PCMSYNC (input) setup time to PCMCLK (input) rise tPC4 500 — —

PCMSYNC (input) hold time to PCMCLK (input) rise tPC5 500 — —

Delay time from PCMCLK (input) rise to PCMSYNC (output) tPC6 — — 500

PCMIN setup time to PCMCLK (output) fall tPC7 500 — —

PCMIN hold time to PCMCLK (output) fall tPC8 500 — —

PCMOUT setup time to PCMCLK (output) rise tPC9 500 — —

PCMOUT hold time to PCMCLK (output) rise tPC10 500 — —

PCMSYNC (input) setup time to PCMCLK (output) rise tPC11 500 — —

PCMSYNC (input) hold time to PCMCLK (output) rise tPC12 500 — —

Delay time from PCMCLK (output) rise to PCMSYNC (output) tPC13

CL = 50

— — 500

PCMCLK (input)

PCMIN

PCMOUT tPC2 tPC3 tPC2 tPC3

tPC0 tPC1

PCMSYNC (input )

PCMSYNC (output) tPC4 tPC5 tPC4 tPC5

tPC6

PCMCLK (output)

PCMIN

PCMOUT

tPC9 tPC10 tPC9 tPC10

tPC7 tPC8

PCMSYNC (input )

PCMSYNC (output) tPC11 tPC12 tPC11 tPC12

tPC13

PCM Timing

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MOUNTING MODULE

Recommended Module Fixing Method

When this module is fixed on a product, our recommended method is to fit the module board-to-board connector

(header) into the board-to-board connector (socket) mounted on the product board, and to solder the module

shielding case to the product board.

Soldering Pattern

Board-to-board connector

(AXK5F20545)

Pattern

inhibiting

zone

3.6

11.7 30.5

13.2

17.5

25.1

4.2

9.5

Pad dimension

3.0

4.0

Unit: [mm]

The pattern inhibiting zone is applied to the MK70120 (antenna built-in type).

29.4

26.4

4.9

7.9

1.5 mm maximum (three soldering points)

: Solderin

oints

Unit: [mm]

Soldering points in the shielding case for fixation on a product board

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Notes on Mounting the Module

1. This module is not adaptable to reflow mounting. When soldering the shielding case to a product board, use a

soldering iron.

2. If metal is placed around the antenna, the antenna characteristics may deteriorate. Do not place copper foil in

the pattern inhibiting zone shown in the above section. Do not place metal around the antenna if possible.

(Only for MK70120).

3. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that

touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding

case and the pattern. For example, apply resist on the entire surface that touches the shielding case.

4. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the

connection with better electrical characteristics in the module mounted state.

CAUTIONS IN USE

This module consists of precision electronic components. Therefore, note the following when handling the

module:

1. In a case of decomposition or recomposition of this module, the operations in these specifications are not

assured.

2. This module is not waterproof or drip-proof. Do not use the module in wet locations.

3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty

places.

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MODULE OUTLINE

Outline of MK70110

Board to Board Connector Assignment

Case Board to Board Connector

RF Coaxial Connector

LabelLot No.

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Outline of MK70120

Board to Board Connector Assignment

LabelLot No.Board to Board ConnectorCaseChip Antenna

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REVISION HISTORY

Page

Document

No. Date Previous

Edition Current

Edition Description

PEDLMK70-01 Aug. 2001 – – Preliminary edition 1

Preliminary edition 2

PEDLMK70-02 Apr. 24, 2002 – – Owing to the device name change from MK70

Series to MK70110/MK70120, the contents

have been changed throughout the document.

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NOTICE

1. The information contained herein can change without notice owing to product and/or technical improvements.

Before using the product, please make sure that the information being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been chosen as an

explanation f or the standard acti on and performa nce of the product. When planning to use t he product, please

ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum ratings and within the

specified operating ranges in cluding, but no t limited to, operating voltage, power dissipation, and operating

temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation

resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or

unusual physi cal or electrical stress including, but not limited to, expos ure to parameters beyond t he specified

maximum ratings or operation outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is

granted by us i n connection with the use o f the product and/or the inf ormation and drawing s contained herein.

No responsibility is assumed by us for any infringement of a third party’s right which may result from the use

thereof.

6. The products listed in this document are intended for use in general electronics equipment for commercial

applications (e.g., office automation, communication equipment, measurement equipment, consumer

electronics, etc.). These products are not authorized for use in any system or application that requires special

or enhanced quality an d reliab ility characteristics n or in an y system or application where the failure of such

system or application may result in the loss or damage of property, or death or injury to humans.

Such applications include, but are not limited to, traffic and automotive equipment, safety devices, ae rospace

equipment, nuclear power control, medical equipment, and life-support systems.

7. Certain products in this document may need government approval before they can be exported to particular

countries. The purchaser assumes the responsibility of determining the legality of export of these products

and will take appropriate and necessary steps at their own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.