SII9334CTU - Silicon Image

Data Brief

SiI9127A HDMI Receiver with Deep Color

Outputs

Data Brief

Document # SiI-DB-1059-A03

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

September 2010

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HDMI®, the HDMI logo and High-Definition Multimedia Interface™ are trademarks or registered trademarks of, and are

used under license from, HDMI Licensing, LLC. x.v.Color™ is a trademark of Sony Corporation.

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SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Introduction

The SiI9127A HDMI Receiver with Deep Color

Outputs is a 2-port receiver that allows DTVs that can

display 10/ 12-bit color de pth to provide the hi g hest

quality protected digital audio and video over a single

cable. The SiI9127A receiver can receive Deep Color

video up to 12-bit, 1080p at 60 Hz. Efficient color

space conversion receives RGB or YCbCr video data

and sends either standard-definition or high-definition

RGB or YCbCr formats.

The SiI9127A receiver supports the extended gam ut YCC

or xvYCC color space described in the IEC 61966-2-4

Specification, which supports approximately 1.8 times the

number of colors as the RGB color space. The xvYCC

color space also makes full use of the range provided by

the standard 8-bit resolution per pixel format.

The SiI9127A receiver is pre-programmed with High-

bandwidth Digital Content Protection (HDCP) keys and

contains an i ntegrated HDCP decrypti on engine for

receiving protected audio and video content . This set of keys

helps reduce programm ing overhead, lowe rs manufacturi ng

costs, and provides the highest level of security.

An integrated Extended Display Identification Data

(EDID) block stored in non-vo latil e mem ory (NVM) can

be programmed at the time of ma nufacture using t he

local I2C bus. On-board RAM can also be loaded throug h

the I2C bus with EDID data from the sy stem micro-

controller during initialization if the EDID content of the

NVM is not used. The EDID is refl ected on the t wo

HDMI ports through the DDC bus. The device allows

different EDID formats to be mixed in an appli cation.

Having the flexibility to provide EDID cont ent from the

sources described above or from external ROM can

eliminate up to two EDID ROMs and save board space.

Flexible power m anagement provides ext remely low standby

power consum ption. Standby power can be supplied from an

HDMI 5 V sign al or from a separate st andby power pin. If

the NVM stores the EDID, only the 5 V power from the

source device is needed to read the EDID.

Inputs

• two HDMI/DVI-compatible ports

• the TMDS™ core runs at 25–2 25 MHz

• dynamic cable equalization automatically detects

the equalization required for the incoming signa l

Digital Video Output

• xvYCC to extended RGB

• 36-bit RGB/YCbCr 4:4:4

• 16/20/24-bit YCbCr 4:2:2

• 8/10/12- bi t YCbCr 4:2:2 (ITU BT.656)

• true 12-bit accurate output data using an internal

14-bit wide processing path

• drive strength is programmable from 2 mA to 14 mA

Digital Audio Interface

• sends and receives up to two channels of

uncompressed digital audio at the rate of 192 kHz

• I2S output with one data signal for stereo formats

• S/PDIF output supports PCM, Dolby Digital , DTS

digital audio transmission with a 32–192 kHz Fs

sample rate

• intelligent audio mute capab ility avoids pops and

noise with automatic soft mute and unmute

• IEC60958 or IEC61937 compatible

Consumer Electronic Control

• Consumer Electronics Control (CEC) interface

incorporates an HDMI CEC I/O

• an integrated CEC Programming Interface (CPI)

relieves the burden of the microcontroller having to

write low-level commands

• Automatic Feature Abort response for unsupported

commands

• Automatic Message Retry on transmit

Package

• 14 mm x 14 mm 128-pin TQFP package with ePad™

Figure 1. Digital Tel evi sion System Diagram

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

System Applications

The SiI9127A receiver is designed for digital televisions that require support for HDM I Deep Color. The device allows

receipt of 10/12-bit color depth up to 1080p resolutions. A single receiver chip provides two HDMI input ports. The

video output interfaces to a video processor and the audio output can interface directly to an audio DAC or an audio DSP

for further processing as shown in Figure 1.

Comparing SiI9127A with SiI9125, SiI9135A, SiI9223A and SiI9233A

Table 1 summarizes the functional differences among the SiI9127A, SiI9125, SiI9135A, SiI9223A and the SiI9233A

receivers.

Table 1. Summary of New Features

Feature SiI9125 SiI9127A SiI9135A SiI9223A SiI9233A

HDMI Input Connections

TMDS Input Ports 2 2 2 4 4

Color Depth 8/10/12-bit 8/10/12-bit 8/10/12-bit 8/10/12-bit 8/10/12-bit

DDC Input Ports 2 2 2 4 4

Maximum TMDS Input Clock 225 MHz 225 MHz 225 MHz 225 MHz 225 MHz

Video Output

Digital Video Output Ports 1 1 1 1 1

Maximum Output Pixel Clock 165 MHz. 165 MHz. 165 MHz. 165 MHz. 165 MHz.

Maximum Output Bus Width 36 36 36 36 36

Audio Formats

S/PDIF Output Ports 1 1 1 1 1

I2S Output 2 channel 2 channel 8 channel 2 channel 8 channel

DSD Output 2 channel NA 6 channel NA 8 channel

High Bit Rate Audio Support

Compressed DTS-HD and Dolby

True-HD No No Yes No Yes

Maximum Audio Sample Rate (Fs) 192 kHz 192 kHz 192 kHz 192 kHz 192 kHz

Video Processing

Color Space Converter RGB to/from

YCbCr

RGB to/from

YCbCr

xvYCC to RGB

RGB to/from

YCbCr

RGB to/from

YCbCr

xvYCC to RGB

RGB to/from

YCbCr

xvYCC to RGB

Pixel Clock Divider ÷ 4, ÷ 2 ÷ 4, ÷ 2 ÷ 4, ÷ 2 ÷ 4, ÷ 2 ÷ 4, ÷ 2

Digital Video Bus Mapping swap Cb, Cr pins swap Cb, Cr pins swap Cb, Cr pins swap Cb, Cr pins swap Cb, Cr pins

Other Features

CEC No Yes No Yes Yes

EDID No NVRAM No NVRAM NVRAM

HDCP Repeater Support No No Yes No Yes

Interlaced Format Detection Pin Yes Yes Yes Yes Yes

Package 144-pin TQFP

ePad 128-pin TQFP

ePad 144-pin TQFP

ePad

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

Pin Diagram

Figure 2 shows the SiI9127A pin assignments of the receiver. Pin names are generalized by type for this document. The

list below the diagram describes the purpose of each type. The package is a 14 mm x 14 mm 128-pin TQFP with an

ePad.

Figure 2. Pin Diagram

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

Package Information

ePad Requirements

The SiI9127A receiver is packaged in a 128-pin, 14 mm x 14 mm TQFP package with an ExposedPad™ (ePad™) that is

used for the electrical ground of the device and for improved thermal transfer characteristics. The ePad dimensions are

4.445 mm x 4.0604 mm ±0.15 mm. Soldering the ePad to the ground plane of the PCB is required to meet package

power dissipation requirements at full speed operation, and to correctly connect the chip circuitry to electrical ground. A

clearance of at least 0.25 mm should be designed on the PCB between the edge of the ePad and the inner edges of the

lead pads to avoid the possibility of electrical shor ts.

The thermal land area on the PCB may use thermal vias to improve heat removal from the package. These thermal vias

also double as the ground connections of the chip and must attach intern ally in the PCB to the ground plane. An array of

vias should be designed into the PCB beneath the package. For optimum thermal performance, the via diameter should

be 12 mils to 13 mils (0.30 mm to 0.33 mm) and the via barrel should be plated with 1-ounce copper to plug the via. This

design helps to avoid any solder wicking inside the via during the soldering process, which may result in voids in solder

between the pad and the thermal land. If the copper plating does not plug the vias, the thermal vias can be tented with

solder mask on the top surface of the PCB to avoid solder wicking inside the via during assembly. The solder mask

diameter should be at least 4 mils (0.1 mm) larger than the via diameter.

Package stand-off when mounting the device also needs to be considered. For a nominal stand-off of approximately

0.1 mm the stencil thickness of 5 mils to 8 mils should provide a good solder joint between the ePad and the thermal

land.

Figure 3 on the next page shows the package dimensions of the SiI9127A receiver.

PCB Layout Guidelines

Refer to Silicon Image application note PCB Layout Guidelines: Designing with Exposed Pads for basic PCB design

guidelines whe n desi g ni n g with therma ll y enhanced packages using the exposed pad. This application note is intended

for use by PCB layout desi g ne rs.

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

Package Dimensions

Figure 3 shows the layou t and dimensions of the 128-pin TQFP package. Package drawings are not to scale.

JEDEC Package Code MS-026-AFB

Item Description Typ Max Item Description Typ Max

A Thickness 1.10 1.20 b Lead width 0.16 0.23

A1 Stand-off 0.10 0.15 c Lead thickness — 0.20

A2 Body thickness 1.00 1.05 e Lead pitch 0.40

D Footprint 16.00 L Lead foot length 0.60 0.75

E Footprint 16.00 L1 Lead length 1.00

D1 Body size 14.00

E1 Body size 14.00

D2 Lead Row Width 12.40

E2 Lead Row Width 12.40

Dimensions are in millimeters.

Overall thickness A = A1 + A2.

Figure 3. 128-Pin TQFP Package Diagram

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

Marking Specification

Drawing is not to scale and pin count shown is representative. Refer to the specifics in Figure 3 on page 5.

Figure 4. Marking Di agram

Ordering Information

Production Part Numbers: TMDS Input Clock Range Part Number

25–225 MHz SiI9127ACTU

The universal package may be used in lead-free and ordinary process lines.

SiI9127A HDMI Receiver with Deep Color Outputs

Data Brief

Silicon Image, Inc.

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