CYStech Electronics Corp.
Spec. No. : C303S3C
Issued Date : 2003.10.07
Revised Date : . .
Page No. : 1/4
DAN217S3 CYStek Product Specification
DAN217S3
HIGH-SPEED SWITCHING DIODE
Description
The DAN217S3 consists of two diodes in a plastic surface mount package. The diodes are
connected in series and the unit is designed for high-speed switching application in hybrid thick
and thin-film circuits.
Features
• Small SMD Package (SOT-323)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Equivalent Circuit Outline
3
12
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -65 ~ +150 °C
Junction Temperature .................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 200 mW
• Maximum Voltages and Currents (Ta=25°C)
Reverse Voltage .................................................................................................................. 70 V
Repetitive Reverse Voltage ................................................................................................. 70 V
Forward Current ............................................................................................................. 150 mA
Repetitive Forward Current ............................................................................................ 500 mA
Forward Surge Current (1ms)....................................................................................... 1000 mA
1. Anode 1
2. Cathode 2
3. Cathode 1 / Anode 2
K1, A2
A1 K2
Sot-323
CYStech Electronics Corp.
Spec. No. : C303S3C
Issued Date : 2003.10.07
Revised Date : . .
Page No. : 2/4
DAN217S3 CYStek Product Specification
Characteristics (Ta=25°C)
Characteristic Symbol Condition Min Max Unit
Reverse Breakdown Voltage V(BR) I
R=100µA 70 - V
VF(1) IF=1mA - 715 mV
VF(2) IF=10mA - 855 mV
VF(3) IF=50mA - 1000 mV
Forward Voltage
VF(4) IF=150mA - 1250 mV
Reverse Current IR V
R=70 - 2.5 µA
Total Capacitance CT V
R=0, f=1MHz - 1.5 pF
Reverse Recovery Time trr IF=IR=10mA, RL=100Ω
measured at IR=1mA - 6 ns
CYStech Electronics Corp.
Spec. No. : C303S3C
Issued Date : 2003.10.07
Revised Date : . .
Page No. : 3/4
DAN217S3 CYStek Product Specification
Characteristic Curves
Forward Biased Voltage & Forward Current
0
150
300
450
0 500 1000 1500 2000
Forward Biased Voltage-VF (mV)
Current-I
F (mA)
Capacitance & Reverse-Biased Voltage
0.1
1
0.1 1 10 100
Reverse Biased Voltage-VR (V)
Capacitance-Cd (pF)
CYStech Electronics Corp.
Spec. No. : C303S3C
Issued Date : 2003.10.07
Revised Date : . .
Page No. : 4/4
DAN217S3 CYStek Product Specification
SOT-323 Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.0315 0.0433 0.80 1.10 e1 0.0256 - 0.65 -
A1 0.0000 0.0039 0.00 0.10 He 0.0787 0.0886 2.00 2.25
bp 0.0118 0.0157 0.30 0.40 Lp 0.0059 0.0177 0.15 0.45
C 0.0039 0.0098 0.10 0.25 Q 0.0051 0.0091 0.13 0.23
D 0.0709 0.0866 1.80 2.20 v 0.0079 - 0.2 -
E 0.0453 0.0531 1.15 1.35 w 0.0079 - 0.2 -
e 0.0512 - 1.3 - θ - -
10° 0
°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
He
E
A
A1 Q
Lp
e1
e
bp
12
3
D
W B
v A
Z
detail Z
A
C
θ
01 2
scale
mm
Style : Pin 1. A1 2.K2 3. K1, A2
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
Marking:
TE
KJG
