Gas Discharge Tubes
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/12/17
CG/CG2 Series
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (Min to Max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100° C
Temperature Maximum: 150° C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.