POWER CONDITIONING - SMT
5
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com
Application Support: apps@hittite.com
HMC976LP3E
400mA LOW NOISE, HIGH PSRR
LINEAR VOLTAGE REGULATOR
v0 2.1112
Outline Drawing
Part Number Package Body Material Lead Finish MSL Rating Package Marking [1]
HMC976LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 976
XXX
X
[1] 4-Digit lot number XXXX
[2] Max peak reow temperature of 260 °C
[3] For standard HMC976LP3E evaluation board, no heat sink (HS) and no air ow, see gures 14, 15, and 16
Table 2. Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Table 3. Recommended Operating Condition
Vdd to GND Voltage +5.8V / -0.3V
EN to GND Voltage +5.8V /-0.3V
RDx / HVx to GND Voltage +5.8V / -0.3V
Maximum Dissipation 780mW
Thermal Resistance
(Junction to Ambient) 51.5 °C/W [3]
Thermal Resistance (Junction to
Case, Ground Paddle) 18 °C/W
Maximum Junction Temperature +150 °C
Max Output Current 420 mA
Storage Temperature -65 to +150 °C
ESD Sensitivity (HBM) Class 1C
Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This
is a stress rating only; functional operation of the device
at these or any other conditions above those indicated in
the operational section of this specication is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. The absolute
maximum ratings apply individually only, not in combination.
NOTES:
[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC
SILICA AND SILICON IMPREGNATED.
[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].
[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
[6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL
BE 0.25m MAX.
[7] PACKAGE WARP SHALL NOT EXCEED 0.05mm
[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB GROUND.
[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND
PATTERN.
Table 4. Package Information
Parameter Condition Min. Typ. Max. Units
Junction Temperature 115 °C
Ambient Temperature -40 85 °C