ASD0011149 Rev. M
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1.0 SCOPE
This specification documents the detail requirements for space qualified product manufactured on Analog
Devices, Inc.'s QML certified line per MIL-PRF-38535 Level V except as modified herein.
The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to
be considered a part of this specification. http://www.analog.com/aerospace
This data sheet specifically details the space grade version of this product. A more detailed operational
description and a complete data sheet for commercial product grades can be found at
www.analog.com/REF43
2.0 Part Number. The complete part number(s) of this specification follow:
Part Number Description
REF43-803J +2.5V Low-Power Precision Voltage Reference
REF43-803L +2.5V Low-Power Precision Voltage Reference
REF43-803RC +2.5V Low-Power Precision Voltage Reference
REF43-803Z +2.5V Low-Power Precision Voltage Reference
REF43R803J Radiation Tested, +2.5V Low-Power Precision Voltage Reference
REF43R803L Radiation Tested, +2.5V Low-Power Precision Voltage Reference
REF43R803RC Radiation Tested, +2.5V Low-Power Precision Voltage Reference
REF43R803Z Radiation Tested, +2.5V Low-Power Precision Voltage Reference
2.1 Case Outline
Letter Descriptive designator¹ Case Outline (Lead Finish per MIL-PRF-38535)
J MACY1-X8 8-Lead Can
L GDFP1-F10 10-lead cerpac
RC CQCC1-N20 20-Terminal leadless chip carrier
Z GDIP1-T8 8-Lead ceramic dual-in-line package (CERDIP)
¹ See MIL-STD-1835
3.0 Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted)
Supply voltage ............................................................................................................................. 40V
Power dissipation ................................................................................................................... 500mW
Output short circuit duration ................................................................................................ Indefinite
Storage Temperature range ........................................................................................ -65° to +150°C
Operating temperature range ..................................................................................... -55° to +125°C
Lead temperature (soldering, 60 sec) ................................................................................... +300°C
Junction Temperature (TJ) .................................................................................................... +175°C
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3.1 Thermal Characteristics:
1
2
3
4
8
7
6
5
Test*
N.C.
OUT
Trim
Test*
V
IN
TEMP
GND
8 pin hermetic cerdip (Z)
4
8
2
5
6
7
3
1
Test*
N.C
V
OUT
V
IN
TEMP
TRIM
GROUND
(CASE)
8-Lead TO
Test*
20-Terminal LCC
1220 3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Bottom
View
N.C.
VIN
N.C.
TEMP
N.C.
N.C.
Test*
N.C.
Test*
N.C.
N.C.
N.C.
N.C.
VOUT
N.C.
N.C.
Trim
N.C.
GND
N.C.
1
2
3
4
5
10
9
8
7
6
TEST*
VIN
TEMP
N.C.
Ground
TEST*
N.C.
VOUT
N.C.
TRIM
10 lead CERPAC
Figure 1 - Terminal connections.
* Reserved for factory testing. Make no electrical connection to these pins.
REF43
4.0 Electrical Table: See notes at end of table
IL
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4.1 Electrical Test Requirements:
4.2 Table III. Lifetest / Burn-in delta limits.
5.0 Life Test/Burn-In Circuit:
5.1 HTRB is not applicable for this drawing.
5.2 Burn-in is per MIL-STD-883 Method 1015 test condition B.
5.3 Steady state life test is per MIL-STD-883 Method 1005.
REF43