NTC thermistors for
temperature measurement
SMD NTC thermistors,
case size 0805 (2012), standard series
Series/Type: B574**V2/ B57620C5
Date: June 2012
The following products presented in this data sheet are being withdrawn.
Ordering Code Substitute Product Date of
Withdrawal Deadline Last
Orders Last Shipments
B57411V2470+062 2012-11-09 2013-03-01 2013-06-01
B57411V2331+062 2012-11-09 2013-03-01 2013-06-01
B57411V2221+062 2012-11-09 2013-03-01 2013-06-01
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Ordering Code Substitute Product Date of
Withdrawal Deadline Last
Orders Last Shipments
B57411V2151+062 2012-11-09 2013-03-01 2013-06-01
B57411V2101+062 2012-11-09 2013-03-01 2013-06-01
B57421V2681+062 2012-11-09 2013-03-01 2013-06-01
B57421V2471+062 2012-11-09 2013-03-01 2013-06-01
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
1) Depends on mounting situation
Applications
Temperature measurement and
compensation
Features
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
Excellent long-term aging stability in high
temperature environment
UL approval (E69802)
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available
on request.
Delivery mode
Blister tape, 180-mm reel (standard);
330-mm reel (on request)
Dimensional drawing
Dimensions in mm
Approx. weight 13 mg
General technical data
Operating temperature range Top 55 ... 125 °C
Max. power (at 25 °C, on PCB) P251) 210 mW
Resistance tolerance ∆RR/RR±3, ±5 %
Rated temperature TR25 °C
Dissipation factor (on PCB) δth1) approx. 3.5 mW/K
Thermal cooling time constant (on PCB) τc1) approx. 10 s
Heat capacity Cth1) approx. 35 mJ/K
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 2 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Electrical specification and ordering codes
R25
ΩNo. of R/T
characteristic
B25/50
K
B25/85
K
B25/100
K
Ordering code
+ = Resistance tolerance
H = ±3%
J = ±5%
47 8500 3590 3635 3650 ±3% B57411V2470+062
100 8501 3500 3540 3550 ±3% B57411V2101+062
150 8501 3500 3540 3550 ±3% B57411V2151+062
220 8501 3500 3540 3550 ±3% B57411V2221+062
330 8501 3500 3540 3550 ±3% B57411V2331+062
470 8502 3940 3980 4000 ±3% B57421V2471+062
680 8502 3940 3980 4000 ±3% B57421V2681+062
1.0 k 1010 3470 3514 3530 ±3% B57620C5102+062
1.0 k 8502 3940 3980 4000 ±3% B57421V2102+062
1.5 k 8502 3940 3980 4000 ±3% B57421V2152+062
2.2 k 8502 3940 3980 4000 ±3% B57421V2222+062
3.3 k 8502 3940 3980 4000 ±3% B57421V2332+062
4.7 k 8500 3590 3635 3650 ±3% B57401V2472+062
4.7 k 8507 4386 4455 4480 ±3% B57471V2472+062
6.8 k 8507 4386 4455 4480 ±3% B57471V2682+062
10 k 1011 3660 3720 3730 ±3% B57620C5103+062
10 k 8500 3590 3635 3650 ±3% B57401V2103+062
10 k 8502 3940 3980 4000 ±3% B57421V2103+062
10 k 8507 4386 4455 4480 ±3% B57471V2103+062
15 k 8502 3940 3980 4000 ±3% B57421V2153+062
22 k 8502 3940 3980 4000 ±3% B57421V2223+062
22 k 8507 4386 4455 4480 ±3% B57471V2223+062
33 k 8502 3940 3980 4000 ±3% B57421V2333+062
33 k 8507 4386 4455 4480 ±3% B57471V2333+062
47 k 8502 3940 3980 4000 ±3% B57421V2473+062
47 k 8507 4386 4455 4480 ±3% B57471V2473+062
100 k 8507 4386 4455 4480 ±3% B57471V2104+062
470 k 8507 4386 4455 4480 ±3% B57471V2474+062
680 k 8507 4386 4455 4480 ±3% B57471V2684+062
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 3 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions ∆R25/R25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
< 2%1)
Storage in damp
heat, steady state
IEC
60068-2-78
JIS C 0022
Temperature of air: (40 ±2) °C
Relative humidity of air:
(93 +2/3)%
Duration: 56 days2)
< 2%2)
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 1003)
< 2%3)
Endurance Pmax: 210 mW
T: (65 ±2) °C
t: 1000 h
< 2%4)
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ±3) °C, (3 ±0.3) s
(245 ±5) °C, (3 ±0.3) s
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
95% of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 1%5)
1) Except B57620C5102+062 ∆R25/R25 (typical): < 6%, B57620C5103+062 ∆R25/R25 (typical): < 3%
2) Except B57620C5102+062 and B57620C5103+062 duration: 21 days, ∆R25/R25 (typical): < 3%
3) Except B57620C5102+062 and B57620C5103+062 number of cycles: 10, ∆R25/R25 (typical): < 3%
4) Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5%
5) Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5%
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 4 of 21Please read Cautions and warnings and
Important notes at the end of this document.
R/T characteristics
R/T No. 1010 1011 8500
T (°C) B25/100 = 3530 K B25/100 = 3730 K B25/100 = 3650 K
RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)
55.0 52.826 6.4 70.014 6.9 63.917 6.8
50.0 38.643 6.1 49.906 6.7 45.889 6.5
45.0 28.574 5.9 36.015 6.4 33.344 6.3
40.0 21.346 5.7 26.296 6.2 24.504 6.1
35.0 16.1 5.5 19.411 6.0 18.201 5.8
30.0 12.256 5.4 14.479 5.8 13.657 5.6
25.0 9.4071 5.2 10.903 5.6 10.347 5.5
20.0 7.2862 5.0 8.2923 5.4 7.9114 5.3
15.0 5.6835 4.9 6.3591 5.2 6.1019 5.1
10.0 4.4698 4.7 4.9204 5.1 4.7454 4.9
5.0 3.5385 4.6 3.8279 4.9 3.7198 4.8
0.0 2.8222 4.5 3.0029 4.8 2.938 4.6
5.0 2.2649 4.3 2.3773 4.6 2.3372 4.5
10.0 1.83 4.2 1.8959 4.5 1.8722 4.4
15.0 1.4872 4.1 1.5207 4.3 1.5096 4.2
20.0 1.2161 4.0 1.228 4.2 1.2249 4.1
25.0 1.0000 3.9 1.0000 4.1 1.0000 4.0
30.0 0.82677 3.8 0.81779 3.9 0.82111 3.9
35.0 0.68708 3.6 0.67341 3.8 0.67798 3.8
40.0 0.57401 3.5 0.55747 3.7 0.56279 3.7
45.0 0.48181 3.5 0.46357 3.6 0.46958 3.6
50.0 0.40638 3.4 0.3874 3.6 0.39374 3.5
55.0 0.34427 3.3 0.32368 3.5 0.33171 3.4
60.0 0.29296 3.2 0.272 3.4 0.28073 3.3
65.0 0.25035 3.1 0.23041 3.3 0.23863 3.2
70.0 0.21478 3.0 0.19604 3.2 0.2037 3.1
75.0 0.18501 2.9 0.16735 3.1 0.17459 3.0
80.0 0.15995 2.9 0.14342 3.0 0.15022 3.0
85.0 0.13881 2.8 0.12347 3.0 0.12975 2.9
90.0 0.12088 2.7 0.10668 2.8 0.11247 2.8
95.0 0.10563 2.7 0.092734 2.8 0.097838 2.8
100.0 0.092597 2.6 0.080903 2.8 0.085396 2.7
105.0 0.081442 2.5 0.070616 2.7 0.074781 2.6
110.0 0.071842 2.5 0.061826 2.6 0.065691 2.6
115.0 0.063571 2.4 0.054282 2.6 0.057883 2.5
120.0 0.056407 2.4 0.047793 2.5 0.051153 2.4
125.0 0.050196 2.3 0.042249 2.4 0.045335 2.4
130.0 0.040289 2.3
135.0 0.0359 2.3
140.0 0.032071 2.2
145.0 0.028723 2.2
150.0 0.025786 2.1
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 5 of 21Please read Cautions and warnings and
Important notes at the end of this document.
R/T characteristics
R/T No. 8501 8502 8507
T (°C) B25/100 = 3550 K B25/100 = 4000 K B25/100 = 4480 K
RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)
55.0 56.633 6.5 96.158 7.4 142.71 7.9
50.0 41.134 6.3 66.892 7.1 96.913 7.6
45.0 30.209 6.1 47.127 6.9 66.637 7.4
40.0 22.42 5.9 33.606 6.6 46.366 7.1
35.0 16.807 5.7 24.243 6.4 32.629 6.9
30.0 12.721 5.5 17.681 6.2 23.213 6.7
25.0 9.7156 5.3 13.032 6.0 16.686 6.5
20.0 7.4854 5.1 9.702 5.8 12.115 6.3
15.0 5.8152 5.0 7.2923 5.6 8.8803 6.1
10.0 4.5537 4.8 5.5314 5.4 6.5692 5.9
5.0 3.5931 4.7 4.2325 5.3 4.9025 5.8
0.0 2.8558 4.5 3.2657 5.1 3.6896 5.6
5.0 2.2857 4.4 2.54 4.9 2.7994 5.4
10.0 1.8416 4.3 1.9907 4.8 2.1406 5.3
15.0 1.4934 4.1 1.5716 4.7 1.6492 5.1
20.0 1.2184 4.0 1.2494 4.5 1.2798 5.0
25.0 1.0000 3.9 1.0000 4.4 1.0000 4.9
30.0 0.82537 3.8 0.80552 4.3 0.78663 4.7
35.0 0.68495 3.7 0.65288 4.1 0.62277 4.6
40.0 0.57139 3.6 0.53229 4.0 0.4961 4.5
45.0 0.47905 3.5 0.43645 3.9 0.39757 4.4
50.0 0.40358 3.4 0.35981 3.8 0.32044 4.3
55.0 0.34158 3.3 0.29819 3.7 0.2597 4.1
60.0 0.2904 3.2 0.24837 3.6 0.21161 4.0
65.0 0.24795 3.1 0.20787 3.5 0.17331 3.9
70.0 0.21259 3.0 0.17479 3.4 0.14265 3.8
75.0 0.183 3.0 0.14763 3.3 0.11799 3.8
80.0 0.15813 2.9 0.12523 3.2 0.098035 3.7
85.0 0.13715 2.8 0.10667 3.2 0.081823 3.6
90.0 0.11938 2.7 0.091227 3.1 0.068589 3.5
95.0 0.10427 2.7 0.078319 3.0 0.057735 3.4
100.0 0.091375 2.6 0.067488 2.9 0.048796 3.3
105.0 0.080333 2.5 0.058363 2.9 0.041403 3.2
110.0 0.070846 2.5 0.050647 2.8 0.035263 3.2
115.0 0.062666 2.4 0.044098 2.7 0.030143 3.1
120.0 0.055592 2.4 0.03852 2.7 0.025858 3.0
125.0 0.049454 2.3 0.033752 2.6 0.022258 3.0
130.0 0.029663 2.6 0.019223 2.9
135.0 0.026146 2.5 0.016655 2.8
140.0 0.023111 2.4 0.014476 2.8
145.0 0.020484 2.4 0.012619 2.7
150.0 0.018203 2.3 0.011033 2.7
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 6 of 21Please read Cautions and warnings and
Important notes at the end of this document.
1) ≤0.2 mm over 10 sprocket holes.
Taping and packing
1 Taping of SMD NTC thermistors
1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3)
Dimensions (mm)
Case size
0402
(8-mm tape)
Case size
0603
(8-mm tape)
Tolerance
A0×B00.60 ×1.15 0.95 ×1.80 ±0.2
T20.70 1.10
T 0.60 0.90 max.
D01.50 1.50 ±0.10
P04.00 4.00 ±0.101)
P22.00 2.00 ±0.05
P12.00 4.00 ±0.10
W 8.00 8.00 ±0.30
E 1.75 1.75 ±0.10
F 3.50 3.50 ±0.05
G 0.75 0.75 min.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 7 of 21Please read Cautions and warnings and
Important notes at the end of this document.
2) ≤0.2 mm over 10 sprocket holes.
1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3)
Dimensions (mm)
Case size
0805
(8-mm tape)
Case size
1206
(8-mm tape)
Tolerance
A0×B01.60 ×2.40 1.90 ×3.50 ±0.2
K01.40 1.40 max.
T22.5 2.5 max.
D01.50 1.50 +0.10/–0
D11.00 1.00 min.
P04.00 4.00 ±0.102)
P22.00 2.00 ±0.05
P14.00 4.00 ±0.10
W 8.00 8.00 ±0.30
E 1.75 1.75 ±0.10
F 3.50 3.50 ±0.05
G 0.75 0.75 min.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 8 of 21Please read Cautions and warnings and
Important notes at the end of this document.
3) Chip thickness depends on the resistance value.
1.3 Reel packing
Packing survey
Case
size
Chip
thick-
ness3)
8-mm tape Reel dimensions Packing units
mm mm pcs./reel
Blister Card-
board
A Tol. W1 Tol. W2 180-mm
reel
330-mm
reel
0402 0.5 x 180 3/+0 8.4 +1.5/0 14.4 max. 10000
0603 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000
330 ±2.0 12.4 +1.5/0 18.4 max. 16000
0805 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000 16000
1.2 x 330 ±2.0 12.4 +1.5/0 18.4 max. 3000 12000
1206 0.8 x 180 2/+0 8.4 +1.5/0 14.4 max. 4000
1.2 x 180 2/+0 8.4 +1.5/0 14.4 max. 2000
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 9 of 21Please read Cautions and warnings and
Important notes at the end of this document.
2 Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
60 SMD Cardboard tape 180-mm reel packing
62 SMD Blister tape 180-mm reel packing
70 SMD Cardboard tape 330-mm reel packing
72 SMD Blister tape 330-mm reel packing
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 10 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Mounting instructions
1 Soldering
1.1 SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 215 ±3 3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3
1.1.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 260 ±5 10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 11 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Wave soldering
Temperature characteristic at component terminal with dual wave soldering
Solder joint profiles for silver/nickel/tin terminations
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 12 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min Tsmin 100 °C 150 °C
- Temperature max Tsmax 150 °C 200 °C
- Time tsmin to tsmax 60 ... 120 s 60 ... 180 s
Average ramp-up rate Tsmax to Tp3°C/ s max. 3 °C/ s max.
Liquidous temperature TL183 °C 217 °C
Time at liquidous tL60 ... 150 s 60 ... 150 s
Peak package body temperature Tp1) 220 °C ... 235 °C2) 245 °C ... 260 °C2)
Time (tP)3) within 5 °C of specified
classification temperature (Tc)20 s3) 30 s3)
Average ramp-down rate Tpto Tsmax 6°C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature maximum 6 min maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 13 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Solder joint profiles for silver/nickel/tin terminations
1.1.3 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
ABC
0402/1005 0.6 0.6 1.7
0603/1608 1.0 1.0 3.0
0805/2012 1.3 1.2 3.4
1206/3216 1.8 1.2 4.5
1.1.4 Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 14 of 21Please read Cautions and warnings and
Important notes at the end of this document.
2 Conductive adhesion
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of
this method is that it involves no thermal stress. The adhesives used must be chemically inert.
3 Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4 Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
5 Cleaning
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
6 Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature: 25 °Cupto45°C
Relative humidity (without condensation): ≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
SMDs: 12 months for Ni-barrier termination
6 months for AgPd termination
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 15 of 21Please read Cautions and warnings and
Important notes at the end of this document.
7 Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 16 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
General
See "Important notes".
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative
humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder SMD NTC thermistors with nickel barrier termination within 12 months after shipment
from EPCOS.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 17 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Mounting
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting
process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand the temperature.
Avoid contamination of the thermistor surface during processing.
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to
an environment with normal atmospheric conditions.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
Operation
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under
normal atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents should be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For
measurement purposes (checking the specified resistance vs. temperature), the component
must not be immersed in water but in suitable liquids (e.g. Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by malfunction.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 18 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
A Area Fläche
B B value B-Wert
B25/100 B value determined by resistance
measurement at 25 °C and 100 °C
B-Wert, ermittelt durch Widerstands-
messungen bei 25 °C und 100 °C
Cth Heat capacitance Wärmekapazität
I Current Strom
N Number (integer) Anzahl (ganzzahliger Wert)
P25 Maximum power at 25 °C Maximale Leistung bei 25 °C
Pdiss Power dissipation Verlustleistung
Pel Electrical power Elektrische Leistung
Pmax Maximum power within stated
temperature range
Maximale Leistung im
angegebenenTemperaturbereich
∆RB/RBResistance tolerance caused by
spread of B value
Widerstandstoleranz, die durch die
Streuung des B-Wertes verursacht wird
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RRRated resistance Nennwiderstand
∆RR/RRResistance tolerance Widerstandstoleranz
RSSeries resistance Serienwiderstand
RTResistance at temperature T
(e.g. R25 = resistance at 25 °C)
Widerstand bei Temperatur T
(z.B. R25 = Widerstand bei 25 °C)
T Temperature Temperatur
∆T Temperature tolerance Temperaturtoleranz
t Time Zeit
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Grenztemperatur
(Kategorietemperatur)
Tmin Lower category temperature Untere Grenztemperatur
(Kategorietemperatur)
Top Operating temperature Betriebstemperatur
TRRated temperature Nenntemperatur
Tsurf Surface temperature Oberflächentemperatur
V Voltage Spannung
Vins Insulation test voltage Isolationsprüfspannung
Vop Operating voltage Betriebsspannung
Vtest Test voltage Prüfspannung
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 19 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
αTemperature coefficient Temperaturkoeffizient
∆Tolerance, change Toleranz, Änderung
δth Dissipation factor Wärmeleitwert
τcThermal cooling time constant Thermische Abkühlzeitkonstante
τaThermal time constant Thermische Zeitkonstante
Abbreviations / Notes
Symbol English German
Surface-mounted devices Oberflächenmontierbares Bauelement
* To be replaced by a number in ordering
codes, type designations etc.
Platzhalter für Zahl im Bestellnummern-
code oder für die Typenbezeichnung.
+ To be replaced by a letter. Platzhalter für einen Buchstaben.
All dimensions are given in mm. Alle Maße sind in mm angegeben.
The commas used in numerical values
denote decimal points.
Verwendete Kommas in Zahlenwerten
bezeichnen Dezimalpunkte.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 20 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Page 21 of 21
Important notes
The following applies to all products named in this publication:
1.
Some parts of this publication contain
statements about the suitability of our products for certain
areas of application
. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out
that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application.
As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2.
We also point out that
in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified.
In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3.
The warnings, cautions and product-specific notes must be observed.
4.
In order to satisfy certain technical requirements,
some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous)
. Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5.
We constantly strive to improve our products. Consequently,
the products described in this
publication may change from time to time
. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also
reserve the right to discontinue production and delivery of products
. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6.
Unless otherwise agreed in individual contracts,
all orders are subject to our General Terms and
Conditions of Supply.
7.
Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that
only requirements mutually agreed upon can and will be implemented in our
Quality Management System.
For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8.
The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending
in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
