LP38500TS-ADJ - Texas Instruments High-Performance Analog

LP38500-ADJ,LP38502-ADJ

LP38500/2-ADJ, LP38500A/2A-ADJ 1.5A FlexCap Low Dropout Linear Regulator

for 2.7V to 5.5V Inputs

Literature Number: SNVS539E

LP38500/2-ADJ, LP38500A/

2A-ADJ

October 30, 2009

1.5A FlexCap Low Dropout Linear Regulator for 2.7V to

5.5V Inputs

General Description

National's FlexCap LDO's feature unique compensation that

allows the use of any type of output capacitor with no limits

on minimum or maximum ESR. The LP38500/2 series of low-

dropout linear regulators operates from a +2.7V to +5.5V input

supply. These ultra low dropout linear regulators respond very

quickly to step changes in load, which makes them suitable

for low voltage microprocessor applications. Developed on a

CMOS process, (utilizing a PMOS pass transistor), the

LP38500/2 has low quiescent current that changes little with

load current.

Ground Pin Current: Typically 2 mA at 1.5A load current.

Disable Mode: Typically 25 nA quiescent current when the

Enable pin is pulled low.

Simplified Compensation: Stable with any type of output

capacitor, regardless of ESR.

Precision Output: "A" grade versions available with 1.5%

VADJ tolerance (25°C) and 3% over line, load and tempera-

ture.

Features

■FlexCap: Stable with ceramic, tantalum, or aluminum

capacitors

■Stable with 10 µF input/output capacitor

■Adjustable output voltage from 0.6V to 5V

■Low ground pin current

■25 nA quiescent current in shutdown mode

■Guaranteed output current of 1.5A

■Available in TO-263, TO-263 THIN, and LLP-8 packages

■Guaranteed VADJ accuracy of ±1.5% @ 25°C (A Grade)

■Guaranteed accuracy of ±3.5% @ 25°C (STD)

■Over-Temperature and Over-Current protection

■−40°C to +125°C operating TJ range

■Enable pin (LP38502)

Applications

■ASIC Power Supplies In:

Printers, Graphics Cards, DVD Players

Set Top Boxes, Copiers, Routers

■DSP and FPGA Power Supplies

■SMPS Regulator

■Conversion from 3.3V or 5V Rail

Typical Application Circuit

30036119

LP38500/2-ADJ, LP38500A/2A-ADJ 1.5A FlexCap Low Dropout Linear Regulator for 2.7V to 5.5V

Inputs

Connection Diagrams for TO-263 (TS) Package

30036121

Top View (LP38500TS-ADJ)

TO-263 Package

30036122

Top View (LP38502TS-ADJ)

TO-263 Package

Connection Diagrams for TO-263 THIN (TJ) Package

30036163

Top View (LP38500TJ-ADJ, LP38500ATJ-ADJ)

TO-263 THIN Package

30036162

Top View (LP38502TJ-ADJ, LP38502ATJ-ADJ)

TO-263 THIN Package

Pin Descriptions for TO-263 (TS), TO-263 THIN (TJ) Packages

Pin # Designation Function

EN Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has

no internal bias and must be either tied to the input voltage, or actively driven.

N/C In the LP38500, this pin has no internal connections. It can be left floating or used for trace

routing.

2 IN Input Supply

3 GND Ground

4 OUT Regulated Output Voltage

5 ADJ Sets output voltage

DAP DAP

The DAP is used to remove heat from the device by conducting it to the copper clad area on

the PCB which acts as the heatsink. The DAP is electrically connected to the backside of the

die. The DAP must be connected to ground potential, but can not be used as the only ground

connection.

www.national.com 2

LP38500/2-ADJ, LP38500A/2A-ADJ

Connection Diagrams for LLP-8 (SD) Package

30036159

Top View (LP38500SD-ADJ, LP38500ASD-ADJ)

LLP-8 Package

30036160

Top View (LP38502SD-ADJ, LP38502ASD-ADJ)

LLP-8 Package

Pin Descriptions for LLP-8 (SD) Package

Pin # Designation Function

1 GND Ground

IN Input Supply (LP38500 only). Input Supply pins share current and must be connected

together on the PC Board.

EN Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has

no internal bias and must be either tied to the input voltage, or actively driven.

3, 4 IN Input Supply. Input Supply pins share current and must be connected together on the PC

Board.

5, 6, 7 OUT Regulated Output Voltage. Output pins share current and must be connected together on the

PC Board.

8 ADJ Sets output voltage

DAP DAP

The DAP is used to remove heat from the device by conducting it to a copper clad area on

the PCB which acts as a heatsink. The DAP is electrically connected to the backside of the

die. The DAP must be connected to ground potential, but can not be used as the only ground

connection.

Ordering Information

TABLE 1. Package Marking and Ordering Information

Output

Voltage

Order Number Package Type Package Marking Supplied As:

ADJ

LP38500SDX-ADJ

LLP-8

LP38500SD-ADJ Tape and Reel of 4500 Units

LP38500SD-ADJ LP38500SD-ADJ Tape and Reel of 1000 Units

LP38502SDX-ADJ LP38502SD-ADJ Tape and Reel of 4500 Units

LP38502SD-ADJ LP38502SD-ADJ Tape and Reel of 1000 Units

LP38500ASDX-ADJ LP38500ASD-ADJ Tape and Reel of 4500 Units

LP38500ASD-ADJ LP38500ASD-ADJ Tape and Reel of 1000 Units

LP38502ASDX-ADJ LP38502ASD-ADJ Tape and Reel of 4500 Units

LP38502ASD-ADJ LP38502ASD-ADJ Tape and Reel of 1000 Units

ADJ

LP38500TSX-ADJ

TO-263

LP38500TS-ADJ Tape and Reel of 500 Units

LP38500TS-ADJ LP38500TS-ADJ Rail of 45 Units

LP38502TSX-ADJ LP38502TS-ADJ Tape and Reel of 500 Units

LP38502TS-ADJ LP38502TS-ADJ Rail of 45 Units

ADJ

LP38500TJ-ADJ

TO-263 THIN

LP38500TJ-ADJ Tape and Reel of 1000 Units

LP38502TJ-ADJ LP38502TJ-ADJ Tape and Reel of 1000 Units

LP38500ATJ-ADJ LP38500ATJ-ADJ Tape and Reel of 1000 Units

LP38502ATJ-ADJ LP38502ATJ-ADJ Tape and Reel of 1000 Units

3 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Storage Temperature Range −65°C to +150°C

Lead Temperature

(Soldering, 5 sec.) 260°C

ESD Rating (Note 2) ±2 kV

Power Dissipation(Note 3) Internally Limited

Input Pin Voltage (Survival) −0.3V to +6.0V

Enable Pin Voltage (Survival) −0.3V to +6.0V

Output Pin Voltage (Survival) −0.3V to +6.0V

IOUT (Survival) Internally Limited

Operating Ratings (Note 1)

Input Supply Voltage 2.7V to 5.5V

Enable Input Voltage 0.0V to 5.5V

Output Current (DC) 0 to 1.5A

Junction Temperature(Note 3) −40°C to +125°C

VOUT 0.6V to 5V

Electrical Characteristics

LP38500/2–ADJ

Unless otherwise specified: VIN = 3.3V, IOUT = 10 mA, CIN = 10 µF, COUT = 10 µF, VEN = VIN, VOUT = 1.8V. Limits in standard type

are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and

Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric

norm at TJ = 25°C, and are provided for reference purposes only.

Symbol Parameter Conditions Min Typ Max Units

VADJ Adjust Pin Voltage (Note 6)2.7V ≤ VIN ≤ 5.5V

10 mA ≤ IOUT ≤ 1.5A

0.584

0.575 0.605 0.626

0.635 V

VADJ

Adjust Pin Voltage (Note 6)

"A" GRADE

2.7V ≤ VIN ≤ 5.5V

10 mA ≤ IOUT ≤ 1.5A

0.596

0.587 0.605 0.614

0.623 V

IADJ Adjust Pin Bias Current 2.7V ≤ VIN ≤ 5.5V 50 750 nA

VDO Dropout Voltage (Note 7)IOUT = 1.5A 220 275

375 mV

ΔVOUT/ΔVIN

Output Voltage Line

Regulation

(Note 4, Note 6)

2.7V ≤ VIN ≤ 5.5V —0.04

0.05 —%/V

ΔVOUT/ΔIOUT

Output Voltage Load

Regulation

(Note 5, Note 6)

10 mA ≤ IOUT ≤ 1.5A —0.18

0.33 —%/A

IGND

Ground Pin Current In Normal

Operation Mode 10 mA ≤ IOUT ≤ 1.5A —23.5

4.5 mA

IDISABLED Ground Pin Current VEN < VIL(EN) —0.025 0.125

15 µA

IOUT(PK) Peak Output Current VOUT ≥ VOUT(NOM) - 5% 3.6 A

ISC Short Circuit Current VOUT = 0V 23.7 A

Enable Input (LP38502 Only)

VIH(EN) Enable Logic High VOUT = ON 1.4 — — V

VIL(EN) Enable Logic Low VOUT = OFF — — 0.65

td(off) Turn-off delay

Time from VEN < VIL(EN) to VOUT =

OFF

ILOAD = 1.5A

—25 —

µs

td(on) Turn-on delay

Time from VEN >VIH(EN) to VOUT =

ILOAD = 1.5A

—25 —

IIH(EN) Enable Pin High Current VEN = VIN —1—nA

IIL(EN) Enable Pin Low Current VEN = 0V —0.1 —

www.national.com 4

LP38500/2-ADJ, LP38500A/2A-ADJ

Symbol Parameter Conditions Min Typ Max Units

AC Parameters

PSRR Ripple Rejection

VIN = 3.0V, IOUT = 1.5A

f = 120Hz —58 —

VIN = 3.0V, IOUT = 1.5A

f = 1 kHz —56 —

ρn(l/f) Output Noise Density f = 120Hz, COUT = 10 µF CER —1.0 —µV/√Hz

enOutput Noise Voltage BW = 100Hz – 100kHz

COUT = 10 µF CER —100 —µV (rms)

Thermal Characteristics

TSD Thermal Shutdown TJ rising —170 —°C

ΔTSD Thermal Shutdown Hysteresis TJ falling from TSD —10 —

θJ-A

Thermal Resistance

Junction to Ambient

TO-263, TO-263 THIN(Note 8)

1 sq. in. copper —37 —

°C/W

Thermal Resistance

Junction to Ambient LLP-8 (Note 9)—80 —

θJ-C

Thermal Resistance

Junction to Case

TO-263, TO-263 THIN —5—°C/W

LLP-8 —16 —

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics.

Note 2: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.

Note 3: Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum

allowable operating junction temperature (TJ(MAX)), and package thermal resistance (θJA). See Application Information.

Note 4: Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the voltage at the input.

Note 5: Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in the load current.

Note 6: The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the adjust

voltage tolerance specification.

Note 7: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. For any output

voltage less than 2.5V, the minimum VIN operating voltage is the limiting factor.

Note 8: The value of θJA for the TO-263 (TS) package and TO-263 THIN (TJ) package can range from approximately 30 to 60°C/W depending on the amount of

PCB copper dedicated to heat transfer (See Application Information).

Note 9: θJA for the LLP-8 package was measured using the LP38502SD-ADJ evaluation board (See Application Information).

5 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, VIN = 2.7V, VEN = VIN,

CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA, VOUT = 1.8V

Noise Density

30036110

Noise Density

30036114

IGND vs Load Current

30036111

IGND(OFF) vs Temperature

30036112

VADJ vs Temperature

30036113

Dropout Voltage vs Load Current

30036115

www.national.com 6

LP38500/2-ADJ, LP38500A/2A-ADJ

VEN vs Temperature

30036116

Turn-on Characteristics

30036117

Turn-on Time

30036155

Turn-on Time

30036156

PSRR

30036120

7 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

Block Diagrams (TO-263, TO-263 THIN)

LP38500-ADJ TO-263 Block Diagram

30036150

LP38502-ADJ TO-263 Block Diagram

30036151

Block Diagrams (LLP-8)

LP38500-ADJ LLP-8 Block Diagram

30036158

LP38502-ADJ LLP-8 Block Diagram

30036151

www.national.com 8

LP38500/2-ADJ, LP38500A/2A-ADJ

Application Information

EXTERNAL CAPACITORS

The LP3850X requires that at least 10 µF (±20%) capacitors

be used at the input and output pins located within one cm of

the IC. Larger capacitors may be used without limit on size for

both CIN and COUT. Capacitor tolerances such as temperature

variation and voltage loading effects must be considered

when selecting capacitors to ensure that they will provide the

minimum required amount of capacitance under all operating

conditions for the application.

In general, ceramic capacitors are best for noise bypassing

and transient response because of their ultra low ESR. It must

be noted that if ceramics are used, only the types with X5R

or X7R dielectric ratings should be used (never Z5U or Y5F).

Capacitors which have the Z5U or Y5F characteristics will see

a drop in capacitance of as much as 50% if their temperature

increases from 25°C to 85°C. In addition, the capacitance

drops significantly with applied voltage: a typical Z5U or Y5F

capacitor can lose as much as 60% of it’s rated capacitance

if only half of the rated voltage is applied to it. For these rea-

sons, only X5R and X7R ceramics should be used.

INPUT CAPACITOR

All linear regulators can be affected by the source impedance

of the voltage which is connected to the input. If the source

impedance is too high, the reactive component of the source

may affect the control loop’s phase margin. To ensure prop-

er loop operation, the ESR of the capacitor used for CIN

must not exceed 0.5 Ohms. Any good quality ceramic ca-

pacitor will meet this requirement, as well as many good

quality tantalums. Aluminum electrolytic capacitors may also

work, but can possibly have an ESR which increases signifi-

cantly at cold temperatures. If the ESR of the input capacitor

may exceed 0.5 Ohms, it is recommended that a 2.2 µF ce-

ramic capacitor be used in parallel, as this will assure stable

loop operation.

OUTPUT CAPACITOR

Any type of capacitor may be used for COUT, with no limita-

tions on minimum or maximum ESR, as long as the minimum

amount of capacitance is present. The amount of capacitance

can be increased without limit. Increasing the size of COUT

typically will give improved load transient response.

SETTING THE OUTPUT VOLTAGE

The output voltage of the LP38500/2-ADJ can be set to any

value between 0.6V and 5V using two external resistors

shown as R1 and R2 in Figure 1.

30036161

FIGURE 1.

The value of R2 should always be less than or equal to 10

kΩ for good loop compensation. R1 can be selected for a giv-

en VOUT using the following formula:

VOUT = VADJ (1 + R1/R2) + IADJ (R1)

Where VADJ is the adjust pin voltage and IADJ is the bias cur-

rent flowing into the adjust pin.

STABILITY AND PHASE MARGIN

Any regulator which operates using a feedback loop must be

compensated in such a way as to ensure adequate phase

margin, which is defined as the difference between the phase

shift and -180 degrees at the frequency where the loop gain

crosses unity (0 dB). For most LDO regulators, the ESR of the

output capacitor is required to create a zero to add enough

phase lead to ensure stable operation. The LP38500/2-ADJ

has a unique internal compensation circuit which maintains

phase margin regardless of the ESR of the output capacitor,

so any type of capacitor may be used.

Figure 2 shows the gain/phase plot of the LP38500/2-ADJ

with an output of 1.2V, 10 µF ceramic output capacitor, deliv-

ering 1.5A of load current. It can be seen that the unity-gain

crossover occurs at 150 kHz, and the phase margin is about

40° (which is very stable).

30036153

FIGURE 2. Gain-Bandwidth Plot for 1.5A Load

Figure 3 shows the gain and phase with no external load. In

this case, the only load is provided by the gain setting resistors

(about 12 kΩ total in this test). It is immediately obvious that

the unity-gain frequency is significantly lower (dropping to

about 500 Hz), at which point the phase margin is 125°.

9 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

30036154

FIGURE 3. Gain-Bandwidth Plot for No Load

The reduction in unity-gain bandwidth as load current is re-

duced is normal for any LDO regulator using a P-FET or PNP

pass transistor, because they have a pole in the loop gain

function given by:

This illustrates how the pole goes to the highest frequency

when RL is minimum value (maximum load current). In gen-

eral, LDO’s have maximum bandwidth (and lowest phase

margin) at full load current. In the case of the LP38500/2-ADJ,

it can be seen that it has good phase margin even when using

ceramic capacitors with ESR values of only a few milli Ohms.

LOAD TRANSIENT RESPONSE

Load transient response is defined as the change in regulated

output voltage which occurs as a result of a change in load

current. Many applications have loads which vary, and the

control loop of the voltage regulator must adjust the current

in the pass FET transistor in response to load current

changes. For this reason, regulators with wider bandwidths

often have better transient response.

The LP38500/2-ADJ employs an internal feedforward design

which makes the load transient response much faster than

would be predicted simply by loop speed: this feedforward

means any voltage changes appearing on the output are cou-

pled through to the high-speed driver used to control the gate

of the pass FET along a signal path using very fast FET de-

vices. Because of this, the pass transistor’s current can

change very quickly.

Figure 3 shows the output voltage load transient which occurs

on a 1.8V output when the load changes from 0.1A to 1.5A at

an average slew rate of 0.5A/µs. As shown, the peak output

voltage change from nominal is about 40 mV, which is about

2.2%.

30036157

FIGURE 4. Load Transient Response

In cases where extremely fast load changes occur, the output

capacitance may have to be increased. When selecting ca-

pacitors, it must be understood that the better performing

ones usually cost the most. For fast changing loads, the in-

ternal parasitics of ESR (equivalent series resistance) and

ESL (equivalent series inductance) degrade the capacitor’s

ability to source current quickly to the load. The best capacitor

types for transient performance are (in order):

1. Multilayer Ceramic: with the lowest values of ESR and

ESL, they can have ESR values in the range of a few milli

Ohms. Disadvantage: capacitance values above about

22 µF significantly increase in cost.

2. Low-ESR Aluminum Electrolytics: these are aluminum

types (like OSCON) with a special electrolyte which

provides extremely low ESR values, and are the closest

to ceramic performance while still providing large

amounts of capacitance. These are cheaper (by

capacitance) than ceramic.

3. Solid tantalum: can provide several hundred µF of

capacitance, transient performance is slightly worse than

OSCON type capacitors, cheaper than ceramic in large

values.

4. General purpose aluminum electrolytics: cheap and

provide a lot of capacitance, but give the worst

performance.

In general, managing load transients is done by paralleling

ceramic capacitance with a larger bulk capacitance. In this

way, the ceramic can source current during the rapidly chang-

ing edge and the bulk capacitor can support the load current

after the first initial spike in current.

PRINTED CIRCUIT BOARD LAYOUT

Good layout practices will minimize voltage error and prevent

instability which can result from ground loops. The input and

output capacitors should be directly connected to the IC pins

with short traces that have no other current flowing in them

(Kelvin connect).

The best way to do this is to place the capacitors very near

the IC and make connections directly to the IC pins via short

traces on the top layer of the PCB. The regulator’s ground pin

should be connected through vias to the internal or backside

ground plane so that the regulator has a single point ground.

The external resistors which set the output voltage must also

be located very near the IC with all connections directly tied

via short traces to the pins of the IC (Kelvin connect). Do not

connect the resistive divider to the load point or DC error will

be induced.

www.national.com 10

LP38500/2-ADJ, LP38500A/2A-ADJ

RFI/EMI SUSCEPTIBILITY

RFI (Radio Frequency Interference) and EMI (Electro-Mag-

netic Interference) can degrade any integrated circuit's per-

formance because of the small dimensions of the geometries

inside the device. In applications where circuit sources are

present which generate signals with significant high frequen-

cy energy content (> 1 MHz), care must be taken to ensure

that this does not affect the IC regulator.

If RFI/EMI noise is present on the input side of the regulator

(such as applications where the input source comes from the

output of a switching regulator), good ceramic bypass capac-

itors must be used at the input pin of the IC to reduce the

amount of EMI conducted into the IC.

If the LP38500/2-ADJ output is connected to a load which

switches at high speed (such as a clock), the high-frequency

current pulses required by the load must be supplied by the

capacitors on the IC output. Since the bandwidth of the reg-

ulator loop is less than 300 kHz, the control circuitry cannot

respond to load changes above that frequency. This means

the effective output impedance of the IC at frequencies above

300 kHz is determined only by the output capacitor(s). Ce-

ramic capacitors provide the best performance in this type of

application.

In applications where the load is switching at high speed, the

output of the IC may need RF isolation from the load. In such

cases, it is recommended that some inductance be placed

between the output capacitor and the load, and good RF by-

pass capacitors be placed directly across the load. PCB

layout is also critical in high noise environments, since RFI/

EMI is easily radiated directly into PC traces. Noisy circuitry

should be isolated from "clean" circuits where possible, and

grounded through a separate path. At MHz frequencies,

ground planes begin to look inductive and RFI/EMI can cause

ground bounce across the ground plane. In multi-layer PC

Board applications, care should be taken in layout so that

noisy power and ground planes do not radiate directly into

adjacent layers which carry analog power and ground.

OUTPUT NOISE

Noise is specified in two ways:

Spot Noise or Output noise density is the RMS sum of all

noise sources, measured at the regulator output, at a specific

frequency (measured with a 1Hz bandwidth). This type of

noise is usually plotted on a curve as a function of frequency.

Total output noise voltage or Broadband noise is the RMS

sum of spot noise over a specified bandwidth, usually several

decades of frequencies. Attention should be paid to the units

of measurement.

Spot noise is measured in units µV/√Hz or nV/√Hz and total

output noise is measured in µV(rms). The primary source of

noise in low-dropout regulators is the internal reference. In

CMOS regulators, noise has a low frequency component and

a high frequency component, which depend strongly on the

silicon area and quiescent current.

Noise can generally be reduced in two ways: increase the

transistor area or increase the reference current. However,

enlarging the transisitors will increase die size, and increasing

the reference current means higher total supply current

(ground pin current).

SHORT-CIRCUIT PROTECTION

The LP38500/2-ADJ contains internal current limiting which

will reduce output current to a safe value if the output is over-

loaded or shorted. Depending upon the value of VIN, thermal

limiting may also become active as the average power dissi-

pated causes the die temperature to increase to the limit value

(about 170°C). The hysteresis of the thermal shutdown cir-

cuitry can result in a “cyclic” behavior on the output as the die

temperature heats and cools.

ENABLE OPERATION (LP38502-ADJ Only)

The Enable pin (EN) must be actively terminated by either a

10 kΩ pull-up resistor to VIN, or a driver which actively pulls

high and low (such as a CMOS rail to rail comparator). If active

drive is used, the pull-up resistor is not required. This pin must

be tied to VIN if not used (it must not be left floating).

DROPOUT VOLTAGE

The dropout voltage of a regulator is defined as the input-to-

output differential required by the regulator to keep the output

voltage within 2% of the nominal value. For CMOS LDOs, the

dropout voltage is the product of the load current and the

RDS(on) of the internal MOSFET pass element.

Since the output voltage is beginning to “drop out” of regula-

tion when it drops by 2%, electrical performance of the device

will be reduced compared to the values listed in the Electrical

Characteristics table for some parameters (line and load reg-

ulation and PSRR would be affected).

REVERSE CURRENT PATH

The internal MOSFET pass element in the LP38500/2-ADJ

has an inherent parasitic diode. During normal operation, the

input voltage is higher than the output voltage and the para-

sitic diode is reverse biased. However, if the output is pulled

above the input in an application, then current flows from the

output to the input as the parasitic diode gets forward biased.

The output can be pulled above the input as long as the cur-

rent in the parasitic diode is limited to 200 mA continuous and

1A peak. The regulator output pin should not be taken below

ground potential. If the LP38500/2-ADJ is used in a dual-sup-

ply system where the regulator load is returned to a negative

supply, the output must be diode-clamped to ground.

POWER DISSIPATION/HEATSINKING

The maximum power dissipation (PD(MAX)) of the LP38500/2-

ADJ is limited by the maximum junction temperature of

125°C, along with the maximum ambient temperature (TA

(MAX)) of the application, and the thermal resistance (θJA) of

the package. Under all possible conditions, the junction tem-

perature (TJ) must be within the range specified in the Oper-

ating Ratings. The total power dissipation of the device is

given by:

PD = ((VIN − VOUT) x IOUT) + (VIN x IGND) (1)

where IGND is the operating ground current of the device

(specified under Electrical Characteristics).

The maximum allowable junction temperature rise (ΔTJ) de-

pends on the maximum expected ambient temperature

(TA(MAX)) of the application, and the maximum allowable junc-

tion temperature (TJ(MAX)):

ΔTJ = TJ(MAX)− TA(MAX) (2)

The maximum allowable value for junction to ambient Ther-

mal Resistance, θJA, can be calculated using the formula:

θJA = ΔTJ / PD(MAX) (3)

11 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

The LP38500/2-ADJ is available in the TO-263 and LLP-8

packages. The thermal resistance depends on the amount of

copper area allocated to heat transfer.

HEATSINKING TO-263 and TO-263 THIN PACKAGES

The TO-263 package and TO-263 THIN package use the

copper plane on the PCB as a heatsink. The DAP of the pack-

age is soldered to the copper plane for heat sinking. Figure

5 shows a typical curve for the θJA of the TO-263 package for

different copper area sizes (the thermal performance of both

TO-263 and TO-263 THIN are the same). The tests were

done using a PCB with 1 ounce copper on top side only, with

copper patterns which were square in shape.

30036152

FIGURE 5. θJA vs Copper Area for TO-263 Package

As shown in the figure, increasing the copper area beyond 1.5

square inch produces very little improvement.

HEATSINKING LLP-8 PACKAGE

The junction-to-ambient thermal resistance for the LLP-8

package is dependent on how much PCB copper is present

to conduct heat away from the device. The LP38502SD-ADJ

evaluation board (980600046-100) was tested and gave a

result of about 80°C/W with a power dissipation of 1W and no

external airflow. This evaluation board is a two layer board

using two ounce copper, and the copper area on topside for

heatsinking is approximately two square inches. Multiple vias

under the DAP also thermally connect to the backside layer

which has about three square inches of copper dedicated to

heatsinking.

Finite modeling of the LP38502SD-ADJ with a four layer

board (JEDEC JESD51-7 and JESD51-5) with one thermal

via directly under the DAP to the first copper plane predicts a

θJA of 72°C/W.

With four thermal vias directly under the DAP to the first cop-

per plane, the modeling predicts a θJA of 50°C/W.

Adding a dog-bone copper area with four additional thermal

vias in the dog-bone area to the first copper plane can improve

θJA to 45C°C/W.

See Application Note AN-1520 A Guide to Board Layout for

Best Thermal Resistance for Exposed Packages for addition-

al thermal considerations for printed circuit board layouts.

www.national.com 12

LP38500/2-ADJ, LP38500A/2A-ADJ

Physical Dimensions inches (millimeters) unless otherwise noted

TO-263 5-Lead, Molded, Surface Mount Package

NS Package Number TS5B

TO-263 THIN 5-Lead, Molded, Surface Mount Package

NS Package Number TJ5A

13 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

8-Lead LLP Package

NS Package Number SDA08C

www.national.com 14

LP38500/2-ADJ, LP38500A/2A-ADJ

Notes

15 www.national.com

LP38500/2-ADJ, LP38500A/2A-ADJ

Notes

LP38500/2-ADJ, LP38500A/2A-ADJ 1.5A FlexCap Low Dropout Linear Regulator for 2.7V to 5.5V

Inputs

For more National Semiconductor product information and proven design tools, visit the following Web sites at:

Products Design Support

Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench

Audio www.national.com/audio App Notes www.national.com/appnotes

Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns

Data Converters www.national.com/adc Samples www.national.com/samples

Interface www.national.com/interface Eval Boards www.national.com/evalboards

LVDS www.national.com/lvds Packaging www.national.com/packaging

Power Management www.national.com/power Green Compliance www.national.com/quality/green

Switching Regulators www.national.com/switchers Distributors www.national.com/contacts

LDOs www.national.com/ldo Quality and Reliability www.national.com/quality

LED Lighting www.national.com/led Feedback/Support www.national.com/feedback

Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy

PowerWise® Solutions www.national.com/powerwise Solutions www.national.com/solutions

Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero

Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic

Wireless (PLL/VCO) www.national.com/wireless PowerWise® Design

University

www.national.com/training

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Technical

Support Center

Email: support@nsc.com

Tel: 1-800-272-9959

National Semiconductor Europe

Technical Support Center

Email: europe.support@nsc.com

National Semiconductor Asia

Pacific Technical Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Technical Support Center

Email: jpn.feedback@nsc.com

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265