L163.B (12/14)1pulseelectronics.com/products/antennas
C-Clip Connector
Pulse Part Number W9908
San Diego, CA 858 674 8100 Vancouver, WA 360 944 7551 Europe 49 7032 7806 0 Asia 86 755 33966678 North Asia 886 3 4356768 China 86 512 6807 9998
Ideal for board-to-antenna applications
Spring contact for positive connection
Surface mount technology; solder reflowable
Features
- PWB Footprint 3.2 x 1.7 mm
- Nominal Contact Height 1 mm
- Tape & Reel Packaging
- RoHS Compliant Product
Applications
- Antenna Contacts
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L163.B (12/14)2pulseelectronics.com/products/antennas
W9908 C-Clip Conguration and Dimensions
PWB Footprint Dimensions and C-Clip Position for W9908
Ground Clearance Area for W9908 C-Clip
PWB Layouts
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Recommendation for reflow soldering process
Printing stencil thickness 0.15 to 0.25 mm is recommended for the solder paste. The maximum soldering temperature
should not exceed 260°C.
The temperature profile recommendations for reflow solder process are presented in Figure 1 and 2. The reflow profile
presented in Figure 2 describes maximum reflow temperatures.
W9908 Connector Soldering
Figure 1 - Minimum temperature profile recommendation for reflow soldering process
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Pulse Part Number W9908
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Figure 2 - Maximum temperature profile recommendation for reflow soldering process
