EPSA12BBJE-30.000M TR RoHS Pb EPSA12 B B J E -30.000M TR Series RoHS Compliant (Pb-free) 2.5V 4 Pad 5mm x 7mm Ceramic SMD LVCMOS Programmable Spread Spectrum Oscillator Packaging Options Tape & Reel Nominal Frequency 30.000MHz Frequency Tolerance/Stability 50ppm Maximum Operating Temperature Range -40C to +85C Spread Spectrum 1.50% Center Spread Output Control Function Power Down ELECTRICAL SPECIFICATIONS Nominal Frequency 30.000MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration.) Operating Temperature Range -40C to +85C Supply Voltage 2.5Vdc 5% Maximum Supply Voltage -0.5Vdc to +3.2Vdc Input Current 18mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 3nSec Maximum (Measured at 10% to 90% of Waveform) Duty Cycle 50% 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Power Down (Disabled Output: High Impedance) Power Down Input Voltage (Vih and Vil) 70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output Power Down Output Disable Time 100nSec Maximum Power Down Output Enable Time 3mSec Maximum Standby Current 10A Maximum (Unloaded; Pad 1=Ground) Spread Spectrum 1.50% Center Spread Modulation Frequency 30kHz Minimum, 32kHz Typical, 45kHz Maximum Period Jitter 100pSec Maximum (Cycle to Cycle; Spread Spectrum-On) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6 EPSA12BBJE-30.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.20 0.15 2 1 1.4 0.2 1.4 0.1 3.68 0.15 PIN CONNECTION 1 Power Down 2 Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 30.000M 3 SXXXXX S=Configuration Designator XXXXX=Ecliptek Manufacturing Identifier 1.60 0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6 EPSA12BBJE-30.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 90% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 10% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6 EPSA12BBJE-30.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 Units 4.0 0.1 2.0 0.1 1.5 +0.1/-0.0 0.30 0.05 7.5 0.1 16.0 +0.3/-0.1 A0* 6.75 0.10 8.0 0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6 EPSA12BBJE-30.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6 EPSA12BBJE-30.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 6 of 6