© 2000 IXYS All rights reserved 1 - 2
Features
International standard package
with DCB ceramic base plate
Planar passivated chips
Short recovery time
Low switching losses
Soft recovery behaviour
Isolation voltage 3600 V~
UL registered E 72873
Applications
Antiparallel diode for high frequency
switching devices
Free wheeling diode in converters
and motor control circuits
Inductive heating and melting
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
High reliability circuit operation
Low voltage peaks for reduced
protection circuits
Low noise switching
Low losses
Dimensions in mm (1 mm = 0.0394")
0.53
1.29
75 503
75 356
1800
3000
3600
-40...+150
-40...+125
110
28800
29300
23300
23800
2400
2640
2160
2380
150
12.7
9.6
50
2.25-2.75/20-25
4.50-5.50/40-48
150 0.80
0.98
260 0.92
1.07
0.228
0.143
3
2
80
IFAVM rating includes reverse blocking losses at TVJM, VR = 0.6 VRRM, duty cycle d = 0.5
Data according to IEC 60747
IXYS reserves the right to change limits, test conditions and dimensions
300 150 200
100 9
200 15
911
875
123
VRSM VRRM Type
V V
200 200 MEK 350-02DA
Symbol Test Conditions Maximum Ratings
IFRMS TC = °CA
IFAVM
ÿÿ
TC = °C; rectangular, d = 0.5 A
IFRM tP < 10 ms; rep. rating, pulse width limited by TVJM A
IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms(60 Hz), sine A
TVJ = 150°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms(60 Hz), sine A
I2tTVJ = 45°C; t = 10 ms (50 Hz), sine A2s
t = 8.3 ms(60 Hz), sine A2s
TVJ = 150°C; t = 10 ms (50 Hz), sine A2s
t = 8.3 ms(60 Hz), sine A2s
TVJ °C
Tstg °C
TSmax °C
Ptot TC = 25°CW
VISOL 50/60 Hz, RMS t = 1 min V~
IISOL £ 1 mA t = 1 s V~
MdMounting torque (M6) Nm/lb.in.
Terminal connection torque (M6) Nm/lb.in.
dSCreeping distance on surface mm
dAStrike distance through air mm
aMaximum allowable acceleration m/s2
Weight g
Symbol Test Conditions Characteristic Values (per diode)
typ. max.
IRTVJ = 25°CV
R= VRRM mA
TVJ = 25°CV
R= 0.8 • VRRM mA
TVJ = 125°CV
R= 0.8 • VRRM mA
VFIF = A; TVJ =125°CV
TVJ =25°CV
IF = A; TVJ =125°CV
TVJ =25°CV
VT0 For power-loss calculations only V
rTmW
RthJH DC current K/W
RthJC DC current K/W
trr IF = A TVJ = 100°Cns
IRM VR= V TVJ = 25°CA
-di/dt = A/msT
VJ = 100°CA
Fast Recovery
Epitaxial Diode
(FRED) Module
MEK 350-02 DA VRRM = 200 V
IFAVM = 356 A
trr = 150 ns
123
© 2000 IXYS All rights reserved 2 - 2
MEK 350-02 DA
200 600 10000 400 800
80
120
160
200
240
280
0.001 0.01 0.1 1 10
0.00
0.05
0.10
0.15
0.20
0.25
0 50 100 150
0.0
0.5
1.0
1.5
2.0
Kf
TVJ
°C-diF/dt
t
s
K/W
0 400 800 1200
10
30
50
70
90
0
20
40
60
80
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VFR
diF/dt
200 600 10000 400 800
10
30
50
0
20
40
60
10 100 1000
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.4 0.8 1.2
0
50
100
150
200
250
300
350
400
IRM
Qr
IF
A
VF-diF/dt -diF/dt
A/
m
s
A
V
µC
A/
m
sA/
m
s
trr
ns
tfr
ZthJS
A/
m
s
µs
V
Fig. 7 Transient thermal impedance junction to heatsink
TVJ= 100°C
VR = 100V TVJ= 125°C
IF = 350A
Constants for ZthJS calculation:
iR
thi (K/W) ti (s)
1 0.002 0.08
2 0.008 0.024
3 0.054 0.112
4 0.164 0.464
Fig. 3 Peak reverse current IRM
versus -diF/dt
Fig. 2 Reverse recovery charge Qr
versus -diF/dt
Fig. 1 Forward current IF versus
voltage drop VF per leg
TVJ= 100°C
VR = 100V TVJ= 100°C
VR = 100V
Qr
IRM
Fig. 4 Dynamic parameters Qr, IRM
versus junction temperature TVJ
Fig. 5 Recovery time trr versus -diF/dt Fig. 6 Peak forward voltage VFR and tfr
versus diF/dt
TVJ=125°C
TVJ=25°CIF= 700A
IF= 350A
IF= 175A
IF= 700A
IF= 350A
IF= 175A
IF= 700A
IF= 350A
IF= 175A VFR
tfr
ZthJH