SCC1300-D02
Murata Electronics Oy Subject to changes 1/34
www.muratamems.fi Doc.Nr. 82113000 Rev. D
SCC1300-D02
Combined Gyroscope and 3 -axis Acce leromete r w it h digital SPI int erf a ces
Features
• ±100 º/s angular rate measurement range
• ±2 g 3-axis acceleration measurement range
• Angular rate measurement around X axis
• Angular rate sensor exceptionally insensitive to
mechanical vibrations and shocks
• Superior bias stability for MEMS gyroscopes (<1º/h)
• Digital SPI interfacing
• Enhanced sel f diagnostics features
• Small size: 8.5 x 18.7 x 4.5 mm (w x l x h)
• RoHS compliant robust packaging suitable for lead-
free soldering process and SMD mounting
• Proven capacitive 3D-MEMS technology
• Temperature range -40 °C...+125 °C
Applications
The SCC1300-D02 is targeted at applications
demanding high stability with tough environ ment al
requirements. Typical applications include:
• Inertial Measurement Units (IMUs) for highly
demanding environments
• Platform stabilization and control
• Motion analysis and control
• Roll over detection
• Robotic control systems
• Guidan ce syste ms
• Navigation systems
Overview
The SCC1300-D02 is a combined high performance gyroscope and accelerometer component. The sensor is based on
Murata’s proven capacitive 3D-MEMS technology.
The component integrates angular rate and acceleration sensing
together with flexible separate digital SPI interfaces. The small robust packaging guarantees reliable operation over the
product’s lifetime. The housing is suitable for SMD mounting. The compo
nent is compatible with RoHS and ELV
directives.
The SCC1300-D02 is designed, manufactured and tested for
high stability, reliability and quality requirements. The
angular rate and acceleration sensors provide highly stable output over wide ranges of temp
erature and mechanical
noise. The angular rate sensor bias stability is in the elite of MEMS gyros. It
is also exceptionally insensitive to all
mechanical vibrations and shocks. The component has several advanced self diagnostics features.
Data Sheet
SCC1300-D02
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TABLE OF CONTENTS
1 Introduction ..................................................................................................................................... 4
2 Specifications .................................................................................................................................. 4
2.1 Performance Specifications for Gyroscope .............................................................................................. 4
2.2 Performance Specifications for Accelerometer ........................................................................................ 5
2.3 Absolute Maximum Ratings ........................................................................................................................ 6
2.4 Pin Description ............................................................................................................................................. 6
2.5 Digital I/O Specification ............................................................................................................................... 8
2.6 SPI AC Characteristics ................................................................................................................................ 9
2.7 Measurement Axis and Directions ........................................................................................................... 10
2.8 Packag e Ch aract e rist ic s ............................................................................................................................ 11
2.8.1 Package Outline Drawing ............................................................................................................... 11
2.8.2 PCB Footprint .................................................................................................................................. 12
2.9 Abbreviations ............................................................................................................................................. 12
3 General Product Description ........................................................................................................ 13
3.1 Factory Calibration..................................................................................................................................... 13
4 Reset and Pow er Up ..................................................................................................................... 14
4.1 Gyro Power-up Sequence ......................................................................................................................... 14
4.1.1 Gyro Reset ....................................................................................................................................... 14
4.2 Accel erometer Pow er -up Sequence ......................................................................................................... 14
4.2.1 Accel erometer reset ....................................................................................................................... 15
5 Component Interfacing ................................................................................................................. 16
5.1 SPI In te rfaces .............................................................................................................................................. 16
5.2 Gyroscope Interface .................................................................................................................................. 16
5.2.1 Gyro SPI Communication Overview ............................................................................................. 16
5.2.2 Gyro SPI Read Frame ..................................................................................................................... 17
5.2.3 Gyro SPI Write Frame ..................................................................................................................... 19
5.2.4 Gyro SPI Mixed Access Mode ........................................................................................................ 20
5.3 Gyroscope ASIC Addressing Space ........................................................................................................ 21
5.3.1 Angular Rate Output Register ....................................................................................................... 21
5.3.1.1 Example of Rate Data Conversion .................................................................................... 22
5.3.2 Gyro Temperature Output Register .............................................................................................. 22
5.3.2.1 Example of GYRO Temperature Conversion ................................................................... 22
5.4 Accelerometer Interface ............................................................................................................................ 23
5.4.1 Accelerometer SPI Communication Overview ............................................................................. 23
5.4.2 Accel erometer SPI Re ad F rame ..................................................................................................... 24
5.4.3 Accel erometer SPI Writ e Frame .................................................................................................... 25
5.4.4 Accelerometer Decremented Register Read Operation .............................................................. 25
SCC1300-D02
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5.4.5 Accelerometer SPI Error Conditioning (Self Diagnostics) ......................................................... 26
5.4.5.1 FRME bit ............................................................................................................................... 26
5.4.5.2 PORST bit ............................................................................................................................ 26
5.4.5.3 ST bit .................................................................................................................................... 26
5.4.5.4 SAT bit .................................................................................................................................. 26
5.4.5.5 aPAR bit ............................................................................................................................... 26
5.4.5.6 dPAR bit ............................................................................................................................... 27
5.4.5.7 Fixed bits ............................................................................................................................. 27
5.4.5.8 SPI error effect on acce leration output data .................................................................... 27
5.5 Accel erom eter ASIC Addressing Spac e .................................................................................................. 28
5.5.1 Control Register (CTRL) ................................................................................................................. 29
5.5.2 Acceleration output registers ........................................................................................................ 29
5.5.2.1 Example of acceleration data conversion ........................................................................ 29
5.5.3 Accelerometer Temperatu re Output Regis ter s ............................................................................ 30
5.5.3.1 Example of accelerometer temperature conversion ....................................................... 30
6 A pplication Information ................................................................................................................ 31
6.1 Application Circuitry and External Component Characteristics ........................................................... 31
6.1.1 Separate Analog an d Digital Ground Layers with Long P o wer Supply Lines .......................... 32
6.2 Boost Regulator and Power Supply Decoupling in Layout ................................................................... 33
6.2.1 Layout Example............................................................................................................................... 33
6.2.2 Therma l Connection ....................................................................................................................... 34
6.3 Assembly Instructions ............................................................................................................................... 34
SCC1300-D02
Murata Electronics Oy Subject to changes 4/34
www.muratamems.fi Doc.Nr. 82113000 Rev. D
1 Introduction
This document contains essential technical information about the SCC1300 sensor, including
specifications, SPI interface descriptions, user accessible register details, electrical properties
and application information. This document should be used as a reference when designing in
SCC1300 component.
2 Specifications
2.1 Performance Specificati ons for Gyroscope
Table 1. Gyroscope performance specifications (Avdd = 5 V, Dvdd = 3.3 V and ambient temperature
unless otherwise specified).
Parameter
Condition
Min A)
Typ
Unit
Analog supply voltage
4.75
5
V
Analog supply current
Temperature range -40 ... +125 °C
24
26
mA
Digital supply voltage
3.0
3.3
V
Digital supply curr en t
Temperature range -40 ... +125 °C
16
20
mA
Operating range
Measurement axis X
-100
°/s
Offset error B)
-1
°/s
Offset over temperature
Temperature range -40 ... +125 °C
Temperature range -10 … +60 °C
-0.6
-0.3
°/s
°/s
Offset drift velocity
Temperature gradient ≤ 2.5 K/min
-0.3
(°/s)/min
Offset short term instability C)
<1
°/h
Angular random walk (ARW) C)
0.45
º/ h
Sensitivity
50
LSB/(°/s)
Sensitivity over temperature
Temperature range -40 ... +125 °C
-1
%
Total sensitivity error B)
-2
%
Nonlinearity
Temperature range -40 ... +125 °C
-0.5
°/s
Noise ( RMS)
0.06
°/s
Noise Density
0.0085
(º/s)/ Hz
Cross-axis sensitivity
%
G-sensitivity
-0.1
(°/s)/g
Sho ck sensitivity
50g, 6ms
°/s
Shock recovery time
ms
Amplitude response
-3dB frequency
50
Hz
Power on setup time
s
Output data rate
2
kHz
Output load
pF
SPI clock rate
0.1
MHz
A) MIN/MAX values are ±3 sigma variation limits from validation test population.
B) Including calibration error and drift over lifetime.
C) Based on Allan variance measurements (Figure 1b).
D) Cross-axis sensitivity is the maximum sensitivity in the plane perpendicular to the measuring direction relative to the sensitivity in the
measuring direction. The specified lim it must not be e xceed ed b y eith er axis.
Figure 1 a) SCC1300-D02 Gyroscope offset over full temperature range, b) Allan variance curve
SCC1300-D02 Gyro Bi as vs. Temperature
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
-40 -20 020 40 60 80 100 120
Temperatu re [ºC]
Angular Rate Offset [º/s]
+3sigma
AVG
-3sigma
SCC1300-D02 Allan Variance Curve
0.1
1
10
100
0.1 110 100 1000 10000 100000
tau [s]
Allan deviation [º/h]
+3 sigma
Average
SCC1300-D02
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2.2 Performance Specifications for Accelerometer
Table 2. Acc elerometer performance specifications (Vdd = 3.3V and ambient temperature unless otherwise
specified).
Parameter
Condition
Min A)
Max A)
Unit
Analog and digital supply voltage
3.0
3.6
V
Current consum ptio n
Active mode
5
mA
Power down mode
mA
Measurement range
Measurement axes X, Y & Z
-2
2
g
Offset error B)
@25 °C ±5°C
-16
16
mg
Offset temperature drift C)
Temperature range -40 ... +125 °C
-18
18
mg
Sensitivity
13 bit output
Between ±3°
LSB/g
°/LSB
Total sensitivity error
Temperature range -40 ... +125 °C
-4
4
% FS
Sensitivity calibration error
@25 °C ±5°C
-0.5
0.5
% FS
Sensitivity temper a ture dr ift
Temperature range -40 ... +125 °C
-0.8
0.8
% FS
Linearity error
+1g ... -1g range
-20
20
mg
Cross-Axis sensitivity D)
-2.5
2.5
%
Zero acceleration output
2-complement format
LSB
Amplitude response E)
-3dB frequency
30
55
Hz
Noise
5
mg RMS
Power on setup time
0.1
s
Output data rate
Hz
Output load
50
pF
SPI clock rate
8
MHz
A) MIN/MAX values are ±3 sigma variation limits from validat i on test populati on.
B) Includes offset deviat i on from 0g value, includi ng cal i brat i on error and drift over lifetime.
C) Biggest change of output f rom RT value due to temperature.
D) Cross-axis sensitivity is the maximum sensitivit y in the plane perpendicul ar to t he measuring direct i on relati ve to the
sensitivity in the measuring direction. It is calculated as the geometric sum of the sensitiviti es in two perpendicular
directions (S x and Sy) in this plane.
E) See Figure 2.
Figure 2. SCC1300-D02 Accelerometer frequency response curves
SCC1300-D02
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2.3 Absol ute Maximum Ratings
Table 3. Absolute maximum ratings of the SCC1300 sensor.
Parameter
Condition
Min
Typ
Max
Unit
Gyroscope supply voltages
Analog supply voltage, AVDD_G
-0.5
7
V
Digital supply volt age, DV DD_G
-0.3
3.6
V
Maximum voltage at analog input/output pins
-0.3
AVDD_G + 0.3V
Maximum voltage at digital i nput/ output pi ns
-0.3
DVDD_G + 0.3
V
Accelerometer supply voltages
Digital supply voltage, DVDD_A
-0.3
3.6
V
Analog supply voltage, AVDD_A
-0.5
7.0
V
Maximum voltage at input / output pins
-0.3
DVDD_A + 0.3V
V
General Component Ratings
Operating tem perature
-40
125
°C
Storage temperature
-40
125
°C
Max 96h
-40
150
°C
Maximum junction temperature during lifetime. Note:
device has to be functional, but not in full spec.
155 °C
Mechanical Shock
3000
g
ESD
HBM
2
kV
CDM
500
V
Ultrasonic agitation (cleaning, welding, etc.)
Prohibited
2.4 Pin Description
The pinout for the SCC1300 is presented below in Figure 3. (See Table 4 for pin desc ripti on)
Figure 3. SCC1 300 pinou t dia gr am.
HEAT
REFGND_G
VREFP_G
EXTRESN_G
RESERVED
AHVVDDS_G
LHV
DVDD_G
DVSS_G
MISO_G
SCK_A
MOSI_A
DVDD_A
RESERVED
DVSS_A
HEAT
HEAT
RESERVED
AVSS_A
AVDD_A
CSB_A
MISO_A
MOSI_G
SCK_G
CSB_G
AVDD_G
RESERVED
RESERVED
AVSS_G
RESERVED
RESERVED
HEAT
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Table 4. SCC 130 0 pin desc r iption
pin #
Name
PD/P U/HV 2)
Description
1
HEAT
Heat sink connection, connect to AVSS_G.
2
REFGND_G
Analog referenc e ground, connect to AVSS_G
3
VREFP_G
Connection for External C for positive referenc e voltage.
4 EXTRESN_G DI PU External Res et , 3. 3V Schmitt-t ri gger input with i nternal pul l -up, High-low
transition causes system restart
5
RESERVED
Factory use only, leave floati ng
6
AHVVDDS_G
HV (~30V)
Connection for External C for high voltage analog s uppl y. High voltage pad ~30V
7
LHV
HV (~30V)
Connection for inductor for high voltage generat i on, hi gh voltage pad ~30V
8
DVDD_G
Digital Supply Voltage
9
DVSS_G
Digital Supply Return
10
MISO_G
Data Out of SPI Interface, 3.3V level.
11
SCK_A
PD
Clk Signal of SPI Interface, 3.3V Schmitt-trigger input
12
MOSI_A
PD
Data In of SPI Interface, 3.3V Schmitt-tri gger i nput
13
RESERVED
Factory use only, leave floati ng
14
DVDD_A
Digital Supply Voltage
15
DVSS_A
Digital Supply Return
16
HEAT
Heat sink connection, connect to AVSS_G.
17
HEAT
Heat sink connection, connect to AVSS_G.
18
RESERVED
Factory use only, leave floati ng
19
AVSS_A
Analog Supply Return
20
AVDD_A
Analog Supply Voltage
21
CSB_A
PU
Chip Select of SPI Interface, 3.3V Schmitt-trigger input
22
MISO_A
Data Out of SPI Interface, 3.3V level
23
MOSI_G
PD
Data In of SP I In te rface, 3.3V Schmitt-trigger input
24
SCK_G
PD
Clk Signal of SPI Interface, 3.3V Schmitt-trigger input
25
CSB_G
PU
Chip Select of SPI Interface, 3.3V Schmitt-trigger input
26
RESERVED
Factory use only, leave floati ng
27
RESERVED
Factory use only, leave floati ng
28
AVDD_G
Analog Supply Voltage
29
AVSS_G
Analog Supply Return
30
RESERVED
Factory use only, leave floati ng
31
RESERVED
Factory use only, leave floati ng
32
HEAT
Heat sink connection, connect t o AVSS_G.
Notes:
1) A = Analog, D = Digital, I = Input, O = Output, Z = Tristate Output, R = Reserved
2) PU = internal pull up, PD = internal pull down, HV = high voltage
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2.5 Digital I/O Specification
Table 5 (gyroscope interface) and Table 6 (accelerometer interface) below describe the DC
character istics of the SC C1 300 se nsor’s dig ita l I/O pin s. T he digital sup pl y voltage is 3.3V unles s
otherwise specified. Current flowing into the circuit has a positive valu e.
Table 5. SCC1300 gyroscope SPI interface DC characteristics
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Input terminal CSB_G
Pull up current
VIN = 0V
IPU
10
50
µA
Input high voltage
DVDD_G = 3.3V
VIH
2
DVDD_G
V
Input low voltage
DVDD_G = 3.3V
VIL
0.8
V
Hysteresis
DVDD_G = 3.3V
VHYST
0.3
V
Input terminal SCK_G
Input high voltage DVDD_G = 3.3V VIH 2 DVDD_G V
Input low voltage
DVDD_G = 3.3V
VIL
0.8
V
Hysteresis
DVDD_G = 3.3V
VHYST
0.3
V
Input leakage current
0 < VMISO < 3.3V
ILEAK
-1
1
uA
Output terminal MOSI_G
Input high voltage
DVDD_G = 3.3V
VIH
2
DVDD_G
V
Input low voltage
DVDD_G = 3.3V
VIL
0.8
V
Hysteresis
DVDD_G = 3.3V
VHYST
0.3
V
Pull down current
VIN = VDVDD_G
ILEAK
10
50
uA
Output terminal MISO_G (Tri-state)
Output high voltage IOUT = -1mA VOH DVDD_G -0.5V V
IOUT = -50µA
DVDD_G -0.2V
V
Output low voltage
0 ≤ VMISO ≤ 3.3V
VOL
0.5
V
Capacitive l oad 200 pF
Table 6. SCC1300 accelerometer SPI interface DC characteristics
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Input terminal CSB_A
Pull up current
VIN = V
IPU
10
50
µA
Input high voltage
DVDD_A = 3.3V
VIH
2
DVDD_A
V
Input low voltage
DVDD_A = 3.3V
VIL
0.8
V
Hysteresis
DVDD_A = 3.3V
VHYST
0.18
V
Input terminal MOSI_A, SCK _A
Pull down current
VIN = 3. 3V
IPD
10
50
µ
A
Input high voltage
DVDD_A = 3.3V
VIH
2
DVDD_A
V
Input low voltage
DVDD_A = 3.3V
VL
0.8
V
Hysteresis
DVDD_A = 3.3V
VHYST
0.18
V
Output terminal MISO_A
Output high voltage I > -1mA
DVDD_A = 3.3V
VOH DVDD_A - 0.5V V
Output low voltage
I < 1 mA
VOL
0.5
V
Capacitive l oad
50
pF
Tri-state leakage
0 < VMISO < 3.3V
ILEAK
-3
3
uA
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2.6 SPI AC Characteristics
The AC characteristics of the SCC1300 are defined in Figure 4 and Table 7.
CSB_G, CSB_A
SCK_G, SCK_A
MOSI_G, MOSI_A
MISO_G, MISO_A
T
LS1
T
CH
T
HOL
T
SET
T
VAL1
T
VAL2
T
LZ
T
LS2
T
LH
MSB i n
MS B out
LSB i n
LS B out
DATA out
DATA in
T
CL
Figure 4. Timing diagram of SPI communication
Table 7. Timing characteristics of SPI communication
Parameter
Condition
Min
Typ
Unit
FSPI
0.1
MHz
TSPI
1/ FSPI
TCH
SCK_G, SCK_A high time
45
TSPI /2
ns
TCL
SCK_G, SCK_A low time
45
TSPI /2
ns
TLS1
CSB_G, CSB_A setup time
45
TSPI /2
ns
TVAL1 Delay CSB_G -> MI SO_G
Delay CSB_A -> MISO_A
30 ns
TSET
MOSI_G, MOSI_A setup time
30
ns
THOL MOSI_G, MOSI _A data hold time 30 ns
TVAL2 Delay SCK_G -> MI SO_G
Delay SCK_A -> MISO_A
40 ns
TLS2 CSB_G, CSB_A hold time 45 TSPI /2 ns
TLZ
Tri-state delay time
ns
TRISE
Rise time of the SCK_G, SCK_A
10
ns
TFALL
Fall time of the SCK_G, SCK_A
10
ns
TLH
Time between SPI cycles
125
ns
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2.7 Measurement Axis and Directions
The positive/negative acceleration and angular rate measurement directions of the SCC1300 are
shown below in Figure 5.
Figure 5. Acceleration and angular rate measurement directions of the SCC1300
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2.8 Package Characteristics
2.8.1 Package Outline Drawing
The package outline and dimensions of the SCC1300 are presented in Figure 6 and Table 8.
Figure 6. Package outline and dimensions of the SCC1300. All tolerances are according to
ISO2768-f (see table below) unless otherwise specified.
Limits for linear measures (ISO2768-f)
Tolerance class
Limits in mm for nominal size in mm
0.5 to 3
Above 3 to 6
Above 6 to 30
Above 30 to 120
f (fine)
±0.05
±0.05
±0.1
±0.15
Table 8. Package dimensions of the SCC1300
Component
Parameter
Min
Typ
Max
Unit
Length
Without leads
19.71
mm
Width
Without leads
8.5
mm
Width
With leads
12.15
mm
Height With leads
(including stand-off and EMC lead)
4.60 mm
Lead pitch
1.0
mm
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2.8.2 PCB Footprint
The footprint dimensions of the SCC1300 are presented in Figure 7 and Table 9.
Figure 7. Footprint of the SCC1300
Table 9. Footprint dim ens io ns of the SCC1300
Component
Parameter
Min
Max
Unit
Footprint length
Without lead footprints
mm
Footprint width
Without lead footprints
mm
Footprint lead pitch
Long side leads
mm
Footprint lead length
mm
Footprint lead width
Long side leads
mm
2.9 Abbreviations
ASIC Application Specific Integrated Circuit
SPI Serial Peripheral Interface
RT Room Temperature
STC Self Test Continuous (continuous self testing of accelerometer element)
STS Self Test Static (gravitation based self test of accelerometer element)
ARW Angular random walk
DPS Degrees per second
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3 G eneral Product Description
The SCC1300 sensor consists of independent acceleration and angular rate sensing elements
and separate independent Application Specific Integrated Circuits (ASICs) used to sense and
control t hose e lements. Figure 8 repr es e nts an u pper l eve l b lock diagram of the component. Both
ASICs have their own independent digital SPI interfaces used to control and read the
accelerometer and the gyro s c ope.
Figure 8. Block diagram of the SCC1300
The angular ra te and ac c el eratio n s e ns ing e lements a r e manuf actur ed us in g Murata's proprietary
High Aspect Ratio (HAR) 3D-MEMS process, which enables robust, extremely stable and low
noise capacitive sensors.
The acceleration sensing element consists of four acceleration-sensitive masses. Acceleration
causes a capacitance change that is converted into a voltage change in the signal conditioning
ASIC.
The angular rate sensing element consists of moving masses that are purposely exited to in-
plane dr ive motion. Rotation in the s ensitiv e directio n causes out-of-plane m ovem ent that can b e
measured as capacitance change with the signal conditioning ASIC.
3.1 Factory Calibration
SCC1300 sensors are factory calibrated. No separate calibration is required in the application.
Parameters that are trimmed during production include sensitivities, offsets and frequency
responses. Calibration parameters are stored to non-volatile memory during manufacturing. The
parameters are read automatically from the internal non-volatile memory during start-up.
It should be noted that assembly can cause minor offset/bias errors to the sensor output. If the
best possible offset/bias accuracy is required, system level offset/bias calibration (zeroing) after
assembly is recommended.
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4 Reset and P ow er Up
After start-up the angular rate and acceleration data is immediately available through SPI
registers . Ther e is no nee d to in itiali ze the g yrosc ope or ac celerom eter before s tarting to us e it. If
the application requires operation correctness to be monitored, several self diagnostic features
are available. For m ore details about enabling the self diagnostic features, refer to the gyro and
accelerometer power-up sequences (Sections 4.1 and 4.2).
4.1 Gyro Power-up Sequence
After po wer -up read the Status r eg ister (0x08) t w ice t o c le ar s e lf dia gnos t ic er ror f lags (see Table
12 for more details about gyro self diagnostics). Angular rate data is available immediately after
start-up without any additional configuration commands.
Table 10. Gyroscope power-up sequence of the SCC1300
Procedure
Function
Set VDVDD_G V=3.0...3.6V
Set VAVDD_G V=4.75...5.25V
Wait 800 ms
Read Status register (08h) two times
Acknowledge error flags after st art up
4.1.1 Gyro Reset
The SCC1300 Gyroscope can be reset by writing 0x04 to the IC Identification register (address
07h) or by using the external active low reset pin (EXTRESN_G). Power supplies should be
within the s pecified rang e before the reset pin c an be released. Pleas e follow the gyro po wer-up
sequence after reset (Table 10).
4.2 Accelerometer Power-up Sequence
No initial configuration is needed before starting to measure acceleration. However, if the
device’s self diagnostic features are being used, the following operations need to be performed
after powering-up the device (see section 5.4.5 for more details about the accelerometer’s self
diagnostics).
Table 11. Accelerometer power-up sequence of the SCC1300
Procedure
Function
Check
Set Vdd = 3.0...3.6 V
Release part from reset
Wait 35 ms
Memory reading and self-diagnostic. Settling of signal path
Read INT_STATUS Acknowledge for possibl e sat uration (SA T -bit)
Check that memory checksum passed
SPI frame fixed bits
SPI ST = 0
W rite CTRL = 00000000
or CTRL = 00001000
or CTRL = 00001010
Set PORST = 0
Set PORST = 0, Sta r t ST C
Set PORST = 0, Start STC, Start STS
SPI frame fixed bits
SPI FRME = 0
SPI ST = 0
SPI SAT = 0
Wait 10 ms
STS calculation
Read CTRL Check that STC is on, if enabled
Check that STS is over, if enabled CTRL.ST = 1
CTRL.ST_CFG = 0
SPI frame fixed bits
SPI FRME = 0
SPI POR ST = 0
SPI ST = 0
SPI SAT = 0
dPAR, data parity
Read Z_MSB, Z_LSB,
Y_MSB, Y_LSB, X_MSB,
X_LSB
Read acceleration dat a SPI frame fixed bits
SPI FRME = 0
SPI POR ST = 0
SPI ST = 0
SPI SAT = 0
dPAR, data parity
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4.2.1 Accelerometer reset
The accelerometer can be reset by writing 0Ch, 05h, 0Fh (in this order) into the RESET register
(address 03h). If the accelerometer’s self diagnostic features are being used, the power-up
sequence should be executed after reset (Table 11).
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5 Component I nt e rfacing
5.1 SPI Interfaces
The SCC1300 sensor has individual SPI interfaces for the accelerometer and angular rate
sensor, and they need to be addressed separately. Both interfaces have their own 4-wire
interconnection pins in the component package. SPI communication transfers data between the
SPI master and registers of the SCC1300’s ASICs. The SCC1300’s ASICs always operate as
slave devices in master-slave operation mode. 3-wire SPI connection cannot be used.
SCC1300 angular rate sensor’s ASIC SPI interface:
MOSI_G master out slave in µP → ASIC
MISO_G master in slave out ASIC → µP
SCK_G serial clock µP → ASIC
CSB_G chip select (active low) µP → ASIC
SCC1300 accelerometer’s ASIC SPI interface:
MOSI_A master out slave in µP → ASIC
MISO_A master in slave out ASIC → µP
SCK_A serial clock µP → ASIC
CSB_A chip select (active low) µP → ASIC
PLEASE NOTE THAT EXACTLY THE SAME SPI ROUTINES DO NOT WORK FOR BOTH
ASICS! For example, the SCC1300 accelerometer ASIC uses 8-bit addressing, while the
SCC1300 angular rate sensor ASIC uses 16-bit addressing.
Both SPI interfaces and instructions for using them are explained separately in the following
chapters. For more details, please refer to “Technical Note 92: SPI Communication with
SCC1300”.
5.2 Gyroscope Interface
This chapter describes the SCC1300 angular rate sensor ASIC interface and how to use it. The
angular rate sensor ASIC SPI interface uses 16-bit addressing.
5.2.1 Gyro SPI Communication Overview
The SPI communication is based on 16-bit words. The SPI fram es consist of a multiple of these
16-bit words. Figure 9 shows an example of a single SPI data transmission. The gyro captures
data on the SCK's rising edge (MOSI line) and data is propagated on the SCK’s falling edge
(MISO line). This is equal to SPI Mode 0 (CPOL = 0 and CPHA = 0). The SPI transmission is
always started with the C S B falling edge and ter minated with the CSB rising edge.
The basic read/write data frame consists of two 16-bit words. The first word contains a register
address, while the second word contains the register content to be written or read (see timing
diagram in Figure 9).
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Figure 9. SPI communication timing diagram
After the CSB falling edge the device interprets the first 16-bit word as a 7-bit register address
and a read/write operation bit. Remaining bits shall be set to zero. Bit [0] of the 16-bit word is
used as an odd parity bit. The 16-bit address word is sho wn belo w in detai l:
MOSI Address Word:
ADR[6:0] : Register address
RW : RW = 1 : Write access
RW = 0 : Read access
Par odd : Odd parity bit.
Par odd = 0 : the number of ones in the address word (D15:D1) is odd.
Par odd = 1 : the number of ones in the address word (D15:D1) is even.
The ADR bits are us ed to select a n internal reg ister of the device; the RW bit selects the ac cess
mode for the selected register. The par odd bi t has to be calculated and inser ted by the mas ter in
order to complete the transmission.
5.2.2 Gyro SPI Read Frame
When the address word bit RW is ‘0', the mas ter perf orms a r ead acces s on the regist er selected
by the register address bits (ADR). After transmission of the address word, the master has to
send an ad dit ion al word (zero vector) to clock the dat a out fr om the MOSI. Dat a is tr ansferred out
from the MOSI MSB first.
Example of how to re ad the rate output
MCU begins the communication by sending the address word (Rate_X register address is 00h,
RW =’0’ and P ar odd =’1’) followed by the zero vector ( with c orrec t parity; in this case ‘Par odd’ bit
value w il l be 1). T he zero vec tor is nec ess ary for the sens or to be ab le t o r eply to the MCU d urin g
the last 16-bit frame. The sensor replies by sending first the status bits follo wed b y the rate data.
MOSI: 0x0001 0x0001
MISO: 0x3FFE 0xXXXX
The complete read frame transmission length is 32 bits (see Figure 10 below).
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
00000 0 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 RW Fixed 0 Par odd
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Figure 10. Complete gyroscope read frame
Encoding of the MISO status flags are shown below.
Status flags (1st 16-bit word on the MISO line) in case status flags are cleared after gyro start-up
(see Section 4.1):
S_OK is generated out of the monitoring flags in the status register (08h).
Data word (2nd 16-b it wor d on the MISO line):
DO[13:0] : Value of the angular rate register (14 bits)
S_OK: Sensor OK flag
Par odd : Odd parity bit.
Par odd = 0 : the number of ones in the data word (D15:D1) is odd.
Par odd = 1 : the number of ones in the data word (D15:D1) is even.
See section 5.3.1 for details on angular rate data conversion.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
00111111111111s_ok Par odd
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DO13 DO12 DO11 DO10 DO9 DO8 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 s_ok Par odd
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5.2.3 Gyro SPI Write Frame
When the address word bit RW is ‘1', t h e master per f orm s a wri te ac c ess on the r e gister s e lected
by the register address (ADR). The SCC1300 writes the next word transmitted by the master
(data word) in the selected register and sends the data that has been previously stored in this
register out from the MISO.
If the device is addressed with a non-existent register address, the resp onse from the MISO will
be ´0x0000´.
The following table shows data encoding for write access:
Data word:
DI[14:0] : Data value for write access (15 Bits)
Par odd : Odd parity bit
Par odd = 0 : the number of ones in the data word (D15:D1) is odd.
Par odd = 1 : the number of ones in the data word (D15:D1) is even.
An exam ple of a complete write frame transmission is given in Figure 11 (gyroscope soft reset):
Figure 11. Gyroscope soft reset frame
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DI14 DI13 DI12 DI11 DI10 DI9 DI8 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 Par odd
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5.2.4 Gyro SPI Mixed Access Mode
It is possible to mix the write and read access modes during one communication frame. Mixed
access mode can be used, for example, to make an interleaved read of both angular rate and
temperature data within the same SPI frame.
Figure 12 shows an example of an interleaved read access:
Figure 12. SPI read interleaving
Each communication word in Figure 12 contains 16 SCK cycles.
After the communication start condition (CSB falling edge), the master sends the address word
ADR1 with the a ddress of the Rate_X r egister (0x 00), R /W = '0 ' (read acc ess) and odd parity. All
combined, ADR1 = 0x01. In parallel the SCC1300 sends out the status flags.
During transmission of the next address word ADR2, the SCC1300 sends out the register value
specified in ADR1 (Rate_X). On ADR2 the master performs another read access, now to the
TEMP register (0x0A). The address word ADR2 will be 0x51 (TEMP register address 0x0A
shifted to left by 3 bits and added odd parity bit; see Figure 9 for more details). To receive the
register value of the second read access (Temperature), the master has to send an additional
word to the MOSI (Zero Vector with Odd Parity).
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5.3 Gyroscope ASIC Addressing Space
The gyroscope ASIC has multiple register and EEPROM blocks. The EEPROM blocks used for
holding calibration data are programmed via SPI during the manufacturing process. The user
only ne eds t o ac ces s the data register block at a ddr esses 00h, 07h, 08h and 0Ah. The cont ent of
this register block is described below.
Table 12. Gyroscope register address space
Address
hex Register Name
Bits Read/
Write Description
00h
Rate_X
15:2
R
Rate sensor output in two's complement format
1 R S_OK Flag
1 – Rate_X and Temp valid
0 – Rate_X and/or Temp invalid
S_OK is generated from internal monitoring flags shown in
the status register (08h).
If any of the flags in register 08h [15:2] is 0, S_OK will be 0
Only if all flags in regist er 08h [15:2] are 1, S_OK will be 1
0
R
Odd Parity bit
07h IC Identificati on
15:3
R/W
Reserved, write all to 0
2 R/W Soft Reset
Setting this bit to 1 to resets the logic core, see section
4.1.1 for more details.
1 R/W Res erved, write to 0
0
R/W
Odd Parity bit
08h
Status/Config 15:10 R Reserved
9 R
Parity_OK
This bit is set as soon as the SPI logic detects a wrong
parity bit received f rom the µC. The bit is automaticall y
cleared during read access to this register.
1 – Parity check ok
0 – Parity error
8:1 R Reserved
0 R Odd Parity bit
0Ah
Temp
15:2 R Temperature sensor output in two's complement format
1 R S_OK Flag
1 – Rate_X and Temp valid
0 – Rate_X and/or Temp invalid
0 R Odd Parity bit
5.3.1 Angular Rate Output Register
Angular r ate data is presented in 14-bit, 2’s com plem ent form at. Bits [1:0] do not contai n angula r
rate data and they must be discarded. Rate_X bit weights are shown in below:
Table 13. Gyroscope rate output bit weights [dps] (sensitivity 50 LSB/dps).
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
s81.92 40.96 20.48 10.24 5.12 2.56 1.28 0.64 0.32 0.16 0.08 0.04 0.02 s_ok Par odd
s = sign bit
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5.3.1.1 Example of Rate Data Conversion
According to the Gyroscope Register Map (Table 12) the bits 1:0 do not contain rate data and
they must be discarded when converting rate register data to angular speed.
For example: the Rate_X register (Address 0x00) data is 0xFF95. The bits 1:0 need to be
discarded and as the rate is presented in 2's complement format, this can be done as an
arithmetic shift right by 2 to handle the number sign correctly. So the actual data for rate
calculation will be 0xFFE5 which equals -27 decimal. The sensitivity of the SCC1300-D02 is 50
LSB/(°/s) (Table 2) so the rate in degrees per second will be:
Rate_X[dps] = -27[LSB] / 50 LSB/dps = -0.54 dps
5.3.2 Gyro Temperature Output Register
The gyroscope ASIC offers temperature information that has a linear response to temperature
change. T he temperature sensor reading does not reflect absolute am bient tem perature. To use
the temperature sensor as an absolute temperature sensor, the offset and sensitivity should be
measured and calibrated at system level.
Tem perature data is presented in the Tem p register ( 0x0A) in 1 4-bit, 2's com plement f ormat. The
bits 1:0 do not contain temperature data and they must be discarded when making temperature
calculations.
The temperature register’s typical output at +23 °C is -1755 counts, and 1 °C change in
temperature typically corresponds to 65 counts. Temperature information is converted from
counts to [°C] as follo ws:
[ ] [ ]
65/)3250+(
=º LSBTempCTemp
,
where Temp[LSB] is the TEMP register content in counts and Temp[°C] is the equivalent
temperature in Celsius.
Temperature sensor offset calibration error at 25°C: ≤ ±15 °C
Temperature sensor sensitivity calibration error : ≤ 5%
5.3.2.1 Example of GYRO Temperature Conversion
For exam ple: the T em p register ( 0x0A) d ata is 0xEF5 A. T he bits 1:0 need to b e di scar ded (Table
12) so the actual temperature data will be 0xFBD6m which equals -1066 decimal. Using the
conversion formula above the actual tem peratur e in °C will be:
Temp[°C] = (-1066 + 3250) / 65 = 33.6 °C
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5.4 Accelerometer Interface
This chapter describes the SCC1300 accelerometer sensor ASIC interface and how to use it. The
accelerometer sensor ASIC SPI interface uses 8-bit addressing.
5.4.1 Accelerometer SPI Communication Overvie w
Each comm unication fram e contains 16 b its (two 8-bit bytes). The SPI fram e format and transf er
protocol for the accelerometer is pr esented in Figure 13 below. T he accelerometer captures dat a
on the SCK's rising edge (MOSI line) and data is propagated on the SCK’s falling edge (MISO
line). This is equal to SPI Mode 0 (CPOL = 0 and CPHA = 0). The SPI transmission is always
started with the CSB falling edge and terminated with the CSB rising edge.
Figure 13. SPI frame format for the accelerometer interface
• MOSI
• A5:A0 Register address
• R/W Read/Write selection, '0' = read, ‘1 ’ = write
• aPAR Odd parity for bits A5:A0, R/W
• DI7:DI0 Input data for data write
• MISO
• Bit 1 Not defined
• FRME FRaMe Error indication (from previous frame)
• Bit 3-5 status bits
• PORST Power On Reset Status
• ST Self Test error
• SAT O utput S AT ur ation indic at o r
• Bit 6 Fixed bit, always ‘0’
• Bit 7 Fixed bit, always ‘1’
• dPAR Odd parity for output data (DO7:DO0)
• DO7:DO0 Output dat a
The first 8 bits in the MOSI line contain info about the operation (read/write) and the register
address be in g ac c ess ed. The f irs t 6 bi ts form an address field for the selec ted oper ation, wh i ch i s
defined by bit 7 ( ‘ 0’ = r ead ‘ 1’ = wr ite) and is fol lo wed b y an odd pari ty bit (aPAR) for the address.
The f ollowing 8 bits in the MOSI line cont ain data for the wr ite operat ion and are ignor ed in case
of a read operation.
The first bits in the MISO line are the Frame Error bit of the previous frame (FRME), the Power
On Reset STatus bit (PORST), the Self-Test status bit (ST), the Saturation status bit (SAT), the
fixed zero bit, the fixe d one bit and the Odd Parit y bit for output data (dPAR) . Pari ty is calcu lated
from data that is currently being sent. The following 8 bits contain data for a read operation.
During a write operation, these data bits are the previous data bits of the addressed register.
For write com mands, data i s written into the ad dressed register on the rising edg e of the CSB. If
the command frame is invalid, data will not be written into the register.
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For read comm ands , the output re gis ter is shif ted out MS B f irs t to the MISO outp ut. An attempt to
read a reserved register outputs data of 0x00.
During the CS B hig h state between data trans f ers , the MISO line is kept in hig h -impedance state.
5.4.2 Accelerometer SPI Read Frame
An example of X-axis acceleration read command is presented in Figure 14.
16-bit acc eleration data is s ent in two 8-b it data f rames . Each fram e contains a parity b it for dat a
(odd parity). The acceleration data is presen ted in 2’s complement format.
When reading acceler ation data, always read the MSB regist er before the LSB register becaus e
reading of MSB latches the LSB so the data in both registers will be from the same moment in
time.
The master gives the register address to be read via the MOSI line: '05' in hex format and
'000101' in binary format, register X_MSB. The 7th bit is set to '0' to indicate a read operation, and
the 8th bit is 1 for odd parity.
The sensor replies to the requested operation by transferring the register content via the MISO
line. After transferring the X_MSB register content, the master gives next register address to be
read: '04' in hex form at and '000100' in binary format, register X_LSB. The sensor replies to the
requested operation by transferring the register content MSB bit first.
Figure 14: Example of 16-bit acceleration data transfer from registers X_MSB, X_LSB (05h, 04h)
DO15…DO0 bits ar e ac c el eratio n d ata ( DO 15 = MSB) and p ar ity (dPAR) is odd p ar it y for each 8-
bit data transmission. F RME is the p oss ibl e f rame err or bit of pr e vi ous f r ame, PORST is the reset
bit, ST is the self-test status bit and SAT is the output saturation status bit.
See section 5.5.2 for details about acceleration data conversion.
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5.4.3 Accelerometer SPI Write Frame
An example of a CTRL register write command is presented in Figure 15.
The master gives the r egist er addres s to be wr itten via the MO SI lin e: the CTRL register is '01' in
hex form at and '000001' i n binar y format. The 7th bit is s et to '1' to indicat e a write oper ation, and
the 8th bit is 1 for odd p arity. MISO dat a bits DO0 ... DO7 are the pr evious data bits of the CTRL
register.
Figure 15. Example of CTRL register write, set PORST = 0, Start STC (see Table 11)
5.4.4 Accelerometer Decremented Register Read Operation
Figure 16 shows a decrem ented r ead operat ion w here the c ontent of four output r egisters is r ead
by one SPI f rame. After nor m al register addr essing and readi ng of one register content , the MCU
keeps the CSB line low and continues supplying SCK pulses. After every 8 SCK pulses, the
output data address is decremented by one and the previous acceleration output register's
content is shifted out without parity bits. The parity bit is calculated and transferred only for the
first 8 bits of data. From the X_LSB register address the ASIC output address jum ps to Z_MSB.
Decremented reading is possible only for registers X_LSB ... Z_MSB.
Accelerometer output registers are not updated during CSB low state, so the decremented read
operation can be used to read all acceleration output registers' (Z_MSB ... X_LSB) content from
the same moment of time. Decremented read is not recommended in fail-safe critical
applications, because output data parity is only available for the first 8 bits of data.
Figure 16. An Example of decremented read operation
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5.4.5 Accelerometer SPI Error Conditioning (Self Diagnostics)
5.4.5.1 FRME bit
If the C SB is r aised to '1' bef ore send ing all 16 SC Ks i n a f ram e, t he fram e is cons idered inv alid.
To support the decremented mode reading, the FRaMe Error is raised if the number of SCK
pulses is not divisible by 8. The FRME bit is also set in case a wrong address parity (aPar) is
sent. When an invalid frame is received, the last command is simply ignored and the register
contents are left unchanged. The bit STATUS.FRME in the STATUS register (0x02) is set to
indicate this error condition. During the next SPI frame this error bit is sent out as FRME status
bit on the MISO line. The frame error condition will be reset only when a correct frame is
received.
5.4.5.2 PORST bit
The POR ST bit is se t if the chip is r eset (HW r eset by Power On Reset or supp l y on/off ) or under
voltage is d etec te d. This bit is also s et af ter po wer-up bec ause the chip h as bee n in a reset s t ate .
PORST c an be s et t o zero ( res et) b y writin g CTRL.PO RST = 0. S of t ware ( SW) reset does not set
the PORST bit.
When CTRL.PORST bit is written to 0 via the SPI, there is a 300ns delay before the register
value is set to zero.
5.4.5.3 ST bit
The self-test fram e status bit ( ST) is set if ST C or STS is alarm ed or memory checksum test
is not passed.
• CASE 1: Checksum fails and the ST frame bit is set to 1. ST is set back to zero only
when a new checksum calculation is passed.
• CASE 2: The ST frame bit is set to 1 because STC or STS is alarm ed. In this case the
ST frame bit can be cleared by reading the INT_STATUS register.
5.4.5.4 SAT bit
The saturation status (SAT) is set to 1 if any of the axis X,Y,Z output values is saturated. SAT
can be cleared by reading the INT_STATUS register. This bit is kept high even after the failure
condition is over if not cleared by reading the INT_STATUS register.
5.4.5.5 aPAR bit
The aPAR is an odd parity bit of input address + R/W-bit. The master writes and the slave checks
this bit.
• If there is a parity error and R/W = '1', the write command is ignored and the FRME
(frame error) bit is set in the STATUS register and in t he SPI f rame. T he next c orrect SPI
fram e will zero this bit.
• If there is a par ity error and R/W = '0', the re ad comm and is perform ed normally and the
FRME bit is set in the STATUS register and in t he SPI frame. The next cor r ect S PI f r ame
will zero this bit.
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Table 14. Examples of correct address parity bit valu e
Address
A5 A4 A3 A2 A1 A0 R/W aPAR
0 0 0 0 0 0 0 1
1 1 1 1 1 1 1
0
1 0 1 0 1 0 1 1
0 1 0 1 0 1 0 0
5.4.5.6 dPAR bit
The dPAR bit is an odd parity bit for 8-bit data that is currently sent in the frame. The master
compares this bit to the received data. B y using dPAR, at least 1-bit errors in data transmission
can be detected.
5.4.5.7 Fixed bits
Bits 6 and 7 in the MISO line are always fixed. Bit 6 should always be '0' and bit 7 always '1'.
These bits can be used to verify that the MISO line is not permanently stuck to '1' or '0'.
5.4.5.8 SPI error effect on acce leration output data
1. Reset stage: When the component is in reset or under voltage state, the PORST bit in the
SPI frame and the CTRL.PORST bit are set. In addition, all acceleration output register
values are set to zero.
2. Saturation: W hen ac celeration ex ceeds the sensor’s m easurement r ange, the output data is
saturated to ± 2.27 g (-4096 / 4095 counts)
3. Self-diagnostic failure: The ST bit in the SPI frame is set when the memory diagnostic or
signal pat h diagnostic func tions fail. In additi on, acceler ation output data is f orced to 0x7FFF
if memory diagnostic fails or to 0xFFFF if signal path diagnostic functions (STC/STS) fail.
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5.5 Accelerometer ASIC Addressing Space
The SCC1300 acce lerometer A SIC register c ontents a nd bit definit ions are desc ribed in detail in
the following sections.
Table 15. Accelerometer register address space
Address
hex
Register Name
Bits Read/
Write
Description
01h CTRL 7:0 R/W Pleas e refer to Table 16 for CTRL register details.
02h STATUS
7:2
R
Reserved
1 R CSMERR: EEP ROM checks um error
1 – Error,
0 – No error
CSMERR a ls o sets ST bit in SP I frame
0 R FRM E: SP I frame error. Bit is reset when next correct SPI
frame is received.
FRME al so set s FRME bit in SPI frame
03h RESET 7:0 R/W Writing 0C'hex, 05'hex, 0F'hex in this order resets component
04h X_LSB 7:0 R X-axis LSB data frame (Read always X_MSB prior to X_LSB)
05h X_MSB 7:0 R X-axis MSB data bits (Reading of this register latches X_LSB)
06h Y_LSB 7:0 R Y-axis LSB data frame (Read always Y_MSB prior to Y_LSB)
07h Y_MSB 7:0 R Y-axis MSB data bits (Reading of this register latches Y_LSB)
08h Z_LSB 7:0 R Z-axis LS B data frame (Read always Z _MSB prior to Z_LSB)
09h Z_MSB 7:0 R Z-axis MSB data bits (Reading of this register latches Z_LSB)
12h TEMP_LSB 7:0 R Data bi ts [7: 0] of temperature sensor
Always read TEMP_MSB prior to TEMP_LSB
13h TEMP_MSB 7:0 R Data bits [15:8] of temperature sensor
Reading of this register latc hes TEMP_LSB
16h
INT_STATUS
7
R
Reserved
6 R SAT: Saturation status of output data
1 – Over range detected, at least one of XYZ axis is saturated
and output data is not valid.
0 – Data in range
SAT bit is also visible in SPI frame. This bit can be active after
start-up, reset or PORST s tage before signal path settles to
final value. If accelerometer self diagnostics is used follow
power-up sequence to acknowledge this b it (Table 11).
5 R STS: Status of gravitati on based start-u p s elf tes t
1 – Failure
0 – No failure
STS also sets ST bit in SPI frame
4 R STC: Status of continuous self test
1 – Failure
0 – No failure
STC also sets ST bit in SPI frame
3:0
R
Reserved
27h ID 7:0 R Custom er readabl e component i dentif ic at i on number, value
27h
Note: INT_STATUS: The bits in the interrupt status register and the corresponding SPI frame bits are cleared after this
register has been read. Register reading is treated as interrupt acknowledgement signal. Bits in this register are kept
active even if the failure conditi on is over until they are acknowledged by reading t he register.
SCC1300-D02
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5.5.1 Control Register (CTRL)
Table 16. SCC1300 accelerometer CTRL control register (address 01h) bit level description
Bit Mode Initial
Value
Name
Description
7
R/W
0
Reserved, write to 0
6 RW 0 PORST 1 means reset state. Bit is set to 1 when the chi p is reset by suppl y off control or under
voltage cont rol. Bit is set after supply off/on transition or startup. This bit can not be set
by SPI but it can be reset by writing a 0 to it. This bi t is also sent as Bit3 (PORST) o f SPI
output data frame on MISO.
5
R/W
0
PDOW
Write 1 to set accelerometer to power down mode
4
R/W
0
Reserved, write to 0
3 R/W 0 ST Write 1 to enable continuous self test calculation (STC). T his bit can not be set to 1 if
CTRL.PDOW or CTRL.MST is already 1 or if CTRL.PDOW or CTRL.MST is being set by
the current SPI command. Use INT_STATUS.ST C and the ST bit in SPI frame for test
result monitoring.
2 R/W 0 MST Memory self-test functi on is activated when user sets this bit to 1. The bit is reset to 0
when self t est is over. This bit can not be set to 1 if CTRL.PDOW is already 1 or if CTRL.
PDOW is being set by the current SPI command. Test is done automatically during start -
up. Set other bits in CTRL register to zero with a separate SPI command before starting
memory self-test with CTRL.MST command. Use STATUS.CSMERR and the ST bit in
SPI frame for test result monit ori ng. During m emory self test, SPI access is prevented for
85us.
1 R/W 0 ST_CFG Write 1 to st art gravit ation based start-up self-test calculation (STS ). This bit can not be
set t o 1 if CTRL.P DOW or CTRL.MST is already 1 or if CTRL.P DOW or CTRL.MST is
being set by the current SPI command. STC and STS have same priority and they can
be set and used simultaneously. This bit is set to 0 when test is over. Use
INT_STATUS.STS and ST bit of SPI frame for test result monitoring.
0 R/W 0 Reserved, write to 0
5.5.2 Acceleration output registers
Acceleration data is presented in 14-bit, 2's complement format in registers X_LSB … Z_MSB. At
0 g acceleration the output is ideally 0000h. Acceleration data bit weights are shown in Table 17:
Table 17. Acceleration output bit weights [mg] (Sensitivity 1800 LSB/g).
5.5.2.1 Example of acceleration data conversion
For example, if X_MSB = 0xFA and X_LSB = 0xEC, the combined X-axis acceleration data is
0xFAEC. Acce leration outp ut bit 0 is not use d a nd ne eds to be discarde d ( Table 17). As the dat a
is presen ted in 2's com plem ent format, the num ber sign nee ds to be hand led corr ectly. This can
be done as an arithmetic shift right by 1. So the actual data for acceleration calculation will be
0xFD76 which equa ls -650 dec imal. The s ensitivit y of the SCC1300-D02 is 1800 LSB/g ( Table 2 )
so the acceleration in g's will be:
X_acc[g] = -650[LSB] / 1800 LSB/g = -0.361 g
DOUT MSB bits(7:0) DOUT LSB bits(7:0)
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
s s s 1137.8 568.9 284.4 142.2 71.1 35.6 17.8 8.89 4.44 2.22 1.11 0.56 x
s = sign bit
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5.5.3 Accelerometer Temperature Output Registers
Offset of the accelerom eter tem perature dat a is factor y calibrated, but se nsitivit y varies f rom part
to part. Temperature data is presented in 13-bit unsigned format and uses 13 bits (13:1) of
TEMP_MSB/TEMP_LSB registers. Always read TEMP_MSB prior to TEMP_LSB because
reading the MSB register latches the LSB register.
5.5.3.1 Example of accelerometer temperature conversion
Table 18. Bit level description for the accelerometer temperature registers
The temperature registers’ typical output at +23 °C is 4096 counts and a 1 °C change in
temperature typically corresponds to 25.6 counts. Temperature information is converted from
counts to [°C] as follo ws:
[ ]
( )
k
Temp
CTemp
LSB
4096
1023 −
+±=°
where Temp[°C] is temperature in Celsius and TempLSB is temperature from TEMP_MSB and
TEMP_LSB registers in decimal format, bits(T12:0). k is the temperature slope factor specified as
Min
Typ
Max
Unit
k
22.4
25.6
28.8
LSB/oC
TEMP MSB bit s(7:0) TEMP LSB b its(7:0)
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
x x T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 x
x = not used
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6 Application Information
6.1 Application Circuitry and External Component Characteristics
Recommended circuit diagram is presented in Figure 17. The component characteristics are
presented in Table 19.
Figure 17. Recommended circuit diagram of the SCC1300.
The optional filtering recommendation for a better PSRR (Power Supply Rejection Ratio) is
presented in Figure 18. Please note that PSSR filtering is optional and not required if the 3.3V
power supp ly is alre ady stable en ough. RC filterin g (R1 & C8 without L2) could als o be suff icient
for most cases.
Figure 18. Optional filtering recommendation to improve PSRR if required.
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6.1.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines
If power s up ply routings /c a bli ngs are long, s ep arate ground c ab lin g, routi ng and l a yers f or an alog
and digital supply voltages should be used to avoid excessive power supply ripple.
In the recommended circuit diagram (Figure 17) and layout example (Figure 20), joint ground is
used as it is the simplest solution and is adequate as long as the supply voltage lines are not long
(when connecting the SCC1300 directly to µC on the same PCB).
Table 19. SCC1300 external components
Component
Parameter
Min
Typ
Max
Unit
C1, C2, C3, C4, C5
Capacitance
70
100
130
nF
ESR @ 1 MHz
100
mΩ
Voltage rating
7
V
C7
Capacitance
376
470
564
nF
ESR @ 1 MHz
100
mΩ
Voltage rating
30
V
L1
Inductance
37
47
57
µH
ESR L=47 µH
5
Ω
Voltage rating
30
V
C6
Capacitance
0.7
1
1.3
µF
ESR @ 1 MHz
100
mΩ
Optional for better PSRR:
R1
Resistance
10
Ω
C8
Capacitance
4.7
µF
L2
Impedance
1k
Ω
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6.2 Boost Regulator and Power S uppl y Decoupling in Layout
Recommended layout for DVDD_G/LHV pin decoupling is shown in Figure 19.
Figure 19. Layout recommendations f or DVDD _G/L H V pin decou pl in g
6.2.1 Layout Example
Figure 20. Example layout for the SCC1300
SCC1300-D02
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6.2.2 Thermal Connection
The component has heat sink pins to transfer internally generated heat from the package to
ambient. Thermal resistance to ambient should be low enough not to self heat the device. If the
internal junction temperature gets too high compared to ambient, this may lead to out of
specification behavior.
Table 20. Thermal resistance
Component
Parameter
Min
Typ
Max
Unit
Thermal resistanc e ΘJA Total thermal resistance
from juncti on to ambient
50 °C/W
6.3 Assembly Instructions
Usage of PCB coating materials may effect component performance. The coating material and
coating proc ess used shou ld be vali dated. For additional as sem bly related details pleas e refer to
“Technical Note 82” for assembly instructions.