SUMMARY
V(BR)DSS= 60V; RDS(ON)= 0.14 ID= 2.7A
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilises a unique structure
that combines the benefits of low on-resistance with fast switching speed. This
makes them ideal for high efficiency, low voltage, power management applications.
FEATURES
•Low on-resistance
•Fast switching speed
•Low threshold
•Low gate drive
•Low profile SO8 package
APPLICATIONS
•DC - DC Converters
•Power Management Functions
•Disconnect switches
•Motor control
DEVICE MARKING
•ZXMN
6A11D
ZXMN6A11DN8
ISSUE 1 - MARCH 2002
60V N-CHANNEL ENHANCEMENT MODE MOSFET
1
SO8
DEVICE REEL
SIZE TAPE
WIDTH QUANTITY
PER REEL
ZXMN6A11DN8TA 7” 12mm 500 units
ZXMN6A11DN8TC 13” 12mm 2500 units
ORDERING INFORMATION
Top View
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ISSUE 1 - MARCH 2002
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PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDSS 60 V
Gate Source Voltage VGS ⫾20 V
Continuous Drain Current VGS=10V; TA=25°C(b)
VGS=10V; TA=70°C(b)
VGS=10V; TA=25°C(a)
ID2.7
2.2
2.1
A
Pulsed Drain Current (c) IDM 8.3 A
Continuous Source Current (Body Diode) (b) IS3.2 A
Pulsed Source Current (Body Diode)(c) ISM 8.3 A
Power Dissipation at TA=25°C (a)(d)
Linear Derating Factor PD1.25
10 mW
mW/°C
Power Dissipation at TA=25°C (a)(e)
Linear Derating Factor PD1.8
14 mW
mW/°C
Power Dissipation at TA=25°C (b)(d)
Linear Derating Factor PD2.1
17 mW
mW/°C
Operating and Storage Temperature Range Tj:Tstg -55 to +150 °C
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)(d) RθJA 100 °C/W
Junction to Ambient (a)(e) RθJA 70 °C/W
Junction to Ambient (b)(d) RθJA 60 °C/W
THERMAL RESISTANCE
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum junction temperature.
(d) For device with one active die
(e) For device with two active die running at equal power.
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CHARACTERISTICS
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PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage V(BR)DSS 60 V ID=250µA, VGS=0V
Zero Gate Voltage Drain Current IDSS 1␮AV
DS=60V, VGS=0V
Gate-Body Leakage IGSS 100 nA VGS=⫾20V, VDS=0V
Gate-Source Threshold Voltage VGS(th) 1.0 V ID=250␮A, VDS=V
GS
Static Drain-Source On-State
Resistance (1) RDS(on) 0.14
0.25 ⍀
⍀
VGS=10V, ID=4.4A
VGS=4.5V, ID=3.8A
Forward Transconductance (3) gfs 4.9 S VDS=15V,ID=2.5A
DYNAMIC (3)
Input Capacitance Ciss 330 pF VDS=40V,V
GS=0V,
f=1MHz
Output Capacitance Coss 35.0 pF
Reverse Transfer Capacitance Crss 17.0 pF
SWITCHING(2) (3)
Turn-On Delay Time td(on) 1.95 ns VDD =15V, ID=2.5A
RG=6.0⍀,VGS=10V
(refer to test circuit)
Rise Time tr3.5 ns
Turn-Off Delay Time td(off) 8.2 ns
Fall Time tf4.6 ns
Gate Charge Qg3.0 nC VDS=15V, VGS=5V,
ID=2.5A
Total Gate Charge Qg5.7 nC VDS=15V,VGS=10V,
ID=2.5A
(refer to test circuit)
Gate-Source Charge Qgs 1.25 nC
Gate-Drain Charge Qgd 0.86 nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1) VSD 0.85 0.95 V TJ=25°C, IS=2.8A,
VGS=0V
Reverse Recovery Time (3) trr 21.5 ns TJ=25°C, IF=2.5A,
di/dt= 100A/µs
Reverse Recovery Charge (3) Qrr 20.5 nC
ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated)
NOTES
(1) Measured under pulsed conditions. Width≤300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
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TYPICAL CHARACTERISTICS
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TYPICAL CHARACTERISTICS
Zetex plc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4422
Fax: (44) 161 622 4420
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY11788
USA
Telephone: (631) 360 2222
Fax: (631) 360 8222
Zetex (Asia) Ltd
3701-04 Metroplaza, Tower 1
Hing Fong Road
Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
© Zetex plc 2002
ZXMN6A11DN8
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DIM INCHES
MIN MAX
A 0.053 0.069
A1 0.004 0.010
D 0.189 0.197
H 0.228 0.244
E 0.150 0.157
L 0.016 0.050
e 0.050 BSC
b 0.013 0.020
c 0.008 0.010
⍜0⬚8⬚
h 0.010 0.020
PACKAGE DIMENSIONSPACKAGE OUTLINE