ESDZV5HS-1BF4 Datasheet Ultra-low clamping single line bidirectional ESD protection Features * * * * * Ultra-low clamping voltage: - 10 V (IEC 61000-4-2 contact discharge 8 kV at 30 ns / 16 A TLP) Bidirectional and symmetrical device High holding voltage for DC line protection 0201 WLCSP package Complies with the following standards: IEC 61000-4-2 level 4 - 15 kV (air discharge) - 10 kV (contact discharge) * ECOPACK(R)2 compliant component 0201 WLCSP package Application Where transient over voltage protection in ESD sensitive equipment is required, such as: * Smartphones, mobile phones and accessories * Tablet and notebooks * Portable multimedia devices and accessories * Wearable, home automation, healthcare * Highly integrated systems Product status link ESDZV5HS-1BF4 Description The ESDZV5HS-1BF4 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. DS12364 - Rev 3 - June 2018 For further information contact your local STMicroelectronics sales office. www.st.com ESDZV5HS-1BF4 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 C) Symbol Parameter Value IEC 61000-4-2 contact discharge 10 IEC 61000-4-2 air discharge 15 Unit Vpp Peak pulse voltage Ppp Peak pulse power (8/20 s) 40 W Ipp Peak pulse current (8/20 s) 4 A Tj Operating junction temperature range -55 to +150 Storage junction temperature range -65 to +150 Tstg TL Maximum lead temperature for soldering during 10 s kV C 260 Figure 1. Electrical characteristics (definitions) I Symbol Parameter VRM Stand-off voltage VCL Clamping voltage RD VH Holding voltage IRM Leakage current at VRM IPP Peak pulse current VTrig Triggering voltage Cline Input capacitance per line RD Dynamic resistance VCL VTrig VBR VRM V IRM IR IPP Table 2. Electrical characteristics (values) (Tamb = 25 C) Symbol Min. Typ. Max. Unit Vtrig 10 12 13.5 V VH 6.5 7 Test condition IRM Leakage current VCL Clamping voltage RD Dynamic resistance, pulse duration 100 ns CLINE DS12364 - Rev 3 Parameter Line capacitance VRM = 5.5 V IEC 61000-4-2, 8 kV contact discharge measured after 30 ns VLINE = 0 V, F = 1 MHz, VOSC = 30 mV V 100 nA 10 V 0.18 4 4.5 pF page 2/10 ESDZV5HS-1BF4 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Variation of leakage current versus junction temperature (typical values) Figure 3. Junction capacitance versus frequency C(pF) 4.5 IR(nA) 120 4.0 3.5 100 3.0 80 2.5 2.0 60 1.5 40 1.0 20 0 0.5 Tj(C) 25 50 75 100 125 150 Figure 4. ESD response to IEC 61000-4-2 (+8 kV contact discharge) V(V) 0.0 0 1 2 3 4 5 Figure 5. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 6. TLP Figure 7. S21 attenuation 20 TLP current (A) 18 16 14 12 10 8 6 4 2 0 TLP voltage (V) 0 DS12364 - Rev 3 2 4 6 8 10 12 14 16 page 3/10 ESDZV5HS-1BF4 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 0201 WLCSP package information Figure 8. 0201 WLCSP package outline Table 3. 0201 WLCSP package mechanical data Dimensions Millimeters Ref. Min. Max. A 0.270 0.300 0.330 b 0.1675 0.1875 0.2075 D 0.560 0.580 0.600 D1 DS12364 - Rev 3 Typ. 0.3375 E 0.260 0.280 0.300 E1 0.205 0.225 0.245 fD 0.0175 0.0275 0.0375 fE 0.0175 0.0275 0.070 page 4/10 ESDZV5HS-1BF4 0201 WLCSP package information Figure 9. Marking U Pin 1 Pin 2 Figure 10. Tape and reel specification Bar indicates Pin 1 DS12364 - Rev 3 page 5/10 ESDZV5HS-1BF4 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Footprint Figure 11. Footprint in mm 3.2 Stencil opening design 1. Recommended design reference a. Stencil opening dimensions: 75 m / 3 mils Figure 12. Stencil opening recommendations DS12364 - Rev 3 page 6/10 ESDZV5HS-1BF4 Solder paste 3.3 Solder paste 1. 2. 3. 4. 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 3.6 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 m. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 13. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting 250 240-245 C Temperature (C) -2 C/s 2 - 3 C/s 60 sec (90 max) 200 -3 C/s 150 -6 C/s 100 0.9 C/s 50 Time (s) 0 Note: DS12364 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 7/10 ESDZV5HS-1BF4 Ordering information 4 Ordering information Figure 15. Ordering information scheme ESDZV5HS - 1 B F4 ESD protection Z: Ultra-low clamping snapback effect V: Very low capacitance 5: Stand-off voltage at 5.5 V min HS : Higher holding voltage symmetrical version Number of lines B = Birectional Package F4 = 0201 WLCSP Table 4. Ordering information DS12364 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode ESDZV5HS-1BF4 U 0201 WLCSP 0.116 mg 15000 Tape and reel page 8/10 ESDZV5HS-1BF4 Revision history Table 5. Document revision history DS12364 - Rev 3 Date Revision Changes 02-Nov-2017 1 Initial release. 16-Feb-2018 2 Updated Table 3: "0201 package mechanical data". 28-Jun-2018 3 Updated package information naming. page 9/10 ESDZV5HS-1BF4 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DS12364 - Rev 3 page 10/10