0201 WLCSP package
Features
• Ultra-low clamping voltage:
– 10 V (IEC 61000-4-2 contact discharge 8 kV at 30 ns / 16 A TLP)
• Bidirectional and symmetrical device
• High holding voltage for DC line protection
• 0201 WLCSP package
• Complies with the following standards: IEC 61000-4-2 level 4
– ±15 kV (air discharge)
– ±10 kV (contact discharge)
•ECOPACK®2 compliant component
Application
Where transient over voltage protection in ESD sensitive equipment is required, such
as:
• Smartphones, mobile phones and accessories
• Tablet and notebooks
• Portable multimedia devices and accessories
• Wearable, home automation, healthcare
• Highly integrated systems
Description
The ESDZV5HS-1BF4 is a bidirectional single line TVS diode designed to protect the
data line or other I/O ports against ESD transients.
The device is ideal for applications where both reduced line capacitance and board
space saving are required.
Product status link
ESDZV5HS-1BF4
Ultra-low clamping single line bidirectional ESD protection
ESDZV5HS-1BF4
Datasheet
DS12364 - Rev 3 - June 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
Vpp Peak pulse voltage IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
±10
±15 kV
Ppp Peak pulse power (8/20 μs) 40 W
Ipp Peak pulse current (8/20 μs) 4 A
TjOperating junction temperature range -55 to +150
°C
Tstg Storage junction temperature range -65 to +150
TLMaximum lead temperature for soldering during 10 s 260
Figure 1. Electrical characteristics (definitions)
VCL VBR VRM
IR
IPP
V
I
VTrig
IRM
RD
VRM Stand-off voltage
VCL Clamping voltage
VH Holding voltage
IRM Leakage current at VRM
IPP Peak pulse current
VTrig Triggering voltage
Cline Input capacitance per line
RD Dynamic resistance
Symbol Parameter
Table 2. Electrical characteristics (values) (Tamb = 25° C)
Symbol Parameter Test condition Min. Typ. Max. Unit
Vtrig 10 12 13.5 V
VH6.5 7 V
IRM Leakage current VRM = 5.5 V 100 nA
VCL Clamping voltage IEC 61000-4-2, 8 kV
contact discharge measured after 30 ns 10 V
RDDynamic resistance, pulse duration 100 ns 0.18 Ω
CLINE Line capacitance VLINE = 0 V, F = 1 MHz, VOSC = 30 mV 4 4.5 pF
ESDZV5HS-1BF4
Characteristics
DS12364 - Rev 3 page 2/10
1.1 Characteristics (curves)
Figure 2. Variation of leakage current versus junction
temperature (typical values)
IR(nA)
0
20
40
60
80
100
120
25 50 75 100 125 150
Tj(°C)
Figure 3. Junction capacitance versus frequency
C(pF)
V(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 1 2 3 4 5
Figure 4. ESD response to IEC 61000-4-2 (+8 kV contact
discharge)
Figure 5. ESD response to IEC 61000-4-2 (-8 kV contact
discharge)
Figure 6. TLP
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10 12 14 16
TLP current (A)
TLP voltage (V)
Figure 7. S21 attenuation
ESDZV5HS-1BF4
Characteristics (curves)
DS12364 - Rev 3 page 3/10
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 0201 WLCSP package information
Figure 8. 0201 WLCSP package outline
Table 3. 0201 WLCSP package mechanical data
Ref.
Dimensions
Millimeters
Min. Typ. Max.
A 0.270 0.300 0.330
b 0.1675 0.1875 0.2075
D 0.560 0.580 0.600
D1 0.3375
E 0.260 0.280 0.300
E1 0.205 0.225 0.245
fD 0.0175 0.0275 0.0375
fE 0.0175 0.0275 0.070
ESDZV5HS-1BF4
Package information
DS12364 - Rev 3 page 4/10
Figure 9. Marking
Pin 1 Pin 2
U
Figure 10. Tape and reel specification
Bar indicates Pin 1
ESDZV5HS-1BF4
0201 WLCSP package information
DS12364 - Rev 3 page 5/10
3Recommendation on PCB assembly
3.1 Footprint
Figure 11. Footprint in mm
3.2 Stencil opening design
1. Recommended design reference
a. Stencil opening dimensions: 75 µm / 3 mils
Figure 12. Stencil opening recommendations
ESDZV5HS-1BF4
Recommendation on PCB assembly
DS12364 - Rev 3 page 6/10
3.3 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size 20-38 µm.
3.4 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and cause solder joints to short. Too low placement force can lead to insufficient contact between package
and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high
resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
3.5 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is
recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
3.6 Reflow profile
Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting
250
0
50
100
150
200
240210180150120906030 300270
-6 °C/s
240-245 °C
2 - 3 °C/s
Temperature (°C) -2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
ESDZV5HS-1BF4
Solder paste
DS12364 - Rev 3 page 7/10
4Ordering information
Figure 15. Ordering information scheme
HS : Higher holding voltage symmetrical version
Z: Ultra-low clamping snapback effect
ESDZV5HS - 1 B F4
ESD protection
V: Very low capacitance
Package
F4 = 0201 WLCSP
Number of lines
5: Stand-off voltage at 5.5 V min
B = Birectional
Table 4. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
ESDZV5HS-1BF4 U 0201 WLCSP 0.116 mg 15000 Tape and reel
ESDZV5HS-1BF4
Ordering information
DS12364 - Rev 3 page 8/10
Revision history
Table 5. Document revision history
Date Revision Changes
02-Nov-2017 1 Initial release.
16-Feb-2018 2 Updated Table 3: "0201 package mechanical data".
28-Jun-2018 3 Updated package information naming.
ESDZV5HS-1BF4
DS12364 - Rev 3 page 9/10
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ESDZV5HS-1BF4
DS12364 - Rev 3 page 10/10
