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FEATURES
APPLICATIONS
DESCRIPTION
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
Low Operating Current of 2.3 mA at 52 kHzControlled Baseline Fast 35 ns Cycle-by-Cycle OvercurrentLimiting One Assembly/Test Site, One FabricationSite ± 1 A Peak Output Current Extended Temperature Performance of Rail-to-Rail Output Swings With 25 ns Rise–55 °C to 125 °C and 20 ns Fall TimesEnhanced Diminishing Manufacturing Sources ± 1% Initial Trimmed 2.5 V Error Amplifier(DMS) Support ReferenceEnhanced Product-Change Notification Trimmed Oscillator Discharge CurrentQualification Pedigree
(1)
New Undervoltage Lockout VersionsEnhanced Replacements for UC2842A Family MSOP-8 Package Minimizes Board SpaceWith Pin-to-Pin Compatibility1 MHz Operation
Switch Mode Power Supplies50 µA Standby Current, 100 µA Maximum
DC-to-DC Converters(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over an
Board Mount Power Modulesextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The UCC28C4x family are high performance current mode PWM controllers. They are enhanced BiCMOSversions with pin-for-pin compatibility to the industry standard UC284xA family and UC284x family of PWMcontrollers. In addition, lower startup voltage versions of 7 V are offered as UCC28C40 and UCC28C41.
Providing necessary features to control fixed frequency, peak current mode power supplies, this family offersseveral performance advantages. These devices offer high frequency operation up to 1 MHz with low start upand operating currents, thus minimizing start up loss and low operating power consumption for improvedefficiency. The devices also feature a fast current sense to output delay time of 35 ns, and a ±1 A peak outputcurrent capability with improved rise and fall times for driving large external MOSFETs directly.
The UCC28C4x family is offered in 8-pin package SOIC (D).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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Note:Toggleflip-flopusedonlyinUCC28C41,UCC28C44,andUCC28C45.
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
AVAILABLE OPTIONS
SOIC-8MAXIMUM UVLOT
A
SMALL OUTLINEDUTY CYCLE ON/OFF
(D)
(1)
14.5 V/9 V UCC28C42MDREP
(2)
100% 8.4 V/7.6 V UCC28C43MDREP7 V/6.6 V UCC28C40MDREP
(2)–55 °C to 125 °C
14.5 V/9 V UCC28C44MDREP
(2)
50% 8.4 V/7.6 V UCC28C45MDREP7 V/6.6 V UCC28C41MDREP
(2)
(1) D (SOIC-8) packages are available taped and reeled. Add R suffix to device type (e.g., UCC28C42DREP) to order quantities of 2500devices per reel. Tube quantities are 75 for D packages (SOIC-8).(2) Product Preview
FUNCTIONAL BLOCK DIAGRAM
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Absolute Maximum Ratings
(1) (2)
Dissipation Ratings
Recommended Operating Conditions
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD 20 VSupply voltage
Max I
CC
30 mAOutput current, I
OUT
peak ±1 AOutput energy, capacitive load 5 µJCOMP, CS, FB –0.3 6.3OUT –0.3 20Voltage rating VRT/CT –0.3 6.3VREF 7Error amplifier output sink current 10 mAT
J
Operating junction temperature range
(3)
–55 150 °CT
stg
Storage temperature range –65 150 °CLead temperature (soldering, 10 s) 300 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals.(3) Long-term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information about enhanced plastic packaging.
θ
ja
T
A
< 25 °C DERATING FACTOR T
A
= 70 °C T
A
= 85 °C T
A
= 125 °CPACKAGE
(°C/W) POWER RATING ABOVE T
A
= 25 °C POWER RATING POWER RATING POWER RATING
D 176 710 mW 5.68 mW/ °C 454 mW 369 mW 142 mW
MIN MAX UNIT
V
DD
Input voltage 18 VV
OUT
Output voltage range 18 VI
OUT
(1)
Average output current 200 mAI
OUT(ref
)
(1)
Reference output current –20 mAT
J
(1)
Operating junction temperature –55 150 °C
(1) It is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time.
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(6) Gain is defined as
ACS +
DVCOM
DVCS ,0 V vVCS v900 mV
Electrical Characteristics
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
V
DD
= 15 V
(1)
, R
T
= 10 k , C
T
= 3.3 nF, C
VDD
= 0.1 µF and no load on the outputs, T
A
= T
J
= –55 °C to 125 °C for theUCC28C4x
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Reference
Output voltage, initial accuracy T
A
= 25 °C , I
OUT
= 1 mA 4.9 5 5.1 VLine regulation V
DD
= 12 V to 18 V 0.2 20 mVLoad regulation 1 mA to 20 mA 3 25 mVTemperature stability
(2)
0.2 0.4 mV/ °CTotal output variation
(2)
4.82 5.18 VOutput noise voltage 10 Hz to 10 kHz, T
A
= 25 °C 50 µVLong term stability 1000 hours, T
A
= 125 °C
(2)
5 25 mVOutput short circuit –30 –45 –55 mA
Oscillator
T
A
= 25 °C
(3)
50.5 53 55 kHzInitial accuracy
T
A
= Full Range
(3)
50.5 57 KHzVoltage stability V
DD
= 12 V to 18 V 0.2 2.85 %Temperature stability T
MIN
to T
MAX
(2)
1 2.5 %Amplitude RT/CT pin peak to peak 1.9 VT
A
= 25 °C, RT/CT = 2 V
(4)
7.7 8.4 9 mADischarge current
RT/CT = 2 V
(4)
7.2 8.4 9.5 mA
Error Amplifier
Feedback input voltage, initial accuracy V
COMP
= 2.5 V, T
A
= 25 °C 2.475 2.500 2.525 VFeedback input voltage, total variation V
COMP
= 2.5 V 2.45 2.50 2.55 VInput bias current –0.1 –2 µAA
VOL
Open-loop voltage gain V
OUT
= 2 V to 4 V 65 90 dBUnity gain bandwidth 1.5 MHzPSRR Power-supply rejection ratio V
DD
= 12 V to 18 V 60 dBOutput sink current V
FB
= 2.7 V, V
COMP
= 1.1 V 2 14 mAOutput source current V
FB
= 2.3 V, V
COMP
= 5 V –0.5 –1 mAV
OH
High-level output voltage V
FB
= 2.3 V, R
LOAD
= 15 k to GND 5 6.8 VV
OL
Low-level output voltage V
FB
= 2.7 V, R
LOAD
= 15 k to VREF 0.1 1.1 V
Current Sense
T
A
= 25 °C
(5) (6)
2.85 3 3.15 V/VGain
T
A
= Full Range
(5) (6)
2.825 3.15 V/VMaximum input signal V
FB
< 2.4 V 0.9 1 1.1 VPSRR Power-supply rejection ratio V
DD
= 12 V to 18 V
(2) (5)
70 dBInput bias current –0.1 –2 µACS to output delay 35 70 nsCOMP to CS offset V
CS
= 0 V 1.15 V
Output
V
OUT
low (R
DS(on)
pull-down) I
SINK
= 200 mA 5.5 15 V
OUT
high (R
DS(on)
pull-up) I
SOURCE
= 200 mA 10 25
(1) Adjust V
DD
above the start threshold before setting at 15 V.(2) Not production tested.(3) Output frequencies of the UCC28C41, UCC28C44, and UCC28C45 are one-half the oscillator frequency.(4) Oscillator discharge current is measured with R
T
= 10 k to V
REF
.(5) Parameter measured at trip point of latch with V
FB
= 0 V.
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1
2
3
4
8
7
6
5
COMP
FB
CS
RT/CT
VREF
VDD
OUT
GND
PDIP (P) or SOIC (D) PACKAGE
(TOP VIEW)
Pin Assignments
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
Electrical Characteristics (continued)V
DD
= 15 V , R
T
= 10 k , C
T
= 3.3 nF, C
VDD
= 0.1 µF and no load on the outputs, T
A
= T
J
= –55 °C to 125 °C for the UCC28C4x
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Rise tIme T
A
= 25 °C, C
LOAD
= 1 nF 25 50 nsFall time T
A
= 25 °C, C
LOAD
= 1 nF 20 40 ns
Undervoltage Lockout (UVLO)
UCC28C42-EP, UCC28C44-EP 13.5 14.5 15.5Start threshold UCC28C43-EP, UCC28C45-EP 7.8 8.4 9 VUCC28C40-EP, UCC28C41-EP 6.5 7 7.5UCC28C42-EP, UCC28C44-EP 8 9 10Minimum operating voltage UCC28C43-EP, UCC28C45-EP 7 7.6 8.2 VUCC28C40-EP, UCC28C41-EP 6.1 6.6 7.1
PWM
UCC28C42-EP, UCC28C43-EP, 94 96Maximum duty cycle UCC28C40-EP, UCC28C44-EP, %47 48UCC28C45-EP, UCC28C41-EPMinimum duty cycle 0%
Current Supply
I
START-UP
Start-up current V
DD
= UVLO start threshold (–0.5 V) 50 100 µAI
DD
Operating supply current V
FB
= V
CS
= 0 V 2.3 3 mA
COMP: This pin provides the output of the error amplifier for compensation. In addition, the COMP pin isfrequently used as a control port by utilizing a secondary-side error amplifier to send an error signal across thesecondary-primary isolation boundary through an opto-isolator.
CS: The current-sense pin is the noninverting input to the PWM comparator. This is compared to a signalproportional to the error amplifier output voltage. A voltage ramp can be applied to this pin to run the device witha voltage mode control configuration.
FB: This pin is the inverting input to the error amplifier. The noninverting input to the error amplifier is internallytrimmed to 2.5 V ±1%.
GND: Ground return pin for the output driver stage and the logic-level controller section.
OUT: The output of the on-chip drive stage. OUT is intended to directly drive a MOSFET. The OUT pin in theUCC28C40, UCC28C42, and UCC28C43 is the same frequency as the oscillator, and can operate near 100%duty cycle. In the UCC28C41, UCC28C44, and the UCC28C45, the frequency of OUT is one-half that of theoscillator due to an internal T flipflop. This limits the maximum duty cycle to <50%.
RT/CT: Timing resistor and timing capacitor. The timing capacitor should be connected to the device groundusing minimal trace length.
VDD: Power supply pin for the device. This pin should be bypassed with a 0.1 µF capacitor with minimal tracelengths. Additional capacitance may be needed to provide hold up power to the device during startup.
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UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
VREF: 5-V reference. For stability, the reference should be bypassed with a 0.1 µF capacitor to ground usingthe minimal trace length possible.
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APPLICATION INFORMATION
Advantages
Low-Voltage Operation
High-Speed Operation
Start/Run Current Improvements
±1% Initial Reference Voltage
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
This device is a pin-for-pin replacement of the bipolar UC2842 family of controllers—the industry standard PWMcontroller for single-ended converters. Familiarity with this controller family is assumed.
The UCC28C4x series is an enhanced replacement with pin-to-pin compatibility to the bipolar UC284x andUC284xA families. The new series offers improved performance when compared to older bipolar devices andother competitive BiCMOS devices with similar functionality. Note that these improvements discussed belowgenerally consist of tighter specification limits that are a subset of the older product ratings, maintaining drop-incapability. In new designs these improvements can be utilized to reduce the component count or enhance circuitperformance when compared to the previously available devices.
This device increases the total circuit efficiency whether operating off-line or in dc input circuits. In off-lineapplications the low start-up current of this device reduces steady state power dissipation in the startup resistor,and the low operating current maximizes efficiency while running. The low running current also provides anefficiency boost in battery-operated supplies.
Two members of the UCC28C4x family are intended for applications that require a lower start-up voltage thanthe original family members. The UCC28C40 and UCC28C41 have a turn-on voltage of 7 V typical and exhibithysteresis of 0.4 V for a turn-off voltage of 6.6 V. This reduced start-up voltage enables use in systems withlower voltages, such as 12 V battery systems that are nearly discharged.
The BiCMOS design allows operation at high frequencies that were not feasible in the predecessor bipolardevices. First, the output stage has been redesigned to drive the external power switch in approximatelyone-half the time of the earlier devices. Second, the internal oscillator is more robust, with less variation asfrequency increases. In addition, the current sense to output delay has been reduced by a factor of three, to 45ns typical. These features combine to provide a device capable of reliable high-frequency operation.
The UCC28C4x family oscillator is true to the curves of the original bipolar devices at lower frequencies, yetextends the frequency programmability range to at least 1 MHz. This allows the device to offer pin-to-pincapability where required, yet capable of extending the operational range to the higher frequencies typical oflatest applications. When the original UC2842 was released in 1984, most switching supplies operated between20 kHz and 100 kHz. Today, the UCC28C4x can be used in designs cover a span roughly ten times higher thanthose numbers.
The start-up current is only 60 µA typical, a significant reduction from the bipolar device's ratings of 300 µA(UC284xA). For operation over the temperature range of –55 °C to 125 °C, the UCC28C4x devices offer amaximum startup current of 100 µA, an improvement over competitive BiCMOS devices. This allows thepower-supply designer to further optimize the selection of the start-up resistor value to provide a more efficientdesign. In applications where low component cost overrides maximum efficiency the low run current of 2.3 mAtypical may allow the control device to run directly through the single resistor to (+) rail, rather than needing abootstrap winding on the power transformer, along with a rectifier. The start/run resistor for this case must alsopass enough current to allow driving the primary switching MOSFET, which may be a few milliamps in smalldevices.
The BiCMOS internal reference of 2.5 V has an enhanced design and utilizes production trim to allow initialaccuracy of ±1% at room temperature and ±2% over the full temperature range. This can be used to eliminatean external reference in applications that do not require the extreme accuracy afforded by the additional device.This is very useful for nonisolated dc-to-dc applications where the control device is referenced to the samecommon as the output. It is also applicable in offline designs that regulate on the primary side of the isolationboundary by looking at a primary bias winding, or perhaps from a winding on the output inductor of abuck-derived circuit.
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Reduced Discharge Current Variation
Soft-Start
UCC28C42
8
1COMP
5
GND
UDG-01072
VREF
Oscillator Synchronization
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
The original UC2842 oscillator did not have trimmed discharged current, and the parameter was not specified onthe data sheet. Since many customers attempted to use the discharge current to set a crude dead-time limit, theUC2842A family was released with a trimmed discharge current specified at 25 °C. The UCC28C4x series nowoffers even tighter control of this parameter, with approximately ±3% accuracy at 25 °C, and less than 10%variation over temperature using the UCC28C4x devices. This level of accuracy can enable a meaningful limit tobe programmed, a feature not currently seen in competitive BiCMOS devices. The improved oscillator andreference also contribute to decreased variation in the peak-to-peak variation in the oscillator waveform, which isoften used as the basis for slope compensation for the complete power system.
Figure 1 provides a typical soft-start circuit for use with the UCC28C42. The values of R and C should beselected to bring the COMP pin up at a controlled rate, limiting the peak current supplied by the power stage.After the soft-start interval is complete, the capacitor continues to charge to V
REF
, effectively removing the PNPtransistor from circuit considerations.
The optional diode in parallel with the resistor forces a soft-start each time the PWM goes through UVLO andthe reference (V
REF
) goes low. Without the diode, the capacitor otherwise remains charged during a brief loss ofsupply or brownout, and no soft-start is enabled upon reapplication of VIN.
Figure 1.
The UCC28C4x oscillator has the same synchronization characteristics as the original bipolar devices. Thus, theinformation in the application report U-100A, UC2842/3/4/5 Provides Low-Cost Current-Mode Control (SLUA143)still applies. The application report describes how a small resistor from the timing capacitor to ground can offeran insertion point for synchronization to an external clock (see Figure 2 and Figure 3 ). Figure 2 shows how theUCC28C42 can be synchronized to an external clock source. This allows precise control of frequency and deadtime with a digital pulse train.
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UDG-01069
8
4
VREF
RT/ CT
UCC28C42
PWM
RT
CT
24
SYNCHRONIZATION
CIRCUIT INPUT
ON .
LOW LOWHIGH
ON . OFF .
CLOCK
INPUT
PWM
OUT
UPPER THRESHOLD
LOWER THRESHOLD
OUTPUT A
COMBINED
UPPER THRESHOLD
LOWER THRESHOLD
VCT
VCT (ANALOG)
VSYNC (DIGITAL)
UDG−01070
Precautions
Circuit Applications
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 2. Oscillator Synchronization Circuit
Figure 3. Synchronization to an External Clock
The absolute maximum supply voltage is 20 V, including any transients that may be present. If this voltage isexceeded, device damage is likely. This is in contrast to the predecessor bipolar devices that could survive up to30 V. Thus, the supply pin should be decoupled as close to the ground pin as possible. Also, since no clamp isincluded in the device, the supply pin should be protected from external sources that could exceed the 20 Vlevel.
Careful layout of the printed board has always been a necessity for high-frequency power supplies. As thedevice switching speeds and operating frequencies increase, the layout of the converter becomes increasinglyimportant.
This 8-pin device has only a single ground for the logic and power connections. This forces the gate drivecurrent pulses to flow through the same ground that the control circuit uses for reference. Thus, the interconnectinductance should be minimized as much as possible. One implication is to place the device (gate driver)circuitry close to the MOSFET it is driving. Note that this can conflict with the need for the error amplifier and thefeedback path to be away from the noise generating components.
Figure 4 shows a typical off-line application.
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UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 4. Typical Off-Line Application
Figure 5 shows the forward converter with synchronous rectification. This application provides 48 V to 3.3 V at10 A with over 85% efficiency, and uses the UCC28C42 as the secondary-side controller and UCC3961 as theprimary-side startup control device.
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R28
100
D3
BAR74
C26
2uF
D5
BAR74
R14
20k40%
C16
5.6nF
+
C15
1uF
C14
1uF
C13
0.22uF
C12
3300pF
C11
1500pF
D6
BZX84C15LT1
UCC28C4x
1COMP
2FB
3CS
4Rt/Ct 5
GND
6
OUT
7
Vcc
8
REF
U2
C22
4.7nF
C23 680pF
C24
0.1uF
C10
2.7nF
1
2
3
4
T2
Q4
Q3
L1
4.7uH
C21
0.1uF
+
C20
470uF
+
C19
470uF
3r3V
PWRGND
D2
C2
1nF
C18
4700pF
C25
0.047uF
VinN
VinP
C9
0.1uF
ucc3961
4FB
5Rt
6Ref
7AGnd 8
Vs
9
CS
10
PGnd
11
Out
1OVS
2SD
3SS 12
Vdd
13
St
14
UVS
U1
+
C1
470uF
C3 10nF
C4
0.22uF
C5
0.1uF C6
470pF
C7
100pF
C8
1uF
C17
4700pF
D1
Q1
Q2
TPS2832
8
BOOT
1IN
6
BTLO
3DT
7
HIDR
4Vcc
2PGND
5
LODR
U4
T1
R19
20
R22
100
R18
7.5k
R17
20k
R16 21.5k
R15
50k
R23
402
R24
20k
R25
20k
R12
200 R13
300
R27
4.7
R26
4.7
R7
10k
R21
10
R1
32.4k
R2
1.2k
R3
2.4k
R4
1.5k R5
76.8k
R6
4.7
R8
5.1k
R9
0.33
R10
1k
R11
46.4k
R20
10
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 5. Forward Converter With Synchronous RectificationUsing the UCC28C42 as the Secondary-Side Controller
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IDISCH − Oscillator Discharge Current − mA
TJ − Temperature − °C
9.0
9.5
8.0
7.5
7.0
8.5
−50 −25 0 25 50 75 100 125
OSCILLATOR DISCHARGE CURRENT
vs
TEMPERATURE
1 k
10 k
100 k
1 k 10 k 100 k
1 M
10 M
OSCILLATOR FREQUENCY
vs
TIMING RESISTANCE AND CAPACITANCE
CT = 220 pF
CT = 4.7 nF
CT = 2.2 nF
CT = 1 nF
CT = 470 pF
RT − T iming Resistance − W
f − Frequency − Hz
f − Frequency − Hz
Gain − (dB)
ERROR AMPLIFIER
FREQUENCY RESPONSE
1 10 100 10 k 100 k 1 M 10 M1 k
10
0
20
200
180
140
120
80
40
0
60
100
160
20
30
40
50
60
70
80
90
100
Phase Margin − (°)
GAIN
PHASE
MARGIN
COMP to CS OFFSET VOLTAGE (with CS = 0)
vs
TEMPERATURE
COMP to CS
TJ − Temperature − °C
0.2
1.8
1.4
1.2
0.8
0.4
0.0
0.6
1.0
1.6
−50 −25 0 25 50 75 100 125
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 6. Figure 7.
Figure 8. Figure 9.
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REFERENCE VOLTAGE
vs
TEMPERATURE
VREF − Reference Voltage − V
−50 −25 0 25 50 75 100 125
TJ − Temperature − °C
4.96
4.97
4.98
4.99
5.01
5.02
5.03
5.04
5.05
5.00
4.95
2.46
2.55
2.54
2.52
2.51
2.49
2.47
2.45
2.48
2.50
2.53
−50 −25 0 25 50 75 100 125
ERROR AMPLIFIER REFERENCE VOLTAGE
vs
TEMPERATURE
VEAREF − Error Amplifier Reference Voltage − V
TJ − Temperature − °C
−200
200
150
50
0
−50
−150
100
−100
ERROR AMPLIFIER INPUT BIAS CURRENT
vs
TEMPERATURE
IBIAS − Error Amplifier Input Bias Current − nA
TJ − Temperature − °C
−50 −25 0 25 50 75 100 125
ISC − Reference Short Circuit Current − mA
REFERENCE SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
−55
−35
−37
−41
−45
−51
−53
−47
−49
−43
−39
−50 −25 0 25 50 75 100 125
TJ − Temperature − °C
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 10. Figure 11.
Figure 12. Figure 13.
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UNDERVOLTAGE LOCKOUT
vs
TEMPERATURE (UCC28C45)
VUVLO − UVLO Voltage − V
TJ − Temperature − °C
7.0
9.0
8.8
8.4
8.0
7.4
7.2
7.8
7.6
8.2
8.6
−50 −25 0 25 50 75 100 125
UVLO
ON
UVLO
OFF
6
16
15
13
11
8
7
10
9
12
14
−50 −25 0 25 50 75 100 125
UVLO
ON
UVLO
OFF
UNDERVOLTAGE LOCKOUT
vs
TEMPERATURE (UCC28C44)
VUVLO − UVLO Voltage − V
TJ − Temperature − °C
5
0
10
15
20
25
200 k 400 k 600 k 800 k0 k 1 M
1-nF LOAD
NO LOAD
SUPPLY CURRENT
vs
OSCILLATOR FREQUENCY
IDD − Supply Current − mA
f − Frequency − Hz
6.3
7.3
7.2
7.0
6.8
6.5
6.4
6.7
6.6
7.1
−50 −25 0 25 50 75 100 125
6.9
UNDERVOLTAGE LOCKOUT
vs
TEMPERATURE (UCC28C41)
VUVLO − UVLO Voltage − V
TJ − Temperature − °C
UVLO
ON
UVLO
OFF
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 14. Figure 15.
Figure 16. Figure 17.
14
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OUTPUT RISE TIME AND FALL TIME
vs
TEMPERATURE
Output Rise and Fall TIme − ns
10
15
40
35
30
20
25
tf
tr
(1 nF)
−50 −25 0 25 50 75 100 125
TJ − Temperature − °C
(1 nF)
10% to 90%
VDD = 12 V
IDD − Supply Current − mA
−50
2.1
3.0
2.9
2.7
2.6
2.4
2.2
2.0
2.3
2.5
2.8
−25 0 25 50 75 100 125
SUPPLY CURRENT
vs
TEMPERATURE
TJ − Temperature − °C
NO LOAD
Duty Cycle − %
f − Frequency − kHz
MAXIMUM DUTY CYCLE
vs
OSCILLATOR FREQUENCY
50
100
90
60
0500
80
70
CT = 220 pF
CT = 1 nF
1000 1500 2000 2500
Maximum Duty Cycle − %
MAXIMUM DUTY CYCLE
vs
TEMPERATURE
90
100
92
94
96
98
−50 −25 0 25 50 75 100 125
UCC28C40
UCC28C42
UCC28C43
TJ − Temperature − °C
UCC28C4x-EPBiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 18. Figure 19.
Figure 20. Figure 21.
15Submit Documentation Feedback
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CURRENT-SENSE THRESHOLD VOLTAGE
vs
TEMPERATURE
VCS_th − Current Sense Threshold − V
0.90
0.95
1.00
1.05
1.10
−50 −25 0 25 50 75 100 125
TJ − Temperature − °C
MAXIMUM DUTY CYCLE
vs
TEMPERATURE
Output Rise and Fall TIme − ns
45
50
46
47
48
49
−50 −25 0 25 50 75 100 125
UCC28C41
UCC28C44
UCC28C45
TJ − Temperature − °C
tD − CS to OUT Delay Time − ns
CS T O OUT DELAY TIME
vs
TEMPERATURE
30 −50 −25 0 25 50 75 100 125
35
70
65
60
55
45
40
50
TJ − Temperature − °C
UCC28C4x-EP
BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS
SGLS352B DECEMBER 2006 REVISED MAY 2007
APPLICATION INFORMATION (continued)
Figure 22. Figure 23.
Figure 24.
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PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
UCC28C43MDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 EAAM
UCC28C45MDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 EABM
V62/07615-01XE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 EAAM
V62/07615-02XE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 EABM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
OTHER QUALIFIED VERSIONS OF UCC28C43-EP, UCC28C45-EP :
Catalog: UCC28C43, UCC28C45
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC28C43MDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC28C45MDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC28C43MDREP SOIC D 8 2500 367.0 367.0 35.0
UCC28C45MDREP SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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