Approval sheet RFBPF Series - 2012(0805)- RoHS Compliance MULTILAYER CERAMIC BAND PASS FILTER Halogens Free Product 2.4 GHz ISM Band Working Frequency P/N: RFBPF2012040AHT *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet FEATURES 1. Miniature footprint: 2.0 X 1.2 X 0.4 mm 2. Low Profile Thickness 3. High Rejection and Low Insertion Loss 4. High attenuation on 2170 MHz & 2 5. LTCC process nd 3 harmonic suppressed APPLICATIONS 1. 2.4GHz ISM band RF applications 2. Bluetooth, Wireless LAN 802.11b/g/n, HomeRF CONSTRUCTION P1 P2 P3 PIN Connection 1 Input port 2 GND 3 Output port DIMENSIONS Figure Page 2 of 7 Symbol Dimension (mm) L 2.00 0.15 W 1.25 0.10 T 0.45 0.10 A 0.95 0.10 B 0.275 0.10 C 0.25 0.10 D 0.60 0.10 E 0.175 0.10 F 0.15 0.10 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet ELECTRICAL CHARACTERISTICS RFBPF2012040AHT Specification Frequency range 2450 50 MHz Insertion Loss 2.5 dB max VSWR 2.0 max Impedance 50 25@ 746~ 764MHz 30@ 824~ 849MHz 26@ 869~ 960MHz 28@ 1570~ 1580MHz 28@ 1710~ 1785MHz Attenuation (min.) 30@ 1850~ 1910MHz 30@ 1930~ 1990MHz 30@ 2110~ 2170MHz 15@ 3300~ 3800MHz 35@ 4800~ 5000MHz 20@ 7200~ 7450.5MHz Operation Temperature Range -40C ~ +85C Typical Electrical Chart SOLDER LAND PATTERN Figure Unit : mm Line width to be designed to match 50 characteristic impedance, depending on PCB material and thickness. Page 3 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 *Solder bath temperature235 5C At least 95% of a surface of each terminal JESD22-B102D *Immersion time2 0.5 sec electrode must be covered by fresh solder. SolderSn3Ag0.5Cu for lead-free Leaching *Solder bath temperature260 5C Loss of metallization on the edges of each of metallization) *Leaching immersion time30 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature120~150, JIS C 0050-5.4 1 minute. No mechanical damage. Samples shall satisfy electrical specification *Solder temperature2705C after test. *Immersion time101 sec Loss of metallization on the edges of each electrode shall not exceed 25%. SolderSn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 242 hrs Drop Test JIS C 0044 Customer's specification. *Height75 cm No mechanical damage. *Test SurfaceRigid surface of concrete Samples shall satisfy electrical specification or steel. after test. *Times6 surfaces for each units2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 Bending test JIS C 0051- 7.4.1 *Pressurizing force 5N(0603)10N(>0603) No remarkable damage or removal of the termination. *Test time101 sec The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 51 sec. Measurement to be made after keeping at room temperature for 242 hours Page 4 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet Temperature cycle JIS C 0025 1. 303 minutes at -40C3C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical 3. 303 minutes at +85C3C, 4. 10~15 minutes at room temperature, specification after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 242 hrs Vibration JIS C 0040 *Frequency10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude1.5mm Samples shall satisfy electrical specification *Test times6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature85C2C No mechanical damage. *Test duration1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 242 hrs Humidity (steady conditions) *Humidity90% to 95% R.H. No mechanical damage. *Temperature402C Samples shall satisfy electrical specification JIS C 0022 *Time1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 242 hrs 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature-40C2C No mechanical damage. *Test duration1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 242 hrs Page 5 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF BPF 201204 0 Walsin Product Code Dimension code RF device BPF : Per 2 digits of Length, Width, Thickness : Band Pass Filter e.g. : A Unit of dimension 0 : 0.1 mm H T Application Specification Packing A : 2.4GHZ ISM Band Design code T : Reeled 1 : 1.0 mm 201204 = Length 20, Width 12, Thickness 04 Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING Paper Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Page 6 of 7 Ao Bo D T W 1.32 0.10 2.25 0.10 1.55 + 0.05 0.80 0.10 8.0 0.10 E F Po P1 P2 1.75 0.10 3.50 0.05 4.00 0.10 4.00 0.10 2.00 0.05 ASC_RFBPF2012040AHT_V04 Apr. 2011 Approval sheet Reel dimensions C Index A 178.0 Dimension (mm) B 60.0 A B C 13.0 Taping Quantity: 2000 pieces per 7" reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party's life, body or property. (1) (2) (3) (4) (5) (6) (7) (8) Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Disaster prevention / crime prevention equipment Traffic signal equipment Transportation equipment (vehicles, trains, ships, etc.) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Page 7 of 7 Temperature : -10 to +40 Humidity : 30 to 70% relative humidity Don't keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. ASC_RFBPF2012040AHT_V04 Apr. 2011