Approval sheet
Page 1 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
RFBPF Series – 2012(0805)- RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
Halogens Free Product
2.4 GHz ISM Band Working Frequency
P/N: RFBPF2012040AHT
*Contents in this sheet are subject to change without prior notice.
Approval sheet
Page 2 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
FEATURES
1.
Miniature footprint: 2.0 X 1.2 X 0.4 mm
3
2.
Low Profile Thickness
3.
High Rejection and Low Insertion Loss
4.
High attenuation on 2170 MHz & 2
nd
harmonic suppressed
5.
LTCC process
APPLICATIONS
1. 2.4GHz ISM band RF applications
2. Bluetooth, Wireless LAN 802.11b/g/n, HomeRF
CONSTRUCTION
P1 P2 P3
P1 P2 P3
DIMENSIONS
Figure Symbol Dimension (mm)
L 2.00 ± 0.15
W 1.25 ± 0.10
T 0.45 ± 0.10
A 0.95 ± 0.10
B 0.275 ± 0.10
C 0.25 ± 0.10
D 0.60 ± 0.10
E 0.175 ± 0.10
F 0.15 ± 0.10
PIN
Connection
1 Input port
2 GND
3 Output port
Approval sheet
Page 3 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
ELECTRICAL CHARACTERISTICS
RFBPF2012040AHT Specification
Frequency range 2450± 50 MHz
Insertion Loss 2.5 dB max
VSWR 2.0 max
Impedance 50 Ω
Attenuation (min.)
25@ 746~ 764MHz
30@ 824~ 849MHz
26@ 869~ 960MHz
28@ 1570~ 1580MHz
28@ 1710~ 1785MHz
30@ 1850~ 1910MHz
30@ 1930~ 1990MHz
30@ 2110~ 2170MHz
15@ 3300~ 3800MHz
35@ 4800~ 5000MHz
20@ 7200~ 7450.5MHz
Operation Temperature Range -40°C ~ +85°C
Typical Electrical Chart
SOLDER LAND PATTERN
Figure
Unit : mm
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
Approval sheet
Page 4 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
RELIABILITY TEST
Test item Test condition / Test method Specification
Solderability
JIS C 0050-4.6
JESD22-B102D
*Solder bath temperature：235 ± 5°C
*Immersion time：2 ± 0.5 sec
Solder：Sn3Ag0.5Cu for lead-free
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
Leaching
(Resistance to dissolution
of metallization)
IEC 60068-2-58
*Solder bath temperature：260 ± 5°C
*Leaching immersion time：30 ± 0.5 sec
Solder : SN63A
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Resistance to soldering heat
JIS C 0050-5.4 *Preheating temperature：120~150 ,℃
1 minute.
*Solder temperature：270±5°C
*Immersion time：10±1 sec
Solder：Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Drop Test
JIS C 0044
Customer’s specification.
*Height：75 cm
*Test Surface：Rigid surface of concrete
or steel.
*Times：6 surfaces for each units；2
times for each side.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Adhesive Strength
of Termination
JIS C 0051- 7.4.3
*Pressurizing force：
5N(≦0603)；10N(>0603)
*Test time：10±1 sec
No remarkable damage or removal of the
termination.
Bending test
JIS C 0051- 7.4.1 The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
Measurement to be made after keeping at
room temperature for 24±2 hours
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Approval sheet
Page 5 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
Temperature cycle
JIS C 0025 1. 30±3 minutes at -40°C±3°C,
2. 10~15 minutes at room temperature,
3. 30±3 minutes at +85°C±3°C,
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Vibration
JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min)
*Total amplitude：1.5mm
*Test times：6hrs.(Two hrs each in three
mutually perpendicular directions)
No mechanical damage.
Samples shall satisfy electrical specification
after test.
High temperature
JIS C 0021 *Temperature：85°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Humidity
(steady conditions)
JIS C 0022
*Humidity：90% to 95% R.H.
*Temperature：40±2°C
*Time：1000+24/-0 hrs.
Measurement to be made after keeping at
room temperature for 24±2 hrs
※ 500hrs measuring the first data then
1000hrs data
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Low temperature
JIS C 0020 *Temperature：-40°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Approval sheet
Page 6 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
BPF
201204
0
A
H
T
Walsin
RF device
Product Code
BPF :
Band Pass Filter
Dimension code
Per 2 digits of Length,
Width, Thickness :
e.g. :
201204 =
Length 20,
Width 12,
Thickness 04
Unit of
dimension
0 : 0.1 mm
1 : 1.0 mm
Application
A : 2.4GHZ ISM
Band
Specification
Design code
Packing
T : Reeled
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
Paper Tape specifications (unit :mm)
Index Ao Bo ΦD T W
Dimension (mm) 1.32 ± 0.10 2.25 ± 0.10 1.55 + 0.05 0.80 ± 0.10 8.0 ± 0.10
Index E F Po P1 P2
Dimension (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05
Approval sheet
Page 7 of 7 ASC_RFBPF2012040AHT_V04 Apr. 2011
Reel dimensions
A
B
C
Taping Quantity: 2000 pieces per 7” reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be
confirmed.
(2) Storage environment condition.
Products should be storage in the warehouse on the following conditions.
Temperature : -10 to +40℃
Humidity : 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
Index A B C
Dimension (mm)
Φ178.0 Φ60.0 Φ13.0
