PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 1
FEATURES
Single IC to cover up to 60MHz output frequency.
Direct oscillation operation
Input Frequency: Fundamental crystal:
o 10MHz to 60MHz
Output Frequency: LVCMOS
o 312.5KHz to 60MHz (2.5V & 3.3V)
o 312.5KHz to 40MHz (1.8V)
3 pad layout options
o PL610Ax series: for Flip Chip bonding
o PL610Bx series: for wire bonding Type1
o PL610Cx series: for wire bonding Type2
Integrated Automatic Level Control (ALC) to maintain
constant drive level
15pF output drive capability
Very low Jitter and Phase Noise
High impedance standby function, <5uA
Low current consumption
Single 1.8V to 3.3V ± 10% power supply
Operating temperature range from -40C to 85C
DESCRIPTION
The PL610 Series is a family of high performance
general purpose oscillators to cover outputs from
312.5KHz up to 60MHz. Designed to fit in a small
2.0x1.6mm, or larger substrates, the PL610 Series
offers the best phase noise and jitter performance,
smallest die size, and lowest power consumption of
any comparable IC. With its Standby function, the
PL610 family of products draw <5µA.
BLOCK DIAGRAM
PAD ASSIGNMENT (Pad locations are measured from the center of the die)
650um
600um
Note: ^ denotes internal pull up
6
1
5
4
2
3
XT
INHN^
VDD
XTN
VSS
Q
PL610Cx
Q
XTAL
OSC
XT
XTN
INHN
/1, /2, /4, /8, /16,
/32, /64
650um
600um
Note: ^ denotes internal pull up
6
1
5
4
2
3
XT
INHN^
VSS
XTN
VDD
Q
PL610Ax
650um
600um
Note: ^ denotes internal pull up
6
1
5
4
2
3
XTN
INHN^ VDD
XT
VSS Q
PL610Bx
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 2
PAD DESCRIPTION
Pad
Name
Description
XT
Crystal input pad
VSS
GND connection
Q
Clock output
VDD
VDD connection
INHN
Output control input. When activated
(Logic “0”) INHN will Tristate (HiZ),
disabling the oscillator and the output.
10MΩ internal pull up resistor.
XTN
Crystal output pad
DIE SPECIFICATION
Parameter
Value
Chip size
0.65x 0.60mm
Chip thickness
130um, ±15um
Pad size
90µm
Chip base
GND level
Die back coating
Optional
(see ordering information)
PL610 Series Configurations
Operating
Voltage
Output
Drive
(mA)
Cload
(pF)
FXT
FXT/16
1.8V to
3.3V
(±10% )
8
8
PL610A1
PL610A5
PL610B1
PL610B5
PL610C1
PL610C5
*Please contact Micrel sales for individual IC availability
Pad #
Pad Name
Pad Center*
PL610Ax
PL610Bx
PL610Cx
X
Y
1
XTN
XT
XTN
-177
231
2
VDD
INHN^
VSS
-215
41
3
Q
VSS
Q
-215
-186
4
VSS
Q
VDD
215
-186
5
INHN^
VDD
INHN^
215
41
6
XT
XTN
XT
177
231
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 3
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETERS
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage Range
VDD
-0.5
4.6
V
Input Voltage Range
VI
-0.5
VDD+0.5
V
Output Voltage Range
VO
-0.5
VDD+0.5
V
Storage Temperature
TS
-65
150
C
Ambient Operating Temperature*
-40
85
C
ESD Protection, Human Body Model
2
KV
Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device and affect product
reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above the operational limits noted in this
specification is not implied. *Operating temperature is guaranteed by design. Parts are tested to commercial grade only.
AC SPECIFICATIONS
PARAMETERS
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Crystal Input Frequency (XT)
Fundamental Crystal (2.5V & 3.3V)
10
60
MHz
Fundamental Crystal (1.8V)
40
Output Frequency
3.3V & 2.5V operation
0.3125
60
MHz
1.8V operation
40
Settling Time
At power-up (VDD > 90%VDD)
2
ms
Output Disable Delay Time
Temp=25℃, 15pF Load
50
μs
Output Rise/Fall Time
(See MTC-1)
3.3V, 15pF Load, 10/90%VDD
1.7
2.2
ns
Output Rise/Fall Time
(See MTC-1)
2.5V, 15pF Load, 10/90%VDD
2
2.5
ns
Output Rise/Fall Time
(See MTC-1)
1.8V, 15pF Load, 10/90%VDD
3
3.5
ns
Duty Cycle* (See MTC-1)
45
50
55
%
* For 1.8V operation, the 50% ±5% duty cycle is guaranteed for frequencies ≤40MHz.
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 4
DC SPECIFICATIONS
PARAMETERS
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Supply Current, Dynamic
@VDD=3.3V, 27MHz, No Load
1.2
mA
@VDD=3.3V, 40MHz, No Load
1.7
@VDD=1.8V, 27MHz, No Load
0.6
@VDD=1.8V, 40MHz, No Load
0.9
Standby Supply Current
INHN=”0”, 3.3V
1
uA
Operating Voltage
1.62
3.63
V
Power Supply Ramp
Time for VDD to reach 90% VDD.
Power ramp must be monotonic.
.001
100
ms
Output Low Voltage
IOL = +4mA
0.4
V
Output High Voltage
IOH = -4mA
VDD – 0.4
V
Output Current(See MCT-2)
VOL = 0.4V, VO H = 2.4V
8
mA
CRYSTAL SPECIFICATIONS
PARAMETERS
SYMBOL
MIN.
TYP.
MAX.
UNITS
Fundamental Crystal Resonator Frequency (2.5V & 3.3V)
FXT
10
60
MHz
Fundamental Crystal Resonator Frequency (1.8V)
40
Crystal Loading Rating
CL (x ta l)
8
pF
Maximum Sustainable Drive Level
100
W
Operating Drive Level @ Frequency <40MHz
25
W
Crystal Shunt Capacitance
C0
3
pF
Effective Series Resistance, Fundamental, (See MTC-3)
ESR
50
Ω
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 5
MEASUREMENT TEST CIRCUITS (MTC)
MTC-1: Rise Time, Fall Time, Duty Cycle, VOL, VOH, Idd,
Power Down Current, Output Enable/Disable
MTC-3: Negative Resistance
MTC-2: Output Drive Current and Output Impedance
XIN
OE^
XOUT
CLK
GND
VDD
0.1µF
Network
Analyzer
XOUT
XIN
OE^
Probe
FET
CLK
VDD
GND
0.1µF
0.1µF
V
XIN
VDD
XOUT
GND
CLK
OE^
FET
Probe
CL
A
0.1µF
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 6
WAVEFORM SWITCHING CHARACTERISTICS
Rise and Fall time:
Duty Cycle:
VOH, VOL:
tr
tf
90%VDD
Tw
T
Duty Cycle = 100% ×
Tw
T
GND
VOH
VOL
50% VDD
VDD
10% VDD
PL610 Series
1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944-0800 • fax +1(408) 474-1000 • www.micrel.com Rev 3/1/11 Page 7
ORDERING INFORMATION
For part ordering, please contact our Sales Department:
2180 Fortune Drive, San Jose, CA 95131, USA
Tel: (408) 944-0800 Fax: (408) 474-1000
PART NUMBER
The order number for this device is a combination of the following:
Part number, Package type and Operating temperature range
Micrel Inc., reserves the right to make changes in its products or specifications, or both at any time without notice. The information furnished by Micrel is believed to be accurate
and reliable. However, Micrel makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of whatever
nature resulting from the use of, or reliance upon this product.
LIFE SUPPORT POLICY: Micrel’s products are not authorized for use as critical compo nents in life support device s or systems without the express
written approval of the President of Micrel Inc.
PL610XX-XX
D5: Die form with 5mil thickness
W5: Sawed wafer with 5mil thickness
W8: Un-sawed wafer with 8mil thickness
Q8: ¼ wafer with 8mil thickness
Divider Selection
Pad Layout
A: flip chip
B: wire bonding type 1
C: wire bonding type 2