SP980-0.009-00-1212 - Bergquist Company

www.bergquistcompany.com

All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED

WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE.Sellers’ and manufacturer s’ only obligation shall be to

replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product

for its intended use, and the user assumes all r isks and liability whatsoever in connection therewith. NEITHER SELLER NOR

MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,

INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR

THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not

contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.

PDS_SP_900S_12.08

The Bergquist Company -

North American Headquarters

18930 West 78th Street

Chanhassen, MN 55317

Phone: 800-347-4572

Fax: 952-835-0430

The Bergquist Company -

European Headquarters

Bramenber g 9a, 3755 BT Eemnes

Netherlands

Phone: 31-35-5380684

Fax: 31-35-5380295

The Bergquist Company - Asia

Room 15,8/F W ah Wai Industrial Centre

No.38-40,Au Pui Wan Street

Fotan, Shatin, N.T. Hong Kong

Ph: 852.2690.9296

Fax: 852.2690.2344

Sil-Pad

900S

High Performance Insulator for Low-Pressure Applications

Features and Benefits

• Thermal impedance:

0.61°C-in2/W (@50 psi)

• Electrically isolating

• Low mounting pressures

• Smooth and highly compliant surface

• Gener al-purpose ther mal interface

material solution

The tr ue workhorse of the Sil-Pad product

family, Sil-Pad 900S thermally conductive

insulation mater ial, is designed for a wide

var iety of applications requir ing high ther mal

performance and electr ical isolation.These

applications also typically have low mounting

pressures for component clamping.

Sil-Pad 900S material combines a smooth

and highly compliant surface character istic

with high thermal conductivity.These features

optimize the thermal resistance properties at

low pressures.

Applications requiring low component clamp-

ing forces include discrete semiconductor s

(TO-220,TO-247 and TO-218) mounted with

spring clips. Spring clips assist with quick

assembly and apply a limited amount of force

to the semiconductor.The smooth surface

texture of Sil-Pad 900S minimizes interfacial

thermal resistance and maximizes ther mal

performance.

Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

Building a Part Number Standard Options

Sil-Pad®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others

Section A

Section B

Section C

Section D

Section E

NA = Selected standard option. If not selecting a standard

option, insert company name, drawing number, and

revision level.

SP900S = Sil-Pad 900S Material

SP900S 0.009 AC 00 ACME 951753 Rev B

Note: To build a part number, visit our website at www.bergquistcompany.com.

Standard thicknesses available: 0.009"

AC = Adhesive, one side

00 = No adhesive

_ _ _ = Standard configuration dash number,

1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or

00 = custom configuration

––––

TYPICAL PROPERTIES OF SIL-PAD 900S

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD

Color Pink Pink Visual

Reinforcement Carr ier Fiberglass Fiberglass —

Thickness (inch) / (mm) 0.009 0.229 ASTM D374

Hardness (Shore A) 92 92 ASTM D2240

Elongation (%45° to Warp andFill) 20 20 ASTM D412

Tensile Strength (psi) / (MPa) 1300 9 ASTM D412

Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 —

ELECTRICAL

Dielectric Breakdown Voltage (Vac) 5500 5500 ASTM D149

Type 3 Electrodes 8300 8300 ASTM D149

Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150

Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257

Flame Rating V-O V-O U.L. 94

THERMAL

Thermal Conductivity (W/m-K) 1.6 1.6 ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi) 10 25 50 100 200

TO-220 Ther mal Performance (°C/W) 3.96 3.41 2.90 2.53 2.32

Thermal Impedance (°C-in2/W) (1) 0.95 0.75 0.61 0.47 0.41

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance .These values are provided for

reference only.Actual application perfor mance is directly related to the surface roughness, flatness and pressure applied.