DATASHEET ISL6731A, ISL6731B FN8582 Rev 1.00 February 13, 2015 Power Factor Correction Controllers The ISL6731A and ISL6731B are active power factor correction (PFC) controller ICs that use a boost topology. The controllers are suitable for AC/DC power systems up to 2kW and over the universal line input. The ISL6731A and ISL6731B operate in Continuous Current Mode (CCM). Accurate input current shaping is achieved with a current error amplifier. A patent pending breakthrough negative capacitance technology minimizes zero crossing distortion and reduces the magnetic components size. The small external components result in lower design cost without sacrificing performance. The internally clamped 12.5V gate driver delivers 1.5A peak current to the external power MOSFET. The ISL6731A and ISL6731B provide a highly reliable system that is fully protected. Protection features include cycle-by-cycle overcurrent, over power limit, over-temperature, input brownout, output overvoltage and undervoltage protection. The ISL6731A and ISL6731B provide excellent power efficiency and transitions into a power saving skip mode during light load conditions, thus improving efficiency automatically. The ISL6731A and ISL6731B can be shut down by pulling the FB pin below 0.5V or grounding the BO pin. Two switching frequency options are provided. The ISL6731B switches at 62kHz, and the ISL6731A switches at 124kHz. * Reduced component size requirements - Enables smaller, thinner AC/DC adapters - Choke and cap size can be reduced - Lower cost of materials * Excellent power factor and THD over line and load - CCM mode with negative capacitance generator for smaller EMI filter and improved performance - Built-in current amplifier with flexibility of gain change * Better light-load efficiency - Automatic pulse skipping with programmable threshold - Programmable or automatic shutdown * Highly reliable design - Cycle-by-cycle current limit - Input average power limit - OVP and OTP protection - Input brownout protection * Small 14 Ld SOIC package Applications * Desktop computer AC/DC adaptor * Laptop computer AC/DC adaptor Related Literature * AN1884, "ISL6731AEVAL1Z and ISL6731BEVAL1Z: Boost CCM PFC for 300W Universal Input Adaptors" * AN1885, "ISL6731AEVAL2Z and ISL6731BEVAL2Z: High Performance Boost CCM PFC Front End for Server Power Applications" * TV AC/DC power supply * AC/DC brick converters 100 VI VLINE Features + VOUT 95 VCC ISEN GATE ICOMP VIN OVP ISL6731A FB COMP GND BO SKIP VREG EFFICIENCY (%) 90 85 80 FN8582 Rev 1.00 February 13, 2015 ISL6731A, NON-SKIP 75 70 65 60 FIGURE 1. TYPICAL APPLICATION ISL6731A, SKIP 0 20 40 60 OUTPUT POWER (%) 80 FIGURE 2. PFC EFFICIENCY Page 1 of 20 100 ISL6731A, ISL6731B Pin Configuration ISL6731A, ISL6731B (14 LD SOIC) TOP VIEW NC 1 14 GATE GND 2 13 NC ISEN 3 12 VCC ICOMP 4 11 VREG VIN 5 10 SKIP BO 6 9 FB OVP 7 8 COMP Pin Descriptions PIN # I/O SYMBOL 1, 13 - NC 2 - GND Ground pin. All voltage levels refer to this pin. 3 I ISEN Current sense pin. The current through this pin is proportional to the inductor current. 4 I/O ICOMP 5 I VIN Input voltage sense. This pin provides the reference voltage to shape inductor current. Connect this pin to a resistor divider from the rectified input voltage. The resistor divider ratio is used to adjust the phase lag between input voltage and the input current. The phase lag is required to compensate the phase lead generated by the EMI filter. 6 I/O BO This pin should be decoupled to GND with a minimum 0.1F ceramic capacitor. The BO pin is a voltage follower, which will follow the DC voltage of the VIN pin. The BO pin is internally tied to GND through a resistor RIS. The decoupling capacitor provides ripple filtering. When the voltage at the BO pin (VBO) drops below brownout voltage threshold, the controller enters shutdown mode and the gate drive is disabled. The BO pin will be disabled when the FB pin drops below the enabling threshold. 7 I OVP Overvoltage protection pin. Connect this pin to a resistor divider from the output. The resistor divider sets the OVP set point. When the OVP pin voltage exceeds 104.5% of the reference voltage VREF, OVP is triggered and the gate drive is disabled. 8 I/O COMP Output of the error amplifier. The voltage of the COMP pin sets the input power. During start-up, a small charge current will slowly ramp up the voltage of the COMP pin. 9 I FB Voltage feedback pin. Connect this pin to a resistor divider from the output. The resistor divider sets the output voltage. When the FB pin voltage exceeds 104% of VREF, OVP is triggered and gate drive is disabled. When the FB pin drops below 10% of VREF, the device is put into shutdown mode. There is an internal pull-down current source for open loop protection. 10 I/O SKIP This pin has dual functions. Connecting this pin to ground disables the light load skip function. An internal 20A current sources out of this pin. Connect a resistor from this pin to the ground to set the average power trip point. The converter exits the skip mode when either the VFB drops below 88% of VREF, or the ISEN current goes above 29A. 11 - VREG Output of internal regulator. The voltage having a 2% tolerance over line, load and operating temperature. Bypass to GND with a 47nF low ESR capacitor. VREG can source up to 10mA. This pin is not recommended for usage other than bypass. 12 I VCC Power supply pin. The VCC pin should be decoupled to GND with a minimum 0.1F ceramic capacitor. 14 O GATE Push-pull gate drive for the external MOSFET. Output voltage is clamped at 12.5V. This pin provides typically 2A sink and 1.5A source capability. FN8582 Rev 1.00 February 13, 2015 DESCRIPTION Not Connected. Must be floating. Current error amplifier output pin. Page 2 of 20 ISL6731A, ISL6731B Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (C) PACKAGE (Pb-Free) PKG. DWG. # ISL6731AFBZ ISL 6731AFBZ -40 to +125 14 Ld SOIC M14.15 ISL6731BFBZ ISL 6731BFBZ -40 to +125 14 Ld SOIC M14.15 NOTES: 1. Add "-T*" suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6731A, ISL6731B. For more information on MSL please see techbrief TB363. TABLE 1. KEY DIFFERENCES IN FAMILY OF ISL6731 VERSION ISL6731A ISL6731B Switching Frequency 124kHz 62kHz FN8582 Rev 1.00 February 13, 2015 Page 3 of 20 VI EMI CHOKE D LF VLINE VOUT L CF2 CF3 ISL6731A, ISL6731B FN8582 Rev 1.00 February 13, 2015 Block Diagram CF1 COUT Q1 Lm DF1 RCS DF2 CREG VCC CURRENT MIRROR 2:1 RSEN ISEN VREG LINEAR REGULATOR UVLO VCC GATE I OC I CS > -------------2 I CS CONTROL LOGIC GND OTP PWM COMP SKIP Vro2 ROV1 OVP CEQ GEN. R IS I ISEN V CS = ---------------------------------2 ICOMP IREF Gmi RIS OSCILLATOR SOFT-START ENABLE 0.25 VIN ----------------------------COMPB 2 BO RIN2 ROV2 Vro1 Vref VIN COMPB SKIP CLAMP COMP-1V RFB2 OVERPOWER LIMIT FB Gmv 20A RIN1 Page 4 of 20 SKIP BO CBO IFB COMP RFB1 Typical 300W Application Schematic D1 IN5406 TP9 P2 1 2 Q1 R28 0.22 R27 0.22 R5 0.22 2.2n 2.2n C5 C6 C21 0.1 R4 51k C19 C1 0.1 270u 450V 390V 3 R2 2.2 RV1 MOV /DNP 2 1 P3 GND C8 220n D8 D7 S1M S1M 47n C20 R23 3.3M 3 2 1 13 C9 TP7 DNP 1u DNP VCC VREG GATE C11 TP8 R8 R24 1n C7 470k U1 3.3M 6.8n 1u VREG Lin.Reg. VCC C10 GATE 14 UVLO LOGIC 4 ICOMP R9 TP6 R11 3k GND 2 ICOMP CEQ OTP 470k 3 ISENI MIRROR Gen 2:1 TP5 ISEN OVP 7 PWM Vin*C I*= 4*BO*BO I* gm VIN C23 2.5V 5 VIN 1n C SKIP OPL TP3 9 FB gm + SKIP COMP BO R13 C13 VCC ISL6731A/B 5.76k 47p R21 TP4 69.8K TP2 25k R22 DNP 2N7002 BO COMP Q2 1 DNP DNP P8 C15 R18 150n C14 62k DNP C17 470n R20 1n 10k DNP C18 P9 1u DNP R14 30k 6 C12 DNP DZ1 3.3V TP10 3.3M R6 C26 2.2n R10 3.3M DNP TP11 VCC OVP 42.2k R25 R26 49.9 TP1 GND FB R17 0 8 3 + 470n 11 2.2n C36 R3 2M DB1 GBU806 C3 680n 12 PE P5 2 2.2n C35 L3 2.2m 4 L4 2.2m 1 AC2 470n DC+ SPP20N60C3 TP12 GATE1 C22 VOUT 1 C3D04060A 10 P4 R1 2M C2 4 UNIVERSAL INPUT 90~265Vac 3 F1 8A 2 AC1 1 P1 L2 1.5m L1 0u D2 2 C16 100n R19 42.2k P6 P7 ISL6731A, ISL6731B FN8582 Rev 1.00 February 13, 2015 Application Schematics Page 5 of 20 (Continued) Typical 85W Application Schematic S3KB-TP D1 S3KB-TP S3KB-TP D5 D6 R9 2.1k R14 5.36k C10 6.8n 4 C20 47n C9 1u Vin*C I*= 4*BO*BO CEQ OTP Gen PWM C SKIP OPL + - C13 220p R10 3.3M GATE 14 VCC GND 2 OVP 7 GND 2.5V VIN SKIP BO 6 R13 5.76k I* gm 10 5 R6 3.3M U1 VREG Lin.Reg. VCC UVLO LOGIC ICOMP 3 ISENI MIRROR 2:1 TP10 DZ1 3.3V VCC 12 R8 470k R11 470k C11 470p C8 220n 11 D8 D7 S1M S1M P3 R4 51k R28 0.22 S3KB-TP S3KB-TP C7 1u 1 R2 2.2 390V 2 R3 2M C1 56u 450V 1 3 4 CMT1 L4 TP9 P2 2 Q1 C3 330n 1 AC2 VOUT DC+ IPP60R600C6 C2 100n P4 R1 2M 1 13 UNIVERSAL INPUT 90~265Vac 1 D2 C14 470n 8 F1 3.15A 3 AC1 2 P1 2.2m L2 D4 D3 C3D04060E 3 FB 9 gm COMP ISL6731A 69.8K R22 R18 68k C18 2.2u C16 1n C15 100n R19 42.2k P6 P7 ISL6731A, ISL6731B FN8582 Rev 1.00 February 13, 2015 Application Schematics Page 6 of 20 ISL6731A, ISL6731B Absolute Maximum Ratings Thermal Information VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +28V GATE to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +18V VIN, BO, ISEN, FB, OVP, ICOMP, SKIP, VREG and COMP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.3V ESD Rating Human Body Model (Tested per JESD22-A114) . . . . . . . . . . . . . . .2.5kV Machine Model (Tested per JESD22-A115). . . . . . . . . . . . . . . . . . . . 200V Charged Device Model (Tested per JESD-C101E) . . . . . . . . . . . . . . . . 1kV Latch-Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA Thermal Resistance (Typical) JA (C/W) JC (C/W) SOIC Package (Notes 4, 5) . . . . . . . . . . . . . 77 38 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . .+150C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65C to +150C Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Recommended Operating Conditions VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V to + 20V Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For JC, the "case temp" location is taken at the package top center. Electrical Specifications -40C to +125C. PARAMETER Operating Conditions: VCC = 15V, TA = +25C. Boldface limits apply across the operating temperature range, SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS VCC SUPPLY CURRENT Start-Up Current ISTART VFB = 1V, VCC < VCC(ON) 73 106 139 A Standby Current ISTDN VFB = GND, VCC > VCC (ON) 179 237 295 A VFB = 2.5V, COMP = SKIP*0.25 +1V 580 690 850 A GATE is floating 3.0 3.7 4.5 mA Skip Mode Current Operating Current (Note 6) ICCSKIP ICC VCC UVLO UVLO Rising Threshold VCC(ON) 9 10 11 V UVLO Falling Threshold VCC(OFF) 6.7 7.5 8.3 V UVLO Threshold Hysteresis VCC(HYS) 2.5 V REGULATOR VOLTAGE VREG Overall Accuracy VREG IREG = 0 to -10mA, VCC = 15V, load capacitor = 47nF 5.1 5.4 5.6 V 30 50 70 mA fSW = 124kHz for ISL6731A and fSW = 62kHz for ISL6731B 94.8 96.5 Free Running Frequency, ISL6731A TA = -40C to +125C, VIN = 0.6V 95.5 107 117 kHz Free Running Frequency, ISL6731A TA = -40C to +125C, VIN = 2.5V 111 125 138 kHz Free Running Frequency, ISL6731B TA = -40C to +125C, VIN = 0.6V 43.5 54 63.7 kHz Free Running Frequency, ISL6731B TA = -40C to +125C, VIN = 2.5V 56.5 64 70.7 kHz 1.33 1.46 1.59 V Current Limit PWM CONVERTERS Maximum Duty Cycle % OSCILLATOR PWM Ramp Amplitude FN8582 Rev 1.00 February 13, 2015 Vm Page 7 of 20 ISL6731A, ISL6731B Electrical Specifications -40C to +125C. (Continued) PARAMETER Operating Conditions: VCC = 15V, TA = +25C. Boldface limits apply across the operating temperature range, SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS 2.33 4.46 0.3 0.45 V GATE DRIVER Gate Drive Pull-Down Resistance VCC = 15V, IGATE = 15mA Gate Drive Pull-Up Voltage Drop VCC = 9V, IGATE = 15mA 0.15 Gate Drive Max. Sourcing/Sinking Current 1.5 A Rise Time CO = 2.2nF, VCC = 15V, gate voltage rise time from 10% to 90% of VGC 34 62 ns Fall Time CO = 2.2nF, VCC = 15V, gate voltage fall time from 10% to 90% of VGC 34 57 ns Gate Clamp Voltage VGC 10.5 12 13.5 V VREF 2.48 2.5 2.52 V VOLTAGE REFERENCE Reference Voltage Feedback Pin Pull-Down Current IFB 65 nA Rising Threshold to Enable Converter FB_EN 280 300 320 mV Falling Threshold to Disable Converter FB_DIS 190 202 214 mV Enable Hysteresis FB_Hys 100 mV VOLTAGE ERROR AMPLIFIER Error Amp Transconductance Gmv 50 ISource/Sink 77 104 A/V 13 A COMP Offset Voltage VCOMP_OFF 0.95 1.01 1.07 V COMP Soft-Start Enable Voltage VCOMP_EN 0.58 0.64 0.75 V INPUT VOLTAGE SENSING VIN Leakage Current 9 nA MULTIPLIER GAIN GMUL COMP = 2.5V, VIN = 1.0V, BO = 1.0V, ISEN = 50A 0.196 0.25 0.296 V/V CURRENT ERROR AMPLIFIER Current DC Gain AIDC IICOMP/IISEN 1.6 1.9 2.2 A/A Error Amp Transconductance Gmi IICOMP = 20A 205 268 331 A/V ICOMP Source/Sink Current (Note 7) 60 Current Sensing Input Offset A -3 2 7 mV -23 -20 -17 A LIGHT LOAD EFFICIENCY ENHANCEMENT AND OVERPOWER PROTECTION Skip Current Reference (Note 7) ISKIP VSKIP = 2V Skip Falling Threshold VSKIP_THf 450 498 550 mV Skip Rasing Threshold VSKIP_THr 570 616 690 mV COMP Upper Limit VCUL 3.53 3.85 4.17 V COMP Valid Range VCUL-1V 2.5 2.83 3.16 V FB Exit Threshold Voltage VFB_EXIT Fraction of VREF, IISEN = 0A 87 88 89 % ISEN Exit Threshold Current ISEN_EXIT VFB = 2.5V -38 -29 -20 A FN8582 Rev 1.00 February 13, 2015 Page 8 of 20 ISL6731A, ISL6731B Electrical Specifications -40C to +125C. (Continued) PARAMETER Operating Conditions: VCC = 15V, TA = +25C. Boldface limits apply across the operating temperature range, SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS BROWNOUT DETECTION Brownout Rising Threshold VBO_R 478 494 510 mV Brownout Falling Threshold VBO_F 387 401 415 mV OVERVOLTAGE PROTECTION Overvoltage Protection, FB pin VRO1 Fraction of VREF; ~1s noise filter 103 104.1 106 % Overvoltage Protection, OVP pin VRO2 Fraction of VREF; ~1s noise filter 103 104.2 106 % -197 -177 -159 A OVERCURRENT PROTECTION Overcurrent Threshold IOC THERMAL SHUTDOWN Shutdown Temperature (Note 7) 160 C Thermal Shutdown Hysteresis (Note 7) 25 C NOTES: 6. This is the VCC current consumed when the device is active but not switching. Does not include gate drive current. 7. Limits should be considered typical and are not production tested. 8. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. 100.50 101.0 100.25 100.5 FSW NORMALIZED (%) VFB NORMALIZED (%) Typical Performance Curves 100.00 99.75 VIN = 2.5V 100.0 99.5 VIN = 0.6V 99.50 -40 -20 0 20 40 60 80 TEMPERATURE (C) FIGURE 3. FEEDBACK ACCURACY FN8582 Rev 1.00 February 13, 2015 100 120 140 99.0 -40 -20 0 20 40 60 80 TEMPERATURE (C) 100 120 FIGURE 4. FSW vs TEMPERATURE, VCC = 15V Page 9 of 20 140 ISL6731A, ISL6731B Typical Performance Curves (Continued) 105 101 FSW NORMALIZED (%) AIDC NORMALIZED (%) 100 100 99 98 95 90 85 80 97 -40 -20 0 20 40 60 80 100 120 75 140 0 0.5 1.0 1.5 2.0 2.5 3.0 VIN (V) TEMPERATURE (C) FIGURE 5. AIDC vs TEMPERATURE FIGURE 6. FSW vs VIN, TA = +25C VCC CURRENT NORMALIZED (%) UVLO THRESHOLD NORMALIZED (%) 102 101 HYSTERESIS 100 UP THRESHOLD 99 DOWN THRESHOLD 98 -40 -20 0 20 40 60 80 100 120 102 101 100 ICC (GATE FLOATING) 99 98 -40 140 ISTART -20 0 20 TEMPERATURE (C) 40 60 80 100 120 TEMPERATURE (C) FIGURE 7. UVLO THRESHOLDS vs TEMPERATURE FIGURE 8. VCC SUPPLY CURRENT vs TEMPERATURE GATE DRIVE TIMING NORMALIZED (%) 112 110 108 FALL TIME 106 104 102 RISE TIME 100 98 96 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (C) FIGURE 9. GATE DRIVE TIMING vs TEMPERATURE (LOAD = 2.2nF) FN8582 Rev 1.00 February 13, 2015 Page 10 of 20 140 ISL6731A, ISL6731B Functional Description VCC Undervoltage Lockout (UVLO) The ISL6731A and ISL6731B start automatically once the voltage at VCC exceeds the UVLO threshold. Shutdown When the VFB pin is below 0.2V, the controller is disabled and the PWM output driver is tri-stated. When disabled, the IC power will be reduced. During shutdown, the COMP pin is discharged to GND and the controller is disabled. The Over-Temperature Protection (OTP) is still alive to prevent the controller from starting up in a high temperature ambient condition. In the event that the FB pin is disconnected from the feedback resistors, the FB pin is pulled to ground by an internal current source IFB. When the FB pin voltage drops below 0.2V, the gate driver is disabled. The ISL6731A or ISL6731B enters shutdown mode. Soft-Start The COMP pin is released once the soft-start operation begins. A 13A current sources out to the RC network connected from the COMP pin until the FB pin voltage reaches 90% of the reference voltage. Switching is inhibited when the COMP pin voltage is below 1V. When the COMP pin reaches 1V, the current error amplifier and the gate driver are activated and the converter starts switching. During UVLO, brownout and shutdown, the COMP is pulled to the ground. Input Voltage Sensing The VIN pin is needed to sense the rectified input voltage. The sensed semi-sinusoidal waveform is needed to shape the inductor current, which helps achieves unity power factor. At the same time, the voltage on the VIN pin is used to generate the negative capacitive element at the input. This will cancel the input filter capacitor, CF. Canceling the effect of CF will increase the displacement power factor and alleviate the zero crossing distortion, which is related to the distortion power factor. The BO pin also utilizes the VIN resistor divider for voltage sensing. Set the resistor divider ratio to satisfy the brownout requirement. First, calculate the resistor divider ratio, KBO. V BORMAX K BO = ------------------------------------------V RMSmin - 2V F (EQ. 1) Where VF is the forward voltage drop of the bridge rectifier and the voltage drop of DF1; DF2. Then, select the RIN2 based on the highest reasonable resistance value. Then select the RIN1 based upon the desirable minimum RMS value of the line voltage for the PFC operation. K BO R IN1 = --------------------- R IN2 1 - K BO (EQ. 2) Inductor Current Sensing The current sensing of the converter has two purposes. One is to force the inductor current to track the input semi-sinusoidal waveform. The other purpose is for overcurrent protection. Refer to Figure 11 for the current sensing scheme. The sensed current ICS is in proportion to the inductor current, IL as described in Equation 3: 1 R CS I CS = --- ---------------- I L 2 R SEN (EQ. 3) where: RCS is the current sensing resistor with low value in the return path to the bridge rectifier. RSEN is the current scaling resistor connected between ISEN to the RCS. VI VOUT L Q1 RCS CURRENT MIRROR EMI CHOKE RSEN VLINE CF3 2:1 I CS CF2 Lm ISEN I CS > 0.5 I OC DF1 DF2 FIGURE 11. INDUCTOR CURRENT SENSING SCHEME RIN2 VIN BO RIN1 COUT CF1 CBO FIGURE 10. INPUT VOLTAGE SENSING SCHEMATIC FN8582 Rev 1.00 February 13, 2015 A high value RCS renders more accurate current sensing. It is recommended to use the RCS to render 120mV peak voltage at the maximum line voltage during full load condition. 120mV V RMSMAX R CS ------------------------------------------------------------2 P Omax (EQ. 4) Where is the efficiency of the converter at the maximum line input with full load. Page 11 of 20 ISL6731A, ISL6731B Since the RCS sees the average input current, high value RCS generates high power dissipation on the RCS. Use a reasonable RCS according to the resistor power rating. The worst-case power dissipation occurs at the input low line when input current is at its maximum. Power dissipation by the resistor is: (EQ. 5) P RCS = I RMSMAX 2 R CS IRMSMAX is the maximum input RMS current at the minimum input line voltage, VRMSmin. Select the RSEN according to the peak current limit requirement. The resistor is sized for an overload current 25% more than the peak inductor peak current. Negative Input Capacitor Generation The patent pending negative capacitor generation capability of ISL6731A and ISL6731B allow the capacitor CF2 to be moved from before the bridge rectifier (Figure 12) to after the bridge rectifier (Figure 13). Thus, a smaller, lower cost CF2 can be used. The change in topology reduces the size of the EMI filter. Furthermore, CF1 can be increased thus decreasing the size of LF (Figure 13). LF CF3 BRIDGE RECFIFIER CF1 CF2 The ISL6731A and ISL6731B can further reduce EMI filter size by lowering the differential noise power density. The reduction is achieved by switching frequency modulation. The frequency varies with the VIN pin. The switching frequency reaches the peak value when the VIN pin voltage is 2V as shown in Figure 6. The peak value of ISL6731A is 124kHz, and the ISL6731B is 62kHz. Output Voltage Regulation (Patent Pending) VLINE Adjusting the negative CEQ can be achieved by adjusting the current compensation network. Frequency Modulation where: EMI CHOKE The equivalent negative capacitor is a function of the input voltage divider ratio, KBO, the current sensing gain and current compensation error integration gain. The output voltage is sensed through a resistor divider. The middle point of the resistor divider is fed to the FB pin. The resistor divider ratio sets the output voltage. The transconductance error amplifier generates a current in proportion to the difference between the FB pin and the 2.5V internal reference. The PFC is stabilized by the compensation network that is connected from the COMP pin to the ground. The voltage of the COMP sets the input average power by determining the amplitude of the current reference. To keep the harmonic distortion to a minimum, it is desirable to set the control bandwidth much lower than twice of the line frequency. The recommended voltage loop bandwidth is 10Hz. During start-up, the compensation capacitors and the charging current from the error amplifier sets the input power increase rate. Thus, soft-start is achieved. Lm FIGURE 12. TYPICAL PFC INPUT FILTER CIRCUIT The COMP is discharged during shutdown and fault conditions. BRIDGE RECFIFIER EMI CHOKE VLINE CF3 Light Load Efficiency Enhancement LF CF2 CF1 Lm FIGURE 13. LOW COST PFC INPUT FILTER CIRCUIT For applications where the output power is above 500W, the negative capacitance helps to improve the power factor dramatically. Refer to Table 2 for the recommended filtering capacitor to be placed after the bridge rectifier, CF1. TABLE 2. RECOMMENDED FILTERING CAPACITOR CF1 PO < 100W Typical C(F)/100W 0.68 100W < PO < 500W PO > 500W 0.33 0.22 For PC, adaptor and TV applications, it is desirable to achieve high efficiency at light load conditions and low standby current. The ISL6731A and ISL6731B can enter light load skip mode automatically. The skip mode trigger threshold is adjustable by the SKIP pin. A 20A current source out of the SKIP pin sets the voltage on the pin via a resistor connected between the pin and ground. Connecting this pin to ground disables the light load skip function. The voltage error amplifier output, COMP, is an indicator of the average input power level. The controller compares the V(COMP) and V(SKIP). If V(COMP)-1V is less than V(SKIP)*0.25, the PFC controller stops gate switching and the COMP pin voltage is clamped to V(SKIP)+0.6V. The controller exits skip mode when VFB drops to 88% (typical) of the reference voltage or when the sensed returned current exceeds 29A. Additional CF1 may be used to accommodate the use of small boost inductor or to eliminate the differential mode filter inductor as long as the equipment meets the power factor or goal. FN8582 Rev 1.00 February 13, 2015 Page 12 of 20 ISL6731A, ISL6731B Protection Circuits Input Brownout, BO Protection Brownout occurs when there is a drop in the line voltage. The BO pin is a dual function pin. The BO pin detects the brownout condition and shuts down the gate driver and controller. During normal operation, the BO pin is used to compensate the effect of the input line voltage change on the voltage loop. To keep the harmonic distortion low, the corner frequency formed by the RBO and CBO should be lower than 6Hz. Figure 14 shows the critical power components; Q1, D and COUT. To minimize the voltage overshoot, the interconnecting wires indicated by heavy lines should be part of the ground or the power plane in a printed circuit board. The components shown in Figure 14 should be located as close together as possible. Please note that the capacitors CVCC and CO each represent numerous physical capacitors. Locate the ISL6731A or ISL6731B within 2 inches of the MOSFET, Q1. The circuit traces for the MOSFETs' gate and source connections from the ISL6731A and ISL6731B must be sized to handle up to 1.5A peak current. D The BO pin is the output of the average voltage of the rectified voltage. The PFC controller is turned off when the BO pin drops below 0.4V. This protects the PFC power stage to enable operation at or below brownout condition for long periods of time. The controller resumes operation when the BO pin returns to 0.5V. L The BO pin is usually connected to GND through a capacitor, CBO. To avoid distortion on the VIN pin, select CBO so that: C BO 0.22F GATE (EQ. 6) VCC Overcurrent Protection The peak current limit function prevents the inductor from saturation. The gate driver turns off when the current goes above the current limit set point. Overpower Protection The overpower protection is implemented by limiting the COMP pin voltage higher than 3.85V (typical). Overvoltage Protection If the voltage on the FB pin exceeds the reference voltage VREF by about 4%, the gate driver is turned off. If the voltage on the OVP pin exceeds the VREF by about 4.5%, the gate driver is turned off. The controller resumes normal operation after both OVP and FB pin drops below VREF. Over-Temperature Protection The ISL6731A and ISL6731B are protected against over-temperature conditions. When the junction temperature exceeds +160C, the PWM shuts down. Normal operation is resumed when the junction temperature decreases below +135C. Application Guidelines Layout Considerations As in any high frequency switching converter, layout is very important. Switching current from one power device to another can generate voltage transients across the impedances of the interconnecting bond wires and circuit traces. These interconnecting impedances should be minimized by using wide, short printed circuit traces. The critical components should be located as close together as possible using ground plane construction or single point grounding. FN8582 Rev 1.00 February 13, 2015 COUT Q1 CVCC FIGURE 14. CRITICAL CURRENT POWER COMPONENTS Component Selection Guidelines A 300W, universal input, PFC converter design is provided for demonstration. The design method is for a continuous current mode power factor correction boost converter with the ISL6731B. The switching frequency is 62kHz. Tables 3 shows the design parameters. TABLE 3. CONVERTER DESIGN PARAMETERS PARAMETER CONDITIONS MIN TYP MAX UNIT VLINE 90 115/230 265 VAC FLINE 47 63 Hz 300 W POMAX Maximum Output Power THOLD Hold Up Time Efficiency VLINE = 115VAC 20 ms 92 % BOOST INDUCTOR SELECTION First, calculate the maximum input RMS current, IINMAX. P OMAX I INMAX = ---------------------------------- V RMSmin (EQ. 7) Where is the converter efficiency at VRMSmin. PF is the power factor at VRMSmin. 300W I INMAX = ---------------------------- = 3.62A 0.92 90V (EQ. 8) Assuming the current is sinusoidal and the peak-to-peak ripple at line is 40%. Page 13 of 20 ISL6731A, ISL6731B The forward power loss on the diode is: The boost inductor, LBST, is given in Equations 9 and 10: 2 V RMSmin 2V RMSmin L BST ---------------------------------------------------------------- 1 - --------------------------------------- V OUT 0.4 F sw 2 I INMAX 90V 2 90V L BST ------------------------------------------------------ 1 - ------------------------ = 654H 0.4 64kHz 3.62 A 390V (EQ. 9) (EQ. 20) P FD = 0.77A 0.9V = 0.692W (EQ. 21) The CREE C3D10060A SiC Schottky diode is selected. (EQ. 10) Choose inductance of 1.5mH, consider the r will decrease at high current for a powder core inductor. The peak current of the inductor is the sum of the average peak inductor current and half of the peak-to-peak ripple current. Select and design the boost inductor as given by Equation 11. The ISL6731A and ISL6731B provides peak current limit function that can prevent the boost inductor saturation. Assuming 25% margin is given to the OCP threshold, select and design the boost inductor with saturation current given by Equation 11 with 25% margin. I LPeak = I 2 I INMAX 1 + ----- 2 (EQ. 11) I LPeak = 1.786A 2 3.88A 1 + ------------------- = 6.017A 2 (EQ. 12) INPUT RECTIFIER The reverse recovery loss on the diode can be calculated. The QRR is found from the diode datasheet. QRR = 25nC. The reverse recover loss on the diode can be estimated: 1 P RRD = --- Q V OUT F 4 RR sw (EQ. 22) 1 P RRD = --- 25nC 390V 62kHz = 0.156W 4 (EQ. 23) The total power loss on the diode is: P D = P FD + P RRD = 0.692 + 0.156 W = 0.848W (EQ. 24) MOSFET POWER DISSIPATION The power dissipation on the MOSFET is from two different types of losses; the conduction loss and the switching loss. For the MOSFET, the worst case is at minimum line input voltage. The maximum average input current is calculated: 2 2 I INMAX I INAVE max = ----------------------------------------- P FD = I OUT max V F First, the drain-to-source RMS current is calculated: (EQ. 13) 8 2 V RMSmin I DS max = I INMAX 1 - ----------- -------------------------V 3 (EQ. 25) 8 2 90V I DS max = 3.623A 1 - ----------- -------------- = 3.081A 3 390V (EQ. 26) OUT 2 2 3.62A I INAVE max = -------------------------------------- = 3.3A (EQ. 14) Select the bridge diode using Equation 15 and sufficient reverse breakdown voltage. Assuming the forward voltage, VF,BR, is 1V across each rectifier diode. The power loss of the rectifier bridge can be calculated: P BR = 2 V F BR I INAVE MAX (EQ. 15) P BR = 2 1V 3.3A = 6.524W (EQ. 16) (EQ. 27) 2 P COND = I DS max r DS on 2 (EQ. 28) P COND = 3.3A 0.285 = 2.71W The switching loss of the MOSFET consists of three parts: the turn-on loss, the turn-off loss and the diode reverse recovery loss. INPUT CAPACITOR SELECTION Refer to Table 2 for the recommended input filter capacitor value. 0.33 C F1 = 300W ----------- = 0.99F 100 The MOSFET, SPP20N60C3 is selected. (EQ. 17) From the MOSFET datasheet, the typical switching losses curves are provided. When RG = 3.6, ID = 6A, EON = 0.013mJ, EOFF = 0.020mJ. This is the recommended capacitor used after the diode bridge. For better power factor, less capacitance can be used. To lower the input filter inductor size, more capacitance can be used. The switching loss due to transition is calculated: P SW = E ON + E OFF F sw (EQ. 29) One 0.68F capacitors is used for CF1. P SW = 0.013mJ + 0.020mJ 64kHz = 2.09W (EQ. 30) BOOST DIODE SELECTION The boost diode loss is determined by the diode forward voltage drop, VF and the output average current. The maximum output current is: The loss caused by COSS can be estimated as: 2 2 P OSS = --- C oss V OUT F 3 sw (EQ. 31) P OMAX I OUT max = -------------------V OUT (EQ. 18) From the MOSFET datasheet, the COSS = 197pF when VOUT = 390V. 300W I OUT max = ---------------- = 0.77A 390V (EQ. 19) 2 2 P OSS = --- 197pF 390V 64kHz = 1.28W 3 FN8582 Rev 1.00 February 13, 2015 (EQ. 32) Page 14 of 20 ISL6731A, ISL6731B THE TOTAL LOSS ON THE MOSFET P COND + P SW + P OSS = 2.71W + 2.09W + 1.28W = 6.08W (EQ. 33) OUTPUT CAPACITOR SELECTION The output capacitor, CO, is required to hold the output above 300V during one line cycle. For capacitors with 20% tolerance, the tolerance should be taken into consideration. Thus, the output capacitance should be greater than: 2 T HOLD P 1 OMAX C O ---------------------------------------------------- ----------------2 2 1 - 0.2 V OUT - V HOLD (EQ. 34) 2 20ms 300W C O ---------------------------------------------- 1.25 = 242F 2 390 - 300V 2 (EQ. 35) V OUT 8 2 I CORMS max = I OUT max ----------- -------------------------- - 1 3 V RMSmin (EQ. 36) 8 2 390V I CORMS max = 0.77A ----------- -------------- - 1 = 1.577A 3 90V (EQ. 37) (EQ. 42) 2 (EQ. 43) P RCSMAX = 3.623A 0.073 = 0.963W The resistor, RSEN sets the overcurrent protection limit. From Equation 3, RSEN should be greater than: R CS I LPeak 1 + 0.2 R SEN ----------------------------------------------------------------2 0.5 I OC (EQ. 44) Where |x| stands for the ABS(x) function, IOC is the overcurrent threshold. It is important to make sure the output peak-to-peak ripple is less than the minimum OVP threshold as specified in the table on "Electrical Specifications" on page 7. The ESR of the capacitor at 2 times of line frequency is found in the capacitor datasheet. The ESR is 737m at 100Hz. 2 (EQ. 38) O Select RSEN from available standard value resistors, the selected RSEN is 3k The input current shaping is achieved by comparing the sensed current signal to the sensed input voltage signal. The current error amplifier (Gmi), together with the current compensation network, adjusts the duty cycle so that the inductor current traces the sensed rectified voltage. Thus, unity power factor is achieved. The compensation network consists of the Trans-Conductance error amplifier (Gmi) and the impedance network (ZICOMP). The goal of the compensation network is to provide a closed loop transfer function with the sufficient 0dB crossing frequency (f0dB) and adequate phase margin. Phase margin is the difference between the open loop phase at f0dB and 180. The following equations relate the compensation network's poles, zeros and gain to the components (Ric, Cic and Cip) in Figure 15. VI 2 4 50Hz 270F 0.77 + 1 V Opp = 0.77A -------------------------------------------------------------------------------------------- = 9.6V 2 50Hz 270F 0.8 VOUT L Q1 (EQ. 39) COUT CF1 The minimum OVP threshold is 103% of the nominal output value. The maximum output peak-to-peak ripple should be less than 6% of the nominal value, which is 23.4VP-P. RCS CURRENT MIRROR CURRENT SENSING RESISTORS R CS = 0.073 (EQ. 41) I CS ISEN (EQ. 40) While a large RCS renders better current sensing accuracy, larger RCS also incurs higher power dissipation. Select three 0.22 resistors in parallel as RCS. 2:1 RSEN Please refer to Equation 4 for calculation of the current sensing resistor RCS. 120mV 265V 0.92 R CS ------------------------------------------------------- = 0.069 2 300W (EQ. 45) CURRENT LOOP COMPENSATION Select the proper capacitor according to the hold time and ripple RMS current requirement. The actual capacitance is 270F. line 2 P RCSMAX = I INMAX R CS 0.073 6.017A 1.2 R SEN ----------------------------------------------------------- = 2.9k 2 90A Calculate the ripple RMS current through the capacitor: 4f line C O ESR + 1 V Opp = I OUT max ---------------------------------------------------------------------- 2f C 0.8 The maximum power dissipation on the RCS occurs at low line and full load condition. The maximum power dissipation is calculated: ICOMP Gmi Ric Cic IREF RIS Cip FIGURE 15. INDUCTOR CURRENT SENSING SCHEME FN8582 Rev 1.00 February 13, 2015 Page 15 of 20 ISL6731A, ISL6731B 120 FZ 100 Thus, the current loop compensation zero is: GILOOP (s) 80 GAIN (dB) Where M is the phase margin, which is 20. FP = 6kHz. This is an aggressive example to fulfill a tight THD for light load. FP 14kHz F Z = ---------------------------------------------------------------------------- = 0.78kHz 14kHz tan atan ------------------ + 20deg 6kHz Gid (s) 60 Gci (s) 40 The total compensation capacitance is calculated: FC 20 2 A IDC R CS V OUT 1 + fc fz C ip + C ic = --------------------------------------- -------------- ---------------- ------------------------------ (EQ. 54) 2 V 2 R SEN + f 1 f m L 2f c p BST c 0 Gsm -20 -40 (EQ. 53) 10 100 1k 10k 100k FREQUENCY (Hz) FIGURE 16. ASYMPTOTIC BODE PLOT FOR CURRENT LOOP GAIN 1 F Z = -----------------------------------2 R ic C (EQ. 46) fz C ip = C ip + C iC ---f (EQ. 56) The value of the noise filtering capacitor is: 0.78kHz C ip = 7.345nF ----------------------- = 0.958nF 6Hz (EQ. 47) Near the crossover frequency, the transfer function from duty cycle to inductor current is well approximated by Equation 48: The value of Cic is: (EQ. 58) (EQ. 48) The value of Ric is: 1 R ic = -------------------------------------------------------------- = 31.85k 2 0.78kHz 6.378nF Ric = 30k, Cic = 6.8nF, Cip = 1nF. Figure 17 shows the actual bode plot of current loop gain. 100 GAIN (dB) (EQ. 49) (EQ. 59) Select the RC value from the standard value, we have: The compensation gain uses external impedance networks as shown in Figure 15, Gci(s) is given by: s ---------------------- + 1 FZ 2 1 G ci s = Gmi ------------------------------------ --------------------------------s C ic + C ip s ----------------------- + 1 2 FP (EQ. 57) C ic = 7.345nF - 0.958nF = 6.378nF Use the following guidelines for locating the poles and zeros of the compensation network. V OUT G id s = ---------------------L BST s (EQ. 55) p ic 1 F P = --------------------------------------------------C ip C ic 2 R ic -----------------------C ip + C ic C ip + C ic = 7.345nF FZ FP FZ FP 50 0 The current gain and modulation gain Gsm is: (EQ. 50) where Vm is the amplitude of the PWM carrier. The open loop gain of the current loop is: G ILOOP s = G id s G sm G ci s (EQ. 51) It is recommended to set the crossover frequency, FC from 1/10 to 1/6 of the switching frequency with a phase margin of 60. A high frequency pole, FP, is set at 1/2 of the switching frequency for ripple filtering. In this example, we set the FC at 14kHz. FC F Z = ------------------------------------------------------- F C tan atan ------- + M F P FN8582 Rev 1.00 February 13, 2015 90 PHASE () Rcs Ris 1 Gsm = --------------- --------- --------Rsen 2 Vm 60 60 45 30 0 10 100 1k 10k 100k FREQUENCY (Hz) FIGURE 17. BODE PLOT OF THE ACTUAL CURRENT LOOP GAIN (EQ. 52) Page 16 of 20 ISL6731A, ISL6731B INPUT VOLTAGE SETTING With the equivalent negative capacitor, the total reactive current reduces to: First, set the BO resistor divider gain, KBO according to Equations 1 and 2. Assuming the converter starts at VLINE = 80VRMS, then the BO resistor divider gain, KBO, should be: 0.5V K BO = ------------------------ = 0.00641 80V - 2V (EQ. 60) In this design, two 470k resistors in series are used for RIN2. Therefore, RIN1 is calculated: 0.00641 R IN1 = ------------------------------- 0.94M = 6.065k 1 - 0.00641 (EQ. 61) The displacement power factor increases to: Ia PF DIS = -------------------------------------------------------- = 0.9958 2 2 I a + I c - I cneg (EQ. 70) VOLTAGE LOOP COMPENSATION The average boost diode forward current can be approximated by: P in I D ave = ---------------V OUT We choose RIN1 = 5.76k, the actual KBO is calculated: R IN1 K BO = --------------------------------- = 0.00609 R IN1 + R IN2 (EQ. 69) I c - I cneg = 0.126A (EQ. 62) NEGATIVE INPUT CAPACITOR GENERATION The ISL6731A and ISL6731B generate an equivalent negative capacitance at the input to cancel the input filter capacitance. Thus, more input capacitors can be used without reducing the power factor. The input equivalent negative capacitance is a function of the current sensing gain, BO resistor divider gain and the compensation components. V m R SEN C NEG = K BO 0.8 - ---------------- -------------------------- C ic + C ip V OUT R CS A iDC (EQ. 71) Assuming the input current traces the input voltage perfectly. The input power is in proportion to (VCOMP - 1V). R SEN 1 0.25 I D ave = --------------------------------------- ---------------- ------------------------------------------------ COMP 2 R CS 0.5 R IS V OUT 2 2 K BO (EQ. 72) Where COMP is the VCOMP - 1V. 1V is the offset voltage. RIS is the internal current scaling resistor. RIS = 14.2k. A I D ave = 0.749 ---- COMP V (EQ. 73) (EQ. 63) VOUT 2.5V 1.5 3k C NEG = 0.00609 0.8 - ---------- --------------------------- 6.8nF + 1nF = 0.17F 390 0.073 1.9 (EQ. 64) FB This equivalent negative capacitor cancels the input filter capacitor required for EMI filtering. Therefore, the displacement power factor significantly improves. For example, CF1 = 0.68F, CF2 = CF3 = 0.47F, using the low cost EMI filter shown in Figure 13. When VLINE = 230VAC, fLINE = 50Hz, PO = 300W. Assuming 95% efficiency under the above test condition, the resistive component of the line current, which is in phase to voltage: Po I a = --------------------------------- = 1.373A V LINE 0.95 RFB2 Gmv RFB1 IFB COMP Rvc Cvp Cvc (EQ. 65) FIGURE 18. OUTPUT VOLTAGE SENSING AND COMPENSATION The reactive current through the input capacitors: I c = V LINE 2 f LINE C F1 + C F2 + C F3 = 0.14A (EQ. 66) Thus, the transfer function from VCOMP to VOUT is: I D ave V OUT s 1 G PS s = ------------------------ = ---------------- ------------------- COMP C O s COMP (EQ. 74) Thus, the displacement power factor is: Ia PF DIS = ----------------------------------- = 0.9948 2 2 Ia + Ic (EQ. 67) FN8582 Rev 1.00 February 13, 2015 (EQ. 75) As shown in Figure 18, the voltage loop gain is: The reactive current generated by the equivalent negative capacitor is: I cneg = V LINE 2 f LINE C NEG = 0.015A I D ave 1 0.749 G PS s = ------------------- -------------------- = ---------------CO s C O s COMP G VLOOP s = G PS s G DIV Gmv Z COMP s (EQ. 76) (EQ. 68) Page 17 of 20 ISL6731A, ISL6731B The output feedback resistor divider gain, GDIV is: V REF G DIV = ---------------V OUT (EQ. 77) Choose components from the standard values. We have CVP = 150nF, CVC = 1F, RVC = 62k. The actual bode plot is shown in Figure 20. 40 R vc C vc s + 1 1 Z COMP s = --------------------------------------- ------------------------------------------------------------ C vc + C vp s R vc C vc C vp ------------------------------------------ s + 1 C vc + C vp (EQ. 78) GAIN (dB) The compensation gain uses external impedance networks as shown in Figure 18, ZCOMP(s) is given by: The targeted crossover frequency, FCV is 7.5Hz. The high frequency pole, FPV, is required in order to reject the 2 time line frequency component. FPV = 20Hz. The targeted phase margin is 50. FZV FPV GmV*ZCOMP (s) 40 Gps (s) FCV GAIN (dB) 20 0 120Hz 20 0 0 -20 90 PHASE () 60 FCV FCV 120Hz 60 60 45 30 0 1 10 100 1k FREQUENCY (Hz) -20 GVLOOP (s) FIGURE 20. BODE PLOT OF THE ACTUAL VOLTAGE LOOP GAIN GDIV -40 -60 1 100 10 1k FREQUENCY (Hz) FIGURE 19. ASYMPTOTIC BODE PLOT OF VOLTAGE LOOP GAIN The zero, FZv is calculated: F CV F Zv = ------------------------------------------------------------------------------tan m + atan F CV F PV (EQ. 79) 7.5Hz F Zv = ----------------------------------------------------------------------------------------------------- = 2.648Hz tan 50deg + atan 7.5Hz 20Hz (EQ. 80) Then the total capacitance used for compensation is calculated: 2 G PS i 2F CV G DIV Gmv F CV F ZV + 1 C vc + C vp = ------------------------------------------------------------------------------------------- ------------------------------------------2 2F CV F CV F PV + 1 (EQ. 81) Thus, the total compensation capacitance is: C vc + C vp = 1127nF F ZV C vp = 1127nF ----------- = 149nF F PV (EQ. 82) (EQ. 83) C vc = 1127nF - 149.1nF = 977nF (EQ. 84) 1 R vc = ------------------------------------------- = 61.5k 2 F ZV C VC (EQ. 85) FN8582 Rev 1.00 February 13, 2015 Page 18 of 20 ISL6731A, ISL6731B Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE February 13, 2015 FN8582.1 Recommended operating conditions on page 7: changed VCC to GND value from "15V to +20V `to "12V to +20V'. Updated Equations 38 and 39 on page 15. March 25, 2014 FN8582.0 Initial Release About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support (c) Copyright Intersil Americas LLC 2014-2015. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN8582 Rev 1.00 February 13, 2015 Page 19 of 20 ISL6731A, ISL6731B Package Outline Drawing M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.220.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45 4 4 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 indentifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN FN8582 Rev 1.00 February 13, 2015 Page 20 of 20 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Intersil: ISL6731BFBZ-T ISL6731BFBZ ISL6731AFBZ-T ISL6731AFBZ