EDA
EDB
EDC
EDD
ED(X)
bidirectional
esd
suppressor
features
•
(16kV)
IEC
61000-4-2
rating
•
Surface
mount
package
•
High
component
density
•
Products
with
lead-free
terminations
meet
EU
RoHS
and
China
RoHS
requirements
ordering
information
From
table
above
TE:
7"
embossed
plastic
tape
ED
A
S03
TE
16V
Pac
kaging
T
ype
P
acka
ge
Code
V
oltage
New
P
art
#
For
further
information
on
packaging,
please
refer
to
Appendix
A.
dimensions
and
construction
L
Die
Pad
M
olded
Resin
Bonding
Wire
Si
Wafer
P
Lead
d
W
5V0
16V
applications
•
ESD
suppression
•
T
ransient
suppression
circuit
schematic
1
2
3
P
a
c
k
a
g
e
Code
W
±0.2
L
±0.2
Pins
Dimensions
inches
(mm)
3
.1
14
(2.90)
.091
(2.30)
S03
6
.1
14
(2.90)
.1
10
(2.80)
S06
T
otal
P
ower
225mw
225mw
p
±0.1
––
.037
(0.95)
Pkg
Ht
±0.2
.039
(1.0)
.039
(1.0)
d
±0.05
.017
(0.43)
.017
(0.43)
W
L
Lead
Die
Pad
Molded
Resin
Bonding
Wire
Si
Wafer
p
d
S03
S06
ED
A
2
3
1
4
5
6
EDB
2
3
1
4
5
6
EDC
T
:
Sn
T
Lead
Plating
5
.1
14
(2.90)
.1
10
(2.80)
S05
225mw
.037
(0.95)
.039
(1.0)
.017
(0.43)
2
3
1
4
5
EDD
W
L
Lead
Die
Pad
Molded
Resin
Bonding
Wire
Si
Wafer
p
d
P
S05
P
±0.1
.075
(1.90)
––
.075
(1.90)
EU
91
K
O
A
Sp
e
er
El
e
c
t
r
o
n
i
cs
,
I
n
c
.
•
1
99
B
ol
iv
ar
Dri
v
e
•
Br
ad
f
or
d
,
P
A
16
7
01
•
U
SA
•
8
14
-3
6
2-
55
36
•
F
ax
:
81
4-
36
2-
8
88
3
•
w
w
w
.k
oa
sp
ee
r
.c
om
Sp
ec
i
fi
ca
ti
o
ns
g
iv
en
h
er
e
in
m
a
y
be
c
h
an
ge
d
at
a
n
y
ti
m
e
wi
th
ou
t
p
ri
or
n
ot
ic
e.
Pl
ea
s
e
co
nf
ir
m
t
ec
hn
i
ca
l
sp
ec
i
fi
ca
ti
o
ns
b
ef
o
re
y
ou
or
der
a
nd
/o
r
u
se.
2/
24
/
08
resistors
92
K
O
A
Sp
e
er
El
e
c
t
r
o
n
i
cs
,
I
n
c
.
•
1
99
B
ol
iv
ar
Dri
v
e
•
Br
ad
f
or
d
,
P
A
16
7
01
•
U
SA
•
8
14
-3
6
2-
55
36
•
F
ax
:
81
4-
36
2-
8
88
3
•
w
w
w
.k
oa
sp
ee
r
.c
om
Sp
ec
i
fi
ca
ti
o
ns
g
iv
en
h
e
re
in
m
a
y
be
c
h
an
ge
d
at
a
n
y
ti
m
e
wi
th
ou
t
p
ri
or
n
ot
ic
e.
Pl
ea
s
e
co
nf
ir
m
t
ec
hn
i
ca
l
sp
ec
i
fi
ca
ti
o
ns
b
ef
o
re
y
ou
or
der
a
nd
/o
r
u
se.
4/
21
/
05
ED(X)
bidirectional
esd
suppressor
application
schematic
Connector
T
ransceiver
Gnd.
Vp
(T
ransient)
V
clamp
0
V
ESD
V
oltage
Capability
IEC
61000-4-2
Channel
Clamp
V
oltage
8kV
H.B.M.
Capacitance
@
1
Mhz
Part
Designation
Diode
Breakdown
V
oltage
I
F
=
1
ma
Leakage
Current
(T
yp.)
applications
and
ratings
ED
A
EDB
16kV
±
0.1uA@14V
20pF
±
20V
16V
to
27V
EDC
EDD
1
6
k
V
±
0
.
1
u
A
@
5
V
1
5
p
F
±
7
V
5
.
1
V
t
o
1
0
V
Peak
Pulse
Current
IPP
8/20us
––
5
.
1
A
resistors
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