CMS04 TOSHIBA Schottky Barrier Diode CMS04 DC-DC Converters Radio-Frequency Rectification in Switching Regulators Reverse-Current Protection in Mobile Devices * Unit: mm Repetitive peak reverse voltage : VRRM = 30 V * Average forward current * * Peak forward voltage : VFM = 0.37 V (max) Suitable for high-density board assembly due to the use of a small Toshiba Nickname: M-FLATTM : IF (AV) = 5.0 A Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 30 V Average forward current IF (AV) 5.0 (Note 1) A IFSM 70 (50 Hz) A Junction temperature Tj -40 to 125 C JEDEC Storage temperature Tstg -40 to 150 C JEITA Non-repetitive peak forward surge current TOSHIBA Note 1: T = 36C: Rectangular waveform ( = 180), VR = 15 V 3-4E1S Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Peak forward voltage Repetitive peak reverse current Junction capacitance Thermal resistance (junction to ambient) Thermal resistance (junction to lead) Symbol Test Condition Min Typ. Max VFM (1) IFM = 1 A (pulse test) 0.27 VFM (2) IFM = 3 A (pulse test) 0.31 VFM (3) IFM = 5 A (pulse test) 0.35 0.37 IRRM (1) VRRM = 5 V (pulse test) 0.31 IRRM (2) VRRM = 30 V (pulse test) 3.3 8.0 VR = 10 V, f = 1.0 MHz 330 Device mounted on a ceramic board board size 50 mm x 50 mm soldering land size 2 mm x 2 mm board thickness 0.64 mm 60 Cj Rth (j-a) Device mounted on a glass-epoxy board board size 50 mm x 50 mm soldering land size 6 mm x 6 mm board thickness 1.6 mm 135 16 Rth (j-) Unit V mA pF C/W Start of commercial production 2000-07 1 2018-09-11 CMS04 Marking Abbreviation Code Part No. S4 CMS04 Land pattern dimensions for reference only 2.1 Unit: mm 1.4 3.0 1.4 Handling Precaution 1) Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. This device is VF - IRRM trade-off type, lower VF higher IRRM; therefore, thermal runaway might occur when voltage is applied. Please take forward and reverse loss into consideration during design. 2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account designing a device at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 100C. When using this device, take the margin into consideration by using an allowable Ta max - IF(AV) curve. IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100C. 3) Thermal resistance between junction and ambient fluctuates depending on the device's mounting condition. When using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance value. 4) For other design considerations, see the Toshiba website. 2 2018-09-11 CMS04 I F - VF PF (AV) - IF (AV) 100 2.4 Forward current IF (A) Average forward power dissipation PF (AV) (W) DC 10 125C 75C 1 0.2 120 1.6 = 60 1.2 Rectangular waveform 0.8 0.4 0 360 IF(AV) Pulse test Tj = 25C 0.1 0 180 1.8 0.4 0.6 0.8 Forward voltage 1.0 VF 1.2 0 0 1.4 (V) Conduction angle: 1.0 2.0 Rectangular waveform DC 80 0 360 IF(AV) 270 60 20 0 0 Conduction angle: VR = 5 V 180 40 120 = 60 1 2 3 4 5 Average forward current 6.0 7.0 IF (AV) 8.0 (A) T max - IF (AV) Maximum allowable lead temperature T max (C) Maximum allowable ambient temperature Ta max (C) 100 5.0 140 Device mounted on a ceramic board: board size: 50 mm x 50 mm Soldering land: size 2 mm x 2 mm board thickness: 0.64 mm 120 4.0 Average forward current Ta max - IF (AV) 140 3.0 6 IF (AV) 7 120 100 80 60 (A) 270 180 Rectangular waveform 120 40 0 360 IF(AV) 20 Conduction angle: VR = 5 V 0 0 8 DC = 60 1 2 3 4 Average forward current 5 6 IF (AV) 7 8 (A) T max - IF (AV) Maximum allowable lead temperature T max (C) 140 120 DC 100 270 80 60 Rectangular waveform 180 40 0 0 0 360 IF(AV) Conduction angle: VR = 15 V = 120 20 1 2 3 4 Average forward current 5 6 IF (AV) 7 8 (A) 3 2018-09-11 CMS04 Cj -VR Repetitive peak forward current (A) 1000 f = 1 MHz Repetitive peak forward current IFRM Junction capacitance Cj (pF) Ta = 25C 100 1 10 10 V 5V VR = 3 V 10 1 60 80 100 Junction temperature Tj 20 10 100 PR (AV) - VR 120 140 DC 0 360 20 300 VR 16 240 Conduction angle: Tj = 125C 12 180 8 120 4 0 160 Rectangular waveform 24 = 60 0 10 (C) 30 20 Reverse voltage VR (V) rth (j-a) (C/W) rth (j-a) - t Transient thermal resistance (mA) Reverse current IR 100 Average reverse power dissipation PR (AV) (W) 20 V 15 V VR = 30 V 40 40 28 Pulse test 20 60 Number of cycles I R - Tj 0 Ta = 25C 80 (V) 1000 0.1 f = 50 Hz 0 1 100 Reverse voltage VR 100 500 Device mounted on a glass-epoxy board: board size: 50 mm x 50 mm Soldering land size: 2.1 mm x 1.4 mm board thickness: 1.6 mm 100 Device mounted on a glass-epoxy board: board size: 50 mm x 50 mm Soldering land size: 6 mm x 6 mm board thickness: 1.6 mm 10 Device mounted on a ceramic board: board size: 50 mm x 50 mm Soldering land: size 2 mm x 2 mm board thickness: 0.64 mm 1 0.5 0.001 0.01 0.1 1 10 100 1000 Time (s) 4 2018-09-11 CMS04 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". 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