2013-09-131
BFP540ESD
1
2
3
4
Low Noise Silicon Bipolar RF Transistor
For ESD protected high gain low noise amplifier
High ESD robustness
typical value 1000 V (HBM)
Outstanding Gms = 21.5 dB @ 1.8 GHz
Minimum noise figure NFmin = 0.9 dB @ 1.8 GHz
Pb-free (RoHS compliant) and halogen-free package
with visible leads
Qualification report according to AEC-Q101 available
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type Marking Pin Configuration Package
BFP540ESD AUs 1=B 2=E 3=C 4=E - - SOT343
Maximum Ratings at T
A
= 25 °C, unless otherwise specified
Parameter Symbol Value Unit
Collector-emitter voltage
TA = 25 °C
T
A
= -55 °C
VCEO
4.5
4
V
Collector-emitter voltage VCES 10
Collector-base voltage VCBO 10
Emitter-base voltage VEBO 1
Collector current IC80 mA
Base current IB8
Total power dissipation1)
TS 77°C
Ptot 250 mW
Junction temperature TJ150 °C
Ambient temperature T
A
-65 ... 150
Storage temperature TSt
g
-65 ... 150
1TS is measured on the emitter lead at the soldering point to the pcb
2013-09-132
BFP540ESD
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1) RthJS 290 K/W
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0
V(BR)CEO 4.5 5 - V
Collector-emitter cutoff current
VCE = 10 V, VBE = 0
ICES - - 10 µA
Collector-base cutoff current
VCB = 5 V, IE = 0
ICBO - - 100 nA
Emitter-base cutoff current
VEB = 0.5 V, IC = 0
IEBO - - 10 µA
DC current gain
IC = 20 mA, VCE = 3.5 V, pulse measured
hFE 50 110 170 -
1For the definition of RthJS please refer to Application Note AN077 (Thermal Resistance Calculation)
2013-09-133
BFP540ESD
Electrical Characteristics at T
A
= 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics (verified by random sampling)
Transition frequency
IC = 50 mA, VCE = 4 V, f = 1 GHz
fT21 30 - GHz
Collector-base capacitance
VCB = 2 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Ccb - 0.14 0.24 pF
Collector emitter capacitance
VCE = 2 V, f = 1 MHz, VBE = 0 ,
base grounded
Cce - 0.41 -
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Ceb - 0.59 -
Minimum noise figure
IC = 5 mA, VCE = 2 V, f = 1.8 GHz, ZS = ZSopt
IC = 5 mA, VCE = 2 V, f = 3 GHz, ZS = ZSopt
NFmin
-
-
0.9
1.3
1.4
-
dB
Power gain, maximum stable1)
IC = 20 mA, VCE = 2 V, ZS = ZSopt,
ZL = ZLopt , f = 1.8 GHz
Gms - 21.5 - dB
Power gain, maximum available1)
IC = 20 mA, VCE = 2 V, ZS = ZSopt,
ZL = ZLopt, f = 3 GHz
Gma - 16 - dB
Transducer gain
IC = 20 mA, VCE = 2 V, ZS = ZL = 50, f = 1.8GHz
IC = 20 mA, VCE = 2 V, ZS = ZL = 50, f = 3GHz
|S21e|2
16
-
18.5
14
-
-
dB
Third order intercept point at output2)
VCE = 2 V, IC = 20 mA, ZS = ZL = 50, f = 1.8GHz
IP3 - 24.5 - dBm
1dB compression point at output
IC = 20 mA, VCE = 2 V, ZS = ZL = 50, f = 1.8GHz
P-1dB - 11 -
1Gma = |S21e / S12e| (k-(k²-1)1/2), Gms = |S21e / S12e|
2IP3 value depends on termination of all intermodulation frequency components.
Termination used for this measurement is 50 from 0.1 MHz to 6 GHz
2013-09-134
BFP540ESD
Total power dissipation Ptot = ƒ(TS)
0 25 50 75 100 125 150
0
50
100
150
200
250
300
T
S
[°C]
Ptot [mW]
Permissible Pulse Load RthJS = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
Ptotmax/ PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Collector-base capacitance Ccb = ƒ (VCB)
f = 1 MHz
0 2 4 6 8 10 12 14
0
0.05
0.1
0.15
0.2
0.25
0.3
V
CB
[V]
C
cb
[pF]
2013-09-135
BFP540ESD
Third order Intercept Point IP3 = ƒ (IC)
(Output, ZS = ZL = 50 )
VCE = parameter, f = 900 MHz
0 10 20 30 40 50 60 70 80
0
5
10
15
20
25
30
I
C
[mA]
IP
3
[dBm]
1.00V
1.50V
2.00V
3.00V
4.00V
Transition frequency fT = ƒ(IC)
VCE = parameter in V, f = 2 GHz
0 10 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
30
I
C
[mA]
f
T
[GHz]
3 − 4.5V
2.00V
1.00V
0.75V
0.50V
Power gain Gma, Gms = ƒ (f)
VCE = 3 V, IC = 25 mA
0 1 2 3 4 5 6
5
10
15
20
25
30
35
40
45
f [GHz]
G [dB]
G
ms
G
ma
|S
21
|
2
Power gain Gma, Gms = ƒ (IC)
VCE = 3 V
f = parameter in GHz
0 10 20 30 40 50 60 70 80 90 100
6
8
10
12
14
16
18
20
22
24
26
28
I
C
[mA]
G [dB]
6.00GHz
5.00GHz
4.00GHz
3.00GHz
2.40GHz
1.80GHz
0.90GHz
2013-09-136
BFP540ESD
Power gain Gma, Gms = ƒ (VCE)
IC = 20 mA
f = parameter in GHz
0 1 2 3 4 5 6
6
8
10
12
14
16
18
20
22
24
26
28
V
CE
[V]
G [dB]
6.00GHz
5.00GHz
4.00GHz
3.00GHz
2.40GHz
1.80GHz
0.90GHz
Noise figure F = ƒ(IC)
VCE = 3 V, f = parameter in GHz
ZS = ZSopt
0 10 20 30 40 50 60 70 80
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
f = 3GHz
f = 5GHz
f = 0.9GHz
f = 4GHz
f = 6GHz
f = 1.8GHz
I
c
[mA]
F [dB]
Noise figure F = ƒ(IC)
VCE = 3V, f = 1.8 GHz
0 10 20 30 40 50 60 70 80
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
I
c
[mA]
F [dB]
Z
S
= 50
Z
S
= Z
Sopt
Noise figure F = ƒ(f)
VCE = 3 V, ZS = ZSopt
01234567
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
F [dB]
f [GHz]
I
C
= 20mA
I
C
= 5.0mA
2013-09-137
BFP540ESD
Source impedance for min.
noise figure vs. frequency
VCE = 3 V, IC = 5 mA / 20 mA
10.1 0.2 0.3 0.40.5 21.5 3 4 5
0
5
1
−5
−1
10
−10
0.5
1.5
−0.5
−1.5
0.1
−0.1
0.2
2
−0.2
−2
0.3
−0.3
0.4 3
−0.4 −3
4
−4
3GHz
I
c
= 5.0mA
1.8GHz
6GHz
5GHz
0.9GHz
I
c
= 20mA
4GHz
2.4GHz
2013-09-138
BFP540ESD
Package SOT343
2013-09-139
BFP540ESD
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Infineon:
BFP540ESDH6327XTSA1