BALF-112X-02D3 50 ohm nominal input / conjugate match balun CC1120, CC1125, 433 MHz, with integrated harmonic filter Datasheet - production data Description STMicroelectronics' BALF-112X-02D3 is an ultra-miniature balun, integrating both matching network and harmonics filter. Matching impedance has been customized for the CC1120, CC1125, CC1175 and CC1200 transceivers from Texas Instruments. The device uses STMicroelectronics' IPD technology on a non-conductive glass substrate, which optimizes RF performance. Flip-Chip (8 bumps) package Figure 1: Application schematic Features 50 nominal input / conjugate match to CC1120, CC1125, CC1175, CC1200 Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint Benefits Very low profile (< 630 m thickness) High RF performance RF BOM and size reduction Applications 433 MHz impedance-matched balun filter optimized for Texas Instruments(R) CC1120, CC1125, CC1175, CC1200 sub-GHz RFICs February 2017 C10 is a DC block capacitor: 0402/100 pF/50 V DocID029426 Rev 2 This is information on a product in full production. 1/12 www.st.com Characteristics 1 BALF-112X-02D3 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN Input power RFIN VESD TOP Typ. Max. - 20 ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 , air discharge) 1300 ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH) 250 - Operating temperature -40 - dBm V +85 C Table 2: Electrical characteristics and RF performance (Tamb = 25 C) RX balun Value Symbol Parameter Unit Min. ZRX Nominal differential impedance ZANT Antenna impedance f S21RX-ANT S11ANT 2/12 Frequency range (bandwidth) 431 Insertion loss in bandwidth -1.9 Input return loss in bandwidth Phase_imbal Output phase imbalance Ampl_imbal Output amplitude imbalance DocID029426 Rev 2 0 Typ. Max. Match to CC112X 50 436 -1.7 MHz dB -20 -18 dB 1.7 10 0.3 1 dB BALF-112X-02D3 Characteristics Table 3: Electrical characteristics and RF performance (Tamb = 25 C) TX filter Value Symbol Parameter Test condition Unit Min. ZTX Nominal TX impedance ZANT Antenna impedance f S21TX-ANT S11ANT Att Frequency range (bandwidth) 431 Insertion loss in bandwidth -1.5 Input return loss in bandwidth Harmonic levels Typ. Max. Match to CC112X 50 436 -1.3 dB -12 -10 Attenuation at 2 fo -40 -26 Attenuation at 3 fo -52 -46 Attenuation at 4 fo -31 -30 Attenuation at 5 fo -35 -32 Attenuation at 6 fo -32 -28 Attenuation at 7 fo -48 -44 DocID029426 Rev 2 MHz dB dBm 3/12 Characteristics 1.1 BALF-112X-02D3 RF measurement Figure 3: Return loss antenna (RX balun) Figure 2: Insertion loss (RX balun) RL_antenna_RX (dB) IL_RX(dB) 0 0 -0.5 -5 -1.0 -10 -1.5 -15 -2.0 -20 -2.5 f (MHz) f (MHz) -3.0 -25 431.0 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 431.0 Figure 4: Amplitude imbalance (RX balun) 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 Figure 5: Phase imbalance (RX balun) Amplitude_lmb (dB) Phase_lmb (dB) 1.0 15 10 0.5 5 0 0.0 -5 -0.5 -10 f (MHz) f (MHz) -15 -1.0 431.0 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 431.0 Figure 6: TX filter transmission 0 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 Figure 7: Insertion loss (TX filter) Transmit_TX(dB) 0 IL_TX(dB) -10 -0.5 -20 -1.0 -30 -1.5 -40 -2.0 -50 -2.5 f (MHz) f (MHz) -60 -3.0 0 4/12 500 1000 1500 2000 2500 3000 3500 4000 DocID029426 Rev 2 431.0 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 BALF-112X-02D3 Characteristics Figure 8: fo attenuation (TX filter) Figure 9: Return Loss antenna (TX filter) RL_antenna_TX(dB) Transmit_TX(dB) 0 0 -10 -5 -20 -10 -30 -15 -40 -20 -50 f (MHz) -60 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 f (MHz) -25 431.0 DocID029426 Rev 2 431.5 432.0 432.5 433.0 432.5 434.0 434.5 435.0 435.5 436.0 5/12 Package information 2 BALF-112X-02D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 Flip-Chip CSPG 0.4 package information Figure 10: Flip-Chip CSPG 0.4 package outline Bottom view Top view (balls down) (balls up) C1 C1 C2 A2 LOGO + ECOPAK2 symbol 1st line ZZ = Part Number X = assembly site nd 2 line Y = year of production WW = Weekof production B1 B1 B3 B2 G B3 A1 Dot indicates Ball #A1 E1 Z Y Z W X W B2 B3 B1 B1 C1 C3 C4 C1 D1 D3 D2 Table 4: Flip-Chip CSPG 0.4 mechanical data 6/12 Dimensions Frequency A1 A2 B1 B2 B3 C1 C2 C3 C4 D1 D2 D3 E1 BAL-112X-02D3 433 MHz 1950 1870 225 750 500 223 1424 820 604 425 205 630 255 DocID029426 Rev 2 BALF-112X-02D3 Package information Figure 11: Footprint -non solder mask defined Figure 12: Footprint - solder mask defined Figure 13: Ball assignment DocID029426 Rev 2 7/12 Package information BALF-112X-02D3 Table 5: Flip-Chip CSPG 0.4 ball description Ball Name Designation A1 GND Ground A3 LNA- Connect to LNA_N B3 LNA+ Connect to LNA_P C1 ANT Connect to antenna D3 TRX_SW Connect to TRX switch E1 GND Ground E2 PA_C Connect to PA output thru C10 E3 PA_OUT Connect to PA Figure 14: Application board EVB (4 layers) 8/12 DocID029426 Rev 2 BALF-112X-02D3 Package information Figure 15: Recommended balun land pattern C10 Connection pads for 868MHz balun L11 1800 micron Center to center distance bettween balun balls to QFN pad is 1.8 mm Top metal balun pads diamter is 220 micron Solder mask opening is 340 microns GND clearance is 178 microns ( 7 mils) This land pattern is also compatible with 433 MHz balun that will solder to the second row of pads. Table 6: Bill of material Designation Reference Value Package L11 LQW15AN10NJ00D 56 nH 0402 Wire wounded C10 39 pF 0402 50 V R13 18 Ohms 0402 C44 56 pF 0402 U3 CC1121 DFN 5X5 U6 BALF-112X-02D3 FC 2 X 1.5 DocID029426 Rev 2 Comments 50 V 433 MHz 9/12 Package information 2.2 BALF-112X-02D3 Flip-chip CSPG 0.4 packing information Figure 16: Flip-chip CSPG 0.4 tape outline 10/12 DocID029426 Rev 2 BALF-112X-02D3 3 Ordering information Ordering information Table 7: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode BALF-112X-02D3 TG Flip-Chip CSPG 0.4 3.94 mg 5000 Tape and reel Revision history Table 8: Document revision history Date Revision Changes 07-Jul-2016 1 First issue. 24-Feb-2017 2 Updated front page. DocID029426 Rev 2 11/12 BALF-112X-02D3 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2017 STMicroelectronics - All rights reserved 12/12 DocID029426 Rev 2