MULTI CONNECTION SYSTEM MINI Reflow Soldering Headers with Solder Pins, 100 % Protected against Mismating, Pin Spacing 3.5 mm/0.138 in (Black) Pin s acing 3.5 mm/0.138 in, black Straight solder pin 250 V/2.5 kV/2 10A Mating direction perpendicular to PCB Pin spacing 3.5 mm/0,138 in, black Right angle solder pin 250 V/2.5 kV/2 10A Mating direction parallel to PCB | No. of poles Htem-No. | No. of poles Hem-No. Closed end headers, 100 % protected against mismating, black, straight solder pin 1 mm x 1 mm, length of solder pin 2.4 mm 2 734-132/105-604 734-133/105-604 734-134/105-604 734-135/105-604 734-136/105-604 734-137/105-604 734-138/105-604 734-140/105-604 734-142/105-604 NOON A oO bh WwW Closed end headers, 100 % protected against mismating, black, right angle solder pin 1 mm x 1 mm, length of solder pin 2.4 mm 2 734-162/105-604 734-163/105-604 734-164/105-604 734-165/105-604 734-166/105-604 734-167/105-604 734-168/105-604 734-170/105-604 734-172/105-604 NO oN O Mm B&B Ww Accessories Coding key, light grey, snap-on type 734-130 Coding key, light grey, snap-on type 734-130 Dimensions (in mm) Diameter of the plated through hole: 1,4** mm optimized for PCB thickness up to 2 mm/0.079 in 28, a lt L = (No. of poles - 1) x pin spacing + 5.9 mm be-10,3 ns 28 oe L = (No. of poles - 1) x pin spacing + 5.9 mm For use in reflow soldering processes in convection ovens based on EN 61 760-1 apply solder paste @ place components on PCB @ begin reflow soldering process Note: These connectors can only be mated and unmated at voltages below 42 V and in the No load condition. For mating and unmating at low power values, please request data, wate