PIN Diode Chips
Rev. V24
Silicon PIN Chips
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Features
Switch & Attenuator Die
Extensive Selection of I-Region Lengths
Hermetic
Glass Passivated Cermachip
Oxide Passivated Planar Chips
Voltage Ratings to 3000 V
Fast Switching Speed
Low Loss
High Isolation
RoHS* Compliant
Description
MACOM offers a comprehensive line of low
capacitance, planar and mesa, silicon PIN diode
chips which use ceramic glass and silicon nitride
passivation technology. The silicon PIN chip series
of devices cover a broad spectrum of performance
requirements for control circuit applications. They
are available in several choices of I-region lengths
and have been optimally designed to minimize
parametric trade offs when considering low
capacitance, low series resistance, and high
breakdown voltages. Their small size and low
parasitics, make them an ideal choice for
broadband, high frequency, micro-strip hybrid
assemblies.
The attenuator line of PIN diode chips are a planar
or mesa construction and because of their thicker
I-regions and predictable RS vs. I characteristics,
they are well suited for low distortion attenuator
and switch circuits. Incorporated in the chip’s
construction is MACOM’s, time proven, hard glass,
Cermachip process. The hard glass passivation
completely encapsulates the entire PIN junction area
resulting in a hermetically sealed chip which has
been qualified in many military applications. These
Cermachip diodes are available in a wide range of
voltages, up to 3,000 volts, which are capable of
controlling kilowatts of RF power.
Many of MACOM ’s silicon PIN diode chips are also available
in several different package styles. Please refer to the
“Packaged PIN Diode Datasheet” for case style availability
and electrical specifications located on the MACOM website.
Also for high voltage, high power devices refer to
MA4PK2000.
Absolute Maximum Ratings1
TA = +25°C (Unless otherwise specified)
Parameter Absolute Maximum
Forward Current (IF) Per P/N Rs vs. I Graph
Reverse Voltage (VR) Per Specification Table
Power Dissipation (W) 175°C – Tambient°C
Theta
Operating Temperature -55°C to +175°C
Storage Temperature -55°C to +200°C
Junction Temperature +175°C
Mounting Temperature +320°C for 10 seconds
1. Exceeding these limits may cause permanent damage to the
chip.
Anode
Full Area Cathode
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
PIN Diode Chips
Rev. V24
Silicon PIN Chips
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https://www.macom.com/support
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Maximum Characteristics Nominal Characteristics
Part Number
Reverse
Voltage2
VR <10 µA
Capacitance
1 MHz
CJ @ -10 V
Series Res.
500 MHz
RS @ 10 mA
Carrier
Lifetime3
TL
Reverse
Recovery
Time4
TRR
I Region
Length Theta
VDC pF Ω ηs ηs µm °C/W
MA4P161-134 100 0.10 1.50 150 15 13 65
MA4P203-134 100 0.15 1.50 150 25 13 75
MA4P7493-134 150 0.05 1.80 80 8 19 60
MADP-000165-01340W 200 0.06 2.50 200 20 19 30
MADP-000135-01340W 200 0.15 1.20 440 44 19 30
Maximum Characteristics Nominal Characteristics
Part Number
Reverse
Voltage2
VR <10 µA
Capacitance
1 MHz
CJ @ -100 V
Series Res.
100 MHz
RS @ 10 mA
Carrier
Lifetime3
TL
Series Res.
100 MHz
RS @ 10 μA
Series Res.
100 MHz
RS @ 1 mA
I Region
Length Theta
VDC pF Ω µs Ω Ω mils °C/W
MA47416-132 200 0.15 6 2 2000 30 4 30
MA47418-134 200 0.15 3 1 500 15 2 25
Attenuator PIN
Low Capacitance PIN
Electrical Specifications: TA = +25°C
2. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (IR) is measured to be <10 μA.
3. Nominal carrier life time (TL ) specified at IF = +10 mA, IREV = -6 mA.
4. Nominal reverse recovery time specified at IF = +20 mA, IREV = -200 mA.
PIN Diode Chips
Rev. V24
Silicon PIN Chips
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MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
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Maximum Characteristics Nominal Characteristics
Part Number
Reverse
Voltage5
VR <10 µA
Capacitance
1 MHz
CJ @ -100 V
Series Res.
100 MHz
RS @ 100 mA
Carrier
Lifetime6
I Region
Length Theta
VDC pF Ω µs µm °C/W
MA4P303-134 200 0.15 @ 10 V 1.5 @ 10 mA8 0.3 20 30
MA4P404-132 250 0.20 @ 50 V 0.70 @ 50 mA8 0.6 30 20
MA4P504-132 500 0.20 0.60 1 50 20
MA4P505-131 500 0.35 0.45 2 50 14
MA4P506-131 500 0.70 0.30 3 50 11
MADP-000488-13740W 900 0.19 @ 50 V 1.6 @ 50 mA 4 140 45
MA4P604-131 1000 0.30 1.00 3 90 10
MA4P606-131 1000 0.60 0.70 4 90 8
MA4P607-212 1000 1.30 0.40 12 127 4
MA4PK3000-12527 3000 2.90 0.25 @ 500 mA9 60 350 1.5
Cermachip PIN
5. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (IR) is measured to be <10 μA.
6. Nominal carrier life time (TL ) specified at IF = +10 mA, IREV = -6 mA.
7. Upon completion of circuit installation, the chip must be covered with a dielectric conformal coating such as SYLGARD 539® to prevent
voltage arcing.
8. Test Frequency = 500 MHz.
9. Test Frequency = 4 MHz.
Electrical Specifications: TA = +25°C (cont.)
PIN Diode Chips
Rev. V24
Silicon PIN Chips
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MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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Anode
Part Number
Nominal Characteristics (mils.)
Anode Diameter
± 0.5
Chip Size
± 0.5
Chip Thickness
± 0.5
MA4P161-134 3.5 13 x 13 6.0
MA4P203-134 3.1 13 x 13 6.0
MA4P7493-134 3.8 13 x 13 6.5
MADP-000165-01340W 2.3 13 x 13 10.0
MADP-000135-01340W 3.1 13 x 13 10.0
Part Number
Nominal Characteristics (mils.)
Anode Diameter
± 0.5
Chip Size
± 2.0
Chip Thickness
± 1.0
MA4P303-134 3.0 13 x 13 10.0
MA4P404-132 6.8 20 x 20 10.0
MA4P504-132 6.8 20 x 20 10.0
MA4P505-131 13.0 27 x 27 11.0
MA4P506-131 15.8 27 x 27 12.0
MADP-000488-13740W 12.2 23 x 23 13.5
MA4P604-131 17.0 27 x 27 13.5
MA4P606-131 21.0 32 x 32 14.0
MA4P607-212 37.0 62 x 62 18.5
MA4PK3000-1252 85.0 172 x 172 28.0
Part Number
Nominal Characteristics (mils.)
Anode Diameter
± 0.5
Chip Size
± 2.0
Chip Thickness
± 1.0
MA47416-132 7.5 x 7.510 19 x 19 7.0
MA47418-134 7.5 13 x 13 7.0
Cermachip PIN Chip
Attenuator PIN Chip
Low Capacitance PIN Chip
10. Anode top contact is square.
Chip Dimensions
PIN Diode Chips
Rev. V24
Silicon PIN Chips
5
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Typical Series Resistance vs. Forward Current Performance
0.1
1
10
100
1000
0 0.1 1 10 100 1000
MA4P203
MA4P303
MA4P404
Series Resistance ()
Forward Current (mA)
0.1
1
10
100
1000
0 0.1 1 10 100 1000
MA4P504
MA4P505
MA4P506
Series Resistance ()
Forward Current (mA)
0.1
1
10
100
1000
0 0.1 1 10 100 1000
MA4P604
MA4P606
MA4P607
Series Resistance ()
Forward Current (mA)
0.1
1
10
100
1000
10000
0 0.1 1 10 100 1000
MA47416
MA47418
Series Resistance ()
Forward Current (mA)
MA4P504, MA4P505, MA4P506
MA4P604, MA4P606, MA4P607
MA4P203, MA4P303, MA4P404
MA47416, MA47418
PIN Diode Chips
Rev. V24
Silicon PIN Chips
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MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
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DC-0008899
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MA4PK3000 (3kV) Chip
Reverse Bias Conductance vs. Frequency
Series Resistance vs. Forward Current @ 100 MHz
0
0.1
1
10
10 100 1000
Series Resistance ()
Forward Current (mA)
Forward Current vs. DC Forward Voltage @ 100 MHz
1
10
100
1000
10000
0.3 0.5 0.7 0.9 1.1 1.3
Forward Current (mA)
Forward Voltage (V)
1
10
100
1000
110 100
0 V
1 V
10 V
20 V
100 V
Reverse Bias Conductance (µs)
Frequency (MHz)
PIN Diode Chips
Rev. V24
Silicon PIN Chips
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MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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Die Handling and Bonding Information
Handling:
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts,
and skin oils. The use of plastic tipped tweezers or vacuum pickup is strongly recommended for the handling and
placing of individual components. Bulk handling should ensure that abrasion and mechanical shock are
minimized.
Die Attach Surface:
Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS compliant solders or electrically
conductive silver epoxy. The metal RF and DC ground plane mounting surface must be free of contamination and
should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder:
A work surface temperature of +255°C is recommended. When hot forming gas (95%N/5%H) is applied, the work
area temperature should be approximately +290°C. The chip should not be exposed to temperatures greater than
+320°C for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven:
For recommended reflow profile refer to Application Note 538 “Surface Mounting Instructions”.
Electrically Conductive Epoxy Die Attachment:
A controlled amount of electrically conductive, silver epoxy, approximately 1 - 2 mils in thickness, should be used
to minimize ohmic and thermal resistance. A thin epoxy fillet should be visible around the perimeter of the chip
after placement to ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically
+150°C for 1 hour.
Wire and Ribbon Bonding:
The die anode bond pads have a Ti-Pt-Au metallization scheme, with a final gold thickness of 1.0 micron.
Thermo-compression or thermo-sonic wedge bonding of either gold wire or ribbon is recommended. A bonder
heat stage temperature setting of +200°C, tool tip temperature of +150°C and a force of 18 to 50 grams is
suggested. Ultrasonic energy may also be used but should be adjusted to the minimum amplitude required to
achieve an acceptable bond. Excessive energy may cause the anode metallization to separate from the chip.
Automatic ball or wedge bonding may also be used.
For more detailed handling and assembly instructions, see Application Note M541, “Bonding and
Handling Procedures for Chip Diode Devices”.
PIN Diode Chips
Rev. V24
Silicon PIN Chips
8
8
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0008899
8
MACOM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
