W83195R-08
150MHZ 4-DIMM CLOCK
Publication Release Date: Mar. 1999
W83195R-08
Data Sheet Revision History
Pages Dates Version Version
On Web
Main Contents
1 n.a. n.a. All of the versions before 0.50 are for internal use.
2 n.a. 02/Apr 1.0 1.0 Change version and version on web site to 1.0
3
4
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6
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Please note that all data and specifications are subject to change without notice. All the trademarks of
products and companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Winbond
customers using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
- 1 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
1.0 GENERAL DESCRIPTION
The W83195R-08 is a Clock Synthesizer which provides all clocks required for high-speed RISC or
CISC microprocessor such as Intel Pentium II. W83195R-08 provides sixteen CPU/PCI frequencies
which are externally selectable with smooth transitions. W83195R-08 also provides 17 SDRAM clocks
controlled by the none-delay buffer_in pin.
The W83195R-08 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
Spread spectrum built in at ±0.5% or ±0.25% to reduce EMI. Programmable stopping individual
clock outputs and frequency selection through I2C interface. The device meets the Pentium power-up
stabilization, which requires CPU and PCI clocks be stable within 2 ms after power-up. Using dual
function pin for the slots(ISA, PCI, CPU, DIMM) is not recommend. The add on cards may have a
pull up or pull down.
High drive seven PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into
30 pF loads. Two CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF
loads, when maintaining 50± 5% duty cycle. The fixed frequency outputs, such as REF, 24MHz and
48 MHz provide better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
• Supports Pentium II CPU with I2C.
• 3 CPU clocks (one free-running CPU clock)
• 17 SDRAM clocks for 4 DIMs
• 7 PCI synchronous clocks
• Two IOAPIC clocks for multiprocessor support
• Optional single or mixed supply:
(Vddq1=Vddq2 = Vddq3 = Vddq4 = VddL1 =VddL2= 3.3V) or (Vddq1= Vddq2 = Vddq3=Vddq4 =
3.3V, VddL1 = VdqL2 = 2.5V)
• < 250ps skew among CPU and SDRAM clocks
• < 250ps skew among PCI clocks
• < 5ns propagation delay SDRAM from buffer input
• Skew from CPU(earlier) to PCI clock -1 to 4ns, center 2.6ns.
• Smooth frequency switch with selections from 50 MHz to 133 MHz CPU
• I
2C 2-Wire serial interface and I2C read back
• ±0.25% or ±0.5% center type spread spectrum function to reduce EMI
• Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
• MODE pin for power Management
• One 48 MHz for USB & one 24 MHz for super I/O
• 56-pin SSOP package
- 2 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
3.0 BLOCK DIAGRAM
PLL2
XTAL
OSC
Spread
Spectrum
PLL1
LATCH
POR STOP
1/2
Control
Logic
Config.
Reg.
STOP
STOP
STOP
PCI
Clock
Divider
a
a
4
2
17
5
48MHz
24MHz
IOAPIC
REF(0:1)
CPUCLK_F
CPUCLK1
SDRAM(0:15)
PCICLK(0:4)
PCICLK_F
Xin
Xout
BUFFER IN
FS(0:3)* 4
MODE*
CPU_STOP#
PCI_STOP#
SDATA*
SDCLK*
SDRAM_F
4.0 PIN CONFIGURATION
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Vddq1
* PCI_STOP#/REF0
Vss
Xin
Xout
Vddq2
PCICLK_F/MODE*
PCICLK0/FS3*
Vss
PCICLK1
PCICLK2
PCICLK3
PCICLK4
Vddq2
BUFFER IN
SDRAM11
SDRAM10
Vddq3
SDRAM 9
SDRAM 8
Vss
SDATA
SDCLK
VddL1
IOAPIC0
IOAPIC_F
Vss
CPUCLK_F
CPUCLK1
VddL2
CPUCLK2
VSS
CPU_STOP#
SDRAM 0
SDRAM 1
SDRAM 2
Vddq3
SDRAM 3
Vss
SDRAM 4
SDRAM 5
SDRAM 6
SDRAM 7
Vddq4
Vddq3
48MHz/FS0*
24MHz/FS1*
PCICLK5
29
26
27
28
25
55
54
53
52
51
50
49
56
SDRAM 15
SDRAM 14
Vss
REF1/ FS2*
SDRAM 12
SDRAM 13
Vss
SDRAM_F
- 3 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
5.0 PIN DESCRIPTION
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Active Low
* - Internal 250kΩ pull-up
5.1 Crystal I/O
SYMBOL PIN I/O FUNCTION
Xin 5 IN Crystal input with internal loading capacitors and
feedback resistors.
Xout 6 OUT Crystal output at 14.318MHz nominally.
5.2 CPU, SDRAM, PCI, IOAPIC Clock Outputs
SYMBOL PIN I/O FUNCTION
CPUCLK_F 52 OUT Free running CPU clock. Not affected by
CPU_STOP#
CPUCLK1
CPUCLK2
51
49
OUT Low skew (< 250ps) clock outputs for host
frequencies such as CPU, Chipset and Cache.
Powered by VddL2. Low if CPU_STOP# is low.
CPU_STOP# 47 IN This asynchronous input halts CPUCLK1,IOAPIC &
SDRAM(0:12) at logic “0” level when driven low.
IOAPIC0
55 OUT High drive buffered output of the crystal, and is
powered by VddL1.
IOAPIC_F 54 OUT Free running IOAPIC clock, and not affected by
CPU_STOP#
SDRAM [ 0:15] 18,19,21,22,24
,25,32,33,35,
36,38,39,40,41
,43,44
OUT SDRAM clock outputs. Fanout buffer outputs from
BUFFER IN pin.(Controlled by chipset)
PCICLK_F/
*MODE
8 I/O Free running PCI clock during normal operation.
Latched Input. Mode=1, Pin 2 is REF0; Mode=0,
Pin2 is PCI_STOP#
PCICLK0/*FS3 9 I/O Low skew (< 250ps) PCI clock outputs.
Latched input for FS3 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
PCICLK [ 1:5 ] 11,12,13,14,16 OUT Low skew (< 250ps) PCI clock outputs.
Synchronous to CPU clocks with 1-48ns skew(CPU
early).
BUFFER IN 17 IN Inputs to fanout for SDRAM outputs.
SDRAM_F 46 O Free running SDRAM clock, and not affected by
CPU_STOP#
- 4 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
5.3 I2C Control Interface
SYMBOL PIN I/O FUNCTION
*SDATA 27 I/O Serial data of I2C 2-wire control interface with internal
pull-up resistor.
*SDCLK 28 IN Serial clock of I2C 2-wire control interface with
internal pull-up resistor.
5.4 Fixed Frequency Outputs
SYMBOL PIN I/O FUNCTION
REF0 / PCI_STOP# 3 I/O 14.318MHz reference clock. This REF output is the
stronger buffer for ISA bus loads.
Halt PCICLK(0:4) clocks at logic 0 level, when input
low (In mobile mode. MODE=0)
REF1 / *FS2 2 I/O 14.318MHz reference clock.
Latched input for FS2 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
24MHz / *FS0 30 I/O 24MHz output clock.
Latched input for FS1 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
48MHz / *FS1 29 I/O 48MHz output for USB during normal operation.
Latched input for FS0 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
5.5 Power Pins
SYMBOL PIN FUNCTION
Vddq1 1 Power supply for Ref [0:1] crystal and core logic.
VddL1 56 Power supply for IOAPIC output, either 2.5V or 3.3V.
VddL2 50 Power supply for CPUCLK_F & CPUCLK[1:2], either
2.5V or 3.3V.
Vddq2 7,15 Power supply for PCICLK_F, PCICLK[0:5], 3.3V.
Vddq3 20,37,45 Power supply for SDRAM_F & SDRAM[0:15], and CPU
PLL core, nominal 3.3V.
Vddq4 31 Power for 24 & 48MHz output buffers and fixed PLL
core.
Vss 4,10,23,26,34,42,48,
53
Circuit Ground.
- 5 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
6.0 FREQUENCY SELECTION
FS3=0 CPU,SDRAM (MHz) PCI (MHz) REF,IOAPIC
FS2 FS1 FS0 (MHz)
0 0 0 124 41.33(CPU/3) 14.318
0 0 1 75 37.5(CPU/2) 14.318
0 1 0 83.3 41.65(CPU/2) 14.318
0 1 1 66.8 33.4(CPU/2) 14.318
1 0 0 103 34.3(CPU/3) 14.318
1 0 1 112 37.33(CPU/3) 14.318
1 1 0 133 44.33(CPU/3) 14.318
1 1 1 100.3 33.3(CPU/3) 14.318
FS3=1 CPU,SDRAM (MHz) PCI (MHz) REF,IOAPIC
FS2 FS1 FS0 (MHz)
0 0 0 120 40.00(CPU/3) 14.318
0 0 1 115 38.33(CPU/3) 14.318
0 1 0 110 36.67(CPU/3) 14.318
0 1 1 105 35.00(CPU/3) 14.318
1 0 0 140 35.00(CPU/4) 14.318
1 0 1 150 37.50(CPU/4) 14.318
1 1 0 124 31.00(CPU/4) 14.318
1 1 1 133 33.25(CPU/4) 14.318
7.0 MODE PIN -POWER MANAGEMENT INPUT CONTROL
MODE, Pin8 (Latched Input) PIN 3
0 PCI_STOP# (Input)
1 REF0 (Output)
- 6 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
8.0 FUNTION DESCRIPTION
8.1 POWER MANAGEMENT FUNCTIONS
All clocks can be individually enabled or disabled via the 2-wire control interface. On power up,
external circuitry should allow 3 ms for the VCO? to stabilize prior to enabling clock outputs to assure
correct pulse widths. When MODE=0, pins 3 and 47 are inputs (PCI_STOP#), (CPU_STOP#), when
MODE=1, these functions are not available. A particular clock can be enabled as both the 2-wire
serial control interface and one of these pins indicate that it should be enable.
The W83195R-08 may be disabled in the low state according to the following table in order to reduce
power consumption. All clocks are stopped in the low state, but maintain a valid high period on
transitions from running to stop. The CPU and PCI clocks transform between running and stop by
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after
which high levels of the output are either enabled or disabled.
CPU_STOP# PCI_STOP# CPUCLK[1:2]
IOAPIC0 &
SDRAM [0:15]
PCI OTHER CLKs XTAL & VCOs
0 0 LOW LOW RUNNING RUNNING
0 1 LOW RUNNING RUNNING RUNNING
1 0 RUNNING LOW RUNNING RUNNING
1 1 RUNNING RUNNING RUNNING RUNNING
8.2 2-WIRE I2C CONTROL INTERFACE
The clock generator is a slave I2C component which can be read back the data stored in the
latches for verification. All proceeding bytes must be sent to change one of the control bytes. The 2-
wire control interface allows each clock output individually enabled or disabled. On power up, the
W83195R-08 initializes with default register settings. Use of the 2-wire control interface is then
optional.
The SDATA signal only changes when the SDCLK signal is low, and is stable when SDCLK is high
during normal data transfer. There are only two exceptions. One is a high-to-low transition on
SDATA while SDCLK is high used to indicate the beginning of a data transfer cycle. The other is a
low-to-high transition on SDATA while SDCLK is high used to indicate the end of a data transfer cycle.
Data is always sent as complete 8-bit bytes followed by an acknowledge generated.
Byte writing starts with a start condition followed by 7-bit slave address and a write command bit [1101
0010], command code checking [0000 0000], and byte count checking. After successful reception of
each byte, an acknowledge (low) on the SDATA wire will be generated by the clock chip. Controller
can start to write to internal I2C registers after the string of data. The sequence order is as follows:
Bytes sequence order for I2C controller :
- 7 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
Clock Address
A(6:0) & R/W Ack 8 bits dummy
Command code Ack 8 bits dummy
Byte count Ack Byte0,1,2...
until Stop
Set R/W to 1 when read back the data sequence is as follows [1101 0011] :
Clock Address
A(6:0) & R/W Ack Byte 0 Ack Ack Byte2, 3, 4...
until Stop
Byte 1
8.3 SERIAL CONTROL REGISTERS
The Pin column lists the affected pin number and the PowerUp column gives the default state at true
power up. "Command Code" byte and "Byte Count" byte must be sent following the acknowledge of
the Address Byte. Although the data (bits) in these two bytes are considered "don't care", they must
be sent and will be acknowledge. After that, the sequence described below (Register 0, Register
1, Register 2, ....) will be valid and acknowledged.
8.3.1 Register 0: CPU Frequency Select Register (default = 0)
Bit @PowerUp Pin Description
7 0 - 0 = ±0.25% Spread Spectrum Modulation
1 = ±0.5% Spread Spectrum Modulation
6 0 - SSEL2 (for frequency table selection by software via I2C)
5 0 - SSEL1 (for frequency table selection by software via I2C)
4 0 - SSEL0 (for frequency table selection by software via I2C)
3 0 - 0 = Selection by hardware
1 = Selection by software I2C - Bit 6:4, 2
2 0 - SSEL3 (for frequency table selection by software via I2C)
1 0 - 0 = Normal
1 = Spread Spectrum enabled
0 0 - 0 = Running
1 = Tristate all outputs
Note : The frequency table selected by software via I2C is the same as the hardware setting
frequency table.
- 8 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
8.3.2 Register 1 : CPU , 48/24 MHz Clock Register (1 = enable, 0 = Stopped)
Bit @PowerUp Pin Description
7 1 - Reserved
6 1 - Reserved
5 1 - Reserved
4 1 - Reserved
3 1 46 SDRAM16 (Active / Inactive)
2 1 49 CPUCLK2 (Active / Inactive)
1 1 51 CPUCLK1 (Active / Inactive)
0 1 52 CPUCLK_F (Active / Inactive)
8.3.3 Register 2: PCI Clock Register (1 = enable, 0 = Stopped)
Bit @PowerUp Pin Description
7 1 - Reserved
6 1 8 PCICLK_F (Active / Inactive)
5 1 16 PCICLK5 (Active / Inactive)
4 1 14 PCICLK4 (Active / Inactive)
3 1 13 PCICLK3 (Active / Inactive)
2 1 12 PCICLK2 (Active / Inactive)
1 1 11 PCICLk1 (Active / Inactive)
0 1 9 PCICLK0 (Active / Inactive)
8.3.4 Register 3: SDRAM Clock Register ( 1 = enable, 0 = Stopped )
Bit @PowerUp Pin Description
7 1 - Reserved
6 1 - Reserved
5 1 30 48MHz (Active / Inactive)
4 1 29 24MHz (Active / Inactive)
3 1 33,32,25,24 SDRAM(12:15) (Active / Inactive)
2 1 22,21,19,18 SDRAM(8:11) (Active / Inactive)
1 1 39,38,36,35 SDRAM(4:7) (Active / Inactive)
0 1 44,43,41,40 SDRAM(0:3) (Active / Inactive)
8.3.5 Register 4: Reserved Register (1 = enable, 0 = Stopped)
Bit @PowerUp Pin Description
7 X - Latched FS0#
- 9 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
6 1 - Reserved
5 1 - Reserved
4 1 - Reserved
3 x - Latched FS1#
2 1 - Reserved
1 x - Latched FS3#
0 1 - Reserved
8.3.6 Register 5: Peripheral Control (1 = enable, 0 = Stopped)
Bit @PowerUp Pin Description
7 1 - Reserved
6 X - Latched FS2#
5 1 - Reserved
4 1 54 IOAPIC _F(Active / Inactive)
3 1 55 IOAPIC0 (Active / Inactive)
2 1 - Reserved
1 1 2 REF1 (Active / Inactive)
0 1 3 REF0 (Active / Inactive)
- 10 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
9.0 SPECIFICATIONS
9.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Subjection to maximum conditions for extended periods may affect reliability.
Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol Parameter Rating
Vdd , VIN Voltage on any pin with respect to GND - 0.5 V to + 7.0 V
TSTG Storage Temperature - 65°C to + 150°C
TB Ambient Temperature - 55°C to + 125°C
TA Operating Temperature 0°C to + 70°C
9.2 AC CHARACTERISTICS
Vddq4 = Vddq3 = Vddq2 = Vddq1=3.3V
±
5 %, VddL1=VddL2 = 2.375V~2.9V , TA = 0
°
C to +70
°
C
Parameter Symbol Min Typ Max Units Test Conditions
Output Duty Cycle 45 50 55 % Measured at 1.5V
CPU/SDRAM to PCI Offset tOFF 1 4 ns 15 pF Load Measured at 1.5V
Skew (CPU-CPU), (PCI-
PCI), (SDRAM-SDRAM)
tSKEW 250 ps 15 pF Load Measured at 1.5V
CPU/SDRAM
Cycle to Cycle Jitter
tCCJ ±250 ps
CPU/SDRAM
Absolute Jitter
tJA 500 ps
Jitter Spectrum 20 dB
Bandwidth from Center
BWJ 500 KHz
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
tTLH
tTHL
0.4 1.6 ns 15 pF Load on CPU and PCI
outputs
Overshoot/Undershoot
Beyond Power Rails
Vover 0.7 1.5 V
22 Ω at source of 8 inch
PCB run to 15 pF load
Ring Back Exclusion VRBE 0.7 2.1 V Ring Back must not enter this
range.
- 11 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
9.3 DC CHARACTERISTICS
Vddq4 = Vddq3 = Vddq2 = Vddq1=3.3V
±
5 %, VddL1=VddL2 = 2.375V~2.9V , TA = 0
°
C to +70
°
C
Parameter Symbol Min Typ Max Units Test Conditions
Input Low Voltage VIL 0.8
Vdc
Input High Voltage VIH 2.0 Vdc
Input Low Current IIL -66
µA
Input High Current IIH 5
µA
Output Low Voltage
IOL = 4 mA
VOL 0.4
Vdc All outputs
Output High Voltage
IOH = 4mA
VOH 2.4 Vdc All outputs using 3.3V power
Tri-State leakage Current Ioz 10
µA
Dynamic Supply Current
for Vdd + Vddq3
Idd3 mA CPU = 66.6 MHz
PCI = 33.3 Mhz with load
Dynamic Supply Current
for Vddq2 + Vddq2b
Idd2 mA Same as above
CPU Stop Current
for Vdd + Vddq3
ICPUS3 mA Same as above
CPU Stop Current
for Vddq2 + Vddq2b
ICPUS2 mA Same as above
PCI Stop Current
for Vdd + Vddq3
IPD3 mA
- 12 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
9.4 BUFFER CHARACTERISTICS
9.4.1 TYPE 1 BUFFER FOR CPU CLOCK
Parameter Symbol Min Typ Max Units Test Conditions
Pull-Up Current Min IOH(min) -27 mA Vout = 1.0 V
Pull-Up Current Max IOH(max) -27 mA Vout = 2.0V
Pull-Down Current Min IOL(min) mA Vout = 1.2 V
Pull-Down Current Max IOL(max) 27 mA Vout = 0.3 V
Rise/Fall Time Min
Between 0.4 V and 2.0 V
TRF(min) 0.4 ns 10pF Load
Rise/Fall Time Max
Between 0.4 V and 2.0 V
TRF(max) 1.6 ns 20pF Load
9.4.2 TYPE 2 BUFFER FOR IOAPIC
Parameter Symbol Min Typ Max Units Test Conditions
Pull-Up Current Min IOH(min) mA Vout = 1.4 V
Pull-Up Current Max IOH(max) -29 mA Vout = 2.7 V
Pull-Down Current Min IOL(min) mA Vout = 1.0 V
Pull-Down Current Max IOL(max) 28 mA Vout = 0.2 V
Rise/Fall Time Min
Between 0.7 V and 1.7 V
TRF(min) 0.4 ns 10pF Load
Rise/Fall Time Max
Between 0.7 V and 1.7 V
TRF(max) 1.8 ns 20pF Load
- 13 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
9.4.3 TYPE 3 BUFFER FOR REF1, 24MHZ, 48MHZ
Parameter Symbol Min Typ Max Units Test Conditions
Pull-Up Current Min IOH(min) -29 mA Vout = 1.0 V
Pull-Up Current Max IOH(max) -23 mA Vout = 3.135V
Pull-Down Current Min IOL(min) 29 mA Vout = 1.95 V
Pull-Down Current Max IOL(max) mA Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min) 1.0 ns 10pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
TRF(max) 4.0 ns 20pF Load
9.4.4 TYPE 4 BUFFER FOR SDRAM (0:15)
Parameter Symbol Min Typ Max Units Test Conditions
Pull-Up Current Min IOH(min) mA Vout = 1.65 V
Pull-Up Current Max IOH(max) -46 mA Vout = 3.135 V
Pull-Down Current Min IOL(min) mA Vout = 1.65 V
Pull-Down Current Max IOL(max) 53 mA Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min) 0.5 ns 20pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
TRF(max) 1.3 ns 30pF Load
9.4.5 TYPE 5 BUFFER FOR PCICLK(0:5,F)
Parameter Symbol Min Typ Max Units Test Conditions
Pull-Up Current Min IOH(min) -33 mA Vout = 1.0 V
Pull-Up Current Max IOH(max) -33 mA Vout = 3.135 V
Pull-Down Current Min IOL(min) 30 mA Vout = 1.95 V
Pull-Down Current Max IOL(max) 38 mA Vout = 0.4 V
Rise/Fall Time Min
Between 0.8 V and 2.0 V
TRF(min) 0.5 ns 15pF Load
Rise/Fall Time Max
Between 0.8 V and 2.0 V
TRF(max) 2.0 ns 30pF Load
- 14 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
10.0 POWER MANAGEMENT TIMING
10.1 CPU_STOP# Timing Diagram
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK_F
CPU_STOP#
CPUCLK[0:3]
SDRAM
34
1234 12
For synchronous Chipset, CPU_STOP# pin is an asynchronous “ active low ” input pin used to stop
the CPU clocks for low power operation. This pin is asserted synchronously by the external control
logic at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run
while the CPU clocks are stopped. The CPU clocks will always be stopped in a low state and
resume output with full pulse width. In this case, CPU ?locks on latency“ is less than 4 CPU clocks
and ?locks off latency” is less then 4 CPU clocks.
10.2 PCI_STOP# Timing Diagram
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK_F
PCI_STOP#
PCICLK[0:5]
1212
For synchronous Chipset, PCI_STOP# pin is an asynchronous ?ctive low” input pin used to stop
the PCICLK [0:5] for low power operation. This pin is asserted synchronously by the external control
logic at the rising edge of free running PCI clock(PCICLK_F). All other clocks will continue to run
while the PCI clocks are stopped. The PCI clocks will always be stopped in a low state and
resume output with full pulse width. In this case, PCI ?locks on latency“ is less than 2 PCI clocks
and ?locks off latency” is less then 2 PCI clocks.
- 15 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
11.0 OPERATION OF DUAL FUCTION PINS
Pins 2,8, 9, 29,30 are dual function pins and are used for selecting different functions in this device
(see Pin description). During power up, these pins are in input mode (see Fig1), therefore, and are
considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these pins is
latched into their appropriate internal registers. Once the correct information is properly latched,
these pins will change into output pins and will be pulled low by default. At the end of the power up
timer (within 3 ms) outputs starts to toggle at the specified frequency.
Within 3ms
Input Output
Output
tri-state
Output
pull low
2.5V
Output
tri state
Output
pull-low
#2 REF1/ FS2*
#8 PCICLK_F/ MODE*
#9 PCICLK0/ FS3*
#30 24/FS0
#29 48/FS1
All other clocks
Vdd
Each of these pins has a large pull-up resistor ( 250 kΩ @3.3V ) inside. The default state will be
logic 1, but the internal pull-up resistor may be too large when long traces or heavy load appear on
these dual function pins. Under these conditions, an external 10 kΩ resistor is recommended to be
connected to Vdd if logic 1 is expected. Otherwise, there should be direct connection to ground if a
logic 0 is desired. The 10 kΩ resistor should be placed before the serious terminating resistor. Note
that these logic will only be latched at initial power on.
If optional EMI reducing capacitor are needed, they should be placed as close to the series
terminating resistor as possible and after the series terminating resistor. These capacitors have
typical values ranging from 4.7pF to 22pF.
- 16 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
Device
Pin
Vdd
Ground Ground
10k Series
Terminating
Resistor Clock
Trace
EMI
Reducing
Cap
10k
Ω
Ω
Optional
Device
Pin
Vdd Pad Ground Pad
Programming Header
Series
Terminating
Resistor Clock
Trace
EMI
Reducing
Cap
Ground
10kΩ
Optional
- 17 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
13.0 ORDERING INFORMATION
Part Number Package Type Production Flow
W83195R-08 56 PIN SSOP Commercial, 0°C to +70°C
14.0 HOW TO READ THE TOP MARKING
W83195R-08
28051234
814GBB
1st line: Winbond logo and the type number: W83195R-08
2nd line: Tracking code 2 8051234
2
: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners.
- 18 - Revision 1.0
W83195R-08
Publication Release Date: Mar. 1999
15.0 PACKAGE DRAWING AND DIMENSIONS
0
0.008
0.400
0.292
7.52
0
7.42
8
7.59
10.31
b
E
D
c
18.2
9
10.16
A1
A2
A
10.41
18.54
18.42
2.79
2.34
8
0.2990.296
0.092
0.110
0.410
0.720 0.7300.725
0.406
MIN.
DIMENSION IN INCH
SYMBOL
DIMENSION IN MM
MIN. NOM MAX. MAX.NOM
0.20
e
L
L1
Y
θ
0.008 0.0135
0.005 0.010
0.024 0.032
0.055
0.003
0.20 0.34
0.13 0.25
0.51 0.760.64 0.020 0.0300.025
0.61 0.81
1.40
0.08
HE
θ
θ
2.57 0.101
.045
.055
.035
.045
HE
0.40/0.50 DIA
TOP VIEW
END VIEW
SEE DETAIL "A"
PARTING LINE
SIDE VIEW
D
A1
A2 A
DETAIL"A"
0.095
0.012 0.016
0.088 0.090
0.010
0.040
2.41
0.30 0.41
2.24 2.29
0.25
1.02
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
- 19 - Revision 1.0
