Copyright 2003, Texas Instruments Incorporated
Data sheet acquired from Harris Semiconductor
SCHS109B – Revised June 2003
The CD4059A-series types are supplied in
24-lead dual-in-line plastic packages
(E suffix), and 24-lead small-outline
packages (M and M96 suffixes).
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
Copyright 2003, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4059AD3 ACTIVE CDIP SB JD 24 1 TBD POST-PLATE N / A for Pkg Type
CD4059AE ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4059AEE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4059AM ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4059AM96 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4059AM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4059AM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4059AME4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4059AMG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4059AM96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4059AM96 SOIC DW 24 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
N (R–PDIP–T24) PLASTIC DUAL–IN–LINE
0.020 (0,51) MIN
0.021 (0,53)
0.015 (0,38)
0.100 (2,54)
1
24
0.070 (1,78) MAX 12
13
1.222 (31,04) MAX
0.125 (3,18) MIN
0’–15’
0.010 (0,25) NOM
0.425 (10,80) MAX
Seating Plane
0.200 (5,08) MAX
0.360 (9,14) MAX
0.010 (0,25)
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
MECHANICAL DATA
MCDI005 – JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JD (R-CDIP-T**) CERAMIC SIDE-BRAZE DUAL-IN-LINE PACKAGE
24 PINS SHOWN
0.590 (14,99)
0.620 (15,75)
TYP
0.590 (15,00)
52
0.012 (0,30)
0.008 (0,20)
48
2.435
40
2.050
0.020 (0,51) MIN
0.125 (3,18) MIN
(61,85)(52,07) (67,31)
2.650
4040087/B 04/95
Seating Plane
A
13
12
0.045 (1,14)
0.065 (1,65)
24
1
0.075 (1,91) MAX (4 Places)
2824
PINS **
0.021 (0,53)
0.015 (0,38)
1.250
(31,75)
DIM
A MAX
0.175 (4,45)
0.140 (3,56)
(36,83)
1.450
0.100 (2,54) 0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package is hermetically sealed with a metal lid.
D. The terminals are gold-plated.
MECHANICAL DATA
MPDI008 – OCTOBER 1994
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
12
Seating Plane
0.560 (14,22)
0.520 (13,21)
13
0.610 (15,49)
0.590 (14,99)
524840
0.125 (3,18) MIN
2.390
(60,71)
(62,23)(53,09)
(51,82)
2.040
2.090 2.450 2.650
(67,31)
(65,79)
2.590
0.010 (0,25) NOM
4040053/B 04/95
A
0.060 (1,52) TYP
1
24
322824
1.230
(31,24)
(32,26) (36,83)
(35,81)
1.410
1.450
1.270
PINS **
DIM
0.015 (0,38)
0.021 (0,53)
A MIN
A MAX 1.650
(41,91)
(40,89)
1.610
0.020 (0,51) MIN
0.200 (5,08) MAX
0.100 (2,54)
M
0.010 (0,25) 0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-011
D. Falls within JEDEC MS-015 (32 pin only)
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