BD41000AFJ-CE2 - ROHM SEMICONDUCTOR

Datashee

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

1/20

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111・14・001

CXPI Transceiver for Automotive

BD41000AFJ-C

General Description

BD41000AFJ-C is a transceiver for the CXPI (Clock

Extension Peripheral Interface) communication.

Switching between Master/Slave Mode can be done

using external pin (MS pin).

Low power consumption during standby

(non-communication) using Power Saving function.

Arbitration function stops the data output upon detection

of BUS data collision. Also Fail-safe function stops

outputs upon detection of under voltage or temperature

abnormality.

Features

 AEC-Q100 Qualified (Note1)

 CXPI standards Qualified

 Transmission speed range from 5kbps to 20kbps

 Master/Slave switching function

 Microcontroller interface corresponds to 3.3V/5.0V

 Built-in terminator (30kΩ)

 Power saving function

 Data arbitration function

 Built-in Under Voltage Lockout (UVLO) function

 Built-in Thermal Shutdown (TSD) function

 Low EME(Electromagnetic Emission)

 High EMI(Electromagnetic Immunity)

 High ESD(Electrostatic Discharge) robustness

(Note1: Grade 1)

Applications

 Automotive networks

Key Specifications

 Power Supply Voltage： +7V to +18V

 Absolute Maximum Rating of BAT： -0.3V to +40V

 Absolute Maximum Rating of BUS： -27V to +40V

 Power OFF Mode Current： 3 μA (Typ)

 Operating Temperature Range： -40°C to +125°C

Package W(Typ) x D(Typ) x H(Max)

SOP-J8 4.90mm x 6.00mm x 1.65mm

SOP-J8

Typical Application Circuit

Figure 1. Typical Application Circuit

Consider the actual application design confirming the following linked document before applying this product.

 Application Note

BD41000AFJ-C

Regulator

Micro

Controller

(Note 1)

INT

CLK(3)

VDD MS(8)

TXD(4)

RXD(1)

NSLP(2) GND(5)

BUS(6)

BAT(7)

10kΩ2.7kΩ(Note 2)

2.7kΩ

GND 220pF

100nF

BD41000AFJ-C

Regulator

Micro

Controller

(Note 1) CLK(3)

VDD MS(8)

TXD(4)

RXD(1)

NSLP(2) GND(5)

BUS(6)

BAT(7)

10kΩ

2.7kΩ

GND

1kΩ

1nF

100nF

Master node CXPI BUS VECU

Note 2 While using slave, It is no problem that CLK is opened in the case of non-using CLK output.

Slave node

RXD

TXD

CLK

I/O

Note 1 INT: Interrupt, RXD: UART RXD, TXD: UART TXD, CLK: Clock, I/O: General Purpose I/O

INT

RXD

TXD

CLK

I/O

2/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Pin Configuration

Figure 2. Pin Configuration

Pin Description

Table 1. Pin Description

Pin No.

Pin Name

Function

RXD

Received data output pin

NSLP

Power saving control input pin

(“H”：Change to “Codec mode”,

“L”：Change to “Power OFF mode”)

CLK

Clock signal input/output pin

(Master setting: Input, Slave setting: Output)

TXD

Transmission data input pin

GND

Ground

BUS

CXPI BUS pin

BAT

Power supply pin

Master/Slave switching pin

(“H”: Master, “L”: Slave)

Block Diagram

Figure 3. Block Diagram

4 5

RXD MS

NSLP

CLK

TXD

BAT

BUS

GND

(TOP VIEW)

BAT

Thermal

Shutdown

(TSD)

Power on

Reset

(POR)

Oscillator

LOGIC

BUS

Low Pass

Filter

30kΩ

Decoder

EncoderArbiter

Timing

Generator

Slope Control

GND

RXD

TXD

NSLP

To each block

CLK

Slope

Timer

Dominant

Timeout Counter

(DTC)

Wakeup

Timer

Controller

Under Voltage

Lockout

(UVLO) Regulator

BAT

3/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Description of Blocks

State Transition Diagram

BD41000AFJ-C is built-in “Power OFF Mode”, “Through Mode”, “RX Through Mode” other than “CODEC Mode” for power

saving control. Each mode is controlled by NSLP, BUS, and TXD pins.

Figure 4. State Transition Diagram

Please refer to the following parameter of the electrical characteristic about (Note 1) and (Note 2).

(Note 1): Wakeup pulse detection LO time, (Note 2): Wakeup input detection time (TXD)

While using master, CLK becomes input pin, and uses to input BUS clock in CODEC mode

Power OFF Mode

“Power OFF Mode” reduces power consumption by not supplying powers to any circuits other than necessary ones for

“Wakeup pulse detection (BUS)” and “Wakeup input detection (TXD)”.

When TXD is “H”, Wakeup input is detected, and then changes to “Through mode”. In the case of shifts to “Power OFF

Mode”, TXD is “L”, and then NSLP is “L”.

“Through Mode” and “RX Through mode” cannot change to “Power OFF Mode” directly. Please change via “CODEC Mode”

with NSLP as “H”.

Through Mode

“Through mode” does not process Coding/Decoding. It only drives signals from TXD to BUS and from BUS to RXD

directly.

Please change to “Through mode” with TXD as “H” to send Wakeup pulse.

RX Through Mode

“RX Through Mode” reverses RXD output at each rising edge of BUS.

Please monitor the change of RXD to detect Wakeup pulse in “Power OFF Mode”,.

CODEC Mode

“CODEC Mode” is the mode of CXPI communication. NSLP should be “H” for the chip to enter “CODEC Mode”.

Outputs in the case of Master setting are changed by the falling edge of CLK, and in the case of Slave setting are changed

by the falling edge of BUS. BUS signal is delayed 2.0±0.5Tbit from TXD input, and RXD is delayed 1.0±0.5Tbit from BUS

input.

The jitter of CLK input should satisfy the CXPI standard (±1.0%) including the effect of BD41000AFJ-C (±0.05%) in the

case of Master setting.

Power OFF Mode

RXD output

Non-power Supply

VBAT≥VPOR

When VBAT<VPOR is established

in all modes, It shifts to

non-power supply state

NSLP=H

BUS

Wakeup pulse detect

(Note 1)

TXD

Wakeup input detect

(Note 2)

CLK output (slave)

BUS output

BUS terminator

Hi-Z(H) fixed

Weak pull-up

RX Through Mode

RXD output

CLK output (slave)

BUS output

BUS terminator

Output is reversed at every

BUS signal rising edge

BUS clock output

Hi-Z(H) fixed

30kΩ pull-up

CODEC Mode

RXD output

CLK output (slave)

BUS output

BUS terminator

Decode BUS signal,

and output it

BUS clock output

Code TXD signal,

and output it.

30kΩ pull-up

Through Mode

RXD output

CLK output (slave)

BUS output

BUS terminator

Output BUS signal

by through

Hi-Z(H) fixed

Output TXD signal

by through

30kΩ pull-up

NSLP=H

NSLP=HNSLP=L

4/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Sequence Diagram

It shows the example of BD41000AFJ-C control sequence (“Sleep Mode”, “Standby Mode” and “Normal Mode”)

corresponding to the CXPI standard. (Please refer to the CXPI standard for specifications about the detail of mode

management.)

1. The Sequence from “Normal Mode” to “Sleep Mode”

When changing to “Sleep Mode”, NSLP should be switched from “H” to “L”, and then the IC turns to “Power OFF Mode”.

TXD has built-in pull-down resistor in case of a fail-safe. In “Sleep Mode”, set TXD to “L” before BD41000AFJ-C enters

“Power OFF Mode” to prevent extra currents from MCU side.

Set CLK to “L” just like TXD, because the pull-down resister of CLK is active in the case of Master setting.

Figure 5. The Sequence from “Normal Mode” to “Sleep Mode”

Figure 6. The Timing Chart from “Normal Mode” to “Sleep Mode” (Master)

Micro Controller

(MCU)

Sleep condition

establish

TXD (Sleep flame)

Normal Mode

Master Node

BD41000AFJ-C

Sleep flame transmit

(with coding)

Sleep flame detect

CLK output stop

TXD output control

Power off indicate

CLK (“L” fixed)

TXD (“L” output)

NSLP (“L” fixed)

Sleep Mode

CODEC Mode

Power OFF Mode

BD41000AFJ-C

CODEC Mode

Slave Node

Micro Controller

(MCU)

Sleep flame detect

RXD (Sleep flame)

TXD output control

Power off indicate

TXD (“L” output)

NSLP (“L” output)

Sleep Mode

Normal Mode

Power off Mode

Sleep flame transmit

(with coding)

Sleep flame(Note 1)

BUS clock supply stop

Note 1 Please refer to the CXPI standard about Sleep flame.

RXD (Sleep flame)

NSLP

TXD

CLK

RXD

BUS

Power OFF Mode

Operating

mode

Sleep flame transmit

Sleep flame receive

Sleep flame

CODEC Mode

Master Node

Tclock_stop_m (Note1)

Note 1 Please refer to the CXPI standard about Tclock_stop_m.

5/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Figure 7. The Timing Chart from “Normal Mode” to “Sleep Mode” (Slave)

2. The Sequence from “Sleep Mode” to “Normal Mode” (Master Node Trigger)

To wake up the node by an internal factor, set NSLP to “H” for the chip to enter “CODEC Mode”. TXD should be “H” for

about 30µs before changing from “Power OFF Mode” to “CODEC Mode” in order to prevent abnormal outputs of BUS or

RXD.

In the case of slave mode, BD41000AFJ-C reverses RXD output at every rising edge of BUS signal after receiving BUS

clock. When detecting first RXD falling edge, please start micro controller initializing operation. To establish wakeup

pulse, please check if RXD output is “H” or detect RXD rising edge after initializing operation.

To change from “Standby Mode” to “Sleep Mode” because the slave node cannot receive the second rising pulse within

the specified time, please return to “Power OFF Mode” with NSLP as “L” again after the change to “CODEC Mode” with

NSLP as “H”.

Figure 8. The Sequence from “Sleep Mode” to “Normal Mode” (Master Node Trigger)

NSLP

TXD

RXD

BUS

Power OFF Mode

Operating

mode

Sleep flame receive

Sleep flame

CODEC Mode

Slave Node

Tsleep_s (Note 2)

Note 2 Please refer to the CXPI standard about Tsleep_s.

Micro Controller

(MCU)

Wakeupfactor

CLK (Output start)

Master Node

BD41000AFJ-C

CLK output start

TXD output control

Power off reset

Power OFF Mode

BD41000AFJ-C

Power OFF Mode

Slave Node

Micro Controller

(MCU)

Wakeupdetect

Wakeupdecision

TXD output control

TXD (“H” output)

Normal Mode

StandbyMode

CODEC Mode

BUS clock supply start

Sleep Mode

StandbyMode

TXD (“H” output)

NSLP (“H” output)

CLK transmit

(with coding) Wakeuppulse receive

(First rising edge)

RXD (“L” output)

RXD (“H” output)

After that, Output reverse by

every BUS signal pull up edge

Power off control

Sleep Mode

Wakeuppulse receive

(Second rising edge)

CODEC ModeNormal Mode

NSLP (“H” output)

RX Through Mode

Initializing

operation

6/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Figure 9. The Timing Chart from “Sleep Mode” to “Normal Mode” (Master Node Trigger, Master)

Figure 10. The Timing Chart from “Sleep Mode” to “Normal Mode” (Master Node Trigger, Slave)

NSLP

TXD

CLK

RXD

BUS

CODEC Mode

Operating

mode Power OFF Mode

Master Node

Within 30μs

NSLP

TXD

RXD

BUS

CODEC Mode

Operating

mode Power OFF Mode

Slave Node

Wakeuppulse

(Clock signal)

CLK

RX Through

Mode

Within 30μs

7/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

3. The Sequence from “Sleep Mode” to “Normal Mode” (Slave Node Trigger)

To wake up the slave node by an internal factor, set TXD to “H” for the chip to enter “Through Mode”.

After receiving the wakeup pulse in the Master Node, RXD output reverses at every rising edge of the BUS signal. It is

better to establish Wakeup at clock’s first falling edge.

To change from “Standby Mode” to “Sleep Mode”, in case the master node cannot receive BUS clock within the

specified time, set NSLP to “L” to return to “Power OFF Mode” then enter to “CODEC Mode” by setting NSLP to “H”.

Figure 11. The Sequence from “Sleep Mode” to “Normal Mode” (Slave Node Trigger)

Figure 12. The Timing Chart from “Sleep Mode” to “Normal Mode” (Slave Node Trigger, Master)

Micro Controller

(MCU)

Master Node

BD41000AFJ-C

Power OFF Mode

BD41000AFJ-C

Power OFF Mode

Slave Node

MicroController

(MCU)

Normal Mode

StandbyMode

BUS clock supply start

Sleep Mode

StandbyMode

Clock transmit

(with coding)

Power off control

Sleep Mode

Clock receive

RX Through Mode

NSLP (“H” output)

Through Mode In the case of it cannot receive

clock within the role time,

Wakeup pulse retransmit

Wakeupfactor

TXD output control

TXD (“H” output)

Wakeup BD41000AFJ-C

when it exceeds TTXD_wakeup

Wakeuppulse transmit

TXD (Wakeup pulse)

Wakeuppulse transmit

(without coding)

Wakeuppulse receive

Wakeupdecision

CLK output start

TXD output control

Power off control

CLK (Output start)

TXD (“H” output)

NSLP (“H” output)

Clock signal detect

RXD(Clock signal)

CODEC Mode

RXD (“L” output)

Normal Mode CODEC Mode

Wakeup pulse

After that, Output reverse at

every BUS signal rising edge

Through output

NSLP

TXD

RXD

BUS

CODEC Mode

Operation

mode Power OFF Mode

Master Node

CLK

Within 30μs

Rx Through Mode

Tclock_start_m (Note1)

Note 1,2 Please refer to the CXPI standard about Tclock_start_m, Ttx_wakeup.

Ttx_wakeup(Note 2)

8/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Figure 13. The Timing Chart from “Sleep Mode” to “Normal Mode” (Slave Node Trigger, Slave)

Transmission and Reception Started Effective Time after Shift to CODEC Mode

To detect clock sequence is to learn the LO width of logic value1 during “CODEC Mode” with NSLP as “H”. To keep

learning it, please start to transmit and receive data after the time equal to 16 Tbit clocks at least. (6 Tbit clocks are

necessary until BUS clock is outputted by BUS or CLK after NSLP as “H”.)

Figure 14. The Actual Time of Transmission and Reception after “CODEC Mode” Changing

NSLP

TXD

CLK

RXD

BUS

CODEC Mode

Power OFF Mode

Slave Node

Wakeuppulse

Ttx_wakeup(Note 2) Ttx_wakeup(Note 2)

Ttx_wakeup_space(Note 3)

Through Mode

Note2,3 Please refer to the CXPI standard about Ttx_wakeup, Ttx_wakeup_space

TTXD_wakeup

Operation

mode

BUS

Max 6Tbit 16Tbit

Prohibit Transmit and Receive Transmit and Receive possible

16Tbit

Prohibit Transmit and Receive Transmit and Receive

possible

Max 6Tbit

Power OFF RX

Through

Master

NSLP

Master

CLK

Slave

RXD

Slave

NSLP

Slave

CLK

Slave

state

Master

state

9/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Arbitration Function

To carry out collision resolution functions that defined by CXPI specification, both micro controller and BD41000AFJ-C

share functions. Basically, BD41000AFJ-C arbitrates between UART bit data and micro controller arbitrates between

UART byte data.

1. In case of collision is happened by transmitting from other node at the same time

In the case of collision (arbitration defeat) after data transmission by other node on BUS, it stops the transmission of

remaining UART flame data at the collision. It is necessary to have the interval 1Tbit or more (BUS baud rate period) to

transmit again after arbitration defeat. Set the wait time in consideration of the frequency deviation of the baud rate clock in

micro controller side and BUS side and the delay at UART circuit in micro controller side.

Figure 15. Arbitration Function (When the Collision is detected after Data Transmission)

2. In case of collision is detected by receiving from other node before transmission is started.

BD41000AFJ-C has built-in function to stop transmission upon detection of BUS data collision.

When the signal is detected on BUS before the start of transmit data, BD41000AFJ-C stops to transmit data for 10 Tbit

period, and then while stopping to transmit data, if TXD signal is inputted to BD41000AFJ-C, BD41000AFJ-C stops to

transmit data for further 10 Tbit period of the transmit data.

Figure 16. Arbitration Function (When receive data is detected before transmission data)

0 1

10 0 1 1 11 0

1 0 1 0 1 01 0

Start

Bit Stop

Bit

Start

Bit Stop

Bit Start

Bit

TXD

BUS

RXD

Receive

detect

Transmit

prohibit signal

(Internal signal)

2.0±0.5Tbit delay

1.0±0.5Tbit delay

11 1 11 1 1 1 1 1 1 1 10

000 0

When arbitration defeat is detected,

more than 1 Tbit interval is needed at next transmition

BUS output can generate

While transmit prohibit signal is set “H”,

BUS output is stopped

When the receive data is detected、BUS output is stopped for 10 Tbit period.

and then, while stopping BUS output, if TXD signal is inputted,

BUS output is stopped for further 10 Tbit period

0 1 0 1

10 0 1 1 11 0

BUS output is stopped

1 0 1 0 1 01 0

Start

Bit Stop

Bit

Start

Bit

Arbitration

defeat

(TXD≠RXD)

Stop

Bit Start

Bit

Start

Bit

BUS output can generate

TXD

BUS

RXD

2.0±0.5Tbit delay

1.0±0.5Tbit delay

Arbitration defeat

1 1 0 1 11 1 1 1 1 1

00000

Transmit

prohibit signal

(Internal signal)

When arbitration defeat is detected,

remainig UART output data is stopped

When arbitration defeat is detected,

1 Tbit or more interval is needed at next transmition

While transmit prohibit signal is set “H”,

BUS output is stopped

10/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

3. In case of collision function failure is happed when micro controller outputs transmission data to BD41000AFJ-C

between the outside range of BD41000AFJ-C arbitration function.

BUS output is delayed 2.5 Tbit(Max.) from TXD input and RXD output is delayed 1.5 Tbit(Max.) from BUS input.

When micro controller outputs transmission data to BD41000AFJ-C at the timing that shown in Figure 17,

CXPI frame of other node is destroyed because BD41000AFJ-C outputs PID just after receive PID.

Micro controller should stop transmission data to BD41000AFJ-C while receiving UART data.

Figure 17 shows the example in case of 2.0 Tbit delay from TXD input to BUS output and 1.0 Tbit delay from BUS input to

RXD output.

Figure 17. Arbitration Function (When micro controller detect receive data with stopbit)

Fail-safe Mode

BD41000AFJ-C has built in fail-safe mode such as DTC (TXD Dominant Abnormal Detection Circuit), TSD (Abnormal

Thermal Detection Circuit) and UVLO/POR (Abnormal Under Voltage Detection Circuit).

The operations of each abnormality situation are as follows;

Table 2. Fail-safe Functions

Fail-safe Function

State Transition

BUS Output

RXD Output

CLK Output

(While using slave)

DTC abnormality

No change

CODEC Mode：Logical value1 output(Note 1)

Through Mode：Hi-Z(H) fixed

BUS signal output

Hi-Z (H) fixed

TSD abnormality

No change

Hi-Z (H) fixed

UVLO abnormality

No change

Hi-Z (H) fixed

POR abnormality

Power OFF Mode

Hi-Z (H) fixed

(Note 1) In the case of TXD fixed L, Logical value0 is outputted only in first 10bit. Logical value1 is outputted before DTC abnormality is detected.

When “L” time of TXD is more than TDTC, DTC (Dominant Timeout Counter) detects abnormality, and then it stops output. It

can retune to normal status with TXD as “H”

When the junction temperature exceeds TTSD, TSD (Thermal Shutdown) circuit detects abnormality, and then it stops

output. It can return to normal status when the temperature drops below TTSD_HYS.

Operations of UVLO (Under Voltage Lockout) and POR (Power ON Reset) are as follows;

When supply voltage drops below VUVLO, UVLO abnormality is detected, and then BUS, RXD and CLK outputs are fixed

Hi-Z (H). (Only slave)

When power supply exceeds VUVLO, transceiver restarts output. When supply voltage drops below VPOR, POR abnormality

is detected, and then it changes to “Power OFF Mode”, and reset status.

Figure 18. Internal Status and Mode by Supply Voltage

0 1 0

10 0 1 1 11 0

Start

Bit Stop

Bit

Start

Bit

Start

Bit

TXD

BUS

RXD

Receive

detect

1.0±0.5Tbit delay

1 0

PID transmission from other node

1 1 1 1 111 1 10 0 0

0000

2.0±0.5Tbit delay

Range of stopping transmission by detecting receive data from other node

(explained operation in previous page)

Transmit

prohibit signal

(Internal signal)

While transmit prohibit signal is set “H”,

BUS output is stopped

When the receive data is detected、BUS output is stopped for 10 Tbit period. BUS output can generate

CXPI frame of other node is destroyed

because irregular own node PID is outputted

If micro controller detect receive data with stopbit, there are some timings

that micro controller can transmit data before stopbit detection.

Absolute maxim rating

40V

Operating guarantee range

POR

Activation range

BAT

voltage UVLO

Activation range

Power OFF Normal operation

UVLO

detection state

18V7V6.7V5.0V0V

Mode

11/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Absolute Maximum Ratings (Ta = 25°C)

Table 3. Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage on Pin BAT (Note 1)

VBAT

-0.3 to +40.0

MS Voltage

VMS

-0.3 to +40.0

BUS Voltage

VBUS

-27.0 to +40.0

CLK, TXD, RXD, NSLP voltage

VMCU

-0.3 to +7.0

Power Dissipation (Note 2)

0.67

Storage Temperature Range

Tstg

-55 to +150

°C

Junction Max Temperature

Tjmax

150

°C

Electro Static Discharge (HBM) (Note 3)

VESD

4000

(Note 1) Pd, ASO should not be exceeded.

(Note 2) Regarding above Ta=25°C, Pd decreased at 5.40mW/°C for temperatures when mounted on 70x70x1.6mm Glass-epoxy PCB.

(Note 3) JEDEC qualified.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Conditions

Table 4. Recommended Operating Conditions

Parameter

Symbol

Rating

Unit

BAT Supply Voltage Range

VBAT

+7 to +18

Operating Temperature Range

Topr

-40 to +125

°C

12/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to +125°C, VBAT=7V to 18V)

Table 5. Electrical Characteristics (1)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

BAT

Supply Current 1

IBAT_SLP

µA

After NSLP Shifts from H to L

Supply Current 2

IBAT_NOR

NSLP=H, MS=H,

CLK=20kHz (Duty=50%)

TXD=10kHz (Duty=50%)

TXD, NLSP, CLK (When Input)

VIH

VIHMCU_IN

2.0

VIL

VILMCU_IN

0.8

Input H Current

IIHMCU_IN

6.0

14.0

40.0

µA

Input Voltage=5V

Input L Current

IILMCU_IN

-5.0

0.0

5.0

µA

Wakeup Input Detection Time

(TXD)

TTXD_wakeup

100

150

µs

H Width

Input Clock Duty

(CLK)

DutyCLK

Duty Rule of H Width

VIH

VIHMS_IN

VBAT-1.0

VIL

VILMS_IN

VBAT-3.0

Input H Current

IIHMS_IN

-5.0

5.0

µA

Input Voltage= VBAT =18V

Input L Current

IILMS_IN

-5.0

5.0

µA

In Power OFF Mode

RXD, CLK (When Output)

Output ON Current

OILMCU_OUT

1.3

3.5

Output Pin=0.4V

Output OFF Current

OIHMCU_OUT

-5.0

0.0

5.0

µA

Output Pin =5V

BUS (DC Characteristics)

Recessive Output Voltage(Note 1)

VBUS_RES

VBAT

x 0.9

RL=500Ω

Dominant Output Voltage 1(Note 1)

VBUS_DOM_1

1.2

VBAT=7V, RL=500Ω

Dominant Output Voltage 2(Note 1)

VBUS_DOM_2

0.6

VBAT=7V, RL=1kΩ

Dominant Output Voltage 3(Note 1)

VBUS_DOM_3

2.0

VBAT=18V, RL=500Ω

Dominant Output Voltage 4(Note 1)

VBUS_DOM_4

0.8

VBAT=18V, RL=1kΩ

H Level Leakage Current

IIHBUS

-5.0

0.0

5.0

µA

When Recessive Output

VBAT= VBUS=18V

Pull-up Resister

RBUS

kΩ

VBAT=12V

Short-circuit Output Current(Note 1)

IOCPBUS

200

VBAT= VBUS=18V、RL=0Ω

L Current at Receiver Operating

IOLBUS

-1

VBAT=12V, VBUS=0V

Input Leakage Current at

Receiver Operating

ILBUS

µA

VBAT=8V, VBUS=18V

Leakage Current when NO_GND

ILBUS_NO_GND

-1

GND=VBAT=12V,

VBUS=0V to 18V

Leakage Current when NO_BAT

ILBUS_NO_BAT

100

µA

VBAT=0V, VBUS=0V to18V

Input H Threshold Voltage

VIHBUS_REC

VBAT

x 0.556

Input L Threshold Voltage

VILBUS_DOM

VBAT

x 0.423

Input Threshold Voltage (Typical)

VTHCBUS

VBAT

x 0.475

VBAT

x 0.5

VBAT

x 0.525

Input Hysteresis Voltage

VHYSBUS

VBAT

x 0.133

(Note 1) RL is pullup resistor that is connected between BAT and BUS terminal outside.

13/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Table 6. Electrical Characteristics (2)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

BUS (AC Characteristics)

LO Level Time 1 of Logical Value

“1” (Note 2)

Ttx_1_lo_rec

0.39Tbit

+0.6τ

TH_rec=70%

LO Level Time 2 of Logical Value

“1”

Ttx_1_lo_dom

0.11

Tbit

TH_dom=30%

HI Detection Time of Receiving

Ttx_0_hi

0.06

Tbit

TH_rec=55.6%

Difference of LO Level Time

Between Logical Value “1” and

Logical Value “0”

Ttx_dif

0.06

Tbit

Ttx_dif= Ttx_0_lo - Ttx_1_lo

Delay Time from the LO Level

Detection to Logical Value “0”

Output

Ttx_0_pd

0.11

Tbit

TH_dom=30%

LO time 1 of Logical Value “0”

Ttx_0_lo_rec

Ttx_1_lo_rec

+ 0.06

Tbit

TH_rec=70%

LO time 2 of Logical Value “0”

Ttx_0_lo_dom

Ttx_1_lo_dom

+ 0.06

Tbit

TH_dom=30%

BUS Pull-down Time

Ttx_1_dom_m

0.16

Tbit

TH_dom=30%

Recessive Voltage of Logical

Value “0”

V_rec_0

Ratio for the Recessive

voltage (V_rec_1)

when logical value is 1

Wakeup Pulse Detection LO

Time for Master Setting

Trx_wakeup_master

100

150

µs

TH_dom=42.3%

Wakeup Pulse Detection LO

Time for Slave Setting

Trx_wakeup_slave

0.5

µs

TH_dom=42.3%

TSD

TSD Detection Temperature

(Note 3)

TTSD

150

200

°C

TSD Hysteresis Temperature

(Note 3)

TTSD_HYS

°C

UVLO

UVLO Detection Voltage

VUVLO

5.0

6.7

POR

POR Detection Voltage

VPOR

5.0

DTC

Dominant Time-out Time

TDTC

(Note 2) τis a fixed number when BUS (1μs ≤τ≤ 5μs)

(Note 3) It is a design guarantee parameter, and is not production tested.

Figure 19. BUS Waves of Logical Value 1, 0

BUS Wave

Logical Value “1”

V_rec_0

TH_rec

TH_dom

Ttx_1_dom_m

Ttx_0_lo_dom

Ttx_0_lo_rec Ttx_0_hi

Ttx_1_lo_dom

Ttx_1_lo_rec

V_rec_1

TH_rec

TH_dom

Ttx_dif

Tbit

BUS Wave

Logical Value “0”

Note1 These parameters show the ratio for VBAT.

(Note1)

14/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Application Example

Figure 20. Application Example of Secondary Clock Master Option

Power Dissipation

Figure 21. Power Dissipation

(Note 1) Measured Board (70mm x 70mm x 1.6mm, glass epoxy 1-layer)

(Note 2) These values are changed by number of layer and copper foil area.

BD41000AFJ-C

Regulator

Micro

Controller

(Note 1)

INT

CLK(3)

VDD MS(8)

TXD(4)

RXD(1)

NSLP(2) GND(5)

BUS(6)

BAT(7)

10kΩ2.7kΩ(Note 2)2.7kΩ

GND 220pF

100nF

Note 2 While using slave, Pullup registor is no need for CLK in the case of non-using CLK output.

Slave node (Applicable secondary clock master option)

RXD

TXD

CLK

I/O

Note 1 INT: Interrupt, RXD: UART RXD, TXD: UART TXD, CLK: Clock, I/O: General Purpose I/O

CXPI BUS VECU

I/O

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

025 50 75 100 125 150

Power dissipation Pd[W]

Temp Ta [℃]

0.67W

θja = 185.2℃/W

15/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

I/O Equivalent Circuits

Type

Equivalence Circuit

Type

Equivalence Circuit

Output pin: RXD

Input pin: NSLP, TXD

Input/output pin: CLK

CXPI BUS Input/output pin: BUS

Input pin: MS

BUS

BAT

1/2 x BAT

16/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

17/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Operational Notes – continued

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 22. Example of Monolithic IC Structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within

the Area of Safe Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls

below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

N N

P+PN N

P+

P Substrate

GND

NP+N N

P+

P Substrate

GND GND

Parasitic

Elements

Pin A

Pin B Pin B

B C

EParasitic

Elements

GND

Parasitic

Elements

Transistor (NPN)Resistor

N Region

close-by

Parasitic

Elements

18/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Ordering Information

－

Part Number

Package

FJ: SOP-J8

Product Rank

C: for Automotive

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagrams

Part Number Marking

Package

Orderable Part Number

4100A

SOP-J8

BD41000AFJ-CE2

SOP-J8 (TOP VIEW)

4100A

Part Number Marking

LOT Number

1PIN MARK

19/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Physical Dimension, Tape and Reel Information

Package Name

SOP-J8

20/20

BD41000AFJ-C

TSZ02201-0E2E0H600190-1-2

2019.03.26 Rev.003

www.rohm.com

TSZ22111 • 15 • 001

Revision History

Date

Revision

Changes

08.Aug.2017

001

New Release

(For additional information, the changed contents is shown from BD41000FJ-C Rev0.02)

All Modified from BD41000FJ-C to BD41000AFJ-C

P5 Added detail information about wakeup decision method of slave node

P7 Added detail information about wakeup decision method of master node

P9,P10 Modified arbitration function explanation

P18 Modified ordering information and marking diagrams

21.Seq.2017

002

P12 Added explanation of RL

26.Mar.2019

003

P1 Added the ApplicationNote information

P9 1. In case of collision is happened by transmitting from other node at the same

time

Added a caution about the time to validate the transmit after an arbitration

defeat occurred.

Notice-PAA-E Rev.004

Notice

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6.In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8.Confirm that operation temperature is within the specified range described in the product specification.

9.ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or

concerning such information.