MC7457RX1000LB - Freescale Semiconductor, Inc.

Freescale Semiconductor

Technical Data

This hardware specification is primarily concerned with the

MPC7457; however, unless otherwise noted, all information here

also applies to the MPC7447. The MPC7457 and MPC7447 are

implementations of the PowerPC™ microprocessor family of

reduced instruction set computer (RISC) microprocessors. This

hardware specification describes pertinent electrical and physical

characteristics of the MPC7457. For functional characteristics of

the processor , refer to the MPC7450 RISC Microprocessor Family

User’s Manual.

To locate any published updates for this hardware specification,

refer to the website at http://www.Freescale.com.

1 Overview

The MPC7457 is the fourth implementation of the fourth

generation (G4) microprocessors from Freescale. The MPC7457

implements the full PowerPC 32-bit architecture and is targeted at

networking and co mputing systems applications. The MPC7457

consists of a processor core, a 512-Kbyte L2, and an internal L3

tag and controller that support a glueless backside L3 cache

through a dedicated high-bandwidth interface. The MPC7447 is

identical to the MPC7457 except that it does not support the L3

cache interface.

Figure 1 shows a block diagram of the MPC7457. The core is a

high-performance superscalar design supporting a

double-precision floating-point unit and a SIMD multimedia unit.

MPC7457EC

Rev. 6, 08/2005

Contents

1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. Comparison with the MPC7455 , MPC7445,

MPC7450, MPC7451, and MPC7441 . . . . . . . . . . . . 7

4. General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5. Electrical and Thermal Characteristics . . . . . . . . . . . 10

6. Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7. Pinout Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 41

9. System Design Information . . . . . . . . . . . . . . . . . . . 47

10. Document Revision History . . . . . . . . . . . . . . . . . . . 61

1 1. Part Numbering and Marking . . . . . . . . . . . . . . . . . . 63

MPC7457

RISC Microprocessor

Hardware Specifications

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

2Freescale Semiconductor

Overview

Figure 1. MPC7457 Block Diagram

Integer

Reservation

Station

Unit 2

Integer

Reservation

Station

Unit 2

Additional Features

• Time Base Counter/Decrementer

• Clock Multiplier

• JTAG/COP Interface

• Thermal/Power Management

• Performance Monitor

x ÷

FPSCR

+ x ÷

Instruction Unit Instruction Queue

(12-Word)

96-Bit (3 Instructions)

Reservation

Integer

128-Bit (4 Instructions)

32-Bit

Floating-

Point Unit

64-Bit

Reservation

Load/Store Unit

(EA Calculation)

Finished

32-Bit

Completion Unit

Completion Queue

(16-Entry)

Tag s 32-Kbyte

D Cache

36-Bit 64-Bit

Integer

Stations (2)

Reservation

Station

Reservation

Stations (2) FPR File

16 Rename

Buffers

Stations (2-Entry)

GPR File

16 Rename

Buffers

Reservation

Station

VR File

16 Rename

Buffers

64-Bit

128-Bit

Completes up

Completed

Instruction MMU

SRs

(Shadow)

128-Entry

IBAT Array

ITLB Ta g s 32-Kbyte

I Cache

Stores

Load Miss

Vector

To u c h

Queue

(3)

VR Issue FPR Issue

Branch Processing Unit

CTR

BTIC (128-Entry)

BHT (2048-Entry)

Fetcher

GPR Issue

(6-Entry/3-Issue) (4-Entry/2-Issue) (2-Entry/1-Issue)

Dispatch

Unit Data MMU

SRs

(Original)

128-Entry

DBAT Array

DTLB

Vector Touch Engine

32-Bit

L1 Castout

Status

L2 Store Queue (L2SQ)

Vector

FPU

Reservation

Station

Reservation

Station

Reservation

Station

Vector

Integer

Unit 1

Vector

Integer

Unit 2

Vector

Permute

Unit

Line

Tags

Block 0 (32-Byte)

Status

Block 1 (32-Byte)

Memory Subsystem

Snoop Push/

Interventions

L1 Castouts

Bus Accumulator

L1 Push

(4)

Unit 2 Unit 1

to three

per clock

instructions

L1 Load Queue (LLQ)

L1 Load Miss (5)

Cacheable Store Request(1)

Instruction Fetch (2)

L1 Service

L1 Store Queue

(LSQ)

L3 Cache Controller

L3CR

StatusTags

Bus Accumulator

Block 0/1

Line

System Bus Interface

L2 Prefetch (3)

64-Bit Data

(8-Bit Parity)

External SRAM

Address Bus Data Bus

Queues

Castout

Bus Store Queue

Push

Load

Queue (11)

Queue (9)/

Queue (10) 2

Notes: 1. The L3 cache interface is not implemented on the MPC7447.

2. The Castout Queue and Push Queue share resources such for a combined total of 10 entries.

The Castout Queue itself is limited to 9 entries, ensuring 1 entry will be available for a push.

512-Kbyte Unified L2 Cache Controller

19-Bit Address

(1, 2, or 4 Mbytes)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 3

Features

The memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol to main memory

and other system resources. The L3 interface supports 1, 2, or 4 Mbytes of external SRAM for L3 cache and/or

private memory data. For systems implementing 4 Mbytes of SRAM, a maximum of 2 Mbytes may be used as cache;

the remaining 2 Mbytes must be private memory.

Note that the MPC7457 is a footprint-compatible, drop-in replacement in a MP C7455 application if the core power

supply is 1.3 V.

2Features

This section summarizes features of the MPC7457 implementation of the PowerPC architecture.

Major features of the MPC7457 are as follows:

• High-performance, superscalar microprocessor

— As many as four instructions can b e fetched from the instruction cache at a time.

— As many as three instructions can be dispatched to the is sue queues at a time.

— As many as 12 instructions can be in the instruction queue (IQ).

— As many as 16 instructions can be at some stage of execution simultaneously.

— Single-cycle execution for most instructions

— One instruction per clock cycle throughput for most instructions

— Seven-stage pipeline control

• Eleven independent execution units and three register files

— Branch processing unit (BPU) features static and dyna mic branch prediction

– 128-entry (32-set, four-way set associative) branch target instruction cache (BTIC), a cache of

branch instructions that have been encountered in branch/loop code sequences. If a target instruction

is in the BTIC, it is fetched into the instruction queue a cycle sooner than it can be made available

from the instruction cache. Typically, a fetch that hits the BTIC provides the first four instructions

in the target stream.

– 2048-entry branch history (BHT) with 2 bits per entry for 4 levels of prediction—not-taken, strongly

not-taken, taken, and strongly taken

– Up to three outstanding speculative branches

– Branch instructions that do not update the count register (CTR) or link register (LR) are often

removed from the instruction stream.

– Eight-entry link register stack to predict the target address of Branch Conditional to Link Register

(bclr) instructions

— Four integer units (IUs) that share 32 GPRs for integer operands

– Three identical IUs (IU1a, IU1b, and IU1c) can execute all integer instructions except multiply,

divide, and move to/from special-purpose register instructions

– IU2 executes miscellaneous instructions including the CR logical operations, integer multiplication

and division instructions, and move to/from special-purpose register instructions

— Five-stage FPU and a 32-entry FPR file

– Fully IEEE 754-1985 compliant FPU for both single- and double-precision operations

– Supports non-IEEE mode for time-critical operations

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

4Freescale Semiconductor

Features

– Hardware support for denormalized numbers

– Thirty-two 64-bit FPRs for single- or double-precision operands

— Four vector units and 32-ent ry vector register file (VRs)

– Vector permute unit (VPU)

– Vector integer unit 1 (VIU1) handles short-latency AltiVec™ integer instructions, such as vector add

instructions (for example, vaddsbs, vaddshs, and vaddsws)

– Vector integer unit 2 (VIU2) handles longer-latency AltiVec integer instructions, such as vector

multiply add instructions (for example, vmhaddshs, vmhraddshs, and vmladduhm)

– Vector floating-point unit (VFPU)

— Three-stage load/store unit (LSU)

– Supports integer, floating-point, and vector instruction load/store traffic

– Four-entry vector touch queue (VTQ) supports all four architected AltiVec data stream operations

– Three-cycle GPR and AltiVec load latency (byte, half-word, word, vector) with one-cycle

throughput

– Four-cycle FPR load latency (single, double) with one-cycle throughput

– No additional delay for misaligned access within double-word boundary

– Dedicated adder calculates effective addresses (EAs)

– Supports store gathering

– Performs alignment, normalization, and precision conv ersion for floating-point data

– Executes cache control and TLB instructions

– Performs alignment, zero padd ing, and sign extension fo r integer data

– Supports hits under misses (multiple outstanding misses)

– Supports both big- and little-endian modes, including misaligned little-endian accesses

• Three issue queues FIQ, VIQ, and GIQ can accept as many as one, two, and three instructions, respectively ,

in a cycle. Instruction dispatch requires the following:

— Instructions can be dispatched only from the three lowest IQ entries—IQ0, IQ1, and IQ2

— A maximum of three instructions can be dispatched to the issue queues per clock cycle

— Space must be available in the CQ for an instruction to dispatch (this includes instructions that are

assigned a space in the CQ but not in an issue queue)

• Rename buffers

— 16 GPR rename buffers

— 16 FPR rename buffers

— 16 VR rename buffers

• Dispatch unit

— Decode/dispatch stage fully decodes each instruction

• Completion uni t

— The completion unit retires an instruction from the 16-entry completion queue (CQ) when all

instructions ahead of it have been completed, the instruct ion has fini shed exec ution, an d no excepti ons

are pending.

— Guarantees sequential programming model (precise exception model)

— Monitors all dispatched instructions and retires them in order

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 5

Features

— Tracks unresolved branches and flushes instructions after a mispredicted branch

— Retires as many as three instructions per clock cycle

• Separate on-chip L1 instruction and data caches (Harvard architecture)

— 32-Kbyte, eight-way set associative instruction and data caches

— Pseudo least recently used (PLRU) replacement algorithm

— 32-byte (eight-word) L1 cache block

— Physically indexed/physical tags

— Cache write-back or write-through operation programmable on a per-page or per-block basis

— Instruction cache can provide four instructions per clock cycle; data cache can provide four words per

clock cycle

— Caches can be disabl ed in software.

— Caches can be locked in software.

— MESI data cache coherency maintained in hardware

— Separate copy of data cache ta gs for efficient snooping

— Parity support on cache and tags

— No snooping of instruction cache except for icbi instruction

— Data cache supports AltiVec LRU and transient instructions

— Critical double- and/or quad-word forwarding is performed as needed. Critical quad-word forwarding

is used for AltiVec loads and instruction fetches. Other accesses use critical double-word forwarding.

• Level 2 (L2) cache interface

— On-chip, 512-Kbyte, eight-way set associative unified instruction and data cache

— Fully pipelined to provide 32 bytes per clock cycle to the L1 caches

— A total nine-cycle load latency for an L1 data cache miss that hits in L2

— PLRU replacement algorithm

— Cache write-back or write-through operation programmable on a per-page or per-block basis

— 64-byte, two-sectored line size

— Parity support on cache

• Level 3 (L3) cache interface (not implemented on MPC7447)

— Provides critical double-word forwarding to the requesting unit

— Internal L3 cache controller and tags

— External data SRAMs

— Support for 1-, 2-, and 4- Mbyte (MB) total SRAM space

— Support for 1- or 2-MB of ca che space

— Cache write-back or write-through operation programmable on a per-page or per-block basis

— 64-byte (1-MB) or 128-byte (2-MB) sectored line size

— Private memory capability for half (1 MB minimum) or all of the L3 SRAM space for a total of 1-, 2-,

or 4-MB of private memory

— Supports MSUG2 dua l data rate (DDR) synchronou s burst SRAMs, PB2 pipelined synchronous burst

SRAMs, and pipelined (register-register) late write synchronous burst SRAMs

— Supports parity on cache and tags

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

6Freescale Semiconductor

Features

— Configurable core-to-L3 frequency divisors

— 64-bit external L3 data bus sustains 64 bits per L3 clock cycle

• Separate memory management units (MMUs) for instructions and data

— 52-bit virtual address; 32- or 36-bit physical address

— Address translation for 4-Kbyte pages, variable-sized blocks, and 256-Mbyte segments

— Memory programmable as write-back/write-through, caching-inhibited/caching-allowed, and memory

coherency enforced/memory coherency not enforced on a page or block b asis

— Separate IBATs and DBATs (eight each) also defined as SPRs

— Separate instruction and data translation lookaside buffers (TLBs)

– Both TLBs are 128-entry, two-way set associative, and use LRU replacement algorithm

– TLBs are hardware- or software-reloadable (that is, on a TLB miss a page table search is performed

in hardware or by system software)

• Efficient data flow

— Although the VR/LSU interface is 128 bits, the L1/L2/L3 bus interface allows up to 256 bits

— The L1 data cache is fully pipelined to provide 128 bits/cycle to or from the VRs

— L2 cache is fully pipelined to provide 256 bits per processor clock cycle to the L1 cache

— As many as eight outstanding, out-of-order, cache misses are allowed between the L1 data cache and

L2/L3 bus

— As many as 16 out-of-order transactions can be pres ent on the MPX bus

— Store merging for multiple store misses to the same line. Only coherency action taken (address-only)

for store misses merged to all 32 bytes of a cache block (no data tenure needed).

— Three-entry finished store queue and five-entry completed store queue between the LSU and the L1 data

cache

— Separate additional queues for efficient buf fering of outbound data (such as castouts and write-through

stores) from the L1 data cache and L2 cache

• Multiprocessing support features include the following:

— Hardware-enforced, MESI cache coherency protocols for data cache

— Load/store with reservation instruction pair for atomic memory references, semaphores, and other

multiprocessor operations

• Power and thermal management

— 1.3-V processor core

— The following three power-saving modes are available to the system:

– Nap—Instruction fetching is halted. Only those clocks for the time base, decrementer, and JTAG

logic remain running. The part goes into the doze state to snoop memory operations on the bus and

back to nap using a QREQ/QACK processor-system handshake protocol.

– Sleep—Power consumption is further reduced by disabling bus snooping, leaving only the PLL in a

locked and running state. All internal functional units are disabled.

– Deep sleep—When the part is in the sleep state, the system can disable the PLL. The system can then

disable the SYSCLK source for greater system power savings. Power-on reset procedures for

restarting and relocking the PLL must be followed on exiting the deep sleep state.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 7

Comparison with the MPC7455, MPC7445, MPC7450, MPC7451, and MPC7441

— Thermal management facility provides software-controllable thermal management. Thermal

management is performed through the use of three supervisor -level registers and an MPC7457-specific

thermal management exception.

— Instruction cache throttling provides control of instruction fetching to limit power consumption

• Performance monitor can be used to help debug system designs and improve software efficiency

• In-system testability and debugging features through JTAG boundary-scan capability

• Testability

— LSSD scan design

— IEEE 1149.1 JTAG interface

— Array built-in self test (ABIST)—factory test only

• Reliability and serviceability

— Parity checking on system bus and L3 cache bus

— Parity checking on the L2 and L3 cache tag arrays

3 Comparison with the MPC7455, MPC7445, MPC7450,

MPC7451, and MPC7441

Table 1 compares the key features of the MPC7457 with the key features of the earlier MPC7455, MPC7445,

MPC7450, MPC7451, and MPC7441. To achieve a higher frequency, the number of logic levels per cycle is

reduced. Also, to achieve this higher frequency, the pipeline of the MPC7457 is extended (compared to the

MPC7400), while maintaining the same level of performance as measured by the number of instructions executed

per cycle (IPC).

Table 1. Microarchitecture Comparison

Microarchitectural Specs MPC7457/MPC7447 MPC7455/MPC7445 MPC7450/MPC7451/

MPC7441

Basic Pipeline Functions

Logic inversions per cycle 18 18 18

Pipeline stages up to execute 5 5 5

Total pipeline stages (minimum) 7 7 7

Pipeline maximum instruction throughput 3 + Branch 3 + Branch 3 + Branch

Pipeline Resources

Instruction buffer size 12 12 12

Completion buffer size 16 16 16

Renames (integer, float, vector) 16, 16, 16 16, 16, 16 16, 16, 16

Maximum Execution Throughput

SFX 333

Vector 2 (any 2 of 4 units) 2 (any 2 of 4 units) 2 (any 2 of 4 units)

Scalar floating-point 1 1 1

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

8Freescale Semiconductor

Comparison with the MPC7455, MPC7445, MPC7450, MPC7451, and MPC7441

Out-of-Order Window Size in Execution Queues

SFX integer units 1 entry ×3 queues 1 entry ×3 queues 1 entry ×3 queues

Vector units In order, 4 queues In order, 4 queues In order, 4 queues

Scalar floating-point unit In order In order In order

Branch Processing Resources

Prediction structures BTIC, BHT, link stack BTIC, BHT, link stack BTIC, BHT, link stack

BTIC size, associativity 128-entry, 4-way 128-entry, 4-way 128-entry, 4-way

BHT size 2K-entry 2K-entry 2K-entry

Link stack depth 8 8 8

Unresolved branches supported 3 3 3

Branch taken penalty (BTIC hit) 1 1 1

Minimum misprediction penalty 6 6 6

Execution Unit Timings (Latency-Throughput)

Aligned load (integer, float, vector) 3-1, 4-1, 3-1 3-1, 4-1, 3-1 3-1, 4-1, 3-1

Misaligned load (integer, float, vector) 4-2, 5-2, 4-2 4-2, 5-2, 4-2 4-2, 5-2, 4-2

L1 miss, L2 hit latency 9 data/13 instruction 9 data/13 instruction 9 data/13 instruction

SFX (aDd Sub, Shift, Rot, Cmp, logicals) 1-1 1-1 1-1

Integer multiply (32 × 8, 32 × 16, 32 × 32) 3-1, 3-1, 4-2 3-1, 3-1, 4-2 3-1, 3-1, 4-2

Scalar float 5-1 5-1 5-1

VSFX (vector simple) 1-1 1-1 1-1

VCFX (vector complex) 4-1 4-1 4-1

VFPU (vector float) 4-1 4-1 4-1

VPER (vector permute) 2-1 2-1 2-1

MMUs

TLBs (instruction and data) 128-entry, 2-way 128-entry, 2-way 128-entry, 2-way

Tablewalk mechanism Hardware + software Hardware + software Hardware + software

Instruction BATs/data BATs 8/8 8/8 4/4

L1 I Cache/D Cache Features

Size 32K/32K 32K/32K 32K/32K

Associativity 8-way 8-way 8-way

Locking granularity Way Way Way

Table 1. Microarchitecture Comparison (continued)

Microarchitectural Specs MPC7457/MPC7447 MPC7455/MPC7445 MPC7450/MPC7451/

MPC7441

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 9

Comparison with the MPC7455, MPC7445, MPC7450, MPC7451, and MPC7441

Parity on I cache Word Word Word

Parity on D cache Byte Byte Byte

Number of D cache misses (load/store) 5/1 5/1 5/1

Data stream touch engines 4 streams 4 streams 4 streams

On-Chip Cache Features

Cache level L2L2L2

Size/associativity 512-Kbyte/8-way 256-Kbyte/8-way 256-Kbyte/8-way

Access width 256 bits 256 bits 256 bits

Number of 32-byte sectors/line 2 2 2

Parity Byte Byte Byte

Off-Chip Cache Support 1

Cache level L3L3L3

Total SRAM space supported 1 MB, 2MB, 4 MB 21 MB, 2 MB 1 MB, 2 MB

On-chip tag logical size (cache space) 1 MB, 2 MB 1 MB, 2 MB 1 MB, 2 MB

Associativity 8-way 8-way 8-way

Number of 32-byte sectors/line 2, 4 2, 4 2, 4

Off-Chip data SRAM support MSUG2 DDR, LW, PB2 MSUG2 DDR, LW, PB2 MSUG2 DDR, LW, PB2

Data path width 64 64 64

Direct mapped SRAM sizes 1 MB, 2 MB, 4 MB 1 MB, 2 MB 1 MB, 2 MB

Parity Byte Byte Byte

Notes:

1. Not implemented on MPC7447, MPC7445, or MPC7441.

2. The MPC7457 supports up to 4 MB of SRAM, of which a maximum of 2 MB can be configured as cache memory; the

remaining 2 MB may be unused or configured as private memory.

Table 1. Microarchitecture Comparison (continued)

Microarchitectural Specs MPC7457/MPC7447 MPC7455/MPC7445 MPC7450/MPC7451/

MPC7441

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

10 Freescale Semiconductor

General Parameters

4 General Parameters

The following list provides a su mmary of the general parameters of the MPC7457:

Technology 0.13 µm CMOS, nine-layer metal

Die size 9.1 mm × 10.8 mm

Transistor count 58 million

Logic design Fully-static

Packages MPC7447: Surface mount 360 ceramic ball grid array (CBGA)

MPC7457: Surface mount 483 ceramic ball grid array (CBGA)

Core power supply 1.3 V ±50 mV DC nomin al

I/O power supply 1.8 V ±5% DC, or

2.5 V ±5% DC, or

1.5 V ±5% DC (L3 interface only, not implemented on MPC744 7)

5 Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7457.

5.1 DC Electrical Characteristics

The tables in this section describe the MPC7457 DC electrical cha racteristics.Table 2 provides the absolute

maximum ratings.

Table 2. Absolute Maximum Ratings 1

Characteristic Symbol Maximum Value Unit Notes

Core supply voltage VDD –0.3 to 1.60 V 2

PLL supply voltage AVDD –0.3 to 1.60 V 2

Processor bus supply voltage BVSEL = 0 OVDD –0.3 to 1.95 V 3, 4

BVSEL = HRESET or OVDD OVDD –0.3 to 2.7 V 3, 5

L3 bus supply voltage L3VSEL = ¬HRESET GVDD –0.3 to 1.65 V 3, 6

L3VSEL = 0 GVDD –0.3 to 1.95 V 3, 7

L3VSEL = HRESET or GVDD GVDD –0.3 to 2.7 V 3, 8

Input voltage Processor bus Vin –0.3 to OVDD + 0.3 V 9, 10

L3 bus Vin –0.3 to GVDD + 0.3 V 9, 10

JTAG signals Vin –0.3 to OVDD + 0.3 V

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 11

Electrical and Thermal Characteristics

Figure 2 shows the undershoot and overshoot voltage on the MPC7457.

Figure 2. Overshoot/Undershoot Voltage

The MPC7457 provides several I/O voltages to support both compatibility with existing systems and migration to

future systems. The MPC7457 core voltage must always be provided at nominal 1.3 V (see Table 4 for actual

recommended core voltage). Voltage to the L3 I/Os and processor interface I/Os are provided through separate sets

of supply pins and may be provided at the voltages shown in Table 3. The input voltage threshold for each bus is

selected by sampling the state of the voltage select pins at the negation of the signal HRESET. The output voltage

will swing from GND to the maximum voltage applied to the OVDD or GVDD power pins.

Storage temperature range Tstg –55 to 150 °C

Notes:

1. Functional and tested operating conditions are given in Ta b l e 4 . Absolute maximum ratings are stress ratings only, and

functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. Caution: VDD/AVDD must not exceed OVDD/GVDD by more than 1.0 V during normal operation; this limit may be exceeded

for a maximum of 20 ms during power-on reset and power-down sequences.

3. Caution: OVDD/GVDD must not exceed VDD/AVDD by more than 2.0 V during normal operation; this limit may be exceeded

for a maximum of 20 ms during power-on reset and power-down sequences.

4. BVSEL must be set to 0, such that the bus is in 1.8-V mode.

5. BVSEL must be set to HRESET or 1, such that the bus is in 2.5-V mode.

6. L3VSEL must be set to ¬HRESET (inverse of HRESET), such that the bus is in 1.5-V mode.

7. L3VSEL must be set to 0, such that the bus is in 1.8-V mode.

8. L3VSEL must be set to HRESET or 1, such that the bus is in 2.5-V mode.

9. Caution: Vin must not exceed OVDD or GVDD by more than 0.3 V at any time including during power-on reset.

10. Vin may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.

Table 2. Absolute Maximum Ratings 1 (continued)

Characteristic Symbol Maximum Value Unit Notes

VIH

GND

GND – 0.3 V

GND – 0.7 V

Not to exceed 10%

OVDD/GVDD + 20%

VIL

OVDD/GVDD

OVDD/GVDD + 5%

of tSYSCLK

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

12 Freescale Semiconductor

Electrical and Thermal Characteristics

Table 4 provides the recommended operating conditions for the MPC7457.

Table 3. Input Threshold Voltage Setting

BVSEL Signal Processor Bus Input Threshold

is Relative to: L3VSEL Signal 1 L3 Bus Input Threshold is

Relative to: Notes

0 1.8 V 0 1.8 V 2, 3

¬HRESET Not Available ¬HRESET 1.5 V 2, 4

HRESET 2.5 V HRESET 2.5 V 2

1 2.5 V 1 2.5 V 2

Notes:

1. Not implemented on MPC7447.

2. Caution: The input threshold selection must agree with the OVDD/GVDD voltages supplied. See notes in Ta bl e 2 .

3. If used, pull-down resistors should be less than 250 Ω.

4. Applicable to L3 bus interface only. ¬HRESET is the inverse of HRESET.

Table 4. Recommended Operating Conditions 1

Characteristic Symbol

Recommended Value

Unit Notes

Min Max

Core supply voltage VDD 1.3 V ± 50 mV V

PLL supply voltage AVDD 1.3 V ± 50 mV V 2

Processor bus supply voltage BVSEL = 0 OVDD 1.8 V ± 5% V

BVSEL = HRESET or OVDD OVDD 2.5 V ± 5% V

L3 bus supply voltage L3VSEL = 0 GVDD 1.8 V ± 5% V

L3VSEL = HRESET or GVDD GVDD 2.5 V ± 5% V

L3VSEL = ¬HRESET GVDD 1.5 V ± 5% V 3

Input voltage Processor bus Vin GND OVDD V

L3 bus Vin GND GVDD V

JTAG signals Vin GND OVDD V

Die-junction temperature Tj0105°C

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not

guaranteed.

2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the voltage

at the AVDD pin, which may be reduced from VDD by the filter.

3. ¬HRESET is the inverse of HRESET.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 13

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7457.

Table 6 provides the DC electrical characteristics for the MPC7457.

Table 5. Package Thermal Characteristics 1

Characteristic Symbol

Value

Unit Notes

MPC7447 MPC7457

Junction-to-ambient thermal resistance, natural convection RθJA 22 20 °C/W 2, 3

Junction-to-ambient thermal resistance, natural convection,

four-layer (2s2p) board

RθJMA 14 14 °C/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

single-layer (1s) board

RθJMA 16 15 °C/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

four-layer (2s2p) board

RθJMA 11 11 °C/W 2, 4

Junction-to-board thermal resistance RθJB 66°C/W5

Junction-to-case thermal resistance RθJC <0.1 <0.1 °C/W 6

Coefficient of thermal expansion 6.8 6.8 ppm/°C

Notes:

1. Refer to Section 9.8, “Thermal Management Information,” for more details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Ta b l e 4 .

Characteristic

Nominal

Bus

Voltage 1

Symbol Min Max Unit Notes

Input high voltage

(all inputs including SYSCLK)

1.5 VIH GVDD × 0.65 GVDD + 0.3 V 2

1.8 OVDD/GVDD × 0.65 OVDD/GVDD + 0.3 V

2.5 1.7 OVDD/GVDD + 0.3 V

Input low voltage

(all inputs including SYSCLK)

1.5 VIL –0.3 GVDD × 0.35 V 2, 6

1.8 –0.3 OVDD/GVDD × 0.35 V

2.5 –0.3 0.7 V

Input leakage current, Vin = GVDD/OVDD —I

in —30µA2, 3

High-impedance (off-state) leakage

current, Vin = GVDD/OVDD

—I

TSI — 30 µA 2, 3, 4

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

14 Freescale Semiconductor

Electrical and Thermal Characteristics

Table 7 provides the power consumption for the MPC7457.

Output high voltage, IOH = –5 mA 1.5 VOH OVDD/GVDD – 0.45 — V 6

1.8 OVDD/GVDD – 0.45 — V

2.5 1.8 — V

Output low voltage, IOL = 5 mA 1.5 VOL —0.45V6

1.8 — 0.45 V

2.5 — 0.6 V

Capacitance,

Vin = 0 V, f = 1 MHz

L3 interface — Cin —9.5pF5

All other inputs — 8.0

Notes:

1. Nominal voltages; see Ta bl e 4 for recommended operating conditions.

2. For processor bus signals, the reference is OVDD while GVDD is the reference for the L3 bus signals.

3. Excludes test signals and IEEE 1149.1 boundary scan (JTAG) signals.

4. The leakage is measured for nominal OVDD/GVDD and VDD, or both OVDD/GVDD and VDD must vary in the same direction

(for example, both OVDD and VDD vary by either +5% or –5%).

5. Capacitance is periodically sampled rather than 100% tested.

6. Applicable to L3 bus interface only.

Table 7. Power Consumption for MPC7457

Processor (CPU) Frequency

Unit Notes

867 MHz 1000 MHz 1200 MHz 1267 MHz

Full-Power Mode

Typical 14.8 15.8 17.5 18.3 W 1, 2

Maximum 21.0 22.0 24.2 25.6 W 1, 3

Nap Mode

Typical 5.2 5.2 5.2 5.2 W 1, 2

Sleep Mode

Typical 5.1 5.1 5.1 5.1 W 1, 2

Table 6. DC Electrical Specifications (continued)

At recommended operating conditions. See Ta b l e 4 .

Characteristic

Nominal

Bus

Voltage 1

Symbol Min Max Unit Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 15

Electrical and Thermal Characteristics

5.2 AC Electrical Characteristics

This section provides the AC electrical characteristics for the MPC7457. After fabrication, functional parts are

sorted by maximum processor core frequency as shown in Section 1.5.2.1, “Clock AC Specifications,” and tested

for conformance to the AC specifications for that frequency. The processor core frequency is determined by the bus

(SYSCLK) frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core

frequency; see Section 1.11, “Ordering Information.”

5.2.1 Clock AC Specifications

Table 8 provides the clock AC timing specifications as defined in Figure 6 and represents the tested operating

frequencies of the devices. The maximum system bus frequency , fSYSCLK, given in Table 8 is considered a practical

maximum in a typical single-processor system. The actual maximum SYSCLK frequency for any application of the

MPC7457 will be a function of the AC timings of the MPC7457, the AC timings for the system controller, bus

loading, printed-circuit board topology, trace lengths, and so forth, and may be less than the value given in Table 8.

For information regarding the use of spread spectrum clock generators, see Section 9.1.3, “System Bus Clock

(SYSCLK) and Spread Spectrum Sources.” PLL configuration and bus-to-core multiplier information is found in

Section 9.1.1, “Core Clocks and PLL Configuration.”

Deep Sleep Mode (PLL Disabled)

Typical 5.0 5.0 5.0 5.0 W 1, 2

Notes:

1. These values apply for all valid processor bus and L3 bus ratios. The values do not include I/O supply power (OVDD and

GVDD) or PLL supply power (AVDD). OVDD and GVDD power is system dependent, but is typically <5% of VDD power. Worst

case power consumption for AVDD < 3 mW.

2. Typical power is an average value measured at the nominal recommended VDD (see Ta b l e 4 ) and 65°C while running the

Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz.

3. Maximum power is the average measured at nominal VDD and maximum operating junction temperature (see Ta b l e 4 ) while

running an entirely cache-resident, contrived sequence of instructions which keep all the execution units maximally busy.

4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a

result, power consumption for this mode is not tested.

Table 8. Clock AC Timing Specifications

At recommended operating conditions. See Ta b l e 4 .

Characteristic Symbol

Maximum Processor Core Frequency

Unit Notes867 MHz 1000 MHz 1200 MHz 1267 MHz

Min Max Min Max Min Max Min Max

Processor frequency fcore 600 867 600 1000 600 1200 600 1267 MHz 1

VCO frequency fVCO 1200 1733 1200 2000 1200 2400 1200 2534 MHz 1

SYSCLK frequency fSYSCLK 33 167 33 167 33 167 33 167 MHz 1, 2

Table 7. Power Consumption for MPC7457 (continued)

Processor (CPU) Frequency

Unit Notes

867 MHz 1000 MHz 1200 MHz 1267 MHz

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

16 Freescale Semiconductor

Electrical and Thermal Characteristics

Figure 3 provides the SYSCLK input timing diagram.

Figure 3. SYSCLK Input Timing Diagram

5.2.2 Processor Bus AC Specifications

Table 9 provides the processor bus AC timing specifications for the MPC7457 as defined in Figure 4 and Figure 5.

Timing specifications for the L3 bus are provided in Section 5.2.3, “L3 Clock AC Specifications.”

SYSCLK cycle time tSYSCLK 6.0 30 6.0 30 6.0 30 6.0 30 ns 2

SYSCLK rise and fall time tKR, tKF —1.0—1.0—1.0—1.0 ns 3

SYSCLK duty cycle measured

at OVDD/2

tKHKL/

tSYSCLK

40 60 40 60 40 60 40 60 % 4

SYSCLK cycle-to-cycle jitter — 150 — 150 — 150 — 150 ps 5, 6

Internal PLL relock time —100—100—100—100 µs7

Notes:

1. Caution: The SYSCLK frequency and PLL_CFG[0:4] settings must be chosen such that the resulting SYSCLK (bus)

frequency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating

frequencies. Refer to the PLL_CFG[0:4] signal description in Section 1.9.1, “PLL Configuration,” for valid PLL_CFG[0:4]

settings.

2. Assumes lightly-loaded, single-processor system; see Section 5.2.1, “Clock AC Specifications” for more information.

3. Rise and fall times for the SYSCLK input measured from 0.4 to 1.4 V.

4. Timing is guaranteed by design and characterization.

5. Guaranteed by design.

6. The SYSCLK driver’s closed loop jitter bandwidth should be less than 1.5 MHz at –3 dB.

7. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for

PLL lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies

when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held

asserted for a minimum of 255 bus clocks after the PLL-relock time during the power-on reset sequence.

Table 8. Clock AC Timing Specifications (continued)

At recommended operating conditions. See Ta b l e 4 .

Characteristic Symbol

Maximum Processor Core Frequency

Unit Notes867 MHz 1000 MHz 1200 MHz 1267 MHz

Min Max Min Max Min Max Min Max

SYSCLK VMVMVM CVIH

CVIL

VM = Midpoint Voltage (OVDD/2)

tSYSCLK

tKR tKF

tKHKL

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 17

Electrical and Thermal Characteristics

Table 9. Processor Bus AC Timing Specifications 1

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol 2

All Revisions and

Speed Grades Unit Notes

Min Max

Input setup times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,

TT[0:3], QACK, TA, TBEN, TEA, TS, EXT_QUAL,

PMON_IN, SHD[0:1], BMODE[0:1],

BMODE[0:1], BVSEL, L3VSEL

tAVKH

tDVKH

tIVKH

tMVKH

1.8

—

Input hold times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL, TT[0:3],

QACK, TA, TBEN, TEA, TS, EXT_QUAL, PMON_IN,

HD[0:1]

BMODE[0:1], BVSEL, L3VSEL

tAXKH

tDXKH

tIXKH

tMXKH

—

Output valid times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT,

PMON_OUT, QREQ, TBST, TSIZ[0:2], TT[0:3], TS,

SHD[0:1], WT

tKHAV

tKHDV

tKHOV

—

2.0

Output hold times:

A[0:35], AP[0:4]

D[0:63], DP[0:7]

AACK, ARTRY, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT,

PMON_OUT, QREQ, TBST, TSIZ[0:2], TT[0:3], TS,

SHD[0:1], WT

tKHAX

tKHDX

tKHOX

0.5

—

SYSCLK to output enable tKHOE 0.5 — ns

SYSCLK to output high impedance (all except TS, ARTRY,

SHD0, SHD1)

tKHOZ —3.5ns

SYSCLK to TS high impedance after precharge tKHTSPZ —1t

SYSCLK 3, 4, 5

Maximum delay to ARTRY/SHD0/SHD1 precharge tKHARP —1t

SYSCLK 3, 5

6, 7

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

18 Freescale Semiconductor

Electrical and Thermal Characteristics

Figure 4 provides the AC test load for the MPC7457.

Figure 4. AC Test Load

SYSCLK to ARTRY/SHD0/SHD1 high impedance after

precharge

tKHARPZ —2t

SYSCLK 3, 5

6, 7

Notes:

1. All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input

SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the signal

in question. All output timings assume a purely resistive 50-Ω load (see Figure 4). Input and output timings are measured at

the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. The symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and

t(reference)(state)(signal)(state) for outputs. For example, tIVKH symbolizes the time input signals (I) reach the valid state (V)

relative to the SYSCLK reference (K) going to the high (H) state or input setup time. And tKHOV symbolizes the time from

SYSCLK(K) going high (H) until outputs (O) are valid (V) or output valid time. Input hold time can be read as the time that

the input signal (I) went invalid (X) with respect to the rising clock edge (KH) (note the position of the reference and its state

for inputs) and output hold time can be read as the time from the rising edge (KH) until the output went invalid (OX).

3. tsysclk is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by the period of

SYSCLK to compute the actual time duration (in ns) of the parameter in question.

4. According to the bus protocol, TS is driven only by the currently active bus master. It is asserted low then precharged high

before returning to high impedance as shown in Figure 6. The nominal precharge width for TS is 0.5 × tSYSCLK, that is, less

than the minimum tSYSCLK period, to ensure that another master asserting TS on the following clock will not contend with

the precharge. Output valid and output hold timing is tested for the signal asserted. Output valid time is tested for

precharge.The high-impedance behavior is guaranteed by design.

5. Guaranteed by design and not tested.

6. According to the bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following

AACK. Bus contention is not an issue because any master asserting ARTRY will be driving it low. Any master asserting it

low in the first clock following AACK will then go to high impedance for one clock before precharging it high during the second

cycle after the assertion of AACK. The nominal precharge width for ARTRY is 1.0 tSYSCLK; that is, it should be high

impedance as shown in Figure 6 before the first opportunity for another master to assert ARTRY

. Output valid and output

hold timing is tested for the signal asserted.The high-impedance behavior is guaranteed by design.

7. According to the MPX bus protocol, SHD0 and SHD1 can be driven by multiple bus masters beginning the cycle of TS.

Timing is the same as ARTRY

, that is, the signal is high impedance for a fraction of a cycle, then negated for up to an entire

cycle (crossing a bus cycle boundary) before being three-stated again. The nominal precharge width for SHD0 and SHD1

is 1.0 tSYSCLK. The edges of the precharge vary depending on the programmed ratio of core to bus (PLL configurations).

8. BMODE[0:1] and BVSEL are mode select inputs and are sampled before and after HRESET negation. These parameters

represent the input setup and hold times for each sample. These values are guaranteed by design and not tested. These

inputs must remain stable after the second sample. See Figure 5 for sample timing.

Table 9. Processor Bus AC Timing Specifications 1 (continued)

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol 2

All Revisions and

Speed Grades Unit Notes

Min Max

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 19

Electrical and Thermal Characteristics

Figure 5 provides the mode select input timing diagram for the MPC7457.

Figure 5. Mode Input Timing Diagram

Figure 6 provides the input/output timing diagram for the MPC7457.

Figure 6. Input/Output Timing Diagram

HRESET

Mode Signals

VM = Midpoint Voltage (OVDD/2)

SYSCLK

1st Sample 2nd Sample

VM VM

SYSCLK

All Inputs

VM = Midpoint Voltage (OVDD/2)

All Outputs tKHOX

tKHDV

(Except TS,

ARTRY, SHD0, SHD1)

All Outputs

ARTRY,

(Except TS,

ARTRY, SHD0, SHD1)

KHOE

KHOZ

KHTSPZ

KHARPZ

KHARP

SHD1

SHD0,

tKHOV

tKHAV

tKHDX

tKHAX

tIXKH

tAXKH

tKHTSX

KHTSV

tKHTSV

KHARV

KHARX

tIVKH

tAVKH

tMVKH

tMXKH

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

20 Freescale Semiconductor

Electrical and Thermal Characteristics

5.2.3 L3 Clock AC Specifications

The L3_CLK frequency is programm ed by the L3 configuration register core-to-L3 divisor ratio. See Table 18 for

example core and L3 frequencies at various divisors. Table 10 provides the potential range of L3_CLK output AC

timing specifications as defined in Figure 7.

The maximum L3_CLK frequency is the core frequency divi ded by two. Given the high core frequencies available

in the MPC7457, however , most SRAM designs will be not be able to operate in this mode using current technology

and, as a result, will select a greater core-to-L3 divisor to provide a longer L3_CLK period for read and write access

to the L3 SRAMs. Therefore, the typical L3_CLK frequency shown in Table 10 is considered to be the practical

maximum in a typical system. The maximum L3_CLK frequency for any application of the MPC7457 will be a

function of the AC timings of the MPC7457, the AC timings for the SRAM, bus loading, and printed-circuit board

trace length, and may be greater or less than the value given in Table 10. Note that SYSCLK input jitter and

L3_CLK[0:1] output jitter are already comprehended in the L3 bus AC timing specifications and do not need to be

separately accounted for in an L3 AC timing analysis. Clock skews, where applicable, do need to be accounted for

in an AC timing analysis.

Freescale is similarly limited by system constraints and cannot perform tests of the L3 interface on a socketed part

on a functional tester at the maximum frequencies of Table 10. Therefore, functional operation and AC timing

information are tested at core-to-L3 divisors which result in L3 frequencies at 250 MHz or lower.

Table 10. L3_CLK Output AC Timing Specifications

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol

Device Revision (L3 I/O Voltage) 6

Unit Notes

Rev 1.1. (All I/O Modes)

Rev 1.2 (1.5-V I/O Mode)

Rev 1.2

(1.8-, 2.5-V I/O Modes)

Min Typ Max Min Typ Max

L3 clock frequency fL3_CLK —200— —250—MHz1

L3 clock cycle time tL3_CLK — 5.0 — — 4.0 — ns 1

L3 clock duty cycle tCHCL/tL3_CLK —50——50— % 2

L3 clock output-to-output skew

(L3_CLK0 to L3_CLK1)

tL3CSKW1 — — 100 — — 100 ps 3

L3 clock output-to-output skew

(L3_CLK[0:1] to

L3_ECHO_CLK[1,3])

tL3CSKW2 — — 100 — — 100 ps 4

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 21

Electrical and Thermal Characteristics

The L3_CLK timing diagram is shown in Figure 7.

Figure 7. L3_CLK_OUT Output Timing Diagram

L3 clock jitter — — ± 75 — — ± 75 ps 5

Notes:

1. The maximum L3 clock frequency (and minimum L3 clock period) will be system dependent. See Section 5.2.3, “L3 Clock

AC Specifications,” for an explanation that this maximum frequency is not functionally tested at speed by Freescale. The

minimum L3 clock frequency and period are fSYSCLK and tSYSCLK, respectively.

2. The nominal duty cycle of the L3 output clocks is 50% measured at midpoint voltage.

3. Maximum possible skew between L3_CLK0 and L3_CLK1. This parameter is critical to the address and control signals which

are common to both SRAM chips in the L3.

4. Maximum possible skew between L3_CLK0 and L3_ECHO_CLK1 or between L3_CLK1 and L3_ECHO_CLK3 for PB2 or

Late Write SRAM. This parameter is critical to the read data signals because the processor uses the feedback loop to latch

data driven from the SRAM, each of which drives data based on L3_CLK0 or L3_CLK1.

5. Guaranteed by design and not tested. The input jitter on SYSCLK affects L3 output clocks and the L3 address, data, and

control signals equally and, therefore, is already comprehended in the AC timing and does not have to be considered in the

L3 timing analysis. The clock-to-clock jitter shown here is uncertainty in the internal clock period caused by supply voltage

noise or thermal effects. This is also comprehended in the AC timing specifications and need not be considered in the L3

timing analysis.

6. L3 I/O voltage mode must be configured by L3VSEL as described in Ta b l e 3 , and voltage supplied at GVDD must match

mode selected as specified in Ta bl e 4 . See Tabl e 23 for revision level information and part marking.

Table 10. L3_CLK Output AC Timing Specifications (continued)

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol

Device Revision (L3 I/O Voltage) 6

Unit Notes

Rev 1.1. (All I/O Modes)

Rev 1.2 (1.5-V I/O Mode)

Rev 1.2

(1.8-, 2.5-V I/O Modes)

Min Typ Max Min Typ Max

L3_CLK0 VM

tL3CR tL3CF

VMVM

L3_CLK1

tL3_CLK

tCHCL

L3_ECHO_CLK1

L3_ECHO_CLK3 VMVM VM VM

VMVM VM VM

For PB2 or Late Write:

tL3CSKW1

tL3CSKW2

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

22 Freescale Semiconductor

Electrical and Thermal Characteristics

5.2.4 L3 Bus AC Specifications

The MPC7457 L3 interface supports three different types of SRAM: source-synchronous, double data rate (DDR)

MSUG2 SRAM, Late W rite SRAMs, and pipeline burst (PB2) SRAMs. Each requires a different protocol on the L3

interface and a different routing of the L3 clock signals. The type of SRAM is p rogrammed in L3CR[22:23] and the

MPC7457 then follows the appropriate protocol for that type. The designer must connect and route the L3 signals

appropriately for each type of SRAM. Following are some observations about the L3 interface.

• The routing for the point-to-point signals (L3_CLK[0:1], L3DATA[0:63], L3DP[0:7], and

L3_ECHO_CLK[0:3]) to a particular SRAM must be delay matched.

• For 1-Mbyte of SRAM, use L3_ADDR[16:0] (L3_ADDR[0] is LSB)

• For 2-Mbyte of SRAM, use L3_ADDR[17:0] (L3_ADDR[0] is LSB)

• For 4-Mbyte of SRAM, use L3_ADDR[18:0] (L3_ADDR[0] is LSB)

• No pull-up resistors are required for the L3 interface

• For high-speed operations, L3 interface address and c ontrol signals s hould be a ‘T’ with minimal stubs to

the two loads; data and clock signals should be point-to-point to their single load. Figure 8 shows the AC

test load for the L3 interface.

Figure 8. AC Test Load for the L3 Interface

In general, if routing is short, delay-matched, and designed for incident wave reception and minimal reflection, there

is a high probability that the AC timing of the MPC7457 L3 interface will meet the maximum frequency operation

of appropriately chosen SRAMs. This is despite the pessimistic, guard-banded AC specifications (see Table 12,

Table 13, and Table 14), the limitations of functional testers described in Section 5.2.3, “L3 Clock AC

Specifications,” and the uncertainty of clocks and signals which inevitably make worst-case critical path timing

analysis pessimistic.

More specifically, certain signals within groups should be delay-matched with others in the same group while

intergroup routing is less critical. Only the address and control signals are common to both SRAMs and additional

timing margin is available for these signals. The double-clocked data signals are grouped with individual clocks as

shown in Figure 9 or Figure 11, depending on the type of SRAM. For example, for the MSUG2 DDR SRAM (see

Figure 9); L3DAT A[0:31], L3DP[0:3], and L3_CLK[0] form a closely coupled group of outputs from the MPC7457;

while L3DATA[0:15], L3DP[0:1], and L3_ECHO_CLK[0] form a closely coupled group of inputs.

The MPC7450 RISC Micr opr ocessor Family User’s Manual refers to logical settings called ‘sample points’ used in

the synchronization of reads from the receive FIFO. The computation of the correct value for this setting is

system-dependent and is described in the MPC7450 RISC Microprocessor Family User’s Manual. Three

specifications are used in this calculation and are given in Table 11. It is essential that all three specifications are

included in the calculations to determine the sample points, as incorrect settings can result in errors and

unpredictable behavior. For more information, see the MPC7450 RISC Microprocessor Family User’s Manual.

Output Z0 = 50 ΩGVDD/2

RL = 50 Ω

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 23

Electrical and Thermal Characteristics

5.2.4.1 Effects of L3OHCR Settings on L3 Bus AC Specifications

The AC timing of the L3 interface can be adjusted using the L3 Output Hold Control Register (L3OCHR). Each

field controls the timing for a group of signals. The AC timing specifications presented herein represent the AC

timing when the register contains the default value of 0x0000_0000. Incrementing a field delays the associated

signals, increasing the output valid time and hold time of the affected signals. In the special case of delaying an

L3_CLK signal, the net effect is to decrease the output valid and output hold times of all signals being latched

relative to that clock signal. The amount of delay added is summarized in Table 12. Note that these se ttings affect

output timing parameters only and do not impact input timing parameters of the L3 bus in any way.

Table 11. Sample Points Calculation Parameters

Parameter Symbol Max Unit Notes

Delay from processor clock to internal_L3_CLK tAC 3/4 tL3_CLK 1

Delay from internal_L3_CLK to L3_CLK[n] output pins tCO 3ns2

Delay from L3_ECHO_CLK[n] to receive latch tECI 3ns3

Notes:

1. This specification describes a logical offset between the internal clock edge used to launch the L3 address and control

signals (this clock edge is phase-aligned with the processor clock edge) and the internal clock edge used to launch the

L3_CLK[n] signals. With proper board routing, this offset ensures that the L3_CLK[n] edge will arrive at the SRAM within a

valid address window and provide adequate setup and hold time. This offset is reflected in the L3 bus interface AC timing

specifications, but must also be separately accounted for in the calculation of sample points and, thus, is specified here.

2. This specification is the delay from a rising or falling edge on the internal_L3_CLK signal to the corresponding rising or falling

edge at the L3CLK[n] pins.

3. This specification is the delay from a rising or falling edge of L3_ECHO_CLK[n] to data valid and ready to be sampled from

the FIFO.

Table 12. Effect of L3OHCR Settings on L3 Bus AC Timing

At recommended operating conditions. See Ta b l e 4 .

Field Name1Affected Signals Value

Output Valid Time Output Hold Time

Unit Notes

Parameter

Symbol 2Change 3Parameter

Symbol 2 Change 3

L3AOH L3_ADDR[18:0],

L3_CNTL[0:1]

0b00 tL3CHOV 0t

L3CHOX 0ps4

0b01 +50 +50

0b10 +100 +100

0b11 +150 +150

L3CLKn_OH All signals latched by

SRAM connected to

L3_CLKn

0b000 tL3CHOV

tL3CHDV

tL3CLDV

L3CHOX,

tL3CHDX,

tL3CLDX,

0ps4

0b001 – 50 – 50 5

0b010 – 100 – 100 5

0b011 – 150 – 150 5

0b100 – 200 – 200 5

0b101 – 250 – 250 5

0b110 – 300 – 300 5

0b111 – 350 – 350 5

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

24 Freescale Semiconductor

Electrical and Thermal Characteristics

5.2.4.2 L3 Bus AC Specifications for DDR MSUG2 SRAMs

When using DDR MSUG2 SRAMs at the L3 interface, the parts should be connected as shown in Figure 9. Outputs

from the MPC7457 are actually launched on the edges of an internal clock phase-aligned to SYSCLK (adjusted for

core and L3 frequency divisors). L3_CLK0 and L3_CLK1 are this internal clock output with 90° phase delay, so

outputs are shown synchronous to L3_CLK0 and L3_CLK1. Output valid times are typically negative when

referenced to L3_CLKn because the data is launched one-quarter period before L3_CLKn to provide adequate setup

time at the SRAM after the delay-matched address, control, data, and L3_CLKn signals have propagated across the

printed-wiring board.

Inputs to the MPC7457 are source-synchronous with the CQ clock generated by the DDR MSUG2 SRAMs. These

CQ clocks are received on the L3_ECHO_CLKn inputs of the MPC7457. An internal circuit delays the incoming

L3_ECHO_CLKn signal such that it is positioned within the valid data window at the internal receiving latches. This

delayed clock is used to capture the data into these latches which comprise the receive FIFO. This clock is

asynchronous to all other processor clocks. This latched data is subsequently read out of the FIFO synchronously to

the processor clock. The time between writing and reading the data is set by the using the sample point settings

defined in the L3CR regi ster.

Table 13 provides the L3 bus interface AC timing specifications for the configuration as shown in Figure 9,

assuming the timing relationships shown in Figure 10 and the loading shown in Figure 8.

L3DOHnL3_DATA[n:n+7],

L3_DP[n/8]

0b000 tL3CHDV

tL3CLDV

L3CHDX,

tL3CLDX,

0ps4

0b001 + 50 + 50

0b010 + 100 + 100

0b011 + 150 + 150

0b100 + 200 + 200

0b101 + 250 + 250

0b111 + 300 + 300

0b111 + 350 + 350

Notes:

1. See the MPC7450 RISC Microprocessor Family User’s Manual for specific information regarding L3OHCR.

2. See Ta b le 1 3 and Ta b le 1 4 for more information.

3. Approximate delay verified by simulation; not tested or characterized.

4. Default value.

5. Increasing values of L3CLKn_OH delay the L3_CLKn signal, effectively decreasing the output valid and output hold times

of all signals latched relative to that clock signal by the SRAM; see Figure 9 and Figure 11.

Table 12. Effect of L3OHCR Settings on L3 Bus AC Timing (continued)

At recommended operating conditions. See Ta b l e 4 .

Field Name1Affected Signals Value

Output Valid Time Output Hold Time

Unit Notes

Parameter

Symbol 2Change 3Parameter

Symbol 2 Change 3

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 25

Electrical and Thermal Characteristics

Table 13. L3 Bus Interface AC Timing Specifications for MSUG2

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol

Device Revision (L3 I/O Voltage) 9

Unit Notes

Rev 1.1. (All I/O Modes)

Rev 1.2 (1.5-V I/O Mode)

Rev 1.2

(1.8-, 2.5-V I/O Modes)

Min Max Min Max

L3_CLK rise and fall time tL3CR, tL3CF — 0.75 — 0.75 ns 1

Setup times: Data and parity tL3DVEH,

tL3DVEL

(– tL3CLK/4)

+ 0.90

—(– t

L3CLK/4)

+ 0.70

— ns 2, 3, 4

Input hold times: Data and parity tL3DXEH,

tL3DXEL

(tL3CLK/4)

+ 0.85

—(t

L3CLK/4)

+ 0.70

—ns2, 4

Valid times: Data and parity tL3CHDV

tL3CLDV

—(– t

L3CLK/4)

+ 0.60

—(– t

L3CLK/4)

+ 0.50

ns 5, 6,

7, 8

Valid times: All other outputs tL3CHOV —(t

L3CLK/4)

+ 0.65

—(t

L3CLK/4)

+ 0.65

ns 5, 7, 8

Output hold times: Data and parity tL3CHDX,

tL3CLDX,

(tL3CLK/4)

– 0.60

—(t

L3CLK/4)

– 0.50

—ns5, 6,

7, 8

Output hold times: All other outputs tL3CHOX (tL3CLK/4)

– 0.50

—(t

L3CLK/4)

– 0.50

— ns 5, 7, 8

L3_CLK to high impedance: Data

and parity

tL3CLDZ —(– t

L3CLK/4)

+ 0.60

—(– t

L3CLK/4)

+ 0.60

L3_CLK to high impedance: All

other outputs

tL3CHOZ —(t

L3CLK/4)

+ 0.65

—(t

L3CLK/4)

+ 0.65

Notes:

1. Rise and fall times for the L3_CLK output are measured from 20% to 80% of GVDD.

2. For DDR, all input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the

rising or falling edge of the input L3_ECHO_CLKn (see Figure 10). Input timings are measured at the pins.

3. For DDR, the input data will typically follow the edge of L3_ECHO_CLKn as shown in Figure 10. For consistency with other

input setup time specifications, this will be treated as negative input setup time.

4. tL3_CLK/4 is one-fourth the period of L3_CLKn. This parameter indicates that the MPC7457 can latch an input signal that is

valid for only a short time before and a short time after the midpoint between the rising and falling (or falling and rising)

edges of L3_ECHO_CLKn at any frequency.

5. All output specifications are measured from the midpoint voltage of the rising (or for DDR write data, also the falling) edge

of L3_CLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume

a purely resistive 50-Ω load (see Figure 8).

6. For DDR, the output data will typically lead the edge of L3_CLKn as shown in Figure 10. For consistency with other output

valid time specifications, this will be treated as negative output valid time.

7. tL3_CLK/4 is one-fourth the period of L3_CLKn. This parameter indicates that the specified output signal is actually launched

by an internal clock delayed in phase by 90°. Therefore, there is a frequency component to the output valid and output hold

times such that the specified output signal will be valid for approximately one L3_CLK period starting three-fourths of a clock

before the edge on which the SRAM will sample it and ending one-fourth of a clock period after the edge it will be sampled.

8. Assumes default value of L3OHCR. See Section 5.2.4.1, “Effects of L3OHCR Settings on L3 Bus AC Specifications,” for

more information.

9. L3 I/O voltage mode must be configured by L3VSEL as described in Ta b l e 3 , and voltage supplied at GVDD must match

mode selected as specified in Ta b l e 4 . See Ta bl e 2 3 for revision level information and part marking.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

26 Freescale Semiconductor

Electrical and Thermal Characteristics

Figure 9 shows the typical connection diagram for the MPC7457 interfaced to MSUG2 DDR SRAMs.

Figure 9. Typical Source Synchronous 4-Mbyte L3 Cache DDR Interface

{L3DATA[0:15],

{L3DATA[16:31],

{L3_DATA[32:47],

L3ADDR[18:0]

L3_CNTL[0]

L3_CLK[0]

L3_CLK[1]

L3_ECHO_CLK[0]

L3_ECHO_CLK[1]

L3ECHO_CLK[2]

L3_ECHO_CLK[3]

{L3DATA[48:63],

L3DP[0:1]}

L3DP[2:3]}

L3DP[4:5]}

L3DP[6:7]}

SA[18:0]

SRAM 0

SRAM 1

D[0:17]

D[18:35]

SA[18:0]

D[0:17]

D[18:35]

L3_CNTL[1]

GND

MPC7457

Denotes

Receive (SRAM

to MPC7457)

Aligned Signals

Denotes

Transmit

(MPC7457 to

SRAM)

Aligned Signals

GVDD/2 1

LBO

Note:

1. Or as recommended by SRAM manufacturer for single-ended clocking.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 27

Electrical and Thermal Characteristics

Figure 10 shows the L3 bus timing diagrams for the MPC7457 interfaced to MSUG2 SRAMs.

Figure 10. L3 Bus Timing Diagrams for L3 Cache DDR SRAMs

5.2.4.3 L3 Bus AC Specifications for PB2 and Late Write SRAMs

When using PB2 or Late Write SRAMs at the L3 interface, the parts should be connected as shown in Figure 11.

These SRAMs are synchronous to the MPC7457; one L3_CLKn signal is output to each SRAM to latch address,

control, and write data. Read data is launched by the SRAM synchronous to the delayed L3_CLKn signal it received.

The MPC7457 needs a co py of that delayed clock which laun ched the SRAM read data to know when the returning

data will be valid. Therefore, L3_ECHO_CLK1 and L3_ECHO_CLK3 must be routed halfway to the SRAMs and

returned to the MPC7457 inputs L3_ECHO_CLK0 and L3_ECHO_CLK2, respectively. Thus, L3_ECHO_CLK0

and L3_ECHO_CLK2 are phase-aligned with the input clock received at the SRAMs. The MPC7457 will latch the

incoming data on the rising edge of L3_ECHO_CLK0 and L3_ECHO_CLK2.

Table 14 provides the L3 bus interface AC timing specifications for the configuration shown in Figure 11, assuming

the timing relationships of Figure 12 and the loading of Figure 8.

L3_ECHO_CLK[0,1,2,3]

L3 Data and Data

VM = Midpoint Voltage (GVDD/2)

Parity Inputs

L3_CLK[0,1]

ADDR, L3CNTL

tL3CHOV

tL3CHOX

L3DATA WRITE

tL3CHOZ

VM VM VM

tL3CHDV

tL3CHDX

VM VMVM

Outputs

Inputs

tL3CLDV

tL3CLDX

tL3CLDZ

tL3DVEH

tL3DXEL

tL3DVEL

tL3DXEH

Note: tL3DVEH and tL3DVEL as drawn here are negative numbers, that is, input setup time is

time after the clock edge.

Note: tL3CHDV and tL3CLDV as drawn here will be negative numbers, that is, output valid time will be

time before the clock edge.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

28 Freescale Semiconductor

Electrical and Thermal Characteristics

Table 14. L3 Bus Interface AC Timing Specifications for PB2 and Late Write SRAMs

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol

All Revisions and L3 I/O

Voltage Modes Unit Notes

Min Max

L3_CLK rise and fall time tL3CR, tL3CF —0.75ns1, 2

Setup times: Data and parity tL3DVEH 0.1 — ns 2, 3

Input hold times: Data and parity tL3DXEH — 0.7 ns 2, 3

Valid times: Data and parity tL3CHDV — 2.5 ns 2, 4, 5

Valid times: All other outputs tL3CHOV —1.8ns5

Output hold times: Data and parity tL3CHDX 1.4 — ns 2, 4, 5

Output hold times: All other outputs tL3CHOX 1.0 — ns 2, 5

L3_CLK to high impedance: Data and parity tL3CHDZ —3.0ns2

L3_CLK to high impedance: All other outputs tL3CHOZ —3.0ns2

Notes:

1. Rise and fall times for the L3_CLK output are measured from 20% to 80% of GVDD.

2. Timing behavior and characterization are currently being evaluated.

3. All input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of

the input L3_ECHO_CLKn (see Figure 10). Input timings are measured at the pins.

4. All output specifications are measured from the midpoint voltage of the rising edge of L3_CLKn to the midpoint of the signal

in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see

Figure 10).

5. Assumes default value of L3OHCR. See Section 5.2.4.1, “Effects of L3OHCR Settings on L3 Bus AC Specifications,” fo r

more information.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 29

Electrical and Thermal Characteristics

Figure 11 shows the typical connection diagram for the MPC7457 interfaced to PB2 SRAMs or Late W rite SRAMs.

Figure 11. Typical Synchronous 1-MByte L3 Cache Late Write or PB2 Interface

L3_ADDR[16:0]

L3_CNTL[0] SA[16:0]

SRAM 0

DQ[0:17]

DQ[18:36]

L3_CNTL[1]

GVDD/2 1

GND

SRAM 1

GVDD/2 1

GND

{L3_DATA[0:15],

{L3_DATA[16:31],

{L3_DATA[32:47],

L3_CLK[0]

L3_CLK[1]

L3_ECHO_CLK[0]

L3_ECHO_CLK[1]

L3_ECHO_CLK[2]

{L3_DATA[48:63],

L3_DP[0:1]}

L3_DP[2:3]}

L3_DP[4:5]}

L3_DP[6:7]}

Denotes

Receive (SRAM

to MPC7457)

Aligned Signals

MPC7457

Denotes

Transmit

(MPC7457 to

SRAM)

Aligned Signals

L3_ECHO_CLK[3]

SA[16:0]

DQ[0:17]

DQ[18:36]

Note:

1. Or as recommended by SRAM manufacturer for single-ended clocking.

Note:

1. Or as recommended by SRAM manufacturer for single-ended clocking.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

30 Freescale Semiconductor

Electrical and Thermal Characteristics

Figure 12 shows the L3 bus timing diagrams for the MPC7457 interfaced to PB2 or Late Write SRAMs.

Figure 12. L3 Bus Timing Diagrams for Late Write or PB2 SRAMs

5.2.5 IEEE 1149.1 AC Timing Specifications

Table 15 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 14 through Figure 17.

Table 15. JTAG AC Timing Specifications (Independent of SYSCLK) 1

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol Min Max Unit Notes

TCK frequency of operation fTCLK 033.3MHz

TCK cycle time tTCLK 30 — ns

TCK clock pulse width measured at 1.4 V tJHJL 15 — ns

TCK rise and fall times tJR and tJF 02ns

TRST assert time tTRST 25 — ns 2

Input setup times:

Boundary-scan data

TMS, TDI

tDVJH

tIVJH

—

ns 3

Input hold times:

Boundary-scan data

TMS, TDI

tDXJH

tIXJH

—

ns 3

Valid times:

Boundary-scan data

TDO

tJLDV

tJLOV

ns 4

L3_ECHO_CLK[0,2]

L3 Data and Data

VM = Midpoint Voltage (GVDD/2)

tL3DVEH

tL3DXEH

Parity Inputs

L3_CLK[0,1]

ADDR, L3_CNTL

tL3CHOV tL3CHOX

L3DATA WRITE

tL3CHDZ

Outputs

Inputs

L3_ECHO_CLK[1,3]

tL3CHDV tL3CHDX

tL3CHOZ

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 31

Electrical and Thermal Characteristics

Figure 13 provides the AC test load for TDO and the boundary-scan outputs of the MPC7457.

Figure 13. Alternate AC Test Load for the JTAG Interface

Figure 14 provides the JTAG clock input timing diagram.

Figure 14. JTAG Clock Input Timing Diagram

Figure 15 provides the TRST timing diagram.

Figure 15. TRST Timing Diagram

Output hold times:

Boundary-scan data

TDO

tJLDX

tJLOX

—

ns 4

TCK to output high impedance:

Boundary-scan data

TDO

tJLDZ

tJLOZ

ns 4, 5

Notes:

1. All outputs are measured from the midpoint voltage of the falling/rising edge of TCLK to the midpoint of the signal in question.

The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 13).

Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.

3. Non-JTAG signal input timing with respect to TCK.

4. Non-JTAG signal output timing with respect to TCK.

5. Guaranteed by design and characterization.

Table 15. JTAG AC Timing Specifications (Independent of SYSCLK) 1 (continued)

At recommended operating conditions. See Ta b l e 4 .

Parameter Symbol Min Max Unit Notes

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

tTCLK

VMVMVM

VM = Midpoint Voltage (OVDD/2)

tJR tJF

tJHJL

TCLK

TRST

tTRST

VM = Midpoint Voltage (OVDD/2)

VM VM

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

32 Freescale Semiconductor

Electrical and Thermal Characteristics

Figure 16 provides the boundary-scan timing diagram.

Figure 16. Boundary-Scan Timing Diagram

Figure 17 provides the test access port timing diagram.

Figure 17. Test Access Port Timing Diagram

VMTCK

Boundary

Data Outputs

Data Inputs

Data Outputs

VM = Midpoint Voltage (OVDD/2)

tDXJH

tDVJH

tJLDV

tJLDZ

Input

Data Valid

Output Data Valid

tJLDX

TCK

TDI, TMS

TDO Output Data Valid

VM = Midpoint Voltage (OVDD/2)

tIXJH

tIVJH

tJLOV

tJLOZ

Input

Data Valid

TDO Output Data Valid

tJLOX

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 33

Pin Assignments

6 Pin Assignments

Figure 18 (Part A) shows the pinout of the MPC7447, 360 CBGA package as viewed from the top surface. Part B

shows the side profile of the CBGA package to indicate the direction of the top surface view.

Figure 18. Pinout of the MPC7447, 360 CBGA Package as Viewed from the Top Surface

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Not to Scale

17 18 19

Part A

View

Part B

Die

Substrate Assembly

Encapsulant

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

34 Freescale Semiconductor

Pin Assignments

Figure 19 (Part A) shows the pinout of the MPC7457, 483 CBGA package as viewed from the top surface. Part B

shows the side profile of the CBGA package to indicate the direction of the top surface view.

Figure 19. Pinout of the MPC7457, 483 CBGA Package as Viewed from the Top Surface

12 3 4 5678 910111213141516

Not to Scale

17 18 19

20 21 22

Part A

View

Part B

Die

Substrate Assembly

Encapsulant

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 35

Pinout Listings

7 Pinout Listings

Table 16 provides the pinout listing for the M PC7447, 360 CBGA package. Table 17 provides the pinout listing for

the MPC7457, 483 CBGA package.

NOTE

This pinout is not compatible with the MPC750, MPC7400, or MPC7410 360 BGA

package.

Table 16. Pinout Listing for the MPC7447, 360 CBGA Package

Signal Name Pin Number Active I/O I/F Select 1Notes

A[0:35] E11, H1, C11, G3, F10, L2, D11, D1, C10, G2, D12, L3,

G4, T2, F4, V1, J4, R2, K5, W2, J2, K4, N4, J3, M5, P5,

N3, T1, V2, U1, N5, W1, B12, C4, G10, B11

High I/O BVSEL 2

AACK R1 Low Input BVSEL

AP[0:4] C1, E3, H6, F5, G7 High I/O BVSEL

ARTRY N2 Low I/O BVSEL 3

AVDD A8 — Input N/A

BG M1 Low Input BVSEL

BMODE0 G9 Low Input BVSEL 4

BMODE1 F8 Low Input BVSEL 5

BR D2 Low Output BVSEL

BVSEL B7 High Input BVSEL 1, 6

CI J1 Low Output BVSEL 3

CKSTP_IN A3 Low Input BVSEL

CKSTP_OUT B1 Low Output BVSEL

CLK_OUT H2 High Output BVSEL

D[0:63] R15, W15, T14, V16, W16, T15, U15, P14, V13, W13,

T13, P13, U14, W14, R12, T12, W12, V12, N11, N10,

R11, U11, W11, T11, R10, N9, P10, U10, R9, W10, U9,

V9, W5, U6, T5, U5, W7, R6, P7, V6, P17, R19, V18,

R18, V19, T19, U19, W19, U18, W17, W18, T16, T18,

T17, W3, V17, U4, U8, U7, R7, P6, R8, W8, T8

High I/O BVSEL

DBG M2 Low Input BVSEL

DP[0:7] T3, W4, T4, W9, M6, V3, N8, W6 High I/O BVSEL

DRDY R3 Low Output BVSEL 7

DTI[0:3] G1, K1, P1, N1 High Input BVSEL 8

EXT_QUAL A11 High Input BVSEL 9

GBL E2 Low I/O BVSEL

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

36 Freescale Semiconductor

Pinout Listings

GND B5, C3, D6, D13, E17, F3, G17, H4, H7, H9, H11, H13,

J6, J8, J10, J12, K7, K3, K9, K11, K13, L6, L8, L10, L12,

M4, M7, M9, M11, M13, N7, P3, P9, P12, R5, R14, R17,

T7, T10, U3, U13, U17, V5, V8, V11, V15

——N/A

HIT B2 Low Output BVSEL 7

HRESET D8 Low Input BVSEL

INT D4 Low Input BVSEL

L1_TSTCLK G8 High Input BVSEL 9

L2_TSTCLK B3 High Input BVSEL 10

No Connect A6, A13, A14, A15, A16, A17, A18, A19, B13, B14, B15,

B16, B17, B18, B19, C13, C14, C15, C16, C17, C18,

C19, D14, D15, D16, D17, D18, D19, E12, E13, E14,

E15, E16, E19, F12, F13, F14, F15, F16, F17, F18, F19,

G11, G12, G13, G14, G15, G16, G19, H14, H15, H16,

H17, H18, H19, J14, J15, J16, J17, J18, J19, K15, K16,

K17, K18, K19, L14, L15, L16, L17, L18, L19, M14, M15,

M16, M17, M18, M19, N12, N13, N14, N15, N16, N17,

N18, N19, P15, P16, P18, P19

—— —11

LSSD_MODE E8 Low Input BVSEL 6, 12

MCP C9 Low Input BVSEL

OVDD B4, C2, C12, D5, E18, F2, G18, H3, J5, K2, L5, M3, N6,

P2, P8, P11, R4, R13, R16, T6, T9, U2, U12, U16, V4,

V7, V10, V14

——N/A

PLL_CFG[0:4] B8, C8, C7, D7, A7 High Input BVSEL

PMON_IN D9 Low Input BVSEL 13

PMON_OUT A9 Low Output BVSEL

QACK G5 Low Input BVSEL

QREQ P4 Low Output BVSEL

SHD[0:1] E4, H5 Low I/O BVSEL 3

SMI F9 Low Input BVSEL

SRESET A2 Low Input BVSEL

SYSCLK A10 — Input BVSEL

TA K6 Low Input BVSEL

TBEN E1 High Input BVSEL

TBST F11 Low Output BVSEL

TCK C6 High Input BVSEL

TDI B9 High Input BVSEL 6

TDO A4 High Output BVSEL

Table 16. Pinout Listing for the MPC7447, 360 CBGA Package (continued)

Signal Name Pin Number Active I/O I/F Select 1Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 37

Pinout Listings

TEA L1 Low Input BVSEL

TEST[0:3] A12, B6, B10, E10 — Input BVSEL 12

TEST[4] D10 — Input BVSEL 9

TMS F1 High Input BVSEL 6

TRST A5 Low Input BVSEL 6, 14

TS L4 Low I/O BVSEL 3

TSIZ[0:2] G6, F7, E7 High Output BVSEL

TT[0:4] E5, E6, F6, E9, C5 High I/O BVSEL

WT D3 Low Output BVSEL 3

VDD H8, H10, H12, J7, J9, J11, J13, K8, K10, K12, K14, L7,

L9, L11, L13, M8, M10, M12

——N/A

Notes:

1. OVDD supplies power to the processor bus, JTAG, and all control signals; and VDD supplies power to the processor core

and the PLL (after filtering to become AVDD). To program the I/O voltage, connect BVSEL to either GND (selects 1.8 V) or

to HRESET (selects 2.5 V). If used, the pull-down resistor should be less than 250 Ω. For actual recommended value of Vin

or supply voltages see Tab le 4 .

2. Unused address pins must be pulled down to GND.

3. These pins require weak pull-up resistors (for example, 4.7 kΩ) to maintain the control signals in the negated state after

they have been actively negated and released by the MPC7447 and other bus masters.

4. This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at HRESET going

high.

5. This signal must be negated during reset, by pull up to OVDD or negation by ¬HRESET (inverse of HRESET), to ensure

proper operation.

6. Internal pull up on die.

7. Ignored in 60x bus mode.

8. These signals must be pulled down to GND if unused, or if the MPC7447 is in 60x bus mode.

9. These input signals are for factory use only and must be pulled down to GND for normal machine operation.

10. This test signal is recommended to be tied to HRESET; however, other configurations will not adversely affect performance.

11. These signals are for factory use only and must be left unconnected for normal machine operation.

12. These input signals are for factory use only and must be pulled up to OVDD for normal machine operation.

13. This pin can externally cause a performance monitor event. Counting of the event is enabled via software.

14. This signal must be asserted during reset, by pull down to GND or assertion by HRESET, to ensure proper operation.

Table 17. Pinout Listing for the MPC7457, 483 CBGA Package

Signal Name Pin Number Active I/O I/F Select 1Notes

A[0:35] E10, N4, E8, N5, C8, R2, A7, M2, A6, M1, A10, U2,

N2, P8, M8, W4, N6, U6, R5, Y4, P1, P4, R6, M7, N7,

AA3, U4, W2, W1, W3, V4, AA1, D10, J4, G10, D9

High I/O BVSEL 2

AACK U1 Low Input BVSEL

AP[0:4] L5, L6, J1, H2, G5 High I/O BVSEL

ARTRY T2 Low I/O BVSEL 3

Table 16. Pinout Listing for the MPC7447, 360 CBGA Package (continued)

Signal Name Pin Number Active I/O I/F Select 1Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

38 Freescale Semiconductor

Pinout Listings

AVDD B2 — Input N/A

BG R3 Low Input BVSEL

BMODE0 C6 Low Input BVSEL 4

BMODE1 C4 Low Input BVSEL 5

BR K1 Low Output BVSEL

BVSEL G6 High Input N/A 6, 7

CI R1 Low Output BVSEL 3

CKSTP_IN F3 Low Input BVSEL

CKSTP_OUT K6 Low Output BVSEL

CLK_OUT N1 High Output BVSEL

D[0:63] AB15, T14, R14, AB13, V14, U14, AB14, W16, AA11,

Y11, U12, W13, Y14, U13, T12, W12, AB12, R12,

AA13, AB11, Y12, V11, T11, R11, W10, T10, W11,

V10, R10, U10, AA10, U9, V7, T8, AB4, Y6, AB7,

AA6, Y8, AA7, W8, AB10, AA16, AB16, AB17, Y18,

AB18, Y16, AA18, W14, R13, W15, AA14, V16, W6,

AA12, V6, AB9, AB6, R7, R9, AA9, AB8, W9

High I/O BVSEL

DBG V1 Low Input BVSEL

DP[0:7] AA2, AB3, AB2, AA8, R8, W5, U8, AB5 High I/O BVSEL

DRDY T6 Low Output BVSEL 8

DTI[0:3]) P2, T5, U3, P6 High Input BVSEL 9

EXT_QUAL B9 High Input BVSEL 10

GBL M4 Low I/O BVSEL

GND A22, B1, B5, B12, B14, B16, B18, B20, C3, C9, C21,

D7, D13, D15, D17, D19, E2, E5, E21, F10, F12, F14,

F16, F19, G4, G7, G17, G21, H13, H15, H19, H5, J3,

J10, J12, J14, J17, J21, K5, K9, K11, K13, K15, K19,

L10, L12, L14, L17, L21, M3, M6, M9, M11, M13,

M19, N10, N12, N14, N17, N21, P3, P9, P11, P13,

P15, P19, R17, R21, T13, T15, T19, T4, T7, T9, U17,

U21, V2, V5, V8, V12, V15, V19, W7, W17, W21, Y3,

Y9, Y13, Y15, Y20, AA5, AA17, AB1, AB22

——N/A

GVDD B13, B15, B17, B19, B21, D12, D14, D16, D18, D21,

E19, F13, F15, F17, F21, G19, H12, H14, H17, H21,

J19, K17, K21, L19, M17, M21, N19, P17, P21, R15,

R19, T17, T21, U19, V17, V21, W19, Y21

——N/A11

HIT K2 Low Output BVSEL 8

HRESET A3 Low Input BVSEL

INT J6 Low Input BVSEL

Table 17. Pinout Listing for the MPC7457, 483 CBGA Package (continued)

Signal Name Pin Number Active I/O I/F Select 1Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 39

Pinout Listings

L1_TSTCLK H4 High Input BVSEL 10

L2_TSTCLK J2 High Input BVSEL 12

L3VSEL A4 High Input N/A 6, 7

L3ADDR[18:0] H11, F20, J16, E22, H18, G20, F22, G22, H20, K16,

J18, H22, J20, J22, K18, K20, L16, K22, L18

High Output L3VSEL

L3_CLK[0:1] V22, C17 High Output L3VSEL

L3_CNTL[0:1] L20, L22 Low Output L3VSEL

L3DATA[0:63] AA19, AB20, U16, W18, AA20, AB21, AA21, T16,

W20, U18, Y22, R16, V20, W22, T18, U20, N18, N20,

N16, N22, M16, M18, M20, M22, R18, T20, U22, T22,

R20, P18, R22, M15, G18, D22, E20, H16, C22, F18,

D20, B22, G16, A21, G15, E17, A20, C19, C18, A19,

A18, G14, E15, C16, A17, A16, C15, G13, C14, A14,

E13, C13, G12, A13, E12, C12

High I/O L3VSEL

L3DP[0:7] AB19, AA22, P22, P16, C20, E16, A15, A12 High I/O L3VSEL

L3_ECHO_CLK[0,2] V18, E18 High Input L3VSEL

L3_ECHO_CLK[1,3] P20, E14 HIgh I/O L3VSEL

LSSD_MODE F6 Low Input BVSEL 7, 13

MCP B8 Low Input BVSEL

No Connect A8, A11, B6, B11, C11, D11, D3, D5, E11, E7, F2,

F11, G2, H9

——N/A14

OVDD B3, C5, C7, C10, D2, E3, E9, F5, G3, G9, H7, J5, K3,

L7, M5, N3, P7, R4, T3, U5, U7, U11, U15, V3, V9,

V13, Y2, Y5, Y7, Y10, Y17, Y19, AA4, AA15

——N/A

PLL_CFG[0:4] A2, F7, C2, D4, H8 High Input BVSEL

PMON_IN E6 Low Input BVSEL 15

PMON_OUT B4 Low Output BVSEL

QACK K7 Low Input BVSEL

QREQ Y1 Low Output BVSEL

SHD[0:1] L4, L8 Low I/O BVSEL 3

SMI G8 Low Input BVSEL

SRESET G1 Low Input BVSEL

SYSCLK D6 — Input BVSEL

TA N8 Low Input BVSEL

TBEN L3 High Input BVSEL

TBST B7 Low Output BVSEL

TCK J7 High Input BVSEL

Table 17. Pinout Listing for the MPC7457, 483 CBGA Package (continued)

Signal Name Pin Number Active I/O I/F Select 1Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

40 Freescale Semiconductor

Pinout Listings

TDI E4 High Input BVSEL 7

TDO H1 High Output BVSEL

TEA T1 Low Input BVSEL

TEST[0:5] B10, H6, H10, D8, F9, F8 — Input BVSEL 13

TEST[6] A9 — Input BVSEL 10

TMS K4 High Input BVSEL 7

TRST C1 Low Input BVSEL 7, 16

TS P5 Low I/O BVSEL 3

TSIZ[0:2] L1,H3,D1 High Output BVSEL

TT[0:4] F1, F4, K8, A5, E1 High I/O BVSEL

WT L2 Low Output BVSEL 3

VDD J9, J11, J13, J15, K10, K12, K14, L9, L11, L13, L15,

M10, M12, M14, N9, N11, N13, N15, P10, P12, P14

——N/A

VDD_SENSE[0:1] G11, J8 — — N/A 17

Notes:

1. OVDD supplies power to the processor bus, JTAG, and all control signals except the L3 cache controls (L3CTL[0:1]); GVDD

supplies power to the L3 cache interface (L3ADDR[0:17], L3DATA[0:63], L3DP[0:7], L3_ECHO_CLK[0:3], and L3_CLK[0:1])

and the L3 control signals L3_CNTL[0:1]; and VDD supplies power to the processor core and the PLL (after filtering to

become AVDD). For actual recommended value of Vin or supply voltages, see Ta bl e 4 .

2. Unused address pins must be pulled down to GND.

3. These pins require weak pull-up resistors (for example, 4.7 kΩ) to maintain the control signals in the negated state after

they have been actively negated and released by the MPC7457 and other bus masters.

4. This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at HRESET going

high.

5. This signal must be negated during reset, by pull up to OVDD or negation by ¬HRESET (inverse of HRESET), to ensure

proper operation.

6. See Ta b l e 3 for bus voltage configuration information. If used, pull-down resistors should be less than 250 Ω.

7. Internal pull up on die.

8. Ignored in 60x bus mode.

9. These signals must be pulled down to GND if unused or if the MPC7457 is in 60x bus mode.

10. These input signals for factory use only and must be pulled down to GND for normal machine operation.

11. Power must be supplied to GVDD, even when the L3 interface is disabled or unused.

12. This test signal is recommended to be tied to HRESET; however, other configurations will not adversely affect performance.

13. These input signals are for factory use only and must be pulled up to OVDD for normal machine operation.

14. These signals are for factory use only and must be left unconnected for normal machine operation.

15. This pin can externally cause a performance monitor event. Counting of the event is enabled via software.

16. This signal must be asserted during reset, by pull down to GND or assertion by HRESET, to ensure proper operation.

17. These pins are internally connected to VDD. They are intended to allow an external device to detect the core voltage level

present at the processor core. If unused, they must be connected directly to VDD or left unconnected.

Table 17. Pinout Listing for the MPC7457, 483 CBGA Package (continued)

Signal Name Pin Number Active I/O I/F Select 1Notes

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 41

Package Description

8 Package Description

The following sections provide the packag e pa ram e te rs and mechanical dimens ion s for the CBGA pack ag e.

8.1 Package Parameters for the MPC7447, 360 CBGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic

ball grid array (CBGA).

Package outline 25 × 25 mm

Interconnects 360 (19 × 19 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.72 mm

Maximum module heigh t 3.24 mm

Ball diameter 0.89 mm (35 mil)

8.2 Mechanical Dimensions for the MPC7447, 360 CBGA

Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360 CBGA

package.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

42 Freescale Semiconductor

Package Description

Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447,

360 CBGA Package

NOTES:

1. DIMENSIONING AND

TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS IN

MILLIMETERS.

3. TOP SIDE A1 CORNER

INDEX IS A METALIZED

FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1

CORNER IS DESIGNATED

WITH A BALL MISSING

FROM THE ARRAY.

0.2

360X

A1 CORNER

0.2

12345678910111213141516

B0.3

0.15

0.15 A

171819

Millimeters

DIM MIN MAX

A 2.72 3.20

A1 0.80 1.00

A2 1.10 1.30

A3 — 0.6

b 0.82 0.93

D 25.00 BSC

D1 — 11.3

D2 8.0 —

D3 — 6.5

D4 10.9 11.1

e 1.27 BSC

E 25.00 BSC

E1 — 11.3

E2 8.0 —

E3 — 6.5

E4 9.55 9.75

Capacitor Region

0.35 A

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 43

Package Description

8.3 Substrate Capacitors for the MPC7447, 360 CBGA

Figure 21 shows the connectivity of the substrate capacitor pads for the MPC7447, 360 CBGA. All capacitors are

100 nF.

Figure 21. Substrate Bypass Capacitors for the MPC7447, 360 CBGA

Capacitor

Pad Number

-1 -2

C1 GND VDD

C2 GND VDD

C3 GND OVDD

C4 GND VDD

C5 GND VDD

C6 GND VDD

C7 GND VDD

C8 GND VDD

C9 GND OVDD

C10 GND VDD

C11 GND VDD

C12 GND VDD

C13 GND VDD

C14 GND VDD

C15 GND VDD

C16 GND OVDD

C17 GND VDD

C18 GND OVDD

C19 GND VDD

C20 GND VDD

C21 GND OVDD

C22 GND VDD

C23 GND VDD

C24 GND VDD

C1-2

C1-1 C2-1 C3-1 C4-1 C5-1 C6-1

C6-2C5-2C4-2C3-2C2-2

C18-1

C18-2 C17-2 C16-2 C15-2 C14-2 C13-2

C13-1C14-1C15-1C16-1C17-1

C12-1

C12-2 C11-2 C10-2 C9-2 C8-2 C7-2

C7-1C8-1C9-1C10-1C11-1

C19-2

C19-1 C20-1 C21-1 C22-1 C23-1 C24-1

C24-2C23-2C22-2C21-2C20-2

A1 CORNER

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

44 Freescale Semiconductor

Package Description

8.4 Package Parameters for the MPC7457, 483 CBGA

The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483-lead ceramic

ball grid array (CBGA).

Package outline 29 × 29 mm

Interconnects 483 (22 × 22 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height —

Maximum module heigh t 3.22 mm

Ball diameter 0.89 mm (35 mil)

8.5 Mechanical Dimensions for the MPC7457, 483 CBGA

Figure 22 provides the mechanical dimensions and bottom surface nomenclature for the MPC7457, 483 CBGA

package.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 45

Package Description

Figure 22. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7457,

483 CBGA Package

0.2

NOTES:

1. DIMENSIONING AND

TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN

MILLIMETERS.

3. TOP SIDE A1 CORNER

INDEX IS A METALIZED

FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE.

A1 CORNER IS

DESIGNATED WITH A BALL

MISSING FROM THE

ARRAY.

A1 CORNER

0.2

12345678910111213141516

0.15 A

171819

Millimeters

DIM MIN MAX

A 2.72 3.20

A1 0.80 1.00

A2 1.10 1.30

A3 -- 0.60

b 0.82 0.93

D 29.00 BSC

D1 — 12.5

D2 8.5 —

D3 — 8.4

D4 10.9 11.1

e 1.27 BSC

E 29.00 BSC

E1 — 12.5

E2 8.5 —

E3 — 8.4

E4 9.55 9.75

483X

B0.3

0.15

2021 22

Capacitor Region

0.35 A

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

46 Freescale Semiconductor

Package Description

8.6 Substrate Capacitors for the MPC7457, 483 CBGA

Figure 23 shows the connectivity of the substrate capacitor pads for the MPC7457, 483 CBGA. All capacitors are

100 nF.

Figure 23. Substrate Bypass Capacitors for the MPC7457, 483 CBGA

Capacitor

Pad Number

-1 -2

C1 GND OVDD

C2 GND VDD

C3 GND GVDD

C4 GND VDD

C5 GND VDD

C6 GND GVDD

C7 GND VDD

C8 GND VDD

C9 GND GVDD

C10 GND VDD

C11 GND VDD

C12 GND GVDD

C13 GND VDD

C14 GND VDD

C15 GND VDD

C16 GND OVDD

C17 GND VDD

C18 GND OVDD

C19 GND VDD

C20 GND VDD

C21 GND OVDD

C22 GND VDD

C23 GND VDD

C24 GND VDD

C1-2

C1-1 C2-1 C3-1 C4-1 C5-1 C6-1

C6-2C5-2C4-2C3-2C2-2

C18-1

C18-2 C17-2 C16-2 C15-2 C14-2 C13-2

C13-1C14-1C15-1C16-1C17-1

C12-1

C12-2 C11-2 C10-2 C9-2 C8-2 C7-2

C7-1C8-1C9-1C10-1C11-1

C19-2

C19-1 C20-1 C21-1 C22-1 C23-1 C24-1

C24-2C23-2C22-2C21-2C20-2

A1 CORNER

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 47

System Design Information

9 System Design Information

This section provides system and thermal design recommendations for successful application of the MPC7457.

9.1 Clocks

The following sections provide more detailed information regarding the clocking of the MPC7457.

9.1.1 Core Clocks and PLL Configuration

The MPC7457 PLL is configured by the PLL_CFG[0:4] signals. For a given SYSCLK (bus) frequency, the PLL

configuration signals set the internal CPU and VCO frequency of operation. The PLL configuration for the

MPC7457 is shown in Table 18 for a set of example frequencies. In this example, shaded cells represent settings

that, for a given SYSCLK frequency, result in core and/or VCO frequencies that do not comply with the 1-GHz

column in Table 8. Note that these configurations were different in some earlier MPC7450-family devices and care

should be taken when upgrading to the MPC7457 to verify the correct PLL settings for an application.

Table 18. MPC7457 Microprocessor PLL Configuration Example for 1267 MHz Parts

PLL_CFG[0:4]

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

167

MHz

01000 2x 2x

10000 3x 2x

10100 4x 2x 667

(1333)

10110 5x 2x 667

(1333)

835

(1670)

10010 5.5x 2x 733

(1466)

919

(1837)

11010 6x 2x 600

(1200)

800

(1600)

1002

(2004)

01010 6.5x 2x 650

(1300)

866

(1730)

1086

(2171)

00100 7x 2x 700

(1400)

931

(1862)

1169

(2338)

00010 7.5x 2x 623

(1245)

750

(1500)

1000

(2000)

1253

(2505)

11000 8x 2x 600

(1200)

664

(1328)

800

(1600)

1064

(2128)

01100 8.5x 2x 638

(1276)

706

(1412)

850

(1700)

1131

(2261)

01111 9x 2x 600

(1200)

675

(1350)

747

(1494)

900

(1800)

1197

(2394)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

48 Freescale Semiconductor

System Design Information

01110 9.5x 2x 633

(1266)

712

(1524)

789

(1578)

950

(1900)

1264

(2528)

10101 10x 2x 667

(1333)

750

(1500)

830

(1660)

1000

(2000)

10001 10.5x 2x 700

(1400)

938

(1876)

872

(1744)

1050

(2100)

10011 11x 2x 733

(1466)

825

(1650)

913

(1826)

1100

(2200)

00000 11.5x 2x 766

(532)

863

(1726)

955

(1910)

1150

(2300)

10111 12x 2x 600

(1200)

800

(1600)

900

(1800)

996

(1992)

1200

(2400)

11111 12.5x 2x 600

(1200)

833

(1666)

938

(1876)

1038

(2076)

1250

(2500)

01011 13x 2x 650

(1300)

865

(1730)

975

(1950)

1079

(2158)

11100 13.5x 2x 675

(1350)

900

(1800)

1013

(2026)

1121

(2242)

11001 14x 2x 700

(1400)

933

(1866)

1050

(2100)

1162

(2324)

00011 15x 2x 750

(1500)

1000

(2000)

1125

(2250)

1245

(2490)

11011 16x 2x 800

(1600)

1066

(2132)

1200

(2400)

00001 17x 2x 850

(1900)

1132

(2264)

00101 18x 2x 600

(1200)

900

(1800)

1200

(2400)

00111 20x 2x 667

(1334)

1000

(2000)

01001 21x 2x 700

(1400)

1050

(2100)

01101 24x 2x 800

(1600)

1200

(2400)

11101 28x 2x 933

(1866)

00110 PLL bypass PLL off, SYSCLK clocks core circuitry directly

Table 18. MPC7457 Microprocessor PLL Configuration Example for 1267 MHz Parts (continued)

PLL_CFG[0:4]

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

167

MHz

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 49

System Design Information

9.1.2 L3 Clocks

The MPC7457 generates the clock for the external L3 synchronous data SRAMs by dividing the core cloc k

frequency of the MPC7457. The core-to-L3 frequency divisor for the L3 PLL i s selected through the L3_CLK bits

of the L3CR register. Generally, the divisor must be chosen according to the frequency supported by the external

RAMs, the frequency of the MPC7457 core, and timing analysis of the circuit board routing. Table 19 shows various

example L3 clock frequencies that can be obtained for a given set of core frequencies.

11110 PLL off PLL off, no core clocking occurs

Notes:

1. PLL_CFG[0:4] settings not listed are reserved.

2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core, or VCO

frequencies which are not useful, not supported, or not tested for by the MPC7455; see Section 5.2.1, “Clock AC

Specifications,” for valid SYSCLK, core, and VCO frequencies.

3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly and the PLL is disabled. However,

the bus interface unit requires a 2x clock to function. Therefore, an additional signal, EXT_QUAL, must be driven at

one-half the frequency of SYSCLK and offset in phase to meet the required input setup tIVKH and hold time tIXKH (see

Ta b l e 9 ). The result is that the processor bus frequency is one-half SYSCLK while the internal processor is clocked at

SYSCLK frequency. This mode is intended for factory use and emulator tool use only.

Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.

4. In PLL-off mode, no clocking occurs inside the MPC7455 regardless of the SYSCLK input.

Table 19. Sample Core-to-L3 Frequencies 1

Core

Frequency

(MHz) 2

÷2 ÷2.5 ÷3 ÷3.5 ÷4 ÷4.5 ÷5 ÷5.5 ÷6 ÷6.5 ÷7 ÷7.5 ÷8

500 250 200 167 143 125 111 100 91 83 77 71 67 63

533 266 213 178 152 133 118 107 97 89 82 76 71 67

550 275 220 183 157 138 122 110 100 92 85 79 73 69

600 300 240 200 171 150 133 120 109 100 92 86 80 75

650 325 260 217 186 163 144 130 118 108 100 93 87 81

666 333 266 222 190 167 148 133 121 111 102 95 89 83

700 350 280 233 200 175 156 140 127 117 108 100 93 88

733 367 293 244 209 183 163 147 133 122 113 105 98 92

800 400 320 266 230 200 178 160 145 133 123 114 107 100

866 433 347 289 248 217 192 173 157 145 133 124 115 108

933 467 373 311 266 233 207 187 170 156 144 133 124 117

1000 500 400 333 285 250 222 200 182 166 154 143 133 125

1050 525 420 350 300 263 233 191 191 175 162 150 140 131

1100 550 440 367 314 275 244 200 200 183 169 157 147 138

Table 18. MPC7457 Microprocessor PLL Configuration Example for 1267 MHz Parts (continued)

PLL_CFG[0:4]

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

167

MHz

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

50 Freescale Semiconductor

System Design Information

9.1.3 System Bus Clock (SYSCLK) and Spread Spectrum Sources

Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference emissions

(EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise magnitude in order to meet

industry and government requirements. These cl ock sources intentionally add long-term jitter in order to dif fuse the

EMI spectral content. The jitter specification given in Table 8 considers short-term (cycle-to-cycle) jitter only and

the clock generator’s cycle-to-cycle output jitter should meet the MPC7457 input cycle-to-cycle jitter requirement.

Frequency modulation and spread are separate concerns, and the MPC7457 is compatible with spread spectrum

sources if the recommendations listed in Table 20 are observed.

It is imperative to note that the processor’ s minimum and maxi mum SYSCLK, core, and VCO frequencies must no t

be exceeded regardless of the type of clock source. Therefore, systems in which the processor is operated at its

maximum rated co re or bus frequency should avoid violating the stated limits by using down-spreading only.

9.2 PLL Power Supply Filtering

The AVDD power signal is provided on the MPC7457 to provide power to the clock generation PLL. To ensure

stability of the internal clock, the power supplied to the AVDD input signal should be filtered of any noise in the

500 kHz to 10 MHz resonant frequency range of the PLL. A circuit similar to the one shown in Figure 24 using

surface mount capacitors with minimum effective series inductance (ESL) is recommended.

1150 575 460 383 329 288 256 209 209 192 177 164 153 144

1200 600 480 400 343 300 267 218 218 200 185 171 160 150

1250 638 500 417 357 313 278 227 227 208 192 179 167 156

1300 650 520 433 371 325 289 236 236 217 200 186 173 163

Notes:

1. The core and L3 frequencies are for reference only. Note that maximum L3 frequency is design dependent. Some examples

may represent core or L3 frequencies which are not useful, not supported, or not tested for the MPC7457; see Section 5.2.3,

“L3 Clock AC Specifications,” for valid L3_CLK frequencies and for more information regarding the maximum L3 frequency.

2. Not all core frequencies are supported by all speed grades; see Ta bl e 8 for minimum and maximum core frequency

specifications.

Table 20. Spread Specturm Clock Source Recommendations

At recommended operating conditions. See Ta b l e 4 .

Parameter Min Max Unit Notes

Frequency modulation — 50 kHz 1

Frequency spread — 1.0 % 1, 2

Notes:

1. Guaranteed by design.

2. SYSCLK frequencies resulting from frequency spreading, and the resulting core and VCO

frequencies, must meet the minimum and maximum specifications given in Ta b l e 8 .

Table 19. Sample Core-to-L3 Frequencies 1 (continued)

Core

Frequency

(MHz) 2

÷2 ÷2.5 ÷3 ÷3.5 ÷4 ÷4.5 ÷5 ÷5.5 ÷6 ÷6.5 ÷7 ÷7.5 ÷8

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 51

System Design Information

The circuit should be placed as close as poss ible to the AVDD pin to minimize noise coupled from nearby circuits.

It is often possible to route directly from the capacitors to the AVDD pin, which is on the periphery of the 360 CBGA

footprint and very close to the periphery of the 483 CBGA footprint, without the inductance of vias.

Figure 24. PLL Power Supply Filter Circuit

NOTE

All production 7447 and 7457 Rev. B devices require a 400 Ω resistor instead of

the 10 Ω resistor shown above. All production 7457 Rev . C devices require a 10 Ω

resistor. For more information, see the MPC7450 Family Chip Errata for the

MPC7457 and MPC7447.

9.3 Decoupling Recommendations

Due to the MPC7457 dynamic power management feature, large address and data buses, and high operating

frequencies, the MPC7457 can generate transient power surges and high frequency noise in its power supply,

especially while driving large capacitive loads. This noise must be prevented from reaching other components in the

MPC7457 system, and the MPC7457 itself requires a clean, tightly regulated source of power. Therefore, it is

recommended that the system designer place at least one decoupling capacitor at each VDD, OVDD, and GVDD pin

of the MPC7457. It is also recommended that these decoupling capacitors receive their power from separate VDD,

OVDD/GVDD, and GND power planes in the PCB, utilizing short traces to minimize inductance. If compromises

must be made due to boa rd constraints, VDD pins should receive the highest priority for decoupling.

These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology (SMT) capacitors

should be used to minimize lead inductance, preferably 0508 or 0603 orientations where connections are made along

the length of the part. Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design:

A Handbook of Black Magic (Prentice Hall, 1993) an d contrary to previous recommendations for decoupling

Freescale microprocessors, multiple small capacitors of equal value are recommended over using multiple values of

capacitance.

In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the

VDD, GVDD, and OVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors

should have a low equivalent series resistance (ESR) rating to ensure the quick response time necessary . They should

also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk

capacitors: 100–330 µF (AVX TPS tantalum or Sanyo OSCON).

9.4 Connection Recommendations

To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level.

Unused active low inputs should be tied to OVDD. Unused active high inputs should be connect ed to GND. All NC

(no-connect) signals must remain unconnected.

Power and ground connections must be made to all external VDD, OVDD, GVDD, and GND pins in the MPC7457.

If the L3 interface is not used, GVDD should be connected to the OVDD power plane, and L3VSEL should be

connected to BVSEL; the remainder of the L3 interface may be left unterminated.

VDD AVDD

10 Ω

2.2 µF 2.2 µF

GND

Low ESL Surface Mount Capacitors

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

52 Freescale Semiconductor

System Design Information

9.5 Output Buffer DC Impedance

The MPC7457 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature. To

measure Z0, an external resistor is co nnected from the chip p ad to O VDD or GND. Then, the value of each resistor

is varied until the pad voltage is OVDD/2 (see Figure 25).

The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When

data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the pad equals OVDD/2. RN

then becomes the resistance of the pull-down devices. Whe n data is held high, SW1 is closed (SW2 is open), and

RP is trimmed until the voltage at the pad equals OV DD/2. RP then becomes the resistance of the pull-up devices. RP

and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2.

Figure 25. Driver Impedance Measurement

Table 21 summarizes the signal impedance results. The impedance increases with junction temperature and is

relatively unaffected by bus voltage.

9.6 Pull-Up/Pull-Down Resistor Requirements

The MPC7457 requires high-resistive (weak: 4.7-kΩ) pull-up resistors on several control pins of the bus interface to

maintain the control signals in the negated state after they have been actively negated and released by the MPC7457

or other bus masters. These pins are: TS, ARTRY, SHDO, and SHD1.

Some pins designated as being for factory test must be pulled up to OVDD or down to GND to ensure proper device

operation. For the MPC7447, 360 BGA, the pins that must be pulled up to OVDD are: LSSD_MODE and TEST[0:3];

the pins that must be pulled down to GND are: L1_TSTCLK and TEST[4]. For the MPC7457, 483 BGA, the pins

that must be pulled up to OVDD are: LSSD_MODE and TEST[0:5]; the pins that must be pulled down are:

Table 21. Impedance Characteristics

VDD = 1.5 V, OVDD = 1.8 V ± 5%, Tj = 5°–85°C

Impedance Processor Bus L3 Bus Unit

Z0Typical 33–42 34–42 Ω

Maximum 31–51 32–44 Ω

OVDD

OGND

Pad

Data

SW1

SW2

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 53

System Design Information

L1_TSTCLK and TEST[6]. The CKSTP_IN signal should likewise be pulled up through a pull-up resistor (weak or

stronger: 4.7–1 kΩ) to prevent erroneous assertions of this signal.

In addition, the MPC7457 has one open-drain style output that requires a pull-up resistor (weak or stronger:

4.7–1 kΩ) if it is used by the system. This pin is CKSTP_OUT.

If pull-down resistors are used to configure BVSEL or L3VSEL, the resistors should be less than 250 Ω (see

Table 16). Because PLL_CFG[0:4] must remain stable during normal operation, strong pull-up and pull-down

resistors (1 kΩ or less) are recommended to configure these signals in order to protect against erroneous switching

due to ground bounce, power supply noise or noise coupling.

During inactive periods on the bus, the address and transfer attributes may not be driven by any master and may,

therefore, float in the high-impedance state for relatively long periods of time. Because the MPC7457 must

continually monitor these signals for snooping, this float condition may cause excessive power draw by the input

receivers on the MPC7457 or by other receivers in the system. These signals can be pulled up through weak (10-kΩ)

pull-up resistors by the system, address bus driven mode enabled (see the MPC7450 RISC Micr oprocessor Family

Users’ Manual for more information about this mode), or they may be otherwise driven by the system during

inactive periods of the bus to avoid this additional power draw . Preliminary studies have shown the additional power

draw by the MPC7457 input receivers to be negligible and, in any event, none of these measures are necessary for

proper device operation. The snooped address and transfer attribute inputs are: A[0:35], AP[0:4], TT[0:4], CI, WT,

and GBL.

If extended addressing is not used, A[0:3] are unused and must be pulled low to GND through weak pull-down

resistors. If the MPC7457 is in 60x bus mode, DTI[0:3] must be pulled low to GND through weak pull-down

resistors.

The data bus input receivers are normally turned off when no read operation is in progress and, therefore, do not

require pull-up resistors on the bus. Other data bus receivers in the system, however, may require pull-ups, or that

those signals be otherwise driven by the system during inactive periods by the system. The data bus signals are:

D[0:63] and DP[0:7] .

If address or data parity is not used by the system, and the respective parity checking is disabled through HID0, the

input receivers for those pins are disabled, and those pins do not require pull-up resistors and should be left

unconnected by the system. If all parity generation is disabled through HID0, all parity checking should also be

disabled through HID0, and all parity pins may be left unconnected by the system.

The L3 interface does not normally require pull-up resistors. Unused L3_ADDR signals are driven low when the

SRAM is configured to be less than 1 M in size via L3CR. For example, L3_ADD[18] will be driven low if the

SRAM size is configured to be 2 M; likewise, L3_ADDR[18:17] will be driven low if the SRAM size is configured

to be 1 M.

9.7 JTAG Configuration Signals

Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the IEEE

1 149.1 specification, but is provided on all processors that implement the PowerPC architecture. While it is possible

to force the TAP controller to the reset state using only the TCK and TMS signals, more reliable power-on reset

performance will be obtained if the TRST signal is asserted during power-on reset. Because the JTAG interface is

also used for accessing the common on-chip processor (COP) function, simply tying TRST to HRESET is not

practical.

The COP function of these processors allows a remote computer system (typically, a PC with dedicated hardware

and debugging software) to access and control the internal operations of the processor . The COP interface connects

primarily through the JTAG port of the processor, with some additional status monitoring signals. The COP port

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

54 Freescale Semiconductor

System Design Information

requires the ability to independently assert HRESET or TRST in order to fully control the processor. If the target

system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or

push-button switches, the COP reset signals must be merged into these signals with logic.

The arrangement shown in Figure 26 allows the COP port to independently assert HRESET or TRST , while ensuring

that the tar get can drive HRESET as well. If the JTAG interface and COP header will not be used, TRST should be

tied to HRESET through a 0-Ω isolation resistor so that it is asserted when the system reset signal (HRESET) is

asserted, ensuring that the JTAG scan chain is initialized during power-on. While Freescale recommends that the

COP header be designed into the system as shown in Figure 26, if this is not possible, the isolation resistor will allow

future access to TRST in the case where a JTAG interface may need to be wired onto the system in debug situations.

The COP header shown in Figure 26 adds many benefits—breakpoints, watchpoints, register and memory

examination/modification, and other stan dard debu gger f eatures are possible through this interface—and can be as

inexpensive as an unpopulated footprint for a header to be added when needed.

The COP interface has a standard header for connection to the target system, based on the 0.025" square-post, 0.100"

centered header assembly (often called a Berg header). The connector typically has pin 14 removed as a connector

key.

There is no standardized way to number the COP header shown in Figure 26; consequently, many different pin

numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while

others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with

an IC). Regardless of the numbering, the signal placement recommended in Figure 26 is common to all known

emulators.

The QACK signal shown in Figure 26 is usually connected to the PCI bridge chip in a system and is an input to the

MPC7457 informing it that it can go into the quiescent state. Under normal operation this occurs during a low-power

mode selection. In order for COP to work, the MPC7457 must see this signal asserted (pulled down). While shown

on the COP header, not all emulator products drive this signal. If the product does not, a pull-down resistor can be

populated to assert this signal. Additionally, some emulator products implement open-drain type outputs and can

only drive QACK asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is deasserted

when it is not being driven by the tool. Note that the pull-up and pull-down resistors on the QACK signal are

mutually exclusive and it is never necessary to populate both in a system. T o preserve correct power-down operation,

QACK should be merged via logic so that it also can be driven by the PCI bridge.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 55

System Design Information

Figure 26. JTAG Interface Connection

HRESET HRESET

From Target

Board Sources

HRESET

SRESET

VDD_SENSE

5 1

2 kΩ10 kΩ

10 kΩ

OVDD

CHKSTP_IN CHKSTP_IN

TMS

TDO

TDI

TCK

TMS

TDO

TDI

TCK

TRST

(if any)

COP Header

14 2

Key

QACK

OVDD

10 kΩ

OVDD

TRST

10 kΩOVDD

10 kΩ

QACK

CHKSTP_OUT

KEY

No Pin

COP Connector

Physical Pin Out

10 kΩ 4

OVDD

2 kΩ 3

0 Ω 5

12 6

Notes:

1. RUN/STOP

, normally found on pin 5 of the COP header, is not implemented on the MPC7457. Connect

pin 5 of the COP header to OVDD with a 10-kΩ pull-up resistor.

2. Key location; pin 14 is not physically present on the COP header.

3. Component not populated. Populate only if debug tool does not drive QACK.

4. Populate only if debug tool uses an open-drain type output and does not actively deassert QACK.

5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP

header though an AND gate to TRST of the part. If the JTAG interface is not implemented, connect

HRESET from the target source to TRST of the part through a 0-Ω isolation resistor.

6. Though defined as a No-Connect, it is a common and recommended practice to use pin 12 as an

additional GND pin for improved signal integrity.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

56 Freescale Semiconductor

System Design Information

9.8 Thermal Management Information

This section provides thermal management information for the ceramic ball grid array (CBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat

sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to

the package by several methods—spring clip to holes in the printed-circuit board or package, and mounting clip and

screw assembly (see Figure 27); however, due to the potential large mass of the heat sink, attachment through the

printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed 10 pounds.

Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options

The board designer can choose between several types of heat sinks to place on the MPC7457. There are several

commercially available heat sinks for the MPC7457 provided by the following vendors:

Aavid Thermalloy 603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech 408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

Calgreg Thermal Solutions 401-732-8100

60 Alhambra Road

Warwick, RI 02886

Internet: www.calgregthermalsolutions.com

International Electronic Research Corporation (IERC) 818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Thermal

Heat Sink CBGA Package

Heat Sink

Clip

Printed-Circuit Board

Interface Material

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 57

System Design Information

Tyco Electronics 800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisbur g, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering 603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at

a given air velocity, spatial volume, mass, attachment method, assembly, and cost.

9.8.1 Internal Package Conduction Resistance

For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction thermal resistance paths are

as follows:

• The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance

• The die junction-to-ball thermal resistance

Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit

board.

Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board

Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach material

(or thermal interface material), and finally to the heat sink where it is removed by forced-air convection.

Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon

may be neglected. Thus, the thermal interface material and the heat sink conduction/convective thermal resistances

are the dominant terms.

External Resistance

Internal Resistance

Radiation Convection

Heat Sink

Printed-Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

(Note the internal versus external package resistance.)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

58 Freescale Semiconductor

System Design Information

9.8.2 Thermal Interface Materials

A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal

contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 29 shows

the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare

joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal

interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the

interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater

than the thermal grease joint.

Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see

Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low interface

pressure and is recommended due to the high power dissipation of the MPC7457. Of course, the selection of any

thermal interface material depends on many factors—thermal performance requirements, manufacturability , service

temperature, dielectric properties, cost, etc.

Figure 29. Thermal Performance of Select Thermal Interface Material

The board designer can choose between seve ral types of thermal interface. Heat sink adhesive materials should be

selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration

requirements. There are several commercially available thermal interfaces and adhesive materials provided by the

following vendors:

The Bergquist Company 800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

0.5

1.5

0 1020304050607080

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

Specific Thermal Resistance (K-in.2/W)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 59

System Design Information

Chomerics, Inc. 781-935-4850

77 Dragon Ct.

Woburn, MA 01888-4014

Internet: www.chomerics.com

Dow-Corning Corporation 800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dow.com

Shin-Etsu MicroSi, Inc. 888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.com

Thermagon Inc. 888-246-9050

4707 Detroit Ave.

Cleveland, OH 44102

Internet: www.thermagon.com

The following section provides a heat sink selection example using one of the commercially available heat sinks.

9.8.3 Heat Sink Selection Example

For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:

Tj = TI + Tr + (RθJC + Rθint + Rθsa) × Pd

where:

Tj is the die-junction temperature

TI is the inlet cabinet ambient temperature

Tr is the air temperature rise within the computer cabinet

RθJC is the junction-to-case thermal resistance

Rθint is the adhesive or interface material the rmal resistance

Rθsa is the heat sink base-to-ambient thermal resistance

Pd is the power dissipated by the device

During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in Table 4.

The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air

temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30°

to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of

the thermal interface material (Rθint) is typically about 1.5°C/W. For example, assuming a Ta of 30°C, a Tr of 5°C,

a CBGA package RθJC = 0.1, and a typical power consumption (Pd) of 18.7 W, the following expression for Tj is

obtained:

Die-junction temperature: Tj = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa) × 18.7 W

For this example, a Rθsavalue of 2.1°C/W or less is required to maintain the die junction temperature below the

maximum value of Table 4.

Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit

used for comparing the thermal performance of various microelectronic packaging technologies, one should

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

60 Freescale Semiconductor

System Design Information

exercise caution when only using this metric in determining thermal management because no single parameter can

adequately describe three-dimensional heat flow . The final die-junction operating temperature is not only a function

of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to

the component's power consumption, a number of factors affect the final operating die-junction

temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink

attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc.

Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic

equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conductio n) may vary

widely . For these reasons, we recommend using conjugate heat transfer models for the board, as well as system-level

designs.

For system thermal modeling, the MPC7447 and MPC7457 thermal model is shown in Figure 30. Four volumes will

be used to represent this device. Two of the volumes, solder ball, and air and substrate, are modeled using the

package outline size of the package. The other two, die, and bump and underfill, have the same size as the die. The

silicon die should be modeled 9.64 × 11.0 × 0.74 mm with the heat source applied as a uniform source at the bottom

of the volume. The bump and underfill layer is modeled as 9.64 × 11.0 × 0.069 mm (or as a collapsed volume) with

orthotropic material properties: 0.6 W/(m • K) in the xy-plane and 2 W/(m • K) in the direction of the z-axis. The

substrate volume is 25 × 25 × 1.2 mm (MPC7447) or 29 × 29 × 1.2 mm (MPC7457), and this volume has

18 W/(m • K) isotropic conductivity. The solder ball and air layer is modeled with the same horizontal dimensions

as the substrate and is 0.9 mm thick. It can also be modeled as a collapsed volume u sing orthotropic material

properties: 0.034 W/(m • K) in the xy-plane direction and 3.8 W/(m • K) in the direction of the z-axis.

Figure 30. Recommended Thermal Model of MPC7447 and MPC7457

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity Value Unit

Bump and Underfill

kx0.6 W/(m • K)

ky0.6

kz2

Substrate

k18

Solder Ball and Air

kx0.034

ky0.034

kz3.8

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 61

Document Revision History

10 Document Revision History

Table 22 provides a revision history for this hardware specification.

Table 22. Document Revision History

Revision

Number Date Substantive Change(s)

6 7/22/2005 Revised Note in Section 9.2, “PLL Power Supply Filtering”

Added heat sink vendor to list in Section 9.8, “Thermal Management Information”

Corrected bump and underfill model dimension in Section 9.8.3, “Heat Sink Selection Example”

5 09/09/2004 Updated document to new Freescale template.

Updated section numbering and changed reference from part number specifications to addendums.

Added Rev. 1.2 devices, including increased L3 clock max frequency to 250 MHz and improved L3

AC timing.

Table 5: Added CTE information.

Table 8: Modified jitter specifications to conform to JEDEC standards, changed jitter specification to

cycle-to-cycle jitter (instead of long- and short-term jitter); changed jitter bandwidth

recommendations.

Table 13: Deleted note 9 and renumbered.

Table 14: Deleted note 5 and renumbered.

Table 17: Revised note 6.

Added Section 9.1.3.

Section 9.2: Changed filter resistor recommendations. Recommend 10 Ω resistor for all production

devices, including production Rev. 1.1 devices. 400 Ω resistor needed only for early Rev. 1.1

devices.

Table 22: Reversed the order of revision numbers.

Added Tables 25 and 26.

4.1 Section 9.1.1: Corrected note regarding different PLL configurations for earlier devices; all

MPC7457 devices to date conform to this table.

Section 9.6: Added information about unused L3_ADDR signals.

Table 24: Changed title to include document order information for MPC74x7RXnnnnNx series part

number specification.

4 Table 9: Corrected pin lists for input and output AC timing to correctly show HIT as an output-only

signal

Added specifications for 1267 MHz devices; removed specs for 1300 MHz devices.

Section 5.2.3: Changed recommendations regarding use of L3 clock jitter in AC timing analysis. The

L3 jitter is now fully comprehended in the AC timing specs and does not need to be included in the

timing analysis.

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

62 Freescale Semiconductor

Document Revision History

3 Corrected numerous errors in lists of pins associated with tKHOV

, tKHOX, tIVKH, and tIXKH in Table 9.

Added support for 1.5 V L3 interface voltage; issues fixed in Rev. 1.1.

Corrected typos in Table 12.

Added data to Table 2.

Clarified address bus pull-up resistor recommendations in Section 1.9.6.

Modified Table 9, Figure 5, and Figure 6 to more accurately show when the mode select inputs

(BMODE[0:1], L3VSEL, BVSEL) are sampled and AC timing requirements

Table 10: Added skew and jitter values.

Table 14: Added AC timing values.

Table 24: Updated to reflect past and current part numbers not fully covered by this document.

Ta bl e 6: R e m ove d C V IH and CVIL; VIH and VIL for SYSCLK input is the same as for other input

signals, and is now noted accordingly in this table.

Table 7: Removed Doze mode power entry (but left footnote 4 for clarity); documentation change

only.

Nontechnical formatting

2 Added substrate capacitor information in Sections 1.8.3 and 1.8.6.

Increased minimum processor and VCO frequencies in Table 8 from 500 and 1000 MHz to 600 and

1200 MHz (respectively).

Corrected maximum processor frequency for 1300 MHz devices in Table 8 (changed from 1333 to

1300 MHz).

Added value for to tL3CSKW1 Table 10.

Added L3OHCR information in Section 1.5.2.4.1.

Added values for tCO and tECI to Table 11.

Added Note 8 to Table 13 and Note 6 to Table 14.

Changed resistor value in PLL filter in Figure 25 from 10 Ω to 400 Ω.

Added 867 MHz speed grade.

Corrected Product Code in Tables 22 and 23.

Added pull-up/pull-down recommendations for CKSTP_IN and PLL_CFG[0:4] to Section 1.9.6.

1.1 Nontechnical reformatting.

Table 22. Document Revision History (continued)

Revision

Number Date Substantive Change(s)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 63

Part Numbering and Marking

11 Part Numbering and Marking

Ordering information for the parts fully covered by this specification document is provided in Section 11.1, “Part

Numbers Fully Addressed by This Document.” Note that the individual part numbers correspond to a maximum

processor core frequency. For available frequencies, contact your local Freescale sales office. In addition to the

processor frequency, the part numbering sc heme also includes an application modifier which may specify spe cial

application conditions. Each part number also contains a revision level code which refers to the die mask revision

number. Section 1 1.2, “Part Numbers Not Fully Addressed by This Document,” lists the part numbers which do not

fully conform to the specifications of this document. These special part numbers require an additional document

called a referred to as a hardware specification addendum.

11.1 Part Numbers Fully Addressed by This Document

Table 23 provides the Freescale part numbering nomenclature for the MPC7457.

1 Removed support for 1.5 V L3 interface voltage from Tables 3 and 4. 1.5 V I/O voltage is not

supported in current MPC7457 devices.

Added package thermal characteristics values to Table 5, made minor revisions to Section 1.9.8.

Added preliminary AC timing values to Tables 10 and 12.

Added footnotes to Table 17.

0 Initial release.

Table 23. Part Numbering Nomenclature

MC 74x7RX nnnn Lx

Product

Code

Part

Identifier Package Processor

Frequency 1

Application

Modifier Revision Level

PPC 2

7457

7447

RX = CBGA 867

1000

1200

1267

L: 1.3 V ± 50 mV

0° to 105°C

B: 1.1; PVR = 8002 0101

MC 7457 867

1000

1200

1267

C: 1.2; PVR = 8002 0102

Notes:

1. Processor core frequencies supported by parts addressed by this specification only. Parts addressed by a

hardware specification addendum may support other maximum core frequencies.

2. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP

3-13. These parts have only preliminary reliability and characterization data. Before pilot production prototypes may

be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging

the qualification status and the fact that product changes may still occur while shipping pilot production prototypes.

Table 22. Document Revision History (continued)

Revision

Number Date Substantive Change(s)

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

64 Freescale Semiconductor

Part Numbering and Marking

11.2 Part Numbers Not Fully Addressed by This Document

Parts with application modifiers or revision levels not fully addressed are described in a separate addendum, which

supplement and supersede this hardware specification. As such parts are released, these specifications will be listed

in this section.

Table 24. Part Numbers Addressed by MPC74x7RXnnnnNx Series Hardware Specifications Addendum

(Document Order No. MPC7457ECS1AD)

MC 74x7RX nnnn Nx

Product

Code

Part

Identifier Package Processor

Frequency

Application

Modifier Revision Level

PPC 7457 RX = CBGA 1000

867

733

600

N: 1.1 V ± 50 mV

0° to 105°C

B: 1.1; PVR = 8002 0101

7447 1000

867

MC 7447 1000

867

733

600

B: 1.1; PVR = 8002 0101

7457 1000

867

733

600

C: 1.2; PVR = 8002 0102

Table 25. Part Numbers Addressed by MPC7457TRXnnnnLB Series Hardware Specifications Addendum

(Document Order No. MPC7457ECS2AD)

MC 7457 T RX nnnn Lx

Product

Code

Part

Identifier

Specification

Modifier Package Processor

Frequency

Application

Modifier Revision Level

MC 7457 T = Extended

Temperature

Device

RX = CBGA 1000

1267

L: 1.3 V ± 50 mV

–40° to 105°C

C: 1.2; PVR = 8002 0102

Table 26. Part Numbers Addressed by MPC7457TRXnnnnNx Series Hardware Specifications Addendum

(Document Order No. MPC7457ECS3AD)

MC 74x7T RXnnnn Nx

Product

Code

Part

Identifier

Specification

Modifier Package Processor

Frequency

Application

Modifier Revision Level

MC 7447 T = Extended

Temperature

Device

RX = CBGA 733

1000

N: 1.1 V ± 50 mV

–40° to 105°C

B: 1.1; PVR = 8002 0101

7457 C: 1.2; PVR = 8002 0102

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 65

Part Numbering and Marking

11.3 Part Marking

Parts are marked as the examples shown in Figure 31.

Figure 31. Part Marking for BGA Device

BGA

Notes:

MMMMMM is the 6-digit mask number.

ATWLYYWWA is the traceability code.

MC7457

RXnnnnLx

MMMMMM

ATWLYYWWA

7457

BGA

MC7447

RX1nnnLx

MMMMMM

ATWLYYWWA

7447

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

66 Freescale Semiconductor

Part Numbering and Marking

THIS PAGE INTENTIONALLY LEFT BLANK

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 6

Freescale Semiconductor 67

Part Numbering and Marking

THIS PAGE INTENTIONALLY LEFT BLANK

MPC7457EC

Rev. 6

08/2005

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