HLMP-BL16-N00DD - Avago Technologies

HLMP-ADxx/AGxx/ALxx/BDxx/BGxx/BLxx

5mm mini Oval Precision Optical Performance

AlInGaP Lamps

Data Sheet

Features

• Well dened spatial radiation pattern

• Viewing angles:

Major axis 70°

Minor axis 35°

• High luminous output

• Red and Amber intensity are available for:

AlInGaP (Bright)

AlInGaP II (Brightest)

• Colors:

626 nm red

630 nm red

590 nm amber

592 nm amber

• Superior resistance to moisture

• UV resistant epoxy

Applications

• Full color/video signs

Description

These Precision Optical Performance Oval LEDs are spe-

cically designed for full color/video and passenger infor-

mation signs. The oval shaped radiation pattern (35° x 70°)

and high luminous intensity ensure that these devices

are excellent for wide eld of view outdoor application

where a wide viewing angle and readability in sunlight

are essential. These lamps have very smooth, matched

radiation patterns ensuring consistent color mixing in full

color applications, message uniformity across the viewing

angle of the sign.

High eciency LED material is used in these lamps:

Aluminum Indium Gallium Phosphide (AlInGaP) for amber

and red. Each lamp is made with an advance optical grade

epoxy oering superior high temperature and high

moisture resistance in outdoor applications. The package

epoxy contains both UV-A and UV-B inhibitors to reduce

the eects of long term exposure to direct sunlight.

Designers can select parallel or perpendicular orientation.

Both lamps are available in tinted version.

Benets

• Viewing angle designed for wide eld of view

application

• Superior performance in outdoor environments

Table 1. Device Selection Guide for AlInGaP II

Part Number

Color and Dominant

Wavelength

ld (nm) Typ.

Luminous

Intensity

Iv (mcd)

at 20 mA Min.

Luminous

Intensity

Iv (mcd)

at 20 mA Max. Stand-O

Leadframe

Orientation

Package

Drawing

HLMP-AD06-NSTxx Red 630 680 2500 No Parallel A

HLMP-AD06-P00xx Red 630 880 No Parallel A

HLMP-AD06-P0Txx Red 630 880 No Parallel A

HLMP-AD06-PQ0xx Red 630 880 1500 No Parallel A

HLMP-AD06-RSTxx Red 630 1500 2500 No Parallel A

HLMP-AD06-STTxx Red 630 1900 3200 No Parallel A

HLMP-AD16-P00xx Red 630 880 Yes Parallel B

HLMP-AD16-QTTxx Red 630 1150 3200 Yes Parallel B

HLMP-AD16-RS0xx Red 630 1500 2500 Yes Parallel B

HLMP-AD16-RSTxx Red 630 1500 2500 Yes Parallel B

HLMP-AD16-RUTxx Red 630 1500 4200 Yes Parallel B

HLMP-AD16-ST0xx Red 630 1900 3200 Yes Parallel B

HLMP-AD16-STTxx Red 630 1900 3200 Yes Parallel B

HLMP-AL16-RSRxx Amber 592 1500 2500 Yes Parallel B

HLMP-AL16-RSKxx Amber 592 1500 2500 Yes Parallel B

HLMP-BD06-L00xx Red 630 400 No Perpendicular C

HLMP-BD06-P00xx Red 630 880 No Perpendicular C

HLMP-BD06-RS0xx Red 630 1500 2500 No Perpendicular C

HLMP-BD06-RSTxx Red 630 1500 2500 No Perpendicular C

HLMP-BD06-STTxx Red 630 1900 3200 No Perpendicular C

HLMP-BD16-NP0xx Red 630 680 1150 Yes Perpendicular D

HLMP-BD16-QRTxx Red 630 1150 1900 Yes Perpendicular D

HLMP-BD16-RU0xx Red 630 1500 4200 Yes Perpendicular D

HLMP-BD16-RUTxx Red 630 1500 4200 Yes Perpendicular D

HLMP-BD16-ST0xx Red 630 1900 3200 Yes Perpendicular D

HLMP-BD16-STTxx Red 630 1900 3200 Yes Perpendicular D

HLMP-BL06-N00xx Amber 592 680 No Perpendicular C

Table 2. Device Selection Guide for AlInGaP

Part Number

Color and Dominant

Wavelength

ld (nm) Typ.

Luminous

Intensity

Iv (mcd)

at 20 mA Min.

Luminous

Intensity

Iv (mcd)

at 20 mA Max. Stand-O

Leadframe

Orientation

Package

Drawing

HLMP-AG01-K00xx Red 626 310 No Parallel A

HLMP-AL01-L00xx Amber 590 400 No Parallel A

HLMP-AL01-LP0xx Amber 590 400 1150 No Parallel A

HLMP-AL01-N00xx Amber 590 680 No Parallel A

HLMP-AL01-NR0xx Amber 590 680 1900 No Parallel A

HLMP-AL01-PQKxx Amber 590 880 1150 No Parallel A

HLMP-AL11-NR0xx Amber 590 880 1900 Yes Parallel B

HLMP-BG01-LM0xx Red 626 400 520 No Perpendicular C

HLMP-BG01-MN0xx Red 626 520 680 No Perpendicular C

HLMP-BL01-NR0xx Red 626 680 1900 No Perpendicular C

HLMP-BL11-KN0xx Red 626 310 880 Yes Perpendicular D

HLMP-BL11-NR0xx Red 626 680 1900 Yes Perpendicular D

Part Numbering System

HLMP - X X X X - X X X XX

Mechanical Options

00: Bulk Packaging

DD: Ammo Pack

YY: Flexi-Bin; Bulk Packaging

ZZ: Flexi-Bin; Ammo Pack

Color Bin

0: No Color Bin Limitation

B: Color bin 2 and 3 only

K: Color bins 2 and 4 only

R: Color Bins 1, 2, 4, and 6 with VF max of 2.6 V

S: Color bins 2 and 4 with VF max of 2.6 V

T: Red Color with VF max of 2.6 V

Maximum Intensity Bin

0: No Iv Bin Limitation

Minimum Intensity Bin

Tint Option

1 or 6: Matching Color Tints

Stando Option

0: Without

1: With

Color

D: 630 nm Red

G: 626 nm Red

L: 590 or 592 nm Amber

Package

A: 5 mm Mini Oval, Parallel

B: 5 mm Mini Oval, Perpendicular

Note: Please refer to AB 5337 for complete information on part numbering system.

Package Dimensions

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

1.50 ±0.15

(0.059 ± 0.006)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

1.50 ±0.15

(0.059 ± 0.006)

HLMP-ALXX Pkg Dimensions

11.70 + 0.13

– 0.08

0.461 + 0.005

– 0.003)(

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY

MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.

3. RECOMMENDED PC BOARD HOLE DIAMETERS:

– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF

LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).

– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.

Absolute Maximum Ratings at TA = 25˚C

Parameter Red and Amber

DC Forward Current[1] 50 mA

Peak Pulsed Forward Current[2] 100 mA

Average Forward Current 30 mA

Reverse Voltage (IR = 100 µA) 5 V

Power Dissipation 120 mW

LED Junction Temperature 130°C

Operating Temperature Range –40°C to +100°C

Storage Temperature Range –40°C to +100°C

Notes:

1. Derate linearly as shown in gure 4.

2. Duty Factor 30%, Frequency 1kHz.

Electrical/Optical Characteristics at TA = 25°C

Parameter Symbol Min. Typ. Max. Units Test Conditions

Typical Viewing Angle

Major 2q1/2 70 deg

Minor 35

Forward Voltage VF V IF = 20 mA

Red (ld = 626 nm) 2.0 2.4

Red (ld = 630 nm)

Option xx0xx 2.2 2.4

Option xxTxx 2.3 2.6

Amber (ld = 590 nm) 2.0 2.4

Amber (ld = 592 nm)

Option xx0xx 2.2 2.4

Option xxRxx, xxSxx 2.3 2.6

Reverse Voltage

Amber, Red VR 5 20 V IR = 100 µA

Peak Wavelength Peak of Wavelength of

Amber (ld = 592 nm) lpeak 594 nm Spectral Distribution

Red (ld = 630 nm) 639 at IF = 20 mA

Spectral Halfwidth Wavelength Width at

Amber (ld = 592 nm) ∆l1/2 17 nm Spectral Distribution 1/2

Red (ld = 630 nm) 17 Power Point at IF = 20 mA

Capacitance VF = 0, F = 1 MHz

Amber, Red C 40 pF

Luminous Ecacy Emitted Luminous

Amber (ld = 592 nm) hv 500 lm/W Power/Emitted Radiant

Red (ld = 630 nm) 155 Power at IF = 20 mA

Thermal Resistance RQJ-PIN 240 °C/W LED Junction-to-

Cathode Lead

Notes:

1. 2q1/2 is the o-axis angle where the luminous intensity is 1/2 the on-axis intensity.

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/hv where Iv is the luminous intensity in candelas and hv is

the luminous ecacy in lumens/watt.

3. The luminous intensity is measured on the mechanical axis of the lamp package.

4. The optical axis is closely aligned with the package mechanical axis.

5. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

6. For Options -xxRxx, -xxSxx and -xxTxx, max. forward voltage (Vf) is 2.6 V. Refer to Vf bin table.

Figure 1. Relative intensity vs. wavelength.

Figure 2a. Amber, red forward current vs.

forward voltage.

Figure 2b. Forward current vs. forward voltage

for option -xxTxx red, and option

-xxRxx and -xxSxx amber.

Figure 4. Amber, red maximum forward current

vs. ambient temperature.

Figure 3. Amber, red relative luminous intensity

vs. forward current.

CURRENT – mA

VF – FORWARD VOLTAGE – V

1.0 3.0

AMBER

HLMP-ALXX fig 3

1.5 2.0 2.5

RED

DC FORWARD CURRENT – mA

FORWARD VOLTAGE – V

0 3.01.0 1.5 2.5

0.5 2.0

AMBER

RED

RELATIVE INTENSITY

(NORMALIZED AT 20 mA)

FORWARD CURRENT – mA

20 30

2.0

1.0

0.5

1.5

2.5

10 40

AMBER

RED

HLMP-ALXX fig 7

IF – FORWARD CURRENT – mA

TA – AMBIENT TEMPERATURE – °C

40 80

20 60 100

RθJA = 585° C/W

RθJA = 780° C/W

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

500 550 600 650 700

WAVELENGTH - nm

RELATIVE INTENSITY

REDAMBER

Figure 5. Spatial radiation pattern – 35 x 70 degree lamps.

Vf Bin Table [2,3]

Bin Id Min. Max.

VA 2.0 2.2

VB 2.2 2.4

VC 2.4 2.6

Notes:

1. All bin categories are established for classication of products.

Products may not be available in all bin categories. Please contact

your Avago representative for further information.

2. Vf bin table only available for those numbers with options -xxRxx,

-xxSxx, -xxTxx.

3. Tolerance for each bin limit is ± 0.05V

HLMP-ALXX fig 8a

RELATIVE INTENSITY – %

100

VERTICAL ANGULAR DISPLACEMENT – DEGREES

40 020 -10 -30 -50

30 10 -20 -40

HLMP-ALXX fig 8b

RELATIVE INTENSITY – %

100

HORIZONTAL ANGULAR DISPLACEMENT – DEGREES

40 020 -10 -30 -50

30 10 -20 -40

Intensity Bin Limits (mcd at 20 mA)

Bin Name Min. Max.

K 310 400

L 400 520

M 520 680

N 680 880

P 880 1150

Q 1150 1500

R 1500 1900

S 1900 2500

T 2500 3200

U 3200 4200

Tolerance for each bin limit is ±15%.

Amber Color Bin Limits (nm at 20 mA)

Bin Name Min. Max.

1 584.5 587.0

2 587.0 589.5

4 589.5 592.0

6 592.0 594.5

Tolerance for each bin limit is ± 0.5 nm.

Precautions:

Lead Forming:

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Soldering and Handling:

• Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.

• LED component may be eectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59mm. Soldering

the LED using soldering iron tip closer than 1.59mm

might damage the LED.

Note:

1. PCB with dierent size and design (component density) will have

dierent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

prole again before loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high eciency

LED die with single wire bond as shown below. Customer is advised

to take extra precaution during wave soldering to ensure that the

maximum wave temperature does not exceed 250°C and the solder

contact time does not exceeding 3sec. Over-stressing the LED during

soldering process might cause premature failure to the LED due to

delamination.

Avago Technologies LED conguration

1.59mm

• ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

• Recommended soldering condition:

Wave

Soldering [1, 2]

Manual Solder

Dipping

Pre-heat temperature 105 °C Max. -

Preheat time 60 sec Max -

Peak temperature 250 °C Max. 260 °C Max.

Dwell time 3 sec Max. 5 sec Max

Note:

1) Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2) It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

• Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. Customer is advised to perform daily check on the

soldering prole to ensure that it is always conforming

to recommended soldering conditions.

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

• Any alignment xture that is being applied during

wave soldering should be loosely tted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during wave

soldering process.

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment xture or pallet.

• If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reow soldering prior to insertion the TH LED.

• Recommended PC board plated through holes (PTH)

size for LED component leads.

LED component

lead size Diagonal

Plated through

hole diameter

0.45 x 0.45 mm

(0.018x 0.018 inch)

0.636 mm

(0.025 inch)

0.98 to 1.08 mm

(0.039 to 0.043 inch)

0.50 x 0.50 mm

(0.020x 0.020 inch)

0.707 mm

(0.028 inch)

1.05 to 1.15 mm

(0.041 to 0.045 inch)

• Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diculty inserting the TH LED.

AllnGaP Device

CATHODE

Example of Wave Soldering Temperature Prole for TH LED

0 10 20 30 40 50 60 70 80 90 100

250

200

150

100

TIME (MINUTES)

PREHEAT

TURBULENT WAVE LAMINAR WAVE

HOT AIR KNIFE

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature:

245°C± 5°C (maximum peak

temperature = 250°C)

Dwell time: 1.5 sec - 3.0 sec

(maximum = 3sec)

Note: Allow for board to be sufficiently

cooled to room temperature before

exerting mechanical force.

Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.

Ammo Packs Drawing

Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of stando or non-stando.

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 250C

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

250C

Lam

s Bab

Label

Packaging Box for Ammo Packs

Note: For InGaN device, the ammo pack packaging box contains ESD logo.

FROM LEFT SIDE OF BOX,

ADHESIVE TAPE MUST BE

FACING UPWARD.

AVAGO

TECHNOLOGIES

ANODE

MOTHERLABEL

CATHODE

–

ANODE LEAD LEAVES

THE BOX FIRST.

LABEL ON

THIS SIDE

OF BOX.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1542EN - September 16, 2008

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR

SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF

A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL

RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH

Acronyms and Denition:

BIN:

(i) Color bin only or VF bin only

(Applicable for part number with color bins but

without VF bin OR part number with VF bins and no

color bin)

(ii) Color bin incorporated with VF Bin

(Applicable for part number that have both color bin

and VF bin)

(ii) Avago Baby Label (Only available on bulk packaging)

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB” only)

(ii) Color bin incorporate with VF Bin

BIN: 2VB

VB: VF bin “VB”

2: Color bin 2 only

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 250C

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

250C

Lam

s Bab

Label