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July 2011 Rev. 1.1.0
Exar Corporation www.exar.com
48720 Kato Road, Fremont CA 94538, USA Tel. +1 510 668-7000 – Fax. +1 510 668-7001
GENERAL DESCRIPTION
The XRP2525 and XRP2526 devices are
respectively single and dual channel integrated
high-side power distribution switches with
independent enables and fault flags. A wide
1.8V to 5.5V input voltage range allows for
operations from industry standard 1.8V, 3.3V
and 5V power rails.
Optimized for USB V
BUS
power distribution, the
XRP2525 and XRP2526 are compliant with the
latest USB 3.0 specification and can be used in
any self or bus powered USB applications. The
power-switch rise and fall times are controlled
to minimize current surges during turn on/off.
The XRP2525 and XRP2526 are pin and
function compatible to respectively Exar’s
SP2525A and SP2526A.
Built-in over current, under voltage lockout
(UVLO), reverse current and over temperature
protections insure safe operations under
abnormal operating conditions.
XRP2525 and XRP2526 are offered in a RoHS
compliant “green”/halogen free 8-pin NSOIC
package.
APPLICATIONS
Self Powered USB 2.0 and 3.0 Hubs
USB Compliant V
BUS
Power Distribution
Audio-Video Equipments
Generic Power Switching
FEATURES
Single/Dual Channel Current Switch
900mA per channel capable
1.15A Over-current Limit
1.8V to 5.5V Input Voltage Range
USB 2.0/3.0 Compliant
Active High or Low Individual Enable
Individual Channel Fault Flag Indicator
Under voltage Lockout, Reverse
Current and Thermal Shutdown
Protection
RoHS Compliant, Green/Halogen Free
8-Pin NSOIC Package
TYPICAL APPLICATION DIAGRAM
Fig. 1: XRP2526 Application Diagram
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© 2011 Exar Corporation 2/11 Rev. 1.1.0
ABSOLUTE MAXIMUM RATI NGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
V
IN
........................................................... -0.3V to 7.0V
V
EN
, V
FLG
............................................................... 7.0V
Storage Temperature .............................. -65°C to 150°C
Power Dissipation ................................ Internally Limited
Lead Temperature (Soldering, 10 sec) ................... 300°C
ESD Rating (HBM - Human Body Model) .................... 2kV
ESD Rating (MM - Machine Model) ........................... 200V
OPERATING RATINGS
Input Voltage Range V
IN
............................. 1.75V to 5.5V
Junction Temperature Range .................... -40°C to 125°C
Thermal Resistance θ
JA
.................................. 128.4ºC/W
ELECTRICAL SPECIFICATIONS
Specifications are for an Operating Junction Temperature of T
J
= 25°C only; limits applying over the full Operating Junction
Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes
only. Unless otherwise indicated, 1.8V to 5.5V, C
IN
= 47µF//1µF, C
OUT
= 10µF, T
J
= –40°C to 125°C.
Parameter Min. Typ. Max. Units Conditions
Input Supply Voltage 1.8 5.5 V
•
Input Quiescent Current 80 150 µA
•
XRP2526 (Both Channels enabled)
V
IN
=5V, I
OUT1
= I
OUT2
=0mA
Input Quiescent Current 52 100 µA
•
XRP2525 & XRP2526 (1 Channel enabled)
V
IN
=5V, I
OUT1
=0mA
Input Shutdown Current 3 µA
•
V
IN
=5V, Channel(s) disabled
Maximum Output Current per
channel 900 mA
•
XRP2525 and XRP2526
Output Leakage Current 10 µA
V
IN
=5V, V
OUT
=0V, Each channel, Switch off
Reverse Leakage Current 10 µA
V
IN
=0V, V
OUT
=5V, Each channel, Switch off
Output MOSFET Resistance 80 140 mΩ •
I
OUT
=0.3A, Each channel
Output turn-on delay 1000 µs
V
IN
=5V, R
L
=10Ω, C
OUT
=1µF, each output
Output turn-on rise time 2000 4000 µs V
IN
=5V, R
L
=10Ω, C
OUT
=1µF, each output
Output turn-off delay 10 20 µs
V
IN
=5V, R
L
=10Ω, C
OUT
=1µF, each output
Output turn-off fall time 22 50 µs
V
IN
=5V, R
L
=10Ω, C
OUT
=1µF, each output
Current limit threshold 0.90 1.15 1.40 A •
V
IN
– V
OUT
=0.3V, Internally set
Short Circuit Current Limit 0.66xI
LIM
A
V
OUT
=0V
Output Voltage Short Circuit
Detect Threshold 925 mV
Operates in short circuit current limit mode
when output voltage is below threshold.
Safe Operating Area (SOA)
Current Limit 3 A
Over temperature shutdown
threshold 135 °C
Temperature rising
Over temperature shutdown
threshold hysteresis 10 °C
Temperature decreasing
Under-voltage lockout threshold 1.55 1.68 1.75 V V
IN
rising or falling
Under-voltage lockout hysteresis 50 mV
FLG output logic low voltage 100 250 mV
I
FLG
=10mA, V
IN
=5.5V
FLG output high leakage 1 µA
FLG blanking time 10 ms
EN input logic high voltage 1.5 V
•
EN input logic low voltage 0.5 V
•
EN input leakage current -1 0 1 µA
V
EN
=0V or V
EN
=5.5V
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© 2011 Exar Corporation 3/11 Rev. 1.1.0
BLOCK DIAGRAM
Fig. 2: XRP2525 and XRP2526 Block Diagrams
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© 2011 Exar Corporation 4/11 Rev. 1.1.0
PIN ASSIGNMENT
Fig. 3: XRP2525 - XRP2526 Pin Assignment
PIN DESCRIPTION – XRP252 5
Name Pin Number Description
EN 1 Channel Enable Input
Active High for XRP2525-1 and Active Low for XRP2525-2
FLG 2 Error Flag Signal
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.
GND 3 Ground Signal
NC 4,5,6 No Connect
IN 7 Voltage Input Pin
OUT 8 Voltage Output Pin
PIN DESCRIPTION – XRP252 6
Name Pin Number Description
EN
X
1,4 Channel Enable Input
Active High for XRP2526-1 and Active Low for XRP2526-2
FLG
X
2,3 Error Flag Signal
Active low open drain output. Active on over-current, over-temperature or UVLO conditions.
GND 6 Ground Signal
IN 7 Voltage Input Pin
OUT
X
5,8 Voltage Output Pin
ORDERING INFORMATION
Part Number Temperature Range Marking Package Packing Quantity
Note 1 Note 2
XRP2525ID-1-F -40°C≤T
A
≤+85°C
2525ID 1
YYWW
X
NSOIC8 Bulk Lead Free and
Halogen Free
Single Channel
Active high
XRP2525IDTR-1-F 2.5K/Tape & Reel
XRP2525ID-2-F -40°C≤T
A
≤+85°C
2525ID 2
YYWW
X
NSOIC8 Bulk Lead Free and
Halogen Free
Single Channel
Active low
XRP2525IDTR-2-F 2.5K/Tape & Reel
XRP2526ID-1-F -40°C≤T
A
≤+85°C
2526ID 1
YYWW
X
NSOIC8 Bulk Lead Free and
Halogen Free
Dual Channel
Active high
XRP2526IDTR-1-F 2.5K/Tape & Reel
XRP2526ID-2-F -40°C≤T
A
≤+85°C
2526ID 2
YYWW
X
NSOIC8 Bulk Lead Free and
Halogen Free
Dual Channel
Active low
XRP2526IDTR-2-F 2.5K/Tape & Reel
XRP2525EVB XRP2525 Evaluation Board
XRP2526EVB XRP2526 Evaluation Board
“YY” = Year – “WW” = Work Week – “X” = Lot Number; when applicable.
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© 2011 Exar Corporation 5/11 Rev. 1.1.0
TYPICAL PERFORMANCE CHARACTERISTICS
All data taken at V
IN
= 5V, C
IN
= 47µF//1µF, C
OUT
= 10µF, T
J
= T
A
= 25°C, unless otherwise specified - Schematic and BOM
from Application Information section of this datasheet.
Fig. 4: Output On-Resistance vs. Temperature (XRP2525)
Fig. 5: Output On-Resistance vs. Temperature (XRP2526)
Fig. 6: Off Supply Current vs. Temperature
Fig. 7: Quiescent Current vs. Temperature
XRP2525 and XRP2526 (1-channel on)
Fig. 8: Quiescent Current vs. Temperature
XRP2526 (2-channels on)
Fig. 9: FLG Logic Low Voltage vs. Temperature
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© 2011 Exar Corporation 6/11 Rev. 1.1.0
Fig. 10: Quiescent Current vs. Input Voltage
XRP2525 and XRP2526 (1-channel on)
Fig. 11: Quiescent Current vs. Input Voltage
XRP2526 (2-channels on)
Fig. 12: Output Turn-Off Delay vs. Temperature
Fig. 13: Output Turn-on Delay vs. Temperature
Fig. 14: Output Fall Time vs. Temperature
Fig. 15: Output Rise Time vs. Temperature
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© 2011 Exar Corporation 7/11 Rev. 1.1.0
Fig. 16: Output Turn-Off Delay Time vs. Input Voltage
Fig. 17: Output Turn-On Delay Time vs. Input Voltage
Fig. 18: Output Fall Time vs. Input Voltage
Fig. 19: Output Rise Time vs. Input Voltage
Fig. 20: Current Limit Threshold vs. Temperature (XRP2525)
Fig. 21: Current Limit Threshold vs. Temperature (XRP2526)
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© 2011 Exar Corporation 8/11 Rev. 1.1.0
Fig. 22: Under-voltage lockout trip level vs. Temperature
(VIN Rising)
Fig. 23: Quiescent Current vs. Enable pin Voltage
XRP2525-1
Fig. 24: Turn-On, Turn-Off Characteristics
(XRP2526-1) COUT = 1uF, Rload = 10Ω
Fig. 25: Turn-On, Turn-Off Characteristics
(
XRP2526-1
)
COUT = 1uF, Rload = 5.1Ω
Fig. 26: Current Limit Operation (XRP2525-1):
VIN=5.5V, Rload = 3.9Ω
Fig. 27: Current Limit Operation (XRP2526-1):
VIN=1.8V, Rload = 1.5Ω
46
48
50
52
54
56
58
60
1.5 2.5 3.5 4.5 5.5
IQ [uA ]
VEN [V]
IQ vs VEN @ 25C: XRP2525-1
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© 2011 Exar Corporation 9/11 Rev. 1.1.0
THEORY OF OPERATION
The XRP2525 and XRP2526 devices are
respectively single and dual channel integrated
high-side power distribution switches that can
be used in any self or bus powered USB
applications. They are compliant with the
latest USB 3.0 specifications. The reverse
current protection feature prevents current to
flow from OUT to IN when the device is
disabled.
INPUT & OUTPUT
Placing bulk capacitances of at least 47μF and
10μF at the input and output pins respectively
reduces power supply transients under heavy
current load conditions.
It is important to place a 1μF ceramic bypass
capacitor from IN to GND as close as possible
to the device in order to control supply
transients.
Furthermore, bypassing the output pin with a
0.1μF to 1μF ceramic capacitor improves the
device response to short-circuit transients.
ERROR FLAG
The error flag signal (FLG
X
output pin) is an
open-drain output and is pulled low (active
low) upon detection of the following
conditions:
Over-current condition
Over-temperature condition
Under voltage lockout condition
Over-temperature and under voltage lockout
conditions are flagged immediately while the
over – current condition is reported only if this
condition persists continuously for longer than
the blanking time of 10ms. The blanking time
prevents erroneous reporting of current faults
due to brief output current spikes.
Once activated, the error flag signal remains
low until all fault conditions have been
removed and is independent for each
individual channel.
CURRENT LIMIT
The current limit threshold is preset internally.
It protects the output MOSFET switches from
damages resulting from undesirable short
circuit conditions or excess inrush current,
which is often encountered during hot plug-in.
The low limit of the current limit threshold of
the XRP2525 and XRP2526 allows a minimum
current of 0.9A through the MOSFET switches.
When an overcurrent condition is detected, the
output current is limited to a constant current
limit threshold value and output voltage is
reduced accordingly. Triggering the current
limit function is signaled by the Error Flag
after 10ms of blanking time period.
UNDER-VOLTAGE LOCKOUT
Under-voltage lockout function (UVLO) keeps
the internal power switch from being turned
on until the power supply has reached at least
1.68V, even if the switch is enabled. Upon
detection of an input voltage below
approximately 1.68V, the power switch is
turned off while a fault condition is reported by
the error flag signal.
THERMAL PROTECTION
Internal thermal sensing circuitry monitors the
operating temperature of the device for each
channel independently. Upon detection of a
temperature in excess of 135°C, the power
switch for the given channel is disabled
preventing any damages to the device while a
fault condition is reported by the error flag
signal. A built-in 10°C hysteresis allows the
device to cool down to 125°C before resuming
normal operations on the faulty channel at
which point the error flag signal is cleared.
TEST CIRCUIT
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P2
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P2
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© 2011 Exar Corporation 10/11 Rev. 1.1.0
PACKAGE SPECIFICATION
8-PIN NSOIC
X
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P2
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P2
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© 2011 Exar Corporation 11/11 Rev. 1.1.0
REVISION HISTORY
Revision Date Description
1.0.0 05/13/2011 Initial release of datasheet
1.1.0 07/14/2011 Corrections of typographical errors
FOR FURTHER ASSISTANCE
Email: customersupport@exar.com
Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx?
E
XAR CORPORATION
HEADQUARTERS AND SALES OFFICES
48720 Kato Road
Fremont, CA 94538 – USA
Tel.: +1 (510) 668-7000
Fax: +1 (510) 668-7030
www.exar.com
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,
is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its
safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in
writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all
such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
