X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch July 2011 Rev. 1.1.0 GENERAL DESCRIPTION APPLICATIONS The XRP2525 and XRP2526 devices are respectively single and dual channel integrated high-side power distribution switches with independent enables and fault flags. A wide 1.8V to 5.5V input voltage range allows for operations from industry standard 1.8V, 3.3V and 5V power rails. Optimized for USB VBUS power distribution, the XRP2525 and XRP2526 are compliant with the latest USB 3.0 specification and can be used in any self or bus powered USB applications. The power-switch rise and fall times are controlled to minimize current surges during turn on/off. The XRP2525 and XRP2526 are pin and function compatible to respectively Exar's SP2525A and SP2526A. Built-in over current, under voltage lockout (UVLO), reverse current and over temperature protections insure safe operations under abnormal operating conditions. XRP2525 and XRP2526 are offered in a RoHS compliant "green"/halogen free 8-pin NSOIC package. Self Powered USB 2.0 and 3.0 Hubs USB Compliant VBUS Power Distribution Audio-Video Equipments Generic Power Switching FEATURES Single/Dual Channel Current Switch 900mA per channel capable 1.15A Over-current Limit 1.8V to 5.5V Input Voltage Range USB 2.0/3.0 Compliant Active High or Low Individual Enable Individual Channel Fault Flag Indicator Under voltage Lockout, Reverse Current and Thermal Shutdown Protection RoHS Compliant, Green/Halogen Free 8-Pin NSOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: XRP2526 Application Diagram Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 - Fax. +1 510 668-7001 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Input Voltage Range VIN ............................. 1.75V to 5.5V Junction Temperature Range ....................-40C to 125C Thermal Resistance JA .................................. 128.4C/W VIN ........................................................... -0.3V to 7.0V VEN, VFLG ............................................................... 7.0V Storage Temperature .............................. -65C to 150C Power Dissipation ................................ Internally Limited Lead Temperature (Soldering, 10 sec) ................... 300C ESD Rating (HBM - Human Body Model) .................... 2kV ESD Rating (MM - Machine Model) ...........................200V ELECTRICAL SPECIFICATIONS Specifications are for an Operating Junction Temperature of TJ = 25C only; limits applying over the full Operating Junction Temperature range are denoted by a "*". Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise indicated, 1.8V to 5.5V, CIN = 47F//1F, COUT = 10F, TJ = -40C to 125C. Parameter Input Supply Voltage Min. Typ. 1.8 Max. Units Conditions 5.5 V * Input Quiescent Current 80 150 A * XRP2526 (Both Channels enabled) VIN=5V, IOUT1 = IOUT2 =0mA Input Quiescent Current 52 100 A * XRP2525 & XRP2526 (1 Channel enabled) VIN=5V, IOUT1 =0mA 3 A * VIN=5V, Channel(s) disabled mA * XRP2525 and XRP2526 Input Shutdown Current Maximum Output Current per channel 900 Output Leakage Current 10 A VIN=5V, VOUT=0V, Each channel, Switch off Reverse Leakage Current 10 A 140 m VIN=0V, VOUT=5V, Each channel, Switch off * IOUT=0.3A, Each channel Output MOSFET Resistance 80 Output turn-on delay 1000 s VIN=5V, RL=10, COUT=1F, each output Output turn-on rise time 2000 4000 s VIN=5V, RL=10, COUT=1F, each output Output turn-off delay 10 20 s VIN=5V, RL=10, COUT=1F, each output Output turn-off fall time 22 50 s 1.15 1.40 A VIN=5V, RL=10, COUT=1F, each output * VIN - VOUT =0.3V, Internally set Current limit threshold 0.90 Short Circuit Current Limit 0.66xILIM A 925 mV 3 A Over temperature shutdown threshold 135 C Temperature rising Over temperature shutdown threshold hysteresis 10 C Temperature decreasing V VIN rising or falling Output Voltage Short Circuit Detect Threshold Safe Operating Area (SOA) Current Limit Under-voltage lockout threshold 1.55 Under-voltage lockout hysteresis 1.68 FLG output logic low voltage 100 FLG output high leakage FLG blanking time EN input logic high voltage (c) 2011 Exar Corporation 250 mV 1 A 10 -1 0 Operates in short circuit current limit mode when output voltage is below threshold. mV IFLG=10mA, VIN=5.5V ms V * 0.5 V * 1 A 1.5 EN input logic low voltage EN input leakage current 1.75 50 VOUT =0V 2/11 VEN=0V or VEN=5.5V Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch BLOCK DIAGRAM Fig. 2: XRP2525 and XRP2526 Block Diagrams (c) 2011 Exar Corporation 3/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch PIN ASSIGNMENT Fig. 3: XRP2525 - XRP2526 Pin Assignment PIN DESCRIPTION - XRP2525 Name Pin Number Description EN 1 Channel Enable Input Active High for XRP2525-1 and Active Low for XRP2525-2 FLG 2 Error Flag Signal Active low open drain output. Active on over-current, over-temperature or UVLO conditions. GND 3 NC 4,5,6 Ground Signal No Connect IN 7 Voltage Input Pin OUT 8 Voltage Output Pin PIN DESCRIPTION - XRP2526 Name Pin Number Description ENX 1,4 Channel Enable Input Active High for XRP2526-1 and Active Low for XRP2526-2 FLGX 2,3 Error Flag Signal Active low open drain output. Active on over-current, over-temperature or UVLO conditions. GND 6 Ground Signal IN 7 Voltage Input Pin OUTX 5,8 Voltage Output Pin ORDERING INFORMATION Part Number XRP2525ID-1-F XRP2525IDTR-1-F XRP2525ID-2-F XRP2525IDTR-2-F XRP2526ID-1-F XRP2526IDTR-1-F XRP2526ID-2-F XRP2526IDTR-2-F XRP2525EVB XRP2526EVB Temperature Range Marking 2525ID 1 YYWW X 2525ID 2 YYWW -40CTA+85C X 2526ID 1 YYWW -40CTA+85C X 2526ID 2 YYWW -40CTA+85C X XRP2525 Evaluation Board XRP2526 Evaluation Board -40CTA+85C Package NSOIC8 NSOIC8 NSOIC8 NSOIC8 Packing Quantity Bulk 2.5K/Tape & Reel Bulk 2.5K/Tape & Reel Bulk 2.5K/Tape & Reel Bulk 2.5K/Tape & Reel Note 1 Note 2 Lead Free and Halogen Free Single Channel Active high Lead Free and Halogen Free Single Channel Active low Lead Free and Halogen Free Dual Channel Active high Lead Free and Halogen Free Dual Channel Active low "YY" = Year - "WW" = Work Week - "X" = Lot Number; when applicable. (c) 2011 Exar Corporation 4/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 5V, CIN = 47F//1F, COUT = 10F, TJ = TA = 25C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs. Temperature (XRP2525) Fig. 5: Output On-Resistance vs. Temperature (XRP2526) Fig. 7: Quiescent Current vs. Temperature Fig. 6: Off Supply Current vs. Temperature XRP2525 and XRP2526 (1-channel on) Fig. 8: Quiescent Current vs. Temperature Fig. 9: FLG Logic Low Voltage vs. Temperature XRP2526 (2-channels on) (c) 2011 Exar Corporation 5/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch Fig. 10: Quiescent Current vs. Input Voltage XRP2525 and XRP2526 (1-channel on) Fig. 11: Quiescent Current vs. Input Voltage XRP2526 (2-channels on) Fig. 12: Output Turn-Off Delay vs. Temperature Fig. 13: Output Turn-on Delay vs. Temperature Fig. 14: Output Fall Time vs. Temperature Fig. 15: Output Rise Time vs. Temperature (c) 2011 Exar Corporation 6/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch Fig. 16: Output Turn-Off Delay Time vs. Input Voltage Fig. 17: Output Turn-On Delay Time vs. Input Voltage Fig. 18: Output Fall Time vs. Input Voltage Fig. 19: Output Rise Time vs. Input Voltage Fig. 20: Current Limit Threshold vs. Temperature (XRP2525) Fig. 21: Current Limit Threshold vs. Temperature (XRP2526) (c) 2011 Exar Corporation 7/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch IQ vs VEN @ 25C: XRP2525-1 60 58 IQ [uA] 56 54 52 50 48 46 1.5 2.5 3.5 VEN [V] 4.5 5.5 Fig. 22: Under-voltage lockout trip level vs. Temperature (VIN Rising) Fig. 23: Quiescent Current vs. Enable pin Voltage Fig. 24: Turn-On, Turn-Off Characteristics Fig. 25: Turn-On, Turn-Off Characteristics (XRP2526-1) COUT = 1uF, Rload = 10 (XRP2526-1) COUT = 1uF, Rload = 5.1 Fig. 26: Current Limit Operation (XRP2525-1): Fig. 27: Current Limit Operation (XRP2526-1): VIN=5.5V, Rload = 3.9 VIN=1.8V, Rload = 1.5 (c) 2011 Exar Corporation XRP2525-1 8/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch damages resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the XRP2525 and XRP2526 allows a minimum current of 0.9A through the MOSFET switches. THEORY OF OPERATION The XRP2525 and XRP2526 devices are respectively single and dual channel integrated high-side power distribution switches that can be used in any self or bus powered USB applications. They are compliant with the latest USB 3.0 specifications. The reverse current protection feature prevents current to flow from OUT to IN when the device is disabled. When an overcurrent condition is detected, the output current is limited to a constant current limit threshold value and output voltage is reduced accordingly. Triggering the current limit function is signaled by the Error Flag after 10ms of blanking time period. INPUT & OUTPUT Placing bulk capacitances of at least 47F and 10F at the input and output pins respectively reduces power supply transients under heavy current load conditions. UNDER-VOLTAGE LOCKOUT Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.68V, even if the switch is enabled. Upon detection of an input voltage below approximately 1.68V, the power switch is turned off while a fault condition is reported by the error flag signal. It is important to place a 1F ceramic bypass capacitor from IN to GND as close as possible to the device in order to control supply transients. Furthermore, bypassing the output pin with a 0.1F to 1F ceramic capacitor improves the device response to short-circuit transients. THERMAL PROTECTION Internal thermal sensing circuitry monitors the operating temperature of the device for each channel independently. Upon detection of a temperature in excess of 135C, the power switch for the given channel is disabled preventing any damages to the device while a fault condition is reported by the error flag signal. A built-in 10C hysteresis allows the device to cool down to 125C before resuming normal operations on the faulty channel at which point the error flag signal is cleared. ERROR FLAG The error flag signal (FLGX output pin) is an open-drain output and is pulled low (active low) upon detection of the following conditions: Over-current condition Over-temperature condition Under voltage lockout condition Over-temperature and under voltage lockout conditions are flagged immediately while the over - current condition is reported only if this condition persists continuously for longer than the blanking time of 10ms. The blanking time prevents erroneous reporting of current faults due to brief output current spikes. TEST CIRCUIT Once activated, the error flag signal remains low until all fault conditions have been removed and is independent for each individual channel. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switches from (c) 2011 Exar Corporation 9/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch PACKAGE SPECIFICATION 8-PIN NSOIC (c) 2011 Exar Corporation 10/11 Rev. 1.1.0 X RP 2 5 2 5 - X RP 2 5 2 6 Single/Dual Channel USB 3.0 Power Distribution Switch REVISION HISTORY Revision Date 1.0.0 05/13/2011 Initial release of datasheet Description 1.1.0 07/14/2011 Corrections of typographical errors FOR FURTHER ASSISTANCE Email: customersupport@exar.com Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 - USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. or its in all Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. (c) 2011 Exar Corporation 11/11 Rev. 1.1.0