PTCTZ..R....TT
www.vishay.com Vishay BCcomponents
Revision: 21-May-13 1Document Number: 29068
For technical questions, contact: nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD PTC Thermistors For Overload Protection
Note
(1) Customized products are available on request
FEATURES
• Ideal for pick-and-place circuit assembly
• Low mounting height
• Suitable for reflow soldering
• Small ceramic diameter for faster response
• Low heat transfer to substrate
• Flat terminations for stable positioning and good
solderability
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Over-temperature/over-load protection:
• Telecom
- Central Office Switching (C.O.)
- Subscriber Terminal Equipment (T.E.)
- Set-top Box (S.B.)
-Modems
- Cable TV communications
• General industry and automotive
- Low power supplies overload protection
- Data bus protection
DESCRIPTION
The component consists of a high-performance PTC
ceramic disc mounted in a lead-frame for direct soldering
onto a printed-circuit board (PCB) or substrate. Ceramics
are covered with a protective high temperature silicone
layer.
MARKING
• All SMD PTCs are marked with a 3-digit type number
(XXX) and a date code (YYWW)
Note
(2) These types pass ITU-K20-21-45 telecommunication protection recommendation
QUICK REFERENCE DATA
DESCRIPTION
VALUE
UNIT
STANDARD
TYPES (1)
TELECOM
TYPES (1)
Nominal R25 2 to 500 10 to 70
Resistance tolerance ± 10; ± 15; ± 20 %
Maximum overload current
(voltage dependent) 2 to 10 A
Non-trip current 50 to500
(at 25 °C)
50 to100
(at 70 °C) mA
Maximum voltage 16 to400 220 to 600 VRMS
Response time at 25 °C
and 20W overload power < 1 s
Matching - Down to 0.5
Maximum continuous
power at 25 °C 2W
ELECTRICAL DATA AND ORDERING INFORMATION
RESISTANCE MATCHING
()
Vmax.
(V)
Int at It at MAX.
TRIP-TIME
at 1 A (s)
Imax. at Vmax.
(A)
CATALOG NUMBER
R25
()
TOL.
(%)
25 C
(mA)
70 C
(mA)
25 C
(mA)
SAP ORDERING
CODE
TYPE NR
MARKING
TELECOMMUNICATION TYPES
10 20 no 245 165 100 270 3.0 2.0 PTCTZ3NR100GTT (2) 012
10 20 0.5 245 165 100 270 3.0 2.0 PTCTZ3MR100GTT (2) 016
40 25 no 265 80 50 130 0.8 2.0 PTCTZ3NR400HTT 002
25 20 1 265 120 70 220 1.3 2.0 PTCTZ3MR250HTT (2) 005
15to20 - no 300 150 100 250 1.5 1.5 PTCTZ3NR150KTT (2) 004
15to20 - 0.5 300 150 100 250 1.5 2.0 PTCTZ3MR150KTT (2) 003
20 20 0.5 300 120 70 250 1.4 1.5 PTCTZ3MR200KTT (2) 018
35 + 15/- 20 1 425 110 70 175 1.0 0.7 PTCTZ3MR350MTT (2) 009
50 20 1 425 90 60 150 0.8 0.7 PTCTZ3MR500MTT 019
GENERAL INDUSTRIAL TYPES
3.3 25 - 24 400 - 650 6.0 8.0 PTCTZ3NR339CTT (2) 013
9.4 25 - 60 150 100 300 1.8 3.0 PTCTZ3NR949ETT (2) 011
PTCTZ..R....TT
www.vishay.com Vishay BCcomponents
Revision: 21-May-13 2Document Number: 29068
For technical questions, contact: nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PTC OUTLINES
DIMENSIONS in millimeters
DIMENSIONS OF SOLDER LANDS in millimeters
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes
which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C
during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue
of perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and
to 10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the
soldered product.
PTC SMD ceramic size: 6.5 mm
3.6 ± 0.1
10 ± 0.25
8.0
2.8
2
4 ± 0.1
4 ± 0.2
0.2
10°
max.
1
7.6 ± 0.25
3.45
± 0.15
1.2
7.2 0
- 0.2
0.6 + 0.6
0
3
2
2
3
1
MATERIAL INFORMATION
REF. DESCRIPTION MATERIAL AND REMARKS
1 Ceramic BaTiO3 doped
2 Metallization NiCr Ag layer
(vacuum deposition)
3Leadframe
Ni plated phosphor bronze material
covered by matte tin layer
11
5
2
0 50 100 150 200 250
300
250
200
150
100
50
0
t (s)
215 °C
180 °C
20 s to 40 s
Internal preheating,
e.g. by infrared,
max. 2 K/s
100 °C
130 °C
External
preheating
Forced
cooling
T
(°C)
Typical values (solid line)
Process limits (dotted lines)
Vapour phase soldering
Reflow soldering
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 °C
t (s)
215 °C
180 °C
10 s
40 s
2 K/s
T
(°C) 245 °C
130 °C
Typical values (solid line)
Process limits (dotted lines)
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www.vishay.com Vishay
Revision: 02-Oct-12 1Document Number: 91000
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PTCTZ3MR150KTX PTCZL09H161SBC052 PTCTZ3MR100GTE PTCTZ3MR150KTE PTCTZ3MR200KTE
PTCTZ3MR250HTE PTCTZ3MR350MTE PTCTZ3MR500STE PTCTZ3NR100GTE PTCTZ3NR150KTE
PTCTZ3NR400HTE PTCTZ3NR949ETE PTCTZ3NR100GTT PTCTZ3NR339CTT PTCTZ3MR200KTT
PTCTZ3NR400HTT PTCTZ3MR100GTT PTCTZ3MR500STT PTCTZ3MR350MTT PTCTZ3NR949ETT
PTCTZ3NR150KTT PTCTZ3MR250HTT PTCTZ3MR150KTT PTCTZ3MR500MTT