SMBTA42/MMBTA42
Feb-21-20031
NPN Silicon Transistor for High Voltages
High breakdown voltage
Low collector-emitter saturation voltage
Complementary types: SMBTA92 (PNP)
1
2
3
VPS05161
Type Marking Pin Configuration Package
SMBTA42/MMBTA42 s1D 1=B 2=E 3=C SOT23
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 300 V
Collector-base voltage VCBO 300
Emitter-base voltage VEBO 6
DC collector current IC500 mA
Base current IB100
Total power dissipation, TS = 74 °C Ptot 360 mW
Junction temperature Tj150 °C
Storage temperature Tst
g
-65 ... 150
Thermal Resistance
Junction - soldering point1) RthJS
210 K/W
1For calculation of RthJA please refer to Application Note Thermal Resistance
SMBTA42/MMBTA42
Feb-21-20032
Electrical Characteristics at TA = 25°C, unless otherwise specified.
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0
V(BR)CEO 300 - - V
Collector-base breakdown voltage
IC = 100 µA, IE = 0
V(BR)CBO 300 - -
Emitter-base breakdown voltage
IE = 100 µA, IC = 0
V(BR)EBO 6 - -
Collector cutoff current
VCB = 200 V, IE = 0
ICBO - - 100 nA
Collector cutoff current
VCB = 200 V, IE = 0 , TA = 150 °C
ICBO - - 20 µA
Emitter cutoff current
VEB = 3 V, IC = 0
IEBO - - 100 nA
DC current gain 1)
IC = 1 mA, VCE = 10 V
IC = 10 mA, VCE = 10 V
IC = 30 mA, VCE = 10 V
hFE
25
40
40
-
-
-
-
-
-
-
Collector-emitter saturation voltage1)
IC = 20 mA, IB = 2 mA
VCEsat - - 0.5 V
Base-emitter saturation voltage 1)
IC = 20 mA, IB = 2 mA
VBEsat - - 0.9
AC Characteristics
fT50Transition frequency
IC = 10 mA, VCE = 20 V, f = 100 MHz
- - MHz
4 pFCollector-base capacitance
VCB = 20 V, f = 1 MHz
-
Ccb -
1) Pulse test: t < 300
s; D < 2%
SMBTA42/MMBTA42
Feb-21-20033
Transition frequency fT = f (IC)
VCE = 10V, f =100MHz
EHP00839SMBTA 42/43
10
MHz
10 10 mA
f
C
1010
T
555
Ι
0123
10
3
2
10
1
5
Total power dissipation Ptot = f(TS)
0 15 30 45 60 75 90 105 120 °C 150
TS
0
40
80
120
160
200
240
280
320
mW
400
P
tot
Permissible pulse load
Ptotmax / PtotDC = f (tp)
10
EHP00840SMBTA 42/43
-6
0
10
5
D
=
5
101
5
102
3
10
10-5 10-4 10-3 10-2 100
s
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
tp
=
DT
tp
T
totmax
tot
PDC
P
p
t
Operating range IC = f (VCEO)
TA = 25°C, D = 0
EHP00841SMBTA 42/43
10
10 V
CEO
10
C
10
3
1
10
-1
5
10 10
10
0
5
Ι
V
mA
5
10
2
0123
555
10
100
1
100
500
DC
µ
µ
ms
ms
ms
s
s
SMBTA42/MMBTA42
Feb-21-20034
Collector current IC = f (VBE)
VCE = 10V
EHP00843SMBTA 42/43
10
0V
BE
1.5
mA
C
10
3
1
10
-1
5
0.5 1.0
10
0
5
Ι
V
5
10
2
Collector cutoff current ICBO = f (TA)
VCB = 160V
EHP00842SMBTA 42/43
10
0C
A
150
nA
CBO
10
4
1
10
-1
5
50 100
5
10
2
10
0
5
Ι
T
max
typ
5
10
3
DC current gain hFE = f (IC)
VCE = 10V
EHP00844SMBTA 42/43
10
10 mA
h
C
10
5
FE
10
3
1
10
0
5
10 10 10
-1 0 1 2 3
Ι
5
10
2
555
Package SOT23
Package Outline
Foot Print
Marking Layout
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
2.6 MAX.
0.25
M
BC
1.9
-0.05
+0.1
0.4 1
A
2
±0.1
3
2.9
DIN 6784
+0.2
acc. to
0.95
C
B
2
˚
30
˚
0.20
...
M
A
0.1 MAX.
10
˚
0.08...0.15
1.1 MAX.
1.3
±0.1
MAX.
10
˚
MAX.
0.8
1.2
0.91.10.9
0.8
Manufacturer
Date code (Year/Month)
Type code
2003, July
BCW66
Example
Pin 1
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Impressum
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.