Sense & Control
Data Sheet
Rev. 1.2, 2017-01-13
TLE5012BD
Angle Sensor
GMR-Based Dual Die Angle Sensor
TLE5012BD
Data Sheet 2 Rev. 1.2, 2017-01-13
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Revision History
Page or Item Subjects
Rev. 1.2, 2017-01-13
6 Changed in Rev. 1.1: Table 1-1: package version number removed
10 Changed in Rev. 1.1: Table 4-2 ESD protection modified
13 Changed in Rev. 1.1: Figure 6-2 updated with improved chip placement tolerance
15 Changed in Rev. 1.1: Table 6-2 updated with improved chip placement tolerance
17 Changed in Rev. 1.1: Figure 6-6 added with marking on frontside and backside
6 Changed in Rev. 1.2: Table 1-1 marking corrected
15 Changed in Rev. 1.2: Figure 6-3 added
15 Changed in Rev. 1.2: Table 6-2 modified
16 Changed in Rev. 1.2: Chapter 6.5: marking table corrected
TLE5012BD
Table of Contents
Data Sheet 3 Rev. 1.2, 2017-01-13
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Dual Die Angle Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 Calculation of the Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Pre-Configured Derivates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1 IIF-type: E1200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.2 SPC-type: E9200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.3 Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.4 Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table of Contents
TLE5012BD
List of Figures
Data Sheet 4 Rev. 1.2, 2017-01-13
Figure 1-1 PG-TDSO-16 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2-1 Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3-1 Dual die angle output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6-1 PG-TDSO-16 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6-2 Position of sensing element, reference to package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6-3 Position of sensing element, reference to lead frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 6-4 Footprint of PG-TDSO-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 6-5 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 6-6 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
List of Figures
TLE5012BD
List of Tables
Data Sheet 5 Rev. 1.2, 2017-01-13
Table 1-1 Derivate Ordering codes (see Chapter 5 for description of derivates). . . . . . . . . . . . . . . . . . . . . . . 6
Table 2-1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4-1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4-2 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6-1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6-2 Sensor IC placement tolerances in package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
List of Tables
TLE5012BD
Product Description
Data Sheet 6 Rev. 1.2, 2017-01-13
Preface
This document is an addendum to the TLE5012B datasheet and describes the TLE5012BD dual die angle sensor.
For all parameters which are not specified here, the TLE5012B datasheet is valid.
1 Product Description
Figure 1-1 PG-TDSO-16 package
1.1 Overview
The TLE5012BD is a fully redundant 360° angle sensor that detects the orientation of a magnetic field. This is
achieved by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance
(iGMR) elements.
Highly precise angle values are determined over a wide temperature range and a long lifetime using an internal
autocalibration algorithm.
Data communications are accomplished with a bi-directional Synchronous Serial Communication (SSC) that is
SPI-compatible.
The absolute angle value and other values are transmitted via SSC or via a Pulse-Width-Modulation (PWM)
Protocol. The sine and cosine raw values can also be read out. These raw signals are digitally processed internally
to calculate the angle orientation of the magnetic field (magnet).
The TLE5012BD is a pre-calibrated sensor. The calibration parameters are stored in laser fuses. At start-up the
values of the fuses are written into flip-flops, where these values can be changed by the application-specific
parameters.
Online diagnostic functions are provided to ensure reliable operation.
Table 1-1 Derivate Ordering codes (see Chapter 5 for description of derivates)
Product Type Marking Ordering Code Package
TLE5012BD E1200 121200 SP001205296 PG-TDSO-16
TLE5012BD E9200 129200 SP001205300 PG-TDSO-16
TLE5012BD
Product Description
Data Sheet 7 Rev. 1.2, 2017-01-13
1.2 Features
•Giant Magneto Resistance (GMR)-based principle
• Fully redundant design with two sensor ICs in one package
• Integrated magnetic field sensing for angle measurement
• 360° angle measurement with revolution counter and angle speed measurement
• Two separate highly accurate single bit SD-ADC
• 15 bit representation of absolute angle value on the output (resolution of 0.01°)
• 16 bit representation of sine / cosine values on the interface
• Max. 1.0° angle error over lifetime and temperature-range with activated auto-calibration
• Bi-directional SSC Interface up to 8Mbit/s
• Supports Safety Integrity Level (SIL) with diagnostic functions and status information
• Interfaces: SSC, PWM, Incremental Interface (IIF), Hall Switch Mode (HSM), Short PWM Code (SPC, based
on SENT protocol defined in SAE J2716)
• Output pins can be configured (programmed or pre-configured) as push-pull or open-drain
• Bus mode operation of multiple sensors on one line is possible with SSC or SPC interface in open-drain
configuration
•0.25 μm CMOS technology
• AEC-Q100 automotive qualified
• ESD > 4kV (HBM)
• Green package with lead-free (Pb-free) plating, halogen free
1.3 Application Example
The TLE5012BD GMR-based dual die angle sensor is designed for angular position sensing in automotive
applications such as:
• Electrical commutated motor (e.g. used in Electric Power Steering (EPS) and actuators)
• Steering angle measurements
• General angular sensing
TLE5012BD
Pin Configuration
Data Sheet 8 Rev. 1.2, 2017-01-13
2 Pin Configuration
Figure 2-1 Pin configuration (top view)
2.1 Pin Description
Table 2-1 Pin Description
Pin No. Symbol In/Out Function
1IFC1
(CLK / IIF_IDX / HS3)
I/O Die 1 Interface C:
External Clock1) / IIF Index / Hall Switch
Signal 3
2 SCK1 I Die 1 SSC Clock
3 CSQ1 I Die 1 SSC Chip Select
4 DATA1 I/O Die 1 SSC Data
5 DATA2 I/O Die 2 SSC Data
6 CSQ2 I Die 2 SSC Chip Select
7 SCK2 I Die 2 SSC Clock
8IFC2
(CLK / IIF_IDX / HS3)
I/O Die 2 Interface C:
External Clock1) / IIF Index / Hall Switch
Signal 3
9IFB2
(IIF_B / HS2)
O Die 2 Interface B:
IIF Phase B / Hall Switch Signal 2
10 GND2 - Die 2 Ground
11 VDD2 - Die 2 Supply Voltage
1
Center of Sensitive
Area
2 3 4 5 6 7 8
910111213141516
TLE5012BD
Dual Die Angle Output
Data Sheet 9 Rev. 1.2, 2017-01-13
3 Dual Die Angle Output
The bottom sensor element of the TLE5012BD is flipped relative to the orientation of the top sensor element
Therefore the rotation direction sensed by the bottom element is opposite to the top element. This is advantageous
for safety critical applications, as the two sensor elements do generally not output the same angle. Figure 3-1
shows the output of the two sensor ICs for a given external magnetic field orientation.
Figure 3-1 Dual die angle output
For applications where an identical angle output of both ICs is desired, the rotation direction and angle offset of
one sensor IC can be reconfigured by changing the settings in the ANG_BASE and ANG_DIR registers via SSC
interface.
12 IFA2
(IIF_A / HS1 / PWM / SPC)
O Die 2 Interface A:
IIF Phase A / Hall Switch Signal 1 /
PWM / SPC output
13 IFA1
(IIF_A / HS1 / PWM / SPC)
O Die 1 Interface A:
IIF Phase A / Hall Switch Signal 1 /
PWM / SPC output
14 VDD1 - Die 1 Supply Voltage
15 GND1 - Die 1 Ground
16 IFB1
(IIF_B / HS2)
O Die 1 Interface B:
IIF Phase B / Hall Switch Signal 2
1) External clock feature is not available in IIF or HSM interface mode
Table 2-1 Pin Description (cont’d)
Pin No. Symbol In/Out Function
0° 90° 180° 270° 360 °
90°
180 °
270 °
360°
top sensor output
bottom sensor output
external magnetic field angle
sensor output angle
TLE5012BD
Specification
Data Sheet 10 Rev. 1.2, 2017-01-13
4 Specification
4.1 Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the device.
4.2 Calculation of the Junction Temperature
The total power dissipation PTOT of the chips leads to self-heating, which increases the junction temperature TJ
above the ambient temperature.
The power multiplied by the total thermal resistance RthJA (junction to ambient) yields the junction temperature.
RthJA is the sum of the two components Junction to Case and Case to Ambient.
(4.1)
Table 4-1 Absolute maximum ratings
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Ambient temperature TA-40 125 °C qualification acc. to AEC Q100
grade 1
Junction temperature TJ-40 150 °C
150 °C For 1000 h, not additive
Table 4-2 ESD protection
Parameter Symbol Values Unit Notes
Min. Max.
ESD voltage VHBM ±4.0 kV 1) ground pins connected
1) Human Body Model (HBM) according to ANSI/ESDA/JEDEC JS-001
VHBM ±2.0 kV 1)
VCDM ±0.5 kV 2)
2) Charged Device Model (CDM) according to JESD22-C101
VCDM ±0.75 kV 2) for corner pins
)22( ∑×+××=×=Δ
Δ+=
+=
Q
QQDDDDthJATOTthJA
AJ
thCAthJCthJA
IVIVRPRT
TTT
RRR
(I
DD
, I
Q
> 0, if direction is into IC)
TLE5012BD
Specification
Data Sheet 11 Rev. 1.2, 2017-01-13
Factors of 2 in the calculation account for the two sensor ICs in the TLE5012BD. Example (assuming no load on
Vout).
(4.2)
For molded sensors, the calculation with RthJC is more appropriate.
[] [] [ ]
()
KVAAV
W
K
T
mAI
VV
DD
DD
8.160028.05120
282
5
=+××
⎥
⎦
⎤
⎢
⎣
⎡
=Δ
=
=
TLE5012BD
Pre-Configured Derivates
Data Sheet 12 Rev. 1.2, 2017-01-13
5 Pre-Configured Derivates
Derivates of the TLE5012BD are available with different pre-configured register settings for specific applications.
The configuration of all derivates can be changed via SSC interface. A detailed table of settings of the derivates
can be found in the latest TLE5012B Register Setting User Manual
5.1 IIF-type: E1200
The TLE5012BD-E1200 is preconfigured for Incremental Interface and fast angle update rate (42.7 μs). It is most
suitable for BLDC motor commutation.
• Autocalibration mode 1 enabled.
• Prediction disabled.
• Hysteresis is set to 0.625°.
• 12bit mode, one count per 0.088° angle step.
• Incremental Interface A/B mode.
5.2 SPC-type: E9200
The TLE5012BD-E9200 is preconfigured for Short-PWM-Code interface. It is most suitable for steering angle and
actuator position sensing.
• Angle update time is 85.4 μs.
• Autocalibration, Prediction, and Hysteresis are disabled.
• SPC unit time is 3 μs.
• SPC interface is set to open-drain output.
TLE5012BD
Package Information
Data Sheet 13 Rev. 1.2, 2017-01-13
6 Package Information
6.1 Package Parameters
6.2 Package Outline
Figure 6-1 PG-TDSO-16 package dimension
Table 6-1 Package Parameters
Parameter Symbol Limit Values Unit Notes
Min. Typ. Max.
Thermal resistance1)
1) Rth values only valid for both dies supplied with VDD
RthJA 120 140 K/W Junction to air2)
2) according to Jedec JESD51-7
RthJC 35 K/W Junction to case
RthJL 70 K/W Junction to lead
Moisture Sensitivity Level MSL 3 260°C
Lead Frame Cu
Plating Sn 100% > 7 μm
TLE5012BD
Package Information
Data Sheet 14 Rev. 1.2, 2017-01-13
Figure 6-2 Position of sensing element, reference to package
0.2
0.2
TLE5012BD
Package Information
Data Sheet 15 Rev. 1.2, 2017-01-13
Figure 6-3 Position of sensing element, reference to lead frame
Table 6-2 Sensor IC placement tolerances in package
Parameter Values Unit Notes
Min. Max.
position eccentricity -100 100 µm in X- and Y-direction, reference to package
position eccentricity -150 150 µm in X-direction, reference to lead frame
position eccentricity -200 200 µm in Y-direction, reference to lead frame
rotation -3 3 ° affects zero position offset of sensor
tilt -3 3 °
TLE5012BD
Package Information
Data Sheet 16 Rev. 1.2, 2017-01-13
6.3 Footprint
Figure 6-4 Footprint of PG-TDSO-16
6.4 Packing
Figure 6-5 Tape and Reel
6.5 Marking
The device is marked on the frontside with a date code, the device type and a lot code. On the backside is a 8 x
18 data matrix code.
Note: For processing recommendations, please refer to Infineon’s Notes on processing
Position Marking Description
1st Line Gxxxx G = green, 4-digit = date code
2nd Line 12x200 Type (6 digits), See ordering Table 1-1
3rd Line xxx Lot code (3 digits)
TLE5012BD
Package Information
Data Sheet 17 Rev. 1.2, 2017-01-13
Figure 6-6 Marking
