AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
1 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
2.0A SINGLE CHANNEL CURRENT-LIMITED
POWER SWITCH WITH LATCH-OFF
Description
The AP2401 and AP2411 are single channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and
under-voltage lockout functionality. A 7ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does
not require any external components. AP2401 and AP2411 will be
latched off after 7ms deglitch.
All devices are available in SO-8, MSOP-8, MSOP-8EP,
U-DFN3030-8 and U-DFN2020-6 packages.
Features
Single Channel Current-Limited Power Switch
Output Discharge Function
Output Current Latch-Off when OCP Triggered
Fast Short-Circuit Response Time: 2µs
2.5A Accurate Current Limiting
Reverse Current Blocking
70m On-Resistance
Input Voltage Range: 2.7V - 5.5V
Built-In Soft-Start with 0.6ms Typical Rise Time
Over-Current and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 2kV HBM, 200V MM
Active Low (AP2401) or Active High (AP2411) Enable
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:
Available in “Green” Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Pin Assignments
GND
IN
IN
EN FLG
OUT
OUT
NC
4
3
2
1
5
6
7
8
(Top View)
SO-8
FLG
OUT
OUT
NC
GND
IN
IN
EN
(Top View)
MSOP-8/MSOP-8EP
Note: Latter with exposed pad
(dotted line)
8
7
6
5
1
2
3
4
FLG
OUT
OUT
NC
GND
IN
IN
EN
1
2
3
4
8
7
6
5
(Top View)
U-DFN3030-8
U-DFN2020-6
Applications
LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers, e-Readers
Printers, Docking Stations, HUBs
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Green
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
2 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Applications Circuit
0.1uF
IN
GND
EN
OUT
ON
120uF
Power Supply
2.7V to 5.5V
0.1uF
OFF
FLG
Load
10k
Enable Active High
Available Options
Part
Number Channel Enable Pin
(EN)
Recommended Maximum
Continuous Load Current
(A)
Typical Output Latch-Off
Current Limit
(A)
Package
AP2401 1 Active Low
2 2.5
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
AP2411 1 Active High
Pin Descriptions
Pin Name Pin Number
Function
SO-8,
MSOP-8
MSOP-8EP,
U-DFN3030-8 U-DFN2020-6
GND 1 1 2 Ground
IN 2, 3 2, 3 1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close
as possible. (all IN pins must be tied together externally)
EN 4 4 3 Enable Input. Active low (AP2401) or active high (AP2411).
FLG 5 5 4 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain
output. FLG is disabled for 7ms after turn-on.
OUT 6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)
NC 8 8 6 No Internal Connection. Recommend tie to OUT pins.
Exposed Pad — Exposed Pad Exposed Pad
Exposed pad. It should be externally connected to GND plane and thermal mass for
enhanced thermal impedance. Exposed pad should not be used as electrical ground
conduction path.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
3 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Functional Block Diagram
Thermal
Sense
FLG
OUT
GND
IN
EN
UVLO
Current
Limit
Current
Sense
Deglitch
Discharge
Control
Driver
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 4 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage (Note 4) -0.3 to 6.5 V
VOUT Output Voltage (Note 4) -0.3 to VIN +0.3 or 6.5 V
VEN , VFLG Enable Voltage (Note 4) -0.3 to VIN +0.3 or 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature 150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
VIN Input voltage 2.7 5.5 V
IOUT Output Current 0 2 A
VIL EN Input Logic Low Voltage 0 0.8 V
VIH EN Input Logic High Voltage 2 VIN V
TA Operating Ambient Temperature -40 +85 °C
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
4 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL= 1µF, unless otherwise specified.)
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
VUVLO Input UVLO VIN rising 1.6 2.0 2.4 V
VUVLO Input UVLO Hysteresis VIN decreasing 50 mV
ISHDN Input Shutdown Current Disabled, OUT = open 0.1 1 µA
IQ Input Quiescent Current Enabled, OUT = open 60 100 µA
ILEAK Input Leakage Current Disabled, OUT grounded 0.1 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 0.01 1 µA
RDS(ON) Switch on-resistance
VIN = 5V, IOUT= 2.0A TA = +25°C 70 84
m
-40°C TA +85°C 105
VIN = 3.3V, IOUT= 2.0A TA = +25°C 90 108
-40°C TA +85°C 135
ILIMIT Over-Load Current Limit
(Note 6) VIN= 5V, VOUT= 4.5V -40°C TA +85°C 2.05 2.5 2.85 A
ITrig Current limiting trigger threshold Output Current Slew rate (< 100A/s) 2.5 A
ISHORT Short-Circuit Current Limit Enabled into short circuit 2.1 2.75 3.3 A
TSHORT Short-circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) 2 µs
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V
ILEAK-EN EN Input leakage VIN = 5V, VEN = 0V and 5.5V 0.01 1 µA
ILEAK-O Output leakage current Disabled, VOUT = 0V 0.5 1 µA
TD(ON) Output turn-on delay time CL = 1µF, RLOAD = 5 0.1 ms
TR Output turn-on rise time CL = 1µF, RLOAD = 5 0.6 1.5 ms
TD(OFF) Output turn-off delay time CL = 1µF, RLOAD = 5 0.1 ms
TF Output turn-off fall time CL = 1µF, RLOAD = 5 0.05 0.1 ms
RFLG FLG output FET on-resistance IFLG = 10mA 20 40
IFOH FLG Off Current VFLG = 5V 0.01 1 µA
TBLANK FLG blanking and latch off time Assertion or deassertion due to overcurrent and over-
temperature condition 4 7 15 ms
TDIS Discharge time CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V 0.6 ms
RDIS Discharge resistance (Note 7) VIN = 5V, disabled, IOUT = 1mA 100
TSHDN Thermal Shutdown Threshold Enabled 140 °C
THYS Thermal Shutdown Hysteresis 20 °C
JA
Thermal Resistance Junction-to-
Ambient
SO-8 (Note 8) 96 °C/W
MSOP-8 (Note 8) 130 °C/W
MSOP-8EP (Note 9) 92 °C/W
U-DFN3030-8 (Note 9) 84 °C/W
U-DFN2020-6 (Note 10) 90 °C/W
Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO.
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
5 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
Figure 1 Voltage Waveforms: AP2401 (left), AP2411 (right)
All Enable Plots are for Enable Active Low
Turn-Off Delay and Fall Time
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5
Vout
2V/div
Ven
5V/div
Iin
1A/div
Device Disable
Turn-On Delay and Rise Time
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5
Vout
2V/div
Ven
5V/div
Iin
1A/div Inrush Current Limit
Device Enable
Turn-Off Delay and Fall Time
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5
Vout
2V/div
Ven
5V/div
Iin
1A/div
Device Disable
Turn-On Delay and Rise Time
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5
Vout
2V/div
Ven
5V/div
Iin
1A/div
Device Enable
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
6 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
Device Enabled Into Short-Circuit
Inrush Current
Full-Load to Short-Circuit
Transient Response
Output Short Circuit TA=25°C
VIN=5V
ROUT=2.5
Device Turns off and Re-enables
Into Current-Limit
Vout
2V/div
Iin
2A/div
FLG
5V/div
Device is latched-off
No-Load to Short-Circuit
Transient Response
Output Short Circuit
TA=25°C
VIN=5V
Vout
2V/div
Iin
2A/div
FLG
5V/div
Device is latched-off
Device Turns off and Re-enables
Into Current-Limit
TA=25°C
VIN=5V
CL=120µF
ROUT=1
Ven
5V/div
Iout
1A/div
Iout
0.5A/div
Ven
5V/div
TA=25°C
VIN=5V
CL=120µF,220uF, 470µF
ROUT=5
CL=220µF
CL=470µF
CL=120µF
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
7 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
Vin
2V/div
Iout
2A/div
UVLO Decreasing
TA=25°C
VIN=5V
ROUT=2.5
CL=120µF
UVLO Increasing
Vin
2V/div
Iout
2A/div
TA=25°C
VIN=5V
ROUT=2.5
CL=120µF
TA=25°C
VIN=5V
ROUT=2.5
CL=120µF
Vout
5V/div
FLG
5V/div
IIout
1A/div
Power ON
Vin
5V/div
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
8 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-On vs. Input Voltage
Turn-On Time (µs)
C = 1µF
R = 5
T = 25°C
L
L
A
0
20
40
60
80
100
120
140
160
180
200
220
240
260
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off vs. Input Voltage
Turn-
O
ff Ti
m
e (µs)
0
100
200
300
400
500
600
700
800
900
1000
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Rise Time vs. Input Voltage
Rise Ti
m
e (µs)
C = 1µF
R = 5
T = 25°C
L
L
A
0
10
20
30
40
50
60
70
80
90
100
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Fall Time vs. Input Voltage
Fall Ti
m
e (µs)
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
9 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
0
10
20
30
40
50
60
70
80
90
100
-50 - 25 0 25 50 75 100 125
Temperature (C)
Supply Current, Output Enabled vs. Temperature
Supply Current
O
utput Enabled (µ
A
)
V = 5.5V
IN
V = 5V
IN
V = 2.7V
IN
V = 3.3V
IN
-50 -25 0 25 50 75 100 125
Temperature (C)
Supply Current, Output Disabled vs. Temperature
Supply Current
O
utput Disabled (µ
A
)
-0.30
0.30
0.25
0.20
0.15
0.10
-0.05
0
-0.10
0.05
-0.15
-0.20
-0.25
V = 5.5V
IN
V = 5V
IN
V = 2.7V
IN
V = 3.3V
IN
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
-50 -25 0 25 50 75 100 125
Temperature (°C)
R vs. Temperature
DS(ON)
R (
m
)
DS(ON)
V = 5.5V
IN
V = 5V
IN
V = 2.7V
IN
V = 3.3V
IN
3.0
-50 -25 0 25 50 75 100 125
Temperature (°C)
Short-Circuit, Output Current vs. Temperature
Short-Circuit
O
utput Current (
A
)
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.0
2.1
V = 5.5V
IN
V = 5V
IN
V = 2.7V
IN
V = 3.3V
IN
2.05
-50 -25 0 25 50 75 100 125
Temperature (°C)
Undervoltage Lockout vs. Temperature
Undervoltage Lockout (V)
2.10
2.15
1.90
1.95
2.00
1.65
1.70
1.75
1.80
1.85
UVLO Falling
UVLO Rising
2.5
2.6
2.7
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off vs. Input Voltage
Threshold Trip Current (
A
)
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
C = 120µF
T = 25°C
L
A
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
10 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Application Information
Power Supply Considerations
A 0.1F to 2.2F X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2F or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that
may cause ringing on the input. Additionally, bypassing the output with a 0.1F to 1.0F ceramic capacitor improves the immunity of the device
to short circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the devices will limit the current until the overload condition is removed
or the internal deglitch time (7-ms typical) is reached and the device is turned off. The device will remain latched off even overload condition is
removed until power is cycled or the device enable is toggled.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2401/AP2411 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT,
and turns off after deglitch time(7-ms typical).
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the
over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT current for deglitch time period
(7-ms typical), and then turned off.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2401/AP2411 is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and output current is clamped at ILIMIT for deglitch time period (7-ms typical), and then turned off.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout.
When that happens, the FLG will remain low and the switch will be latched off until the fault condition is removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2401/AP2411 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RJA + TA
Where:
TA= Ambient temperature°C
RJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2401/AP2411 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an over-current condition, the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed. The FLG open-drain output is asserted when an over-temperature shutdown occurs with 7-ms deglitch.
When the FLG is asserted, the switch will be latched off until the temperature drops to 20°C below the thermal shutdown threshold and the power
or EN pin is cycled.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
11 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,
even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any
residue of the output voltage when either no external output resistance or load resistance is present at the output.
Ordering Information
Part
Number Status Package
Code Packaging 7”/13” Tape and Reel
Quantity Part Number Suffix
AP24X1S-13 New Product S SO-8 2500/Tape & Reel -13
AP24X1M8-13 New Product M8 MSOP-8 2500/Tape & Reel -13
AP24X1MP-13 New Product MP MSOP-8EP 2500/Tape & Reel -13
AP24X1FGE-7 New Product FGE U-DFN3030-8 3000/Tape & Reel -7
AP24X1SN-7 Preview SN U-DFN2020-6 3000/Tape & Reel -7
Marking Information
(1) SO-8
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
12 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Marking Information (cont.)
(2) MSOP-8
(3) MSOP-8EP
(4) U-DFN3030-8
XX : Identification Code
( Top View )
X : A~Z : Internal Code
XY
X X
W
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Part Number Package Identification Code
AP2401FGE-7 U-DFN3030-8 BD
AP2411FGE-7 U-DFN3030-8 BF
(5) U-DFN2020-6
XX : Identification Code
( Top View )
X : A~Z : Internal Code
XY
XX
W
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
Part Number Package Identification Code
AP2401SN-7 U-DFN2020-6 DD
AP2411SN-7 U-DFN2020-6 DF
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
13 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
1. Package type: SO-8
2. Package type: MSOP-8
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8
All Dimensions in mm
MSOP-8
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
Gauge Plane
Seating Plane
Detail ‘A’
Detail ‘A’
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
A
A1
A2
e
Seating Plane
Gauge Plane
L
See Detail C
Detail C
c
a
E1
E3
A3
1
E
y
x
D
b
0.25
4x10°
4x10°
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
14 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
3. Package type: MSOP-8EP
4. Package type: U-DFN3030-8 Type E
5. Package type: U-DFN2020-6
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
U-DFN3030-8
Type E
Dim Min Max Typ
A 0.57 0.63 0.60
A1 0 0.05 0.02
A3 0.15
b 0.20 0.30 0.25
D 2.95 3.05 3.00
D2 2.15 2.35 2.25
E 2.95 3.05 3.00
e 0.65
E2 1.40 1.60 1.50
L 0.30 0.60 0.45
Z 0.40
All Dimensions in mm
U-DFN2020-6
Dim Min Max Typ
A 0.57 0.63 0.60
A1 0 0.05 0.03
A3 0.15
b 0.20 0.30 0.25
D 1.95 2.075 2.00
D2 1.45 1.65 1.55
e 0.65
E 1.95 2.075 2.00
E2 0.76 0.96 0.86
L 0.30 0.40 0.35
All Dimensions in mm
b (x8)
e
L (x8)
A1
A3
Z (x4)
D
D2
E2
E
A
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
L
D
8Xb
See Detail C
Detail C
c
a
E1
E3
A3
E2
4X10°
4X10°
0.25
D1
SEATING PLANE
D2
D
e
Pin#1 ID
L
b
D2/2
E2
E
A1
AA3
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
15 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
(2) Package type: MSOP-8
(3) Package type: MSOP-8EP
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions Value (in mm)
C 0.650
X 0.450
Y 1.350
Y1 5.300
Dimensions Value
(in mm)
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
X C
Y
Y1
X
C1
C2
Y
G
X C
Y
Y2 Y1
X1
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
16 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package type: U-DFN3030-8 Type E
(5) Package type: U-DFN2020-6
Dimensions Value (in mm)
C 0.65
C1 2.35
X 0.30
Y 0.65
Y1 1.60
Y2 2.75
Dimensions Value (in mm)
Z 1.67
G 0.15
X1 0.90
X2 0.45
Y 0.37
C 0.65
Y
(x8)
X (x8) C
C1
Y1 Y2
G
G
YC
Z
Y
X2
X1
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
17 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
Taping Orientation (Note 11)
For U-DFN2020-6 and U-DFN3030-8 Type E
Note: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
18 of 18
www.diodes.com
March 2013
© Diodes Incorporated
AP2401/AP2411
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
