2002 Microchip Technology Inc. DS21362B-page 1
TC1173
Features
Extremely Low Supply Current for Longer Battery Life
Very Low Dropout Voltage
300mA Output Current
Standard or Custom Output Voltages
ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
Power Saving Shutdown Mode
Bypass Input for Ultra Quiet Operation
Over Current and Over Temperature Protection
Space-Saving MSOP Package Option
Applications
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Device Selection Table
NOTE: xx indicates output voltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
General Description
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is
typically 50µA at full load (20 to 60 times lower than in
bipolar regulators).
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. An error output (ERROR) is asserted when the
TC1173 is out-of-regulation (due to a low input voltage
or excessive output current). ERROR canbesetasa
low battery warning or as a processor RESET signal
(with the addition of an external RC network). Supply
current is reduced to 0.05µA (typical) and V
OUT
and
ERROR fall to zero when the shutdown input is low.
The TC1173 incorporates both over temperature and
over current protection. The TC1173 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
Typical Application
Package Type
Part Number Package Junction
Temp. Range
TC1173-xxVOA 8-Pin SOIC -40°C to +125°C
TC1173-xxVUA 8-Pin MSOP -40°C to +125°C
TC1173
1
2
3
45
6
7
8
VOUT
VOUT
CBYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
C1
1µF
GND
NC
Bypass
VIN VIN
NC
SHDN
+
ERROR
R3
1M
ERROR
8-Pin SOIC
1
2
3
4
VIN
5
6
7
8
NC
VOUT
GND
NC
Bypass
TC1173VOA
8-Pin MSOP
1
2
3
4
VIN
5
6
7
8
NC
VOUT
GND
NC
Bypass
SHDN
TC1173VUA
ERROR SHDN
ERROR
300mA CMOS LDO with Shutdown ERROR Output and Bypass
TC1173
DS21362B-page 2
2002 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage..................(VSS 0.3V) to (VIN +0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ<125°C
Storage Temperature..........................-65°C to +150°C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1173 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN =V
OUT +1V,I
L=0.1mA,C
L=3.3µF, SHDN >V
IH,T
A= 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol Parameter Min Typ Max Units Test Conditions
VIN Input Operating Voltage 2.7 6.0 VNote 8
IOUTMAX Maximum Output Current 300 ——mA
VOUT Output Voltage
VR–2.5% VR±0.5%
VR+2.5% VNote 1
VOUT/TV
OUT Temperature Coefficient 40 —ppm/°CNote 2
VOUT/VIN Line Regulation 0.05 0.35 %(V
R+1V)VIN 6V
VOUT/VOUT Load Regulation 0.5 2.0 %I
L= 0.1mA to IOUTMAX (Note 3)
VIN-VOUT Dropout Voltage
20
80
240
30
160
480
mV IL=0.1mA
IL=100mA
IL=300mA(Note 4)
ISS1 Supply Current 50 90 µA SHDN =V
IH,
ISS2 Shutdown Supply Current 0.05 0.5 µA SHDN =0V
PSRR Power Supply Rejection Ratio 60 dB FRE 1kHz
IOUTSC Output Short Circuit Current 550 650 mA VOUT =0V
VOUT/PDThermal Regulation 0.04 V/W Note 5
eN Output Noise 260 nV/Hz F=1kHz,C
OUT =1µF,
RLOAD =50
SHDN Input
VIH SHDN Input High Threshold 45 ——%V
IN
VIL SHDN Input Low Threshold 15 %VIN
ERROR Output
VMIN Minimum Operating Voltage 1.0 V
VOL Output Logic Low Voltage 400 mV 1 mA Flows to ERROR
VTH ERROR Threshold Voltage 0.95 x VR—V
VOL ERROR Positive Hysteresis 50 mV Note 7
Note 1: VRis the user-programmed regulator output voltage setting.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regula-
tion specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA,T
J,θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN VR+V
DROPOUT and VIN 2.7V for IL= 0.1mA to IOUTMAX.
TC VOUT =(V
OUTMAX –V
OUTMIN)x10
6
VOUT xT
2002 Microchip Technology Inc. DS21362B-page 3
TC1173
2.0 PIN DESCRIPTIONS
ThedescriptionsofthepinsarelistedinTable2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP) Symbol Description
1V
OUT Regulated voltage output.
2 GND Ground terminal.
3 NC No connect.
4 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance
by approximately 5%.
6 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA(typical).
7 NC No connect.
8V
IN Unregulated supply input.
TC1173
DS21362B-page 4
2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173’s supply current
does not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to IOUTMAX operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05µA
(typical), VOUT falls to zero and ERROR is disabled.
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
3.1 ERROR Output
ERROR is driven low whenever VOUT falls out of
regulation by more than 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated VOUT regardless of the programmed
output voltage value (e.g., ERROR =V
OL at 4.75V
(typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH +V
H.
As shown in Figure 3-1, ERROR canbeusedasa
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 msec to allowtime for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT,V
IN or any other voltage less than (VIN +0.3V).
FIGURE 3-2: ERROR OUTPUT
OPERATION
3.2 Output Capacitor
A1µF (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1and less
than 5.0.A1µF capacitor should be connected from
VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
(Since many aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are recom-
mended for applications operating below -25°C.)
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
3.3 Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If outputnoiseis not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
TC1173
1
2
3
4
VOUT
VOUT
CBYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
C1
1µF
GND
NC
Bypass
VIN
NC
SHDN
+
ERROR 5
6
7
8
C3 required only if ERROR
is used as a processor RESET signal.
(see text)
Battery
RESET or
Battery Low
R3
1M
C2
1µF
C3
0.2µF
+
+
VTH
VOUT
ERROR
VIH
VOL
HYSTERESIS (VH)
2002 Microchip Technology Inc. DS21362B-page 5
TC1173
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function ofthe maximum ambienttemperature
(TA
MAX
), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(θJA). The 8-Pin SOIC package has a θJA of approxi-
mately 160°C/Watt, while the 8-Pin MSOP package
has a θJA of approximately 200°C/Watt.
EQUATION 4-2:
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX = 3.0V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 250mA
TJMAX = 125°C
TAMAX =55°C
θJA = 200°C/W
8-Pin MSOP Package
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD(VINMAX –V
OUTMIN)ILOADMAX
= [(3.0 x 1.1) (2.7 x .995)]250 x 10–3
= 155mW
Maximum allowable power dissipation:
In this example, the TC1173 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 250mW into Equation 4-1, from
which VINMAX =4.1V.
4.3 Layout Considerations
The primary path of heat conduction out of thepackage
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and therefore
increase the maximum allowable power dissipation
limit.
Where:
PD(VINMAX –V
OUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX =(T
JMAX –T
AMAX)
θJA
Where all terms are previously defined.
PDMAX =(T
JMAX –T
AMAX)
θJA
= (125 55)
200
= 350mW
TC1173
DS21362B-page 6
2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise
FREQUENCY (kHz)
NOISE (µV/HZ)
10.0
1.0
0.01 0.01 1 10 100 1000
0.1
0.0
RLOAD = 50
COUT = 1µF
0.012
0.010
0.008
0.004
0.002
0.000
-0.002
-0.004
0.006
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
Line Regulation
LINE REGULATION (%)
2.00
1.80
1.60
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
Load Regulation
LOAD REGULATION (%)
1 to 300mA
1 to 50mA
1 to 100mA
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
050 100 150 200 250 300
LOAD CURRENT (mA)
Dropout Voltage vs. Load Current
DROPOUT VOLTAGE (V)
100.0
90.0
70.0
80.0
50.0
40.0
60.0
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
Supply Current
SUPPLY CURRENT (µA)
3.075
3.025
2.925
2.975
-40°-20°0°20°40°60°80°100°120°
TEMPERATURE (°C)
VOUT vs. Temperature
VOUT (V)
12
5
°
C
8
85
°
C
C
7
°
C
2
5
°
C
0
°
C
C
-4
0
°
C
VIN = 4V
ILOAD = 100µA
CLOAD = 3.3µF
2002 Microchip Technology Inc. DS21362B-page 7
TC1173
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
PIN 1
User Direction of Feed
Standard Reel Component Orientation
for TR Suffix Device
W
P
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
Standard Reel Component Orientation
for TR Suffix Device
PIN 1
User Direction of Feed
P
W
TC1173
DS21362B-page 8
2002 Microchip Technology Inc.
6.3 Package Dimensions
8-Pin MSOP
.122 (3.10)
.114 (2.90)
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.006 (0.15)
.002 (0.05)
.016 (0.40)
.010 (0.25)
.197 (5.00)
.189 (4.80)
.008 (0.20)
.005 (0.13)
.028 (0.70)
.016 (0.40)
6° MAX.
.026 (0.65) TYP.
PIN 1
Dimensions: inches (mm)
.050
(
1.27
)
TYP
.
8
°
MAX.
PIN 1
.244
(
6.20
)
.228
(
5.79
)
.157
(
3.99
)
.150
(
3.81
)
.197
(
5.00
)
.189
(
4.80
)
.020
(
0.51
)
.013
(
0.33
)
.010
(
0.25
)
.004
(
0.10
)
.069
(
1.75
)
.053
(
1.35
)
.010
(
0.25
)
.007
(
0.18
)
.050
(
1.27
)
.016
(
0.40
)
.
8
-Pin
SO
I
C
Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21362B-page 9
TC1173
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1173
DS21362B-page 10 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21362B-page 11
TC1173
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nologyIncorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
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and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
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devices, Serial EEPROMs, microperipherals,
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design and manufacture of development
systems is ISO 9001 certified.
DS21362B-page 12
2002 Microchip Technology Inc.
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Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21362B*
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